JPS6238438B2 - - Google Patents
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- Publication number
- JPS6238438B2 JPS6238438B2 JP19879384A JP19879384A JPS6238438B2 JP S6238438 B2 JPS6238438 B2 JP S6238438B2 JP 19879384 A JP19879384 A JP 19879384A JP 19879384 A JP19879384 A JP 19879384A JP S6238438 B2 JPS6238438 B2 JP S6238438B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nozzle
- flow rate
- liquid supply
- metal strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Electroplating Methods And Accessories (AREA)
- Nozzles (AREA)
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、鋼板の電気めつきラインにおいて、
めつきセル部の陽極とストリツプ間に、めつき液
をストリツプ幅方向の速度分布を均一に供給でき
る流量調節用ヘツダーおよびノズルに関するもの
である。[Detailed Description of the Invention] <Industrial Application Field> The present invention is applied to an electroplating line for steel sheets.
This invention relates to a flow rate adjusting header and nozzle that can supply plating liquid between the anode and the strip in a plating cell section with a uniform velocity distribution in the width direction of the strip.
本発明は、めつき槽において、めつき液流速を
ストリツプの幅方向に均一にコントロールできる
ヘツダーおよびノズルを提供することを目的とし
て開発したものである。 The present invention was developed for the purpose of providing a header and a nozzle that can uniformly control the flow rate of the plating solution in the width direction of the strip in a plating tank.
第１図は、鋼板の電気めつきラインの例を示
す。ストリツプ１はペイオフリール２から払い出
され、脱脂槽６および酸洗槽７にてストリツプ表
面に付着している油脂等の不純物をクリーニング
した後、めつき槽８にてめつきされ、防錆等のた
めの後処理装置９を経てテンシヨンリール１２に
巻き取られ、めつき工程が完了する。 FIG. 1 shows an example of an electroplating line for steel sheets. The strip 1 is discharged from the payoff reel 2, and after cleaning impurities such as oils and fats adhering to the strip surface in a degreasing tank 6 and a pickling tank 7, it is plated in a plating tank 8 to prevent rust. It passes through a post-processing device 9 and is wound onto a tension reel 12, completing the plating process.
第２図から第４図には、めつき槽の例を示す。 Examples of plating tanks are shown in FIGS. 2 to 4.
第２図は水平セル、第３図は縦セル、第４図は
ラジアルセルをそれぞれ示している。すなわち、
走行する金属ストリツプ１を陰極に帯電させ、金
属ストリツプ１に対向して、走行方向に直角に設
けられた複数個の板状もしくは棒状の電極１４を
陰極に帯電させ、金属ストリツプ１と陽極１４間
に配設された、複数個のノズル１５よりめつき液
を供給して、金属ストリツプ１上にめつき金属を
析出させる装置が最近の電気めつきラインにおけ
るめつき槽である。陽極は、めつき液中にめつき
金属イオンを溶出するタイプの可溶性陽極と、め
つき液中にめつき金属イオンを溶出しないタイプ
の不溶性陽極の二種類ある。 FIG. 2 shows a horizontal cell, FIG. 3 shows a vertical cell, and FIG. 4 shows a radial cell. That is,
The running metal strip 1 is charged as a cathode, and a plurality of plate-shaped or rod-shaped electrodes 14 provided opposite to the metal strip 1 and perpendicular to the running direction are charged as cathodes, and the distance between the metal strip 1 and the anode 14 is charged as a cathode. A plating tank in a recent electroplating line is a device for depositing plating metal on the metal strip 1 by supplying plating liquid from a plurality of nozzles 15 arranged in the plating tank. There are two types of anodes: soluble anodes that elute plating metal ions into the plating solution, and insoluble anodes that do not elute plating metal ions into the plating solution.
一般に、金属ストリツプ表面に析出するめつき
金属の目付量は、ラインスピード、電流密度、め
つき液流速等によつて決るが、近年の高能率の電
気めつきラインにおいては、上記パラメーターは
いずれも比較的高い値をねらつており、ラインス
ピードが〜250m／min、電流密度は〜200A／ｄ
m2、めつき液流速は〜5m／sec程度である。 Generally, the basis weight of the plating metal deposited on the surface of the metal strip is determined by line speed, current density, plating solution flow rate, etc., but in recent high-efficiency electroplating lines, all of the above parameters have been compared. The line speed is ~250m/min, and the current density is ~200A/d.
m 2 , and the plating liquid flow rate is about 5 m/sec.
