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JPS6231836B2 - - Google Patents
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JPS6231836B2 - - Google Patents

Info

Publication number
JPS6231836B2
JPS6231836B2 JP56074689A JP7468981A JPS6231836B2 JP S6231836 B2 JPS6231836 B2 JP S6231836B2 JP 56074689 A JP56074689 A JP 56074689A JP 7468981 A JP7468981 A JP 7468981A JP S6231836 B2 JPS6231836 B2 JP S6231836B2
Authority
JP
Japan
Prior art keywords
electronic circuit
wiring board
circuit component
insulating substrate
mother wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56074689A
Other languages
English (en)
Other versions
JPS57193094A (en
Inventor
Hisashi Nakamura
Tatsuo Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56074689A priority Critical patent/JPS57193094A/ja
Priority to KR8202084A priority patent/KR860000188B1/ko
Priority to US06/377,997 priority patent/US4495546A/en
Priority to DE8282302525T priority patent/DE3279897D1/de
Priority to EP82302525A priority patent/EP0065425B1/en
Publication of JPS57193094A publication Critical patent/JPS57193094A/ja
Publication of JPS6231836B2 publication Critical patent/JPS6231836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/007—Manufacture of substantially flat articles, e.g. boards, from particles or fibres and at least partly composed of recycled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【発明の詳細な説明】 本発明はチツプ抵抗、チツプコンデンサ、回路
導体などの小型回路素子を有する電子回路部品を
備えた電子回路部品構体およびその製造方法に関
するものである。この種の電子回路部品構体に用
いる電子回路部品は混成集積回路部品ともいわ
れ、用途によつて各種の構造があるが、その代表
的な構造は基板の両面又は片面に印刷等によつて
回路導体を形成したもの、あるいはさらにこの該
回路導体にチツプ部品を半田付けしたものであ
る。
このような電子回路部品構体の電子回路部品は
一般に樹脂によつてモールドされていて接続用の
リード線が外部に引出されており、これをマザー
配線基板に取付ける場合は、マザー配線基板に設
けた孔に前記リード線を挿入して半田付けする。
しかし、この半田付けの作業は煩雑で生産性が低
く、かつ接続不良などの不良品が発生し易い。ま
た、リード線を半田付けするためのスペースを必
要とするので小型化が制約されるなどの問題点が
ある。そのために最近ではリード線のない小型電
子回路部品が使用されるようになつている。
第１図は上記リードレスタイプの電子回路部品
を示している。同図において、１は合成樹脂より
なる基板、２ａ，２ｂは基板１の両面に形成され
た回路導体、２ｃ，２ｄは基板１の端部両面に形
成した接続導体、３ａ，３ｂは回路導体２ａ，２
ｂに半田付け４された小型回路素子である。第２
図は第１図の電子回路部品をマザー配線基板５に
取付けた状態を示している。電子回路部品はマザ
ー配線基板５に設けたスリツト６に接続導体２
ｃ，２ｄを設けた挿入部が挿入され、マザー配線
基板５の回路導体７と前記接続導体２ｃ，２ｄが
半田付け８されている。
ところで上記従来の構造は挿入作業を容易に
し、かつ、接続導体２ｃ，２ｄを損傷しないよう
にスリツト６に挿入する必要があるため、スリツ
ト６にはある程度のクリヤランスを必要とする。
そのために挿入された電子回路部品の位置ぎめが
不安定となり、浮上り、傾き、脱落などの不良品
が発生し易く、また半田付け８の部分がクリヤラ
ンスがあるためにマザー配線基板５のたわみや外
部からの衝撃によつてクラツクを生じ接続不良に
なることがある。
本発明は上記のような欠点のない電子回路部品
構体およびその製造方法を提供することを目的と
する。以下その実施例を第３図ないし第７図につ
いて説明する。第３図イにおいて、９はポリイミ
