JPS6238887B2 - - Google Patents
Info
- Publication number
- JPS6238887B2 JPS6238887B2 JP5500479A JP5500479A JPS6238887B2 JP S6238887 B2 JPS6238887 B2 JP S6238887B2 JP 5500479 A JP5500479 A JP 5500479A JP 5500479 A JP5500479 A JP 5500479A JP S6238887 B2 JPS6238887 B2 JP S6238887B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric ceramic
- composite
- plate
- block
- composite piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 45
- 239000002131 composite material Substances 0.000 claims description 31
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000010287 polarization Effects 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、圧電セラミツク板と抵抗体が端面で
接合された複合圧電セラミツク板の製造方法に関
するものであり、この複合圧電セラミツク板は、
共振子あるいはフイルタと抵抗体とを一枚の板に
形成した複合部品の形成に使用されるものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a composite piezoelectric ceramic plate in which a piezoelectric ceramic plate and a resistor are bonded at their end faces, and the composite piezoelectric ceramic plate includes:
It is used to form composite parts in which a resonator or filter and a resistor are formed on a single plate.
厚みたて振動および厚みすべり振動のいわゆる
厚み振動を利用した圧電共振子および圧電フイル
タは、1MHz以上の高周波領域で動作する無調整
小型部品として使用されている。そして、これら
の部品は回路において抵抗体と直列に並列に接続
して使用されることが多い。しかしながら、この
ように圧電共振子あるいは圧電フイルタにこれと
別体の抵抗体を外付けしていたのでは、回路の小
形化に対して非常に不利である。 Piezoelectric resonators and piezoelectric filters that utilize so-called thickness vibrations, such as vertical thickness vibrations and thickness shear vibrations, are used as small, non-adjustable components that operate in a high frequency range of 1MHz or higher. These components are often used in a circuit by being connected in series and parallel with a resistor. However, if a separate resistor is externally attached to the piezoelectric resonator or piezoelectric filter in this way, it is extremely disadvantageous to downsizing the circuit.
本発明の目的は、前述のような欠点をなくし、
非常に小形の複合部品を作製するのに適した複合
圧電セラミツク板の、簡易で量産性に富んだ製造
方法を提供しようとするものである。 The purpose of the present invention is to eliminate the above-mentioned drawbacks,
The present invention aims to provide a simple and mass-producible manufacturing method for a composite piezoelectric ceramic plate suitable for manufacturing extremely small composite parts.
以下、本発明の方法の一実施例について、第１
図および第２図を参照して説明する。 Hereinafter, the first embodiment of the method of the present invention will be described.
This will be explained with reference to the figures and FIG.
第１図において、複合圧電セラミツクブロツク
１００は、圧電セラミツクブロツク１とカーボン
抵抗体のブロツク２，３が、接着剤４，５でそれ
ぞれ接着され、一体化されているものである。こ
の複合圧電セラミツクブロツク１００を図のＸ−
X′面で所要の厚さで切断すれば、第２図に示す
ような、圧電セラミツク板６とカーボン抵抗体薄
板７とが端面で接合された複合圧電セラミツク板
２００が得られる。第２図の複合圧電セラミツク
板２００で、圧電セラミツク板６の振動姿態は、
第１図の圧電セラミツクブロツク１の分極方向に
よつて決定される。圧電セラミツクブロツク１の
分極方向が主面に対して垂直な場合および主面に
平行でかつＸ−X′切断面に平行な方向である場
合には、圧電セラミツク板６は厚みすべり振動が
励振される。同様に、圧電セラミツクブロツク１
の分極方向が主面に平行でかつＸ−X′切断面に
垂直な方向である場合には、圧電セラミツク板６
は厚みたて振動で励振される。 In FIG. 1, a composite piezoelectric ceramic block 100 is made up of a piezoelectric ceramic block 1 and carbon resistor blocks 2 and 3, which are bonded together with adhesives 4 and 5, respectively. This composite piezoelectric ceramic block 100 is
By cutting to a required thickness in the X' plane, a composite piezoelectric ceramic plate 200 as shown in FIG. 2 is obtained, in which the piezoelectric ceramic plate 6 and the carbon resistor thin plate 7 are joined at their end surfaces. In the composite piezoelectric ceramic plate 200 shown in FIG. 2, the vibration state of the piezoelectric ceramic plate 6 is as follows.
It is determined by the polarization direction of the piezoelectric ceramic block 1 shown in FIG. When the polarization direction of the piezoelectric ceramic block 1 is perpendicular to the main surface or parallel to the main surface and parallel to the X-X' section, thickness shear vibration is excited in the piezoelectric ceramic plate 6. Ru. Similarly, piezoelectric ceramic block 1
When the polarization direction of the piezoelectric ceramic plate 6 is parallel to the main surface and perpendicular to the X-X′ section,
is excited by vertical vibration.
