JPS6233641B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magnetic head, and more particularly to a method of manufacturing an erasing head that reduces the number of manufacturing steps.

Conventionally, the following manufacturing methods have been used to assemble magnetic heads.

(1) A gap area is formed in a molded case or the like in advance, a core is inserted between the gap areas, and the core and case are fixed with adhesive or the like.

(2) Insert a spacer in the gap area,
A gap is formed by sandwiching this spacer and gluing the core. Then, the core with this gap formed is placed in a molded case etc.
Cast and fix.

Conventionally, as mentioned above, forming the gap part,
The assembly of the body part is done in a completely different process. For this reason, the number of work steps has increased, resulting in extremely low efficiency. Also,
Since the gap part is formed from a non-magnetic part using adhesive or the like, it has the drawback of poor dimensional accuracy.

The present invention solves the above-mentioned problems in the conventional art, and by forming the gap part and molding the body part at the same time, it reduces the number of manufacturing steps and reduces the number of parts, thereby improving reliability. The object of the present invention is to provide a method for manufacturing an erasing head that enables improved performance and cost reduction.

Hereinafter, an embodiment of the method for manufacturing an erasing head according to the present invention will be described with reference to the drawings.

First, as shown in FIG. 1, the gap portion of the erasing head in the present invention consists of a frame 1 made of a conductive non-magnetic material such as an aluminum plate or a copper plate.
It is formed integrally with the material by pressing, squeezing, etc. In the example, 2 in the figure is a gap part,
3 is a ground terminal, and 5 is an input terminal, each of which is formed integrally with the frame 1. Next, the core 6 as shown in FIG. 2 is placed at the required position of the frame 1 shown in FIG.
The core 6 is connected to each terminal provided on the frame 1 described above. A coil 7 is wound around the core 6 in advance, and when installing the core 6, the gap portion 2 formed integrally with the frame 1 is first inserted between required cores. Further, the winding terminal 8 of the coil 7 is connected to the input terminal 5, and dotite is applied between the ground terminal 3 and the core 6. As described above, once the arrangement of the core 6 to the frame 1 and the connection to each terminal have been completed, the frame itself is placed in a cavity provided in a mating mold, and the body portion is molded. The body portion is molded by a transfer molding method. This transfer molding method is a type of resin encapsulation method, and uses a powdered or granular molding compound, a transfer molding machine, and a multi-cavity mold. This method is
A powder or granular molding material is preformed into a tablet shape, and the object (in the case of the example, the frame 1 on which the core 6 is arranged) is placed in a fixed mold. If necessary, preheating may be performed using a high-frequency heating device. This transfer molding method is a method in which fluidized resin is injected under pressure into the cavity of the mold using a plunger at the same time as the tablet is inserted.
It is characterized by the ability to mold many pieces at once and by relatively low pressure molding.

When the frame 1 described above is taken out from the cavity of the mating mold after undergoing the treatment process using the transfer molding method described above, the body portion 9 is sealed with resin as shown in FIG. can get. After that, the ground terminal 3, the mounting terminal 4, and the input terminal 5 are strained and cut to the required length, and other unnecessary terminals are cut off from the body surface and separated from the frame 1 to complete the structure as shown in Figure 4. This results in an eraser head that can be erased.

Although the above description has been made using a single type erase head as an example, the present invention can also be applied to a semi-double type erase head. It goes without saying that various modifications can be made without changing the gist of the invention.

As described above, the present invention provides a method for manufacturing an erasing head in which the gap part 2 and the body part 9 are formed at the same time. Frame 1 made of electrically conductive and non-magnetic material
(a) arranging the core 6 around which the coil 7 is wound at a predetermined position on the frame 1 to connect it to the input terminal 5; (b) arranging the core 6; (c) leaving the above-mentioned terminals on the outside of the body part 9; I tried to get
By reducing the number of manufacturing steps and parts, it is possible to improve reliability and reduce costs.

[Brief explanation of the drawing]

Figure 1 is a configuration diagram of a frame used in one embodiment of the present invention, Figure 2 is a diagram showing a core around which a coil is wound, Figure 3 is a diagram showing a molded body part, and Figure 4 is a diagram showing a main body. FIG. 3 shows a finished product of the erasing head according to the invention. 1: Frame, 2: Gap section, 3: Earth terminal, 4: Mounting terminal, 5: Input terminal, 6: Core, 7: Coil, 8: Winding terminal, 9: Body section.

Claims (1)

[Scope of Claims] 1. A method for manufacturing an erasing head in which a gap part and a body part are formed at the same time: Using a frame made of material, (a) connecting a core with a coil wound thereon to the input terminal by arranging it at a predetermined position on the frame; (c) leaving the above-mentioned terminals on the outside of the body part; Head manufacturing method.