ド等、耐熱性と可とう性とを有する合成樹脂の薄
板よりなる絶縁基板、１０ａはその表面に形成さ
れた回路導体、１０ｂは絶縁基板９の両端に形成
された接続導体、１１は回路導体１０ａに半田付
け１２された小型回路素子である。１４ａ，１４
ｂは同一形状大きさの２個１対の支持基板で硬質
の合成樹脂あるいはアルミ等の金属によつて形成
されており、絶縁基板９の裏面に間隔ｄをおいて
接着剤１３により接着されている。第３図ロはイ
の電子回路部品を間隔ｄを中心として折曲げ、支
持基板１４ａ，１４ｂを重ね合わせた本発明の第
１実施例の電子回路部品である。この電子回路部
品Ａは第４図に示すようにマザー配線基板１５に
設けたスリツト１６に挿入され、第５図に示すよ
うに、マザー配線基板１５の回路導体１７と接続
導体１０ｂが半田付け１８される。
第６図は本発明の電子回路部品構体の第２の実
施例である。電子回路部品Ｂはマザー配線基板１
５への挿入部に凹部１９を設けて該挿入部を異な
る大きさを有する２個の挿入部に分割し、マザー
配線基板１５に分割して設けたスリツト１６ａ，
１６ｂに挿入する。この構造は電子回路部品のマ
ザー配線基板への挿入が規正され、逆挿入を防止
する効果がある。第７図は本発明の電子回路部品
構体の第３の実施例である。この電子回路部品Ｃ
はマザー配線基板１５への挿入部に一定の間隔を
おいて複数個の切込２０が設けてある。この構造
は半田槽に浸漬して半田付けをする場合に半田の
まわりがよく、半田ブリツジを防止して確実な半
田付けが行なわれる。
以上述べたように本発明の実施例の電子部品回
路構体は耐熱性と可とう性とを有する絶縁基板９
の表面に回路導体１０ａと接続導体１０ｂを形成
し、該回路導体１０ａに小型回路素子１１を半田
付け１２によつて接続し、前記絶縁基板９の裏面
には同一形状大きさの硬質材料よりなる２個１対
の支持基板１４ａ，１４ｂを中央に間隔ｄをおい
て固着し、該間隔を設けた部分を中心として前記
絶縁基板９を折曲げて、前記２個１対の支持基板
１４ａ，１４ｂを重ね合せて電子回路部品を形成
し、該電子回路部品をマザー配線基板１５に設け
たスリツト１６に挿入し、その挿入部に設けた前
記接続導体をマザー配線基板１５の回路導体１７
と半田付け１８するものである。上記電子回路部
品構体で使用される電子回路部品は耐熱性と可と
う性とを有する絶縁基板９の表面に形成された回
路導体１０ａに小型回路素子１１が半田付け１２
によつて接続されており、前記絶縁基板９の裏面
には同一形状大きさの２個１対の支持基板１４
ａ，１４ｂが中央に間隔ｄをおいて固着されてお
り、該間隔を設けた部分を中心として前記絶縁基
板９を折曲げて前記２個１対の支持基板１４ａ，
１４ｂを重ね合せた構造を有する。そして、その
マザー配線基板１５への挿入部は、凹部１９によ
つて異なる大きさを有する２個の挿入部に分割さ
れており、あるいは挿入部に一定の間隔をおいて
複数個の切込２０が設けてある。
本発明の実施例の電子回路部品構体は以上の構
成を有するので以下述べるような効果がある。(1)
絶縁基板９は耐熱性を有するので半田付けの熱に
耐え、かつ、可とう性を有するのでマザー配線基
板１５のたわみによつて半田接続が破壊されるこ
とがない。第２図の従来の構造はマザー配線基板
のたわみの限界は５mm程度であつたが、本発明に
おいてはマザー配線基板を折損する程度に曲げて
も半田接続が破壊されないことが実験的に確認さ
れた。すなわち、第２図の従来の構造はマザー配
線基板５に作用する曲げの応力は半田付け８の部
分に集中するのに対し、本発明においては、曲げ
の応力は２個１対の支持基板１４ａ，１４ｂを離
間させるように作用し、半田付け１８の部分は可
とう性を有する絶縁基板９に追従するからであ
る。(2)２個１対の支持基板１４ａ，１４ｂは重ね
合せてあつてその外側を可とう性を有する絶縁基
板９がとりまいている。そしてこの電子回路部品
をマザー配線基板１５のスリツト１６に挿入する
と絶縁基板９の弾性によつて第５図に示すように
スリツト１６の両側に弾発的に圧接する。したが
つて電子回路部品の位置ぎめが安定し、浮上つた
り、傾いたり、脱落したりすることがない。そし
てスリツト１６のクリヤランスを十分にとること
ができるので挿入作業が容易になる。(3)マザー配
線基板への挿入部に凹部１９を設け挿入部を異な
る大きさを有する２個の挿入部に分割することに
より誤挿入が防止される。(4)マザー配線基板への
挿入部に一定の間隔をおいて複数個の切込２０を
設けることによつて半田付けを確実容易にする。
以上のように本発明の電子回路部品構体は、簡
単な構造にして高密度実装が可能であり、又その
製造方法は電子回路部品をマザー配線基板へ容易
かつ確実に取付けられる利点がある。
【図面の簡単な説明】
第１図は従来の電子回路部品を示す図、第２図
は第１図の電子回路部品をマザー配線基板に挿入
したときの断面図、第３図は本発明の電子回路部
品の第１実施例Ａを示す図で、イは折曲げ前、ロ
は折曲げ後の状態をそれぞれ示す図、第４図は本
発明の電子回路部品をマザー配線基板に挿入する
ときの状態を示す図、第５図は本発明の電子回路
部品をマザー配線基板に挿入したときの断面図、
第６図は本発明の電子回路部品の第２実施例Ｂの
要部を示す図、第７図は本発明の電子回路部品の
第３実施例Ｃの要部を示す図である。 ９…絶縁基板、１０ａ…回路導体、１０ｂ…接
続導体、１１…小型回路素子、１２半田付け、１
３…接着剤、１４，１４ｂ…支持基板、１５…マ
ザー配線基板、１６…スリツト、１７…回路導
体、１８…半田付け、１９…凹部、２０…切込。

