JPS6240853B2 - - Google Patents
Info
- Publication number
- JPS6240853B2 JPS6240853B2 JP57025130A JP2513082A JPS6240853B2 JP S6240853 B2 JPS6240853 B2 JP S6240853B2 JP 57025130 A JP57025130 A JP 57025130A JP 2513082 A JP2513082 A JP 2513082A JP S6240853 B2 JPS6240853 B2 JP S6240853B2
- Authority
- JP
- Japan
- Prior art keywords
- shutter
- semiconductor wafer
- suction
- head
- forced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Manipulator (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Description
【発明の詳細な説明】
本発明は半導体ウエハーの吸着ヘツドの改良に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a suction head for semiconductor wafers.
最近半導体製造工程の自動化が推進され、ウエ
ハーをエピタキシヤル成長装置等へ配列する場合
に無接触でウエハーを搬送できる吸着ヘツドを用
いる。斯る吸着ヘツドは第１図に示す様に、ヘツ
ド１面に放射状に設けた吹出孔２から外周方向に
斜めに矢印の如くN2ガスを吹出して、ペルヌイ
の原理により半導体ウエハー３を非接触で吸着す
る。 Recently, automation of semiconductor manufacturing processes has been promoted, and when wafers are arranged in an epitaxial growth apparatus or the like, a suction head that can transfer the wafers without contact is used. As shown in Fig. 1, such a suction head blows out N2 gas diagonally in the direction of the arrow in the direction of the outer periphery from the blow-off holes 2 provided radially on one surface of the head, thereby non-contacting the semiconductor wafer 3 using Pernoulli's principle. Adsorb with.
斯る吸着ヘツドでは吹出孔２からのN2ガスが
ヘツド周辺に吹出されるので、すでに配列した半
導体ウエハー３等を移動させる欠点があり自動化
の利点が失なわれる。また半導体ウエハー３には
必ず位置合わせのためのフアセツトと呼ばれる切
欠き部があり、これに起因して半導体ウエハー３
がゆらいだり、回転してしまうので、位置がづれ
る欠点がありこれも自動化の利点を失う。 In such a suction head, since the N2 gas from the blow-off hole 2 is blown out around the head, there is a disadvantage that the semiconductor wafers 3, etc. that have already been arranged must be moved, and the advantage of automation is lost. In addition, the semiconductor wafer 3 always has a notch called a facet for positioning, and due to this, the semiconductor wafer 3
Since it sways or rotates, it has the disadvantage of shifting its position, which also loses the advantage of automation.
本発明は斯る欠点に鑑みてなされ、従来の欠点
を完全に除去した半導体ウエハーの吸着ヘツドを
提供するものである。以下に第２図および第３図
を参照して本発明の一実施例を詳述する。 The present invention has been made in view of these drawbacks and provides a suction head for semiconductor wafers that completely eliminates the conventional drawbacks. An embodiment of the present invention will be described in detail below with reference to FIGS. 2 and 3.
本発明に依る半導体ウエハーの吸着ヘツドはヘ
ツド本体１０、ヘツド本体１０の吸着面に設けた
複数のガスの吹出孔１１、本体１０の周端に設け
た複数のガスの吸込孔１２、ヘツド本体１０の周
辺に設けた強制シヤツター１３および自重シヤツ
ター１４より構成されている。 The suction head for semiconductor wafers according to the present invention includes a head main body 10, a plurality of gas blow-off holes 11 provided on the suction surface of the head main body 10, a plurality of gas suction holes 12 provided on the peripheral edge of the main body 10, and a head main body 10. It is composed of a forced shutter 13 and a self-weight shutter 14 provided around the periphery of the shutter.
ヘツド本体１０は表面をテフロン加工し、吸着
面に中心から少し離れたところに複数のガスの吹
出孔１１を放射状に設ける。なお吹出孔１１はガ
スを外周方向に吹き出す様に傾斜している。 The surface of the head body 10 is treated with Teflon, and a plurality of gas blow-off holes 11 are provided radially on the suction surface at positions slightly apart from the center. Note that the blowout holes 11 are inclined so as to blow out gas toward the outer circumference.
ガスの吸込孔１２は吹出孔１１の半径の延長上
に設けられ、対応する吹出孔１１との間に吸着面
に溝１５を設けてガス流を安定させる。 The gas suction holes 12 are provided on an extension of the radius of the blow-off holes 11, and a groove 15 is provided on the suction surface between the gas suction holes 12 and the corresponding blow-off holes 11 to stabilize the gas flow.
