JPS6236639B2 - - Google Patents

Description

[Detailed Description of the Invention] This invention hermetically seals electronic components,
Moreover, the present invention relates to an improved container for electronic components that quickly radiates heat generated from the electronic components to the outside air.

FIG. 1 is a cross-sectional view showing the structure of a conventional example of a container for electronic parts, in which numeral 1 denotes an electronic part, which in this example is a flip-chip type semiconductor device. 2 is a substrate made of ceramic or the like that holds the electronic component 1 and is provided with wiring for connecting the electronic component 1 to external terminals;
4 is a contact that directly contacts the electronic component 2, holds the electronic component 2 between it and the board 2, and quickly removes the heat generated in the electronic component 2; 4 is a contact that surrounds the electronic component 2 and protects it from the outside air; An envelope 5 is inserted between the inner surface of the envelope 4 and the contact 3 to connect the contact 3 to an electronic component. 2, a spring for pressing against 2 to ensure stable and reliable contact between the two; 6, a sealing material for airtightly sealing the envelope 4 to the substrate 2; 7, a spring in the internal cavity of the envelope 4; It is an inert gas such as helium that is filled around the electronic component 1 to protect the electronic component 1 and supplement the transfer of the generated heat to the envelope 4.

However, the conventional configuration as described above has the following problems.

(a) Since the contact 3 is only pressed by the spring 5 and not fixed, the contact 3 applies an impact load to the electronic component 1 due to vibrations during transportation or when the electronic component 1 is in operation. The electronic component 1 may be damaged.

(b) Since it is necessary to fill in an inert gas 7 such as helium, the manufacturing process becomes complicated, and in addition, the contact 3
Since high precision is required for processing, the manufacturing cost is high and the reliability is poor.

Additionally, electronic components, particularly highly reliable products such as semiconductor integrated circuit devices, generally require hermetic seals, and therefore special measures are required to remove heat from the electronic components.

This invention was made in view of the above points, and uses a threaded contactor as a contactor and screws it into a screw hole provided in the center upper wall of the container to connect the above-mentioned electronic components. By sandwiching the electronic component and interposing a contact piece that is softer than the electronic component between the electronic component and the contact, it has excellent hermetic sealing function and heat dissipation function, and is resistant to vibration and is highly reliable for electronic components. The purpose is to provide containers.

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a cross-sectional view showing the structure of the first embodiment of the present invention. Portions equivalent to those of the conventional example are designated by the same reference numerals, and their explanation will be omitted. In this first embodiment, a flip-chip type semiconductor device (electronic component) 1 bonded to a substrate 2 is connected to the substrate 2 by a bellows-shaped movable piece 8 having a contact piece (to be described in detail later) that comes into direct contact with the flip-chip semiconductor device (electronic component) 1. There is a hermetic seal on the top. FIG. 3 is a cross-sectional view showing the structure of the movable piece 8 used in this first embodiment, which has a bellows part 81 that can be freely deformed on the outer periphery, and has an inner surface made of indium, which is relatively soft at room temperature, on the inner surface of the upper wall. A contact piece 82 made of metal and in direct contact with the electronic component 1 is provided, and a seal portion 83 is provided at the lower end of the bellows portion 81 to enable hermetic sealing to the substrate 1. Further, reference numeral 9 denotes a set screw (threaded contact) screwed into a screw hole drilled in the envelope 4, and the set screw 9 presses the contact piece 82 against the electronic component 1 from the outside of the movable piece 8. , the electronic component 1 is securely held in contact with the electronic component 1. 10 is a sealing material that seals the seal portion 83 of the movable piece 8. The unevenness on the outer surface of the envelope 4 is similar to that of the conventional example shown in FIG. In this first embodiment, the electronic component 1 is moved to the movable piece 8.
Hermetically seal this with contact piece 8.
2. Via the outer wall of the movable piece 8 and the set screw 9,
Since it is connected and fixed to the envelope 4, the heat generated is well dissipated. Furthermore, the contact is pressed against the electronic component by the tightening force of the screw instead of the spring force, and a soft contact piece is interposed between the contact and the electronic component to reliably prevent damage to the electronic component due to vibration. can.

FIG. 4 is a sectional view showing the structure of a second embodiment of the present invention. In the figure, the same reference numerals as in FIG.
11 is brazed and is screwed into a screw hole drilled in the envelope 4 to press the electronic component 1 through the contact piece 111 and securely hold it in contact;
12 is a lid that seals the screw hole; 13 is a rotation preventing member such as a compound that prevents the screw of the threaded contact 11a from loosening; and 14 is a sealing material for the lid 12. In this second embodiment, the hermetic seal relies on the envelope 4 and the lid 12 without using the bellows-shaped movable piece 8 in the first embodiment shown in FIG. piece 111,
It is connected and fixed to the envelope 4 via the threaded contact 11a, and the same effects as the first embodiment can be obtained with a simple structure.

FIG. 5 is a side view, partially in section, of another form of the threaded contact used in the construction of this second embodiment, in which the contact piece 111 is fixed by fitting into the tip as shown in the figure. The child 11b may also be used.

6A and 6B are side views showing other forms of the lid used in the configuration of the second embodiment, and the lids 12a and 12b shown in the figures each have a heat dissipation portion on the outer surface of the lid 12 shown in FIG. 121 and 122 are provided to improve the heat dissipation effect. Lid 1
2 may be fixed to the envelope 4 by local heating using an electron beam, a laser beam, or the like.

As explained above, according to the electronic component container according to the present invention, a screw hole is provided in the center upper wall of the container, and an outer enclosure for hermetically sealing the electronic component placed on the substrate together with the substrate. and a member having higher thermal conductivity than the electronic component, which is screwed into the screw hole of the envelope and presses the electronic component against the board via a contact piece that is softer and has higher thermal conductivity than the electronic component. Since a clamping screw contact is provided, not only the hermetic sealing function and the heat dissipation function can be improved, but also damage to electronic components due to vibration can be prevented, thereby improving reliability.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing the structure of a conventional example of a container for electronic parts, Fig. 2 is a sectional view showing the structure of a first embodiment of the present invention, and Fig. 3 is a movable FIG. 4 is a cross-sectional view showing the structure of the second embodiment of the present invention, and FIG. 5 is a cross-sectional view showing the structure of the second embodiment. FIGS. 6A and 6B are side views showing other forms of the lid used in the construction of the second embodiment. In the figure, 1 is an electronic component, 4 is an envelope, 6,
10 is a sealing material, 8 is a movable piece, 9, 11a, 11
b is a threaded contact, and 82 and 111 are contact pieces. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] 1. An electronic component container that hermetically seals electronic components mounted on a board and radiates heat generated from the electronic components to the outside air, with a screw hole bored in the center upper wall of the container. an envelope for hermetically sealing the electronic component together with the substrate; and a member having a higher thermal conductivity than the electronic component, which is screwed into a screw hole in the envelope to hermetically seal the electronic component with the substrate. A container for electronic components, characterized by comprising a screw contact that is pressed and clamped to a substrate via a contact piece that is softer than the electronic components and has a higher thermal conductivity. 2. The electronic component according to claim 1, wherein the electronic component is hermetically sealed by a bellows-shaped metal movable piece having the contact piece integrally on the inner surface of its upper wall. container. 3. Claim 1 or 2, characterized in that the outer surface of the envelope has an uneven shape.
Container for electronic components as described in section.