JPS6234141B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to the so-called TAB (Tape Automated
The present invention relates to tape carriers used when assembling integrated circuit devices using the bonding method.

The TAB method is a method in which an integrated circuit (hereinafter referred to as IC) chip is connected to a tape carrier in which the same wiring pattern is repeatedly placed in close contact with a long insulating film. Since it is formed to match the electrode arrangement, all connections can be made at the same time by aligning the two, and since the same wiring pattern is repeated on a long tape, the IC chips can be connected continuously. There are advantages such as being able to perform

Figure 1 shows an example of a conventional tape carrier with an IC chip connected. tape carrier 1
Sprocket holes 2 are provided on both sides of the tape carrier and can be used for transporting long tape carriers. Device holes 3 are formed at equal intervals in the center of the tape carrier, and leads 4 protrude into the holes, and an IC is inserted at the tip of the device holes 3.
Chip 5 is connected. An electrical test of the connected IC is performed by applying a needle to the pad 6 provided at the end of the lead 4. Through holes 7a to 7d are opened in the thus inspected ICs in order to grade them according to good, bad, or performance. For example, an IC with a hole at position 7a is a defective product, 7b is a good product, 7c is a good performance IC, and 7a is a good IC.
d is not a defective IC, but it is an IC with inferior performance. The presence or absence of these through-holes is detected by a photo sensor, and is used, for example, to punch out and remove defective ICs, or to differentiate them by grade.

However, in the past, this through hole was made in a part without a conductive pattern, so the contrast between the amount of light passing through the semitransparent insulating film and the amount of light passing through the hole was small, and erroneous recognition often occurred. In addition, the density of the insulating film also varied due to variations in manufacturing lots, and there was a drawback that the detection sensitivity of the photo sensor had to be adjusted by tape lots.

The present invention was made in order to eliminate the above-mentioned drawbacks of the conventional technology, and by making through holes on the metal pattern, it prevents light leakage when the holes are not open, and prevents erroneous recognition of detection by photo sensors. This is what we are trying to prevent.

That is, a feature of the present invention is that in a tape carrier in which the same metal wiring pattern is repeatedly provided in close contact with one main surface of an insulating film at equal intervals, the metal wiring pattern and the insulating film are attached to the metal wiring pattern. It is located on a tape carrier with a hole passing through it. Furthermore, another feature of the present invention is that in a tape carrier in which identical metal wiring patterns are provided in close contact with one main surface of an insulating film at regular intervals, a portion of the insulating film that does not have the metal wiring pattern has a light-shielding property. The tape carrier is provided with a pad and a hole is provided in the light-shielding pad area extending through the insulating film. Preferably, the light-shielding pad is made of the same metal as the metal wiring pattern.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 shows an example in which a metal pad 8 is provided and a through hole 9a is drilled thereon in order to determine the quality of the IC. The size of the pad without detection error is 1 in diameter.
It only needs to be a square with a square size of 2 mm or more for the hole size of mm. Alternatively, a hole may be made in a part of the wiring pattern as shown in 9b. In this case, the pad 6 is made a little larger so that an electrical test can be performed even after the hole is drilled. If the color of the insulating film 1 is relatively dark, even if the entire circumference of the hole is not metal.
It is sufficient even if only a portion is covered with metal as shown in c. Polyester or polyimide film is usually used as the insulating film, but polyester has a high light transmittance, so it is better to use it as in examples 9a and 9b, but polyimide usually has a brownish color. Since the light transmission rate is relatively low, the example 9c is also sufficient.

The above explanation is based on an example in which through-holes are drilled for the purpose of determining pass/fail for electrical inspection and for grading, but the examples are not limited to this, and can also be applied to defects in the tape carrier manufacturing process and IC chip assembly processes. However, by changing the position of the holes for each process, it is also possible to tally the defects for each process at the final stage.

As described in detail above, according to the present invention, it is possible to reliably detect the presence or absence of holes drilled on a tape carrier using a photo sensor, thereby eliminating the need to remove non-defective products or treat defective products as non-defective products. Not only is this eliminated, but process control can also be easily and reliably performed.

[Brief explanation of the drawing]

Figure 1 is a plan view showing a conventional tape carrier.
FIG. 2 is a plan view showing a tape carrier according to an embodiment of the present invention. In the figure, 1... insulating film, 2...
... Sprocket hole, 3... Device hole, 4... Lead, 5... IC chip, 6... Pad, 7a to 7d... Through hole, 8... Metal pad, 9a to 9c... Through hole, It is.

Claims (1)

[Claims] 1. In a tape carrier in which the same metal wiring pattern is repeatedly provided in close contact with the insulating film on one main surface of an insulating film, a through hole is provided in a portion of the metal wiring pattern that is in close contact with the insulating film, allowing light to pass through the through hole;
A tape carrier characterized in that this makes it possible to recognize the characteristic results of a semiconductor chip connected to a metal wiring pattern with good contrast.