強制シヤツター１３は吸着された半導体ウエハ
ー１６の周端が当接し、吸着面との高さとの調整
を行い吸着力を調整する働きと、半導体ウエハー
１６の離脱時に強制的に下降させて吸着力から分
離し所定の位置に導く働きをする。 The forced shutter 13 has the function of adjusting the suction force by adjusting the height of the semiconductor wafer 16 that is attracted by the circumferential edge of the semiconductor wafer 16 that has been attracted to the suction surface, and also forcibly lowering the semiconductor wafer 16 when it is released to remove the attraction force. It functions to separate and guide it to a predetermined position.
自重シヤツター１４は自体の重さにより上下す
るもので、ウエハー１６の搬送時には自重シヤツ
ター１４は下降しガスを回収し易くし、ウエハー
１６の離脱時には自重シヤツター１４は載置台
（図示せず）は当接してなじみながら上昇し、隣
接ウエハー１６へのガスの影響を防止する。 The self-weight shutter 14 moves up and down depending on its own weight, and when the wafer 16 is being transported, the self-weight shutter 14 is lowered to make it easier to recover gas, and when the wafer 16 is removed, the self-weight shutter 14 moves from the mounting table (not shown). The wafer 16 rises while making contact with the wafer 16, thereby preventing the influence of the gas on the adjacent wafer 16.
なお吸着面の中心にはウエハー１６の吸着を検
出する発光受光センサー１７を設けている。 Note that a light emitting and receiving sensor 17 for detecting suction of the wafer 16 is provided at the center of the suction surface.
斯る本発明の吸着ヘツドに依れば、第３図の矢
印の如く、ガス導入口１８を経て吹出孔１１から
N2ガスを外周方向に傾斜して吹き出し、溝１５
を経て吸込口１２から真空に引いた排出口１９を
介してこのN2ガスを回収する安定したガス流に
よりベルヌイの原理で半導体ウエハー１６を吸着
する。この際半導体ウエハー１６の周端を強制シ
ヤツター１３頭部のテーパー面と接触させてウエ
ハー１６の回転を防止している。次に吸着ヘツド
を移動させて半導体ウエハー１６を搬送し、載置
台上まで動く。更に吸着ヘツドを下降させて前述
の如く自重シヤツター１４を載置台に当接させて
強制シヤツター１３を下降してウエハー１６を吸
着力より分離する。このとき半導体ウエハー１６
はその下部の空気抵抗によつて木の葉の如く移動
しようとするが、自重シヤツター１４で囲むこと
により空気抵抗が均一となり、強制シヤツター１
３により規制されて正確に所望の位置に載置され
る。 According to the adsorption head of the present invention, as shown by the arrow in FIG.
N2 gas is blown out at an angle toward the outer circumference, and the groove 15
The semiconductor wafer 16 is adsorbed using Bernoulli's principle by a stable gas flow that recovers this N 2 gas through the exhaust port 19 which is evacuated from the suction port 12 . At this time, the peripheral end of the semiconductor wafer 16 is brought into contact with the tapered surface of the head of the forced shutter 13 to prevent the wafer 16 from rotating. Next, the suction head is moved to transport the semiconductor wafer 16 and move it onto the mounting table. Furthermore, the suction head is lowered to bring the gravity shutter 14 into contact with the mounting table as described above, and the forced shutter 13 is lowered to separate the wafer 16 by the suction force. At this time, the semiconductor wafer 16
tries to move like a leaf due to the air resistance at the bottom, but by surrounding it with its own weight shutter 14, the air resistance becomes uniform, and the forced shutter 1
3 so that it can be accurately placed at a desired position.
以上に詳述した如く本発明に依れば、吸込孔で
ガスを完全に回収するために、すでに載置台に載
置した他の半導体ウエハーをガス流で移動させる
ことがない利点を有する。また強制シヤツターお
よび自重シヤツターにより半導体ウエハーを従来
の如く回転することなく吸着でき、且つ正確に載
置台上に載置できるので、半導体ウエハーの搬送
載置が完全に自動化できる。 As detailed above, according to the present invention, since the gas is completely recovered through the suction hole, there is an advantage that other semiconductor wafers already placed on the mounting table are not moved by the gas flow. In addition, the forced shutter and gravity shutter allow the semiconductor wafer to be picked up without rotating as in the prior art, and to be accurately placed on the mounting table, making it possible to completely automate the transportation and placement of the semiconductor wafer.