前述のカーボン抵抗体は、170℃〜250℃の温度
で焼結されることが多く、この抵抗体の耐熱特性
は200℃程度となる。また、圧電セラミツクスの
耐熱特性を考慮すると、複合圧電ブロツクの形成
の際用いる接着剤４，５は、180℃以下で硬化ま
たは使用できるものを用いることが望ましい。 The aforementioned carbon resistor is often sintered at a temperature of 170°C to 250°C, and the heat resistance of this resistor is about 200°C. Furthermore, in consideration of the heat resistance properties of piezoelectric ceramics, it is desirable to use adhesives 4 and 5 that can be cured or used at temperatures below 180° C. for use in forming the composite piezoelectric block.
さらに、圧電セラミツクブロツク１とカーボン
抵抗体２，３の表面状態は通常異なつていて、圧
電セラミツクブロツク１の方が平滑であることが
多い。したがつて、接着時には、圧電セラミツク
ブロツク１とカーボン抵抗体２，３の接合する主
面を、2000番以下の粒径の大きい研磨剤であらし
て、粗面にしてから接着することが望ましい。 Furthermore, the surface conditions of the piezoelectric ceramic block 1 and the carbon resistors 2 and 3 are usually different, with the piezoelectric ceramic block 1 often being smoother. Therefore, at the time of bonding, it is desirable to roughen the main surfaces of the piezoelectric ceramic block 1 and the carbon resistors 2, 3 to be bonded with an abrasive with a large particle size of No. 2000 or less to make the surface rough before bonding.
以上のように、本発明の方法によれば、厚みす
べり振動あるいは厚みたて振動のいわゆる厚み振
動の圧電セラミツク板とカーボン抵抗体薄板とが
端面で接合され、一体化された複合圧電セラミツ
ク板を容易に得ることができる。 As described above, according to the method of the present invention, a piezoelectric ceramic plate of so-called thickness vibration of thickness shear vibration or thickness vertical vibration and a carbon resistor thin plate are joined at their end faces to form an integrated composite piezoelectric ceramic plate. can be obtained easily.
次に、本発明の方法について具体例をあげて説
明する。 Next, the method of the present invention will be explained using specific examples.
圧電セラミツクブロツクとして、主面に垂直方
向に100℃、5kV／mm、１時間の条件で分極され
た、チタン酸ジルコン酸マグネシウム酸鉛系の30
mm×40mm×３mmの材料を用いた。また、カーボン
抵抗体ブロツクには、30mm×40mm×１mmの寸法に
加工したものを二つ用いた。これら３個のブロツ
クを、両面研磨機を用いて、500番のアルミナ研
磨剤により各主面をあらした後、トリクロールエ
チレンを用いて超音波洗浄を行い、接着しやすい
ように前処理を行なつた。それからブロツクを２
液体のエポキシ系樹脂の接着剤を用いて150℃、
２時間の硬化条件で接着させ、30mm×40mm×５mm
の複合圧電セラミツクブロツクを得た。エポキシ
系樹脂の接着剤の厚みを10μｍ以下の非常に薄い
ものとした。この複合圧電セラミツクブロツクを
５mm×30mmの寸法の面に平行に200μｍの間隔
で、スライシングマシンによつて切断し、５mm×
30mm×0.2mmの複合圧電セラミツク板を約150枚得
た。このときの切断ロスは約10mmであつた。つぎ
に前記５mm×30mm×0.2mmの複合圧電セラミツク
板を５mmの辺に平行すなわち圧電セラミツク板と
抵抗体薄板とが接合されている方向に１mmの間隔
にダイシングマシンによつて切断し、１mm×５mm
×0.2mmの矩形の複合圧電セラミツク板を約20枚
得た。この複合圧電セラミツク板のセラミツク部
分の表裏両面に所要の電極を形成して、
10.7MHzのFM用の厚みすべり振動のセラミツク
フイルタを構成した。一方、抵抗体の部分の表裏
両面にも所要の電極を形成して、フイルタの周辺
回路の抵抗体を構成した。 As a piezoelectric ceramic block, 30% of lead-based titanate zirconate magnesium oxide was polarized perpendicularly to the main surface at 100℃, 5kV/mm, and for 1 hour.
A material measuring mm x 40 mm x 3 mm was used. Furthermore, two carbon resistor blocks processed into dimensions of 30 mm x 40 mm x 1 mm were used. Using a double-sided polisher, each main surface of these three blocks was roughened with No. 500 alumina abrasive, and then ultrasonically cleaned using trichlorethylene to pre-treat them for easy adhesion. Summer. Then block 2
150℃ using liquid epoxy resin adhesive,
Adhesive under curing conditions for 2 hours, 30mm x 40mm x 5mm
A composite piezoelectric ceramic block was obtained. The thickness of the epoxy resin adhesive is very thin, less than 10 μm. This composite piezoelectric ceramic block was cut by a slicing machine at intervals of 200 μm parallel to a surface with dimensions of 5 mm × 30 mm.