ここで、めつき品質上、めつき金属の目付量
は、金属ストリツプ幅方向にわたつて均一である
ことが必要である。ストリツプエツヂ部は他の部
分に比べて高電流密度になることから、めつき金
属がオーバーコートされ易いが、最近では、それ
を防止するために各種のエツヂマスク装置が考案
され、実用化されつつある。 Here, in terms of plating quality, it is necessary that the basis weight of the plating metal be uniform across the width direction of the metal strip. Since the current density is higher in the strip edge than in other parts, the plating metal is likely to be overcoated, but recently various edge mask devices have been devised and put into practical use to prevent this.
一方、めつき液についても、金属ストリツプの
幅方向に均一な速度で噴射されないと、目付量の
アンバランスの原因になる。 On the other hand, if the plating liquid is not sprayed at a uniform speed in the width direction of the metal strip, it will cause an imbalance in the basis weight.
第５図は従来のめつき液のノズルの一例を示
す。めつき液は、給液用ヘツダー１５を経てノズ
ル１６よりストリツプ１と陽極１４の間に、めつ
き時発生するO2ガス等を除去することを目的と
して、比較的高流速（１〜5m／sec程度）にて噴
射される。 FIG. 5 shows an example of a conventional plating liquid nozzle. The plating liquid is passed through the liquid supply header 15 and from the nozzle 16 between the strip 1 and the anode 14 at a relatively high flow rate (1 to 5 m/min) for the purpose of removing O 2 gas etc. generated during plating. sec).
第６図〜第８図には、第５図のＡ―Ａ方向から
見たノズル断面を示す。第６図は幅方向に一定の
断面積をもつノズルを、第７図は中央が狭く両端
が広い断面積を有するノズルを、第８図は幅方向
に分割されたノズル（断面積は一定もしくは可
変）をそれぞれ示す。 6 to 8 show cross sections of the nozzle viewed from the direction AA in FIG. 5. Figure 6 shows a nozzle with a constant cross-sectional area in the width direction, Figure 7 shows a nozzle with a narrow center and wide cross-sectional area at both ends, and Figure 8 shows a nozzle divided in the width direction (the cross-sectional area is constant or variable).
従来の装置は、ノズル幅方向の圧力損失が異な
るため、ノズル幅方向のめつき液流速が不均一に
なるという欠点を有していた。すなわち、第６図
に示す均一断面のノズルでは、ノズル中央部のめ
つき液流速がノズル両端のめつき液流速より高く
なりがちである。また、第７図に示すノズルで
は、特定の板厚の金属ストリツプでは比較的均一
な流速が得られる場合もあるが、金属ストリツプ
の板厚、板幅サイズが変わつた場合には、陽極と
金属ストリツプ間の幅方向の断面積分布が変るた
め、板幅方向のめつき液流速分布が変化するの
で、いろいろなサイズの金属ストリツプに適応で
きないという欠点を有していた。また、第８図に
示すものについても上記のことと同様の問題があ
る。 Conventional devices have had the disadvantage that the flow rate of the plating liquid in the nozzle width direction is non-uniform because the pressure loss in the nozzle width direction is different. That is, in the nozzle having a uniform cross section as shown in FIG. 6, the flow rate of the plating liquid at the center of the nozzle tends to be higher than the flow rate of the plating liquid at both ends of the nozzle. In addition, with the nozzle shown in Figure 7, a relatively uniform flow rate may be obtained with a metal strip of a certain thickness, but if the thickness or width of the metal strip changes, the anode and metal Since the cross-sectional area distribution in the width direction between the strips changes, the flow velocity distribution of the plating liquid in the board width direction changes, so it has the disadvantage that it cannot be applied to metal strips of various sizes. Further, the device shown in FIG. 8 also has the same problem as above.
最近の電気めつきラインでは、陽極と金属スト
リツプ間の極間距離は、低電力ロス、高電流密度
を指向して、10〜20mm程度に狭小化される傾向に
あり、板幅方向の均一流速を得るのはますます困
難になりつつある。 In recent electroplating lines, the distance between the anode and the metal strip tends to be narrowed to about 10 to 20 mm, aiming at low power loss and high current density. is becoming increasingly difficult to obtain.