第１図は従来の吸着ヘツドを説明する断面図、
第２図および第３図は本発明の吸着ヘツドを説明
する上面図および断面図である。
主な図番の説明、１０はヘツド本体、１１は吹
出孔、１２は吸込孔、１３は強制シヤツター、１
４は自重シヤツター、１６は半導体ウエハーであ
る。
Figure 1 is a cross-sectional view illustrating a conventional suction head.
FIGS. 2 and 3 are a top view and a sectional view illustrating the suction head of the present invention. Explanation of the main drawing numbers: 10 is the head body, 11 is the blowout hole, 12 is the suction hole, 13 is the forced shutter, 1
4 is a dead weight shutter, and 16 is a semiconductor wafer.
Claims (1)
と、該吹出孔の延長上に設けた吸込口と、前記ヘ
ツドの全周にわたつて設けた強制シヤツタと、該
強制シヤツタの外側全周に前記強制シヤツタとは
独立してそれ自体の重さにより上下自在に可動す
る自重シヤツタとを具備し、前記吹出孔から前記
吸込孔へと流すガス流によつて半導体ウエハーの
周端を前記強制シヤツタの内側面に当接するよう
にして前記半導体ウエハーを吸着し、前記自重シ
ヤツタの先端部を前記半導体ウエハーの所定の載
置台の表面に当接させた状態で前記強制シヤツタ
を強制的に下降させることにより前記半導体ウエ
ハーを前記吸着から分離して前記所定の載置台へ
載置することを特徴とする半導体ウエハーの吸着
ヘツド。 ２ 特許請求の範囲第１項に於て、前記吹出孔か
ら吸込孔まで溝を設けガス流の経路を一定とした
ことを特徴とする半導体ウエハーの吸着ヘツド。[Scope of Claims] 1. A plurality of blow-off holes provided radially on the surface of the head, a suction port provided on an extension of the blow-off holes, a forced shutter provided over the entire circumference of the head, and the forced shutter provided over the entire circumference of the head. A self-gravity shutter is provided around the entire outer circumference of the shutter, which is movable up and down by its own weight independently of the forcible shutter, and the shutter is provided with a self-gravity shutter that can freely move up and down due to its own weight, and the semiconductor wafer is The semiconductor wafer is adsorbed so that the peripheral end is in contact with the inner surface of the forced shutter, and the forced shutter is moved with the tip of the dead weight shutter in contact with the surface of a predetermined mounting table for the semiconductor wafer. A suction head for a semiconductor wafer, characterized in that the semiconductor wafer is forcibly lowered to separate the semiconductor wafer from the suction and place it on the predetermined mounting table. 2. A suction head for semiconductor wafers according to claim 1, characterized in that a groove is provided from the blow-off hole to the suction hole so that a gas flow path is constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025130A JPS58141536A (en) | 1982-02-17 | 1982-02-17 | Attracting head of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57025130A JPS58141536A (en) | 1982-02-17 | 1982-02-17 | Attracting head of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58141536A JPS58141536A (en) | 1983-08-22 |
| JPS6240853B2 true JPS6240853B2 (en) | 1987-08-31 |
Family
ID=12157369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57025130A Granted JPS58141536A (en) | 1982-02-17 | 1982-02-17 | Attracting head of semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58141536A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010094786A (en) * | 2008-10-17 | 2010-04-30 | Ngk Spark Plug Co Ltd | Apparatus and method for non-contact transport of wiring board, and method of manufacturing resin wiring board |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58189535U (en) * | 1982-06-11 | 1983-12-16 | 日本電気株式会社 | Wafer suction device |
| US4474397A (en) * | 1982-11-16 | 1984-10-02 | International Business Machines Corporation | Pick-up head utilizing aspirated air flow |
| JPS6080876A (en) * | 1983-10-11 | 1985-05-08 | Fuji Xerox Co Ltd | Non-magnetic one-component developing device |
| JPS61140432A (en) * | 1984-12-11 | 1986-06-27 | Shinko Denki Kk | Holder of wafer or the like |
| DE3686781D1 (en) * | 1985-05-04 | 1992-10-29 | Seibu Giken Kk | DEVICE FOR HOLDING AND / OR PROMOTING A PLATE BY MEANS OF A FLUID WITHOUT PERSONAL TOUCH. |
| JPS6216924A (en) * | 1985-05-04 | 1987-01-26 | Seibu Giken:Kk | A method of suspending and suspending a plate-like object in a non-contact state using fluid |
| JPH0753543B