Claims (1)

  1. 【特許請求の範囲】 １ 主面に回路導体が形成されかつ折曲げ部を有
    する可とう性の絶縁基板と、前記絶縁基板の前記
    主面または他の主面に前記折曲げ部を介して間隔
    をあけて固着された２個の硬質材料よりなる支持
    基板とを有する電子回路部品が、前記他の主面の
    両端部が互いに近づくように前記折曲げ部におい
    て折曲げられた状態でマザー配線基板に設けた貫
    通孔に挿入されており、前記電子回路部品の回路
    導体が前記マザー配線基板に設けた回路導体と電
    気的に接続されていることを特徴とする電子回路
    部品構体。 ２ 可とう性を有する絶縁基板の主面に回路導体
    を形成する工程と、前記回路導体に回路素子を接
    続し、前記絶縁基板の前記主面または他の主面に
    は硬質材料よりなる２個の支持基板を互いに間隔
    をあけて固着する工程と、前記間隔をあけた部分
    を中心として前記絶縁基板を折曲げて電子回路部
    品を形成する工程と、前記電子回路部品をマザー
    配線基板に設けた貫通孔に挿入して前記可とう性
    を有する絶縁基板の弾性力により前記電子回路部
    品を前記マザー配線基板の貫通孔壁に当接させて
    仮固定する工程と、前記絶縁基板の回路導体を前
    記マザー配線基板の回路導体に半田により電気的
    に接続する工程とを有することを特徴とする電子
    回路部品構体の製造方法。
JP56074689A 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same Granted JPS57193094A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56074689A JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same
KR8202084A KR860000188B1 (ko) 1981-05-18 1982-05-13 혼성집적회로 부품 및 그 부착 방법
US06/377,997 US4495546A (en) 1981-05-18 1982-05-13 Hybrid integrated circuit component and printed circuit board mounting said component
DE8282302525T DE3279897D1 (en) 1981-05-18 1982-05-18 Hybrid integrated circuit component and printed circuit board mounting said component
EP82302525A EP0065425B1 (en) 1981-05-18 1982-05-18 Hybrid integrated circuit component and printed circuit board mounting said component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074689A JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same

Publications (2)

Publication Number Publication Date
JPS57193094A JPS57193094A (en) 1982-11-27
JPS6231836B2 true JPS6231836B2 (ja) 1987-07-10

Family

ID=13554428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074689A Granted JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same

Country Status (5)

Country Link
US (1) US4495546A (ja)
EP (1) EP0065425B1 (ja)
JP (1) JPS57193094A (ja)
KR (1) KR860000188B1 (ja)
DE (1) DE3279897D1 (ja)

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DE2914336A1 (de) * 1979-04-09 1980-11-06 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung starr- flexibler leiterplatten
JPS598370Y2 (ja) * 1979-05-08 1984-03-15 アルプス電気株式会社 電気回路ユニツト
JPS5935018Y2 (ja) * 1979-10-23 1984-09-27 日本電気ホームエレクトロニクス株式会社 電子部品取付装置
FR2504345A1 (fr) * 1981-04-21 1982-10-22 Elbeuf Electro Indle Assemblage d'un circuit imprime souple et d'un circuit imprime rigide et circuits imprimes pour un tel assemblage
JPH0672973B2 (ja) * 1983-06-30 1994-09-14 株式会社リコー オ−トフオ−カス方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955272A (zh) * 2014-03-31 2015-09-30 奇点新源国际技术开发(北京)有限公司 一种印刷电路板

Also Published As

Publication number Publication date
EP0065425A3 (en) 1985-01-09
JPS57193094A (en) 1982-11-27
EP0065425B1 (en) 1989-08-16
KR860000188B1 (ko) 1986-02-28
KR840000080A (ko) 1984-01-30
EP0065425A2 (en) 1982-11-24
US4495546A (en) 1985-01-22
DE3279897D1 (en) 1989-09-21

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