〈発明の目的〉
本発明は、上述した種々の問題点を解決しよう
とするもので、特にめつきすべきストリツプの幅
方向のめつき液流速を均一にすることができるめ
つき液流速制御装置を提供することを目的とす
る。<Objective of the Invention> The present invention aims to solve the various problems mentioned above, and in particular provides a plating liquid flow rate control device that can make the plating liquid flow rate uniform in the width direction of the strip to be plated. The purpose is to provide
〈発明の構成〉
本発明によれば、走行する金属ストリツプを陰
極に帯電させ、金属ストリツプに対向して設けら
れた電極を陽極に帯電させ、金属ストリツプと陽
極の間に配設された少なくとも１個のノズルより
めつき液を供給して、金属ストリツプ上にめつき
金属を析出させる連続電気めつきラインにおい
て、前記ノズルに対応するめつき液給液ヘツダー
から給液管を複数本分岐させ、これら分岐したそ
れぞれの給液管の上流側には流量調節弁を、下流
側には整流板を取付け、前記複数本の給液管の他
端を前記ノズルのめつき液入側幅方向に連結した
ことを特徴とするめつき液流速制御装置が提供さ
れる。<Structure of the Invention> According to the present invention, a running metal strip is charged as a cathode, an electrode provided opposite to the metal strip is charged as an anode, and at least one electrode disposed between the metal strip and the anode is charged. In a continuous electroplating line that supplies plating liquid from several nozzles to deposit plating metal onto a metal strip, a plurality of liquid supply pipes are branched from the plating liquid supply header corresponding to the nozzle, and these A flow control valve was installed on the upstream side of each of the branched liquid supply pipes, a rectifying plate was installed on the downstream side, and the other ends of the plurality of liquid supply pipes were connected in the width direction of the plating liquid input side of the nozzle. A plating liquid flow rate control device is provided.
以下、本発明を更に詳細に説明する。 The present invention will be explained in more detail below.
本発明のめつき液噴射用ヘツダーおよびノズル
の構造、すなわち、めつき液流速制御装置を第９
図および第１０図に示す。第９図は本発明の装置
の側面図を、第１０図は第９図のＢ―Ｂ視図をそ
れぞれ示す。 The structure of the plating liquid injection header and nozzle of the present invention, that is, the plating liquid flow rate control device
and FIG. 10. FIG. 9 shows a side view of the device of the present invention, and FIG. 10 shows a BB view of FIG. 9.
ヘツダー１５から、幅方向に複数個に分割され
た給液管１９より流量調節弁１８を介してめつき
液を分配して供給し、各給液管１９内に整流板１
７を設けることにより、各給液管内の流量分布が
均一化され、さらに１体構造で作られたノズル１
６でめつき液を合流させる構造になつている。 Plating liquid is distributed and supplied from the header 15 through a flow rate control valve 18 from liquid supply pipes 19 divided into a plurality of parts in the width direction, and a rectifying plate 1 is supplied into each liquid supply pipe 19.
By providing the nozzle 7, the flow rate distribution in each liquid supply pipe is made uniform, and the nozzle 1 made of one piece structure is
The structure is such that the plating liquid is merged at 6.
ヘツダー１５からの給液管１９の分割数は、鋼
板ストリツプの板幅、板厚サイズによつて任意に
選定してよいが、分割数が多ければ多いほど、幅
方向の均一流速分布は得られ易い。 The number of divisions of the liquid supply pipe 19 from the header 15 may be arbitrarily selected depending on the width and thickness of the steel strip, but the greater the number of divisions, the more uniform flow velocity distribution in the width direction can be obtained. easy.
また、整流板１７としては、塩化ビニール、
SUS316、ゴムライニング品などを用いることが
できる。 Moreover, as the rectifying plate 17, vinyl chloride,
SUS316, rubber lined products, etc. can be used.
