JPS6237666B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to a novel hot melt composition with excellent adhesive properties. Hot melt compositions are solid at room temperature, are melted by heat during use, are applied to various substrates, and then solidified by cooling, and are widely used as adhesives, coatings, etc. for substrates. . Currently, base polymers for these hot melt compositions include ethylene copolymers such as ethylene-vinyl acetate copolymer (EVA) and ethylene-acrylate copolymer, and thermoplastic polymers such as polyethylene, polyamide, polyurethane, and polyester. A combination of various waxes and tackifying resins is used as a viscosity modifier. As this tackifying resin, naturally occurring resins such as rosin and rosin ester are widely used. Among them, rosin ester has been widely used because it has an excellent adhesion imparting effect, but resources are limited. Rosin ester is a natural product, and due to price and supply instability, petroleum resins made from abundant petroleum resources have tended to be used in place of rosin ester in recent years. However, petroleum resins have various drawbacks such as poor adhesion imparting effect and insufficient heat resistance. Various proposals have been made to improve these drawbacks, but the current situation is that there are still none with sufficient performance. In order to improve the hue and heat resistance of petroleum resins, for example, completely hydrogenated aromatic petroleum resins or cyclopentadiene resins are widely used. difference)
is low. As a result of intensive research to overcome these drawbacks, the present inventors succeeded in developing a method for producing a resin that has an extremely high adhesiveness imparting effect, and by blending a predetermined amount of this resin, the adhesive strength can be increased. The present invention was completed based on the knowledge that an excellent hot melt composition can be obtained. That is, the present invention provides (a) general formula

[Formula] (In the formula, H is hydrogen, R represents an alkyl group having 1 to 3 carbon atoms, m and n are integers of 0 or 1 or more, and m+n=6). 20 to 90 parts by weight of a 5-membered ring compound and/or a Diels-Alder adduct of the 5-membered ring compound [component A];
A softening point of 60 to 130°C obtained by further hydrogenating a copolymer resin () obtained by copolymerizing a membered ring compound and a codimer of 1,3-butadiene [component B] 80 to 10 parts by weight The present invention relates to a hot melt composition characterized in that it contains a hydrogenated resin (1) and (2) an ethylene copolymer and/or a wax as essential components. Hereinafter, the hot melt composition according to the present invention will be specifically explained. The hydrogenated resin () (component (a)) in the present invention is obtained by further hydrogenating the copolymer resin () obtained by copolymerizing [component A] and [component B], and has a softening point of 60 ~130℃. [Component A] is the general formula

[Production of copolymer resin ()]

2. Charge raw material monomers and xylene having the composition shown in Table 1 into an autoclave, and react under the polymerization conditions shown in Table 1 in a nitrogen atmosphere. From the resulting polymer solution, unreacted substances, low polymers, and xylene are removed by distillation. Copolymerized resin by removing ()
(-1, -2, -3, -4, -5,
-6) was obtained.

[Production of hydrogenated resin ()]

The resins (-1 to -6, -a, -b) obtained in Synthesis Examples 1 to 6 and Comparative Synthesis Examples 1 to 2 were hydrogenated as follows under the conditions shown in Table 2. That is, 100 g each of resins (-1 to -6, -a, -b), 100 g each of methylcyclohexane as a solvent, and a catalyst (sulfur-resistant stabilized nickel N manufactured by JGC Chemical Co., Ltd.).
113) Charge 3 g of each into a 500 ml autoclave equipped with a stirrer, perform a hydrogenation reaction, cool and take out the reactants, and remove the filtered catalyst.
The solvent was removed by distillation to obtain a hydrogenated resin ().

[Table] Examples 1 to 6 and Comparative Examples 1 to 2 (Preparation and properties of hot melt adhesives) Hydrogenated resins obtained in the above synthesis examples (-1 to
-6 and -a, -b), 40 parts each, ethylene-vinyl acetate copolymer "Evaflex"
220'' and 20 parts of 145'' paraffin wax were melted and mixed uniformly to prepare a hot melt composition. Using these compositions, the peel strength was measured and the adhesive strength was investigated. That is, composition 5
g in aluminum foil with size 150 x 200 mm and thickness 0.2 mm at 180℃, 150Kg/cm ² . Molded for G3 minutes, thickness 0.2
Create a test piece with a width of 25 mm and ASTMD1876-
A T-type peel test was conducted according to 61T to determine the Al/Al peel strength. The results are shown in Table 3.

[Table] As is clear from the table, the hot melt compositions of the present invention (Examples 1 to 6) exhibited sufficiently strong peel strength, and Comparative Example 1 showed a hydrogenated resin obtained by polymerizing dicyclopentadiene alone. Comparative Example 2 shows that when [Component B] is used in excess, the softening point of the resin obtained is too low, and its hydrogenation This shows that hot melt compositions using resin do not have sufficient adhesive strength.

Claims (1)

[Claims] 1 (a) General formula [Formula] (In the formula, H represents hydrogen, R represents an alkyl group having 1 to 3 carbon atoms, m and n are 0 or an integer of 1 or more, and m+n=6 20 to 90 parts by weight of a 5-membered ring compound having a conjugated double bond represented by
A softening point of 60 to 130°C obtained by further hydrogenating a copolymer resin obtained by copolymerizing a membered ring compound and 80 to 10 parts by weight of a codimer of 1,3-butadiene [component B]. A hot melt composition characterized in that it contains a hydrogenated resin having () and (b) an ethylene copolymer and/or a wax as essential components.