Approximately 150 composite piezoelectric ceramic plates measuring 30 mm x 0.2 mm were obtained. The cutting loss at this time was approximately 10 mm. Next, the 5 mm x 30 mm x 0.2 mm composite piezoelectric ceramic plate was cut using a dicing machine into 1 mm intervals parallel to the 5 mm sides, that is, in the direction in which the piezoelectric ceramic plate and the resistor thin plate were joined. 5mm
Approximately 20 rectangular composite piezoelectric ceramic plates measuring 0.2 mm were obtained. Required electrodes are formed on both the front and back sides of the ceramic part of this composite piezoelectric ceramic plate,
A ceramic filter with thickness shear vibration for 10.7MHz FM was constructed. On the other hand, necessary electrodes were also formed on both the front and back surfaces of the resistor portion to constitute the resistor of the peripheral circuit of the filter.
このようにして構成されたフイルタと抵抗体を
直列あるいは並列に接続して、FM中間周波数回
路に用いる複合圧電部品を作つた。この複合圧電
部品は非常に小形であり、前記30mm×40mm×５mm
の複合圧電セラミツクブロツクから約3000個の複
合部品が得られた。 By connecting the filter and resistor constructed in this way in series or parallel, we created a composite piezoelectric component for use in an FM intermediate frequency circuit. This composite piezoelectric component is extremely small, with a size of 30 mm x 40 mm x 5 mm.
Approximately 3000 composite parts were obtained from the composite piezoelectric ceramic block.
以上のように、本発明の方法によれば、複合部
品を量産するのに適した複合圧電セラミツク板を
容易に得ることができる。 As described above, according to the method of the present invention, a composite piezoelectric ceramic plate suitable for mass-producing composite parts can be easily obtained.
図面は本発明にかかる複合圧電セラミツク板の
製造方法の一実施例を説明するためのもので、第
１図は複合圧電セラミツクブロツクの一例を示す
斜視図、第２図は本発明によつて得られる複合圧
電セラミツク板の一例を示す斜視図である。
１……圧電セラミツクブロツク、２，３……カ
ーボン抵抗体ブロツク、４，５……接着剤、６…
…圧電セラミツク板、７，８……カーボン抵抗体
薄板、１００……複合圧電セラミツクブロツク、
２００……複合圧電セラミツク板。
The drawings are for explaining one embodiment of the method for manufacturing a composite piezoelectric ceramic board according to the present invention. FIG. 1 is a perspective view showing an example of a composite piezoelectric ceramic block, and FIG. FIG. 2 is a perspective view showing an example of a composite piezoelectric ceramic plate. 1... Piezoelectric ceramic block, 2, 3... Carbon resistor block, 4, 5... Adhesive, 6...
...Piezoelectric ceramic plate, 7, 8...Carbon resistor thin plate, 100...Composite piezoelectric ceramic block,
200...Composite piezoelectric ceramic plate.
Claims (1)
ブロツクとをあらかじめ粗面化した主面で、180
℃以下で硬化または使用できる接着剤を用いて接
着して一体化した複合圧電セラミツクブロツク
を、前記主面に対して垂直な方向に切断して、圧
電セラミツク板と板状カーボン抵抗体板とが端面
で接合した複合板を切り出すことを特徴とする複
合圧電セラミツク板の製造方法。1. The piezoelectric ceramic block and the carbon resistor block were roughened in advance on their main surfaces, and
A composite piezoelectric ceramic block that has been bonded and integrated using an adhesive that can be cured or used at temperatures below 30°F is cut in a direction perpendicular to the main surface to form a piezoelectric ceramic plate and a plate-like carbon resistor plate. A method for manufacturing a composite piezoelectric ceramic board, which comprises cutting out a composite board joined at its end faces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5500479A JPS55147017A (en) | 1979-05-04 | 1979-05-04 | Manufacture for composite piezo-electric ceramic plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5500479A JPS55147017A (en) | 1979-05-04 | 1979-05-04 | Manufacture for composite piezo-electric ceramic plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55147017A JPS55147017A (en) | 1980-11-15 |
| JPS6238887B2 true JPS6238887B2 (en) | 1987-08-20 |
Family
ID=12986501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5500479A Granted JPS55147017A (en) | 1979-05-04 | 1979-05-04 | Manufacture for composite piezo-electric ceramic plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55147017A (en) |
-
1979
- 1979-05-04 JP JP5500479A patent/JPS55147017A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55147017A (en) | 1980-11-15 |
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