ここで、めつき液は、可溶性陽極に対しては塩
化物浴を、不溶性陽極に対しては硫酸塩浴を使用
する場合が一般的であり、いずれの場合もPHが１
〜４と低く、腐食性の液体であることから、本発
明のめつき液流速制御装置には、FRP材や天然
硬質ゴム等のライニングを採用することが必要で
あり、これらの耐食材料の採用によりめつき液に
対する耐久姓は十分保証することができる。 Here, the plating solution generally uses a chloride bath for soluble anodes and a sulfate bath for insoluble anodes, and in both cases, the pH is 1.
~4, and is a corrosive liquid. Therefore, it is necessary to use a lining made of FRP material, natural hard rubber, etc. in the plating liquid flow rate control device of the present invention. Therefore, durability against plating liquid can be fully guaranteed.
〈実施例〉
本発明のヘツダーおよびノズルを使用した場合
と、従来のノズルおよびヘツダーを使用した場合
の幅方向の流速分布の実測例を第１１図に示す。<Example> Fig. 11 shows an example of actual measurement of the flow velocity distribution in the width direction when using the header and nozzle of the present invention and when using the conventional nozzle and header.
実験条件は、ノズル幅：1000mm、液の平均流速
：3m／secに設定し、本発明の給液管の分割数
は３個にて、テストを行なつた結果、第６図に実
線で示す従来ノズルの幅方向の液流速変動
〔ｖ２−ｖ１／ｖ〕は20％程度あつたのに対し、第６図
に
点線で示す本発明のノズルの液流速変動
〔ｖ２′−ｖ１′／ｖ２〕は５％以下であり、本発明の
ヘツダー
およびノズルの液流速の制御性が優れていること
がわかる。なお、v1，v1′は最低流速、v2，v2′は
最高流速である。 The experimental conditions were as follows: nozzle width: 1000 mm, average liquid flow velocity: 3 m/sec, and the number of divisions of the liquid supply pipe of the present invention was 3. The test results are shown in the solid line in Figure 6. While the liquid flow velocity fluctuation in the width direction of the conventional nozzle [v 2 - v 1 /v] was about 20%, the liquid flow velocity fluctuation of the nozzle of the present invention shown by the dotted line in FIG. 6 was about 20% [v 2 '-v 1 ]. '/v 2 ] is 5% or less, which indicates that the header and nozzle of the present invention have excellent controllability of liquid flow rate. Note that v 1 and v 1 ′ are the minimum flow velocities, and v 2 and v 2 ′ are the maximum flow velocities.
また、本発明のノズルおよびヘツダーを電気め
つきラインに適用し、液流速以外の他のめつき条
件を同一にして、金属ストリツプの板幅方向のめ
つき金属の目付量の変動を調査した結果、５％以
下に収まり、本発明のノズルおよびヘツダーの有
効性が確認できた。 In addition, the nozzle and header of the present invention were applied to an electroplating line, and other plating conditions other than the liquid flow rate were kept the same, and variations in the basis weight of the plated metal in the width direction of the metal strip were investigated. , was below 5%, confirming the effectiveness of the nozzle and header of the present invention.
〈発明の効果〉
本発明においては、ヘツダーからノズルに至る
給液管を複数とし、この給液管の上流側には流量
調節弁を、下流側には整流板を取り付けることに
より、めつき液の流速をストリツプの幅方向に均
一にすることができる。また、めつき液流速の変
動が少なくなるため、めつき金属の目付量の変動
も少なくなる。<Effects of the Invention> In the present invention, a plurality of liquid supply pipes are provided from the header to the nozzle, and a flow rate control valve is installed on the upstream side of the liquid supply pipe, and a rectifier plate is installed on the downstream side of the liquid supply pipe. The flow velocity can be made uniform in the width direction of the strip. Further, since the variation in the flow rate of the plating liquid is reduced, the variation in the basis weight of the plating metal is also reduced.
第１図は一般的電気めつきラインの線図であ
る。第２図は水平型セル、第３図は縦型セル、第
４図はラジアル型セルの線図的断面図である。第
５図は従来のヘツダーおよびノズルの断面図であ
る。第６図、第７図および第８図は第５図のＡ―
Ａ視図であり、それぞれ、幅方向均一断面ノズ
ル、幅方向可変断面ノズルおよび幅方向分割ノズ
ルを有するヘツダーおよびノズルの正面図であ
る。第９図は本発明のめつき液流速制御装置の断
面図である。第１０図は第９図のＢ―Ｂ方向に見
た本発明のめつき液流速制御装置の平面図であ
る。第１１図は板幅方向のめつき液流速分布を示
すグラフである。
符号説明、１……ストリツプ、２……ペイオフ
リール、３……入側シヤー、４……ウエルダー、
５……入側ルーパー、６……脱脂装置、７……酸
洗装置、８……めつき槽、９……後処理装置、１
０……出側ルーパー、１１……出側シヤー、１２
……テンシヨンリール、１３……コンダクターロ
ール、１４……アノード、１５……ヘツダー、１
６……ノズル、１７……整流板、１８……流量調
節弁、１９……給液管。
FIG. 1 is a diagram of a typical electroplating line. FIG. 2 is a diagrammatic cross-sectional view of a horizontal cell, FIG. 3 is a vertical cell, and FIG. 4 is a radial cell. FIG. 5 is a sectional view of a conventional header and nozzle. Figures 6, 7, and 8 are A- in Figure 5.
FIG. 3 is a front view of a header and a nozzle having a widthwise uniform cross-section nozzle, a widthwise variable cross-section nozzle, and a widthwise divided nozzle, respectively. FIG. 9 is a sectional view of the plating liquid flow rate control device of the present invention. FIG. 10 is a plan view of the plating liquid flow rate control device of the present invention, viewed in the direction BB in FIG. 9. FIG. 11 is a graph showing the plating liquid flow velocity distribution in the board width direction. Code explanation, 1...Strip, 2...Payoff reel, 3...Entry side shear, 4...Welder,
5... Entrance looper, 6... Degreasing device, 7... Pickling device, 8... Plating tank, 9... Post-processing device, 1
0...Output looper, 11...Output shear, 12
...Tension reel, 13 ... Conductor roll, 14 ... Anode, 15 ... Header, 1
6... Nozzle, 17... Rectifying plate, 18... Flow control valve, 19... Liquid supply pipe.
Claims (1)
金属ストリツプに対向して設けられた電極を陽極
に帯電させ、金属ストリツプと陽極の間に配設さ
れた少なくとも１個のノズルよりめつき液を供給
して、金属ストリツプ上にめつき金属を析出させ
る連続電気めつきラインにおいて、前記ノズルに
対応するめつき液給液ヘツダーから給液管を複数
本分岐させ、これら分岐したそれぞれの給液管の
上流側には流量調節弁を、下流側には整流板を取
付け、前記複数本の給液管の他端を前記ノズルの
めつき液入側幅方向に連結したことを特徴とする
めつき液流速制御装置。1 Charge the running metal strip to the cathode,
An electrode provided facing the metal strip is charged as an anode, and a plating liquid is supplied from at least one nozzle disposed between the metal strip and the anode to deposit plating metal on the metal strip. In a continuous electroplating line, a plurality of liquid supply pipes are branched from the plating liquid supply header corresponding to the nozzle, and a flow rate control valve is installed on the upstream side of each of these branched liquid supply pipes, and a flow rate control valve is installed on the downstream side of each of these branched liquid supply pipes. A plating liquid flow rate control device, characterized in that a rectifying plate is attached, and the other ends of the plurality of liquid supply pipes are connected in the width direction of the plating liquid inlet side of the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19879384A JPS6176698A (en) | 1984-09-22 | 1984-09-22 | Device for controlling flow rate of plating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19879384A JPS6176698A (en) | 1984-09-22 | 1984-09-22 | Device for controlling flow rate of plating liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6176698A JPS6176698A (en) | 1986-04-19 |
| JPS6238438B2 true JPS6238438B2 (en) | 1987-08-18 |
Family
ID=16396997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19879384A Granted JPS6176698A (en) | 1984-09-22 | 1984-09-22 | Device for controlling flow rate of plating liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176698A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63255392A (en) * | 1987-04-13 | 1988-10-21 | Nkk Corp | Electroplating method and device |
| CN101498020B (en) | 2009-01-13 | 2012-10-03 | 江苏万基精密影像器材有限公司 | Electrolytic apparatus for aluminum base plate for printing |
| CN103834974B (en) * | 2012-11-20 | 2016-10-05 | 宝山钢铁股份有限公司 | One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device |
-
1984
- 1984-09-22 JP JP19879384A patent/JPS6176698A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6176698A (en) | 1986-04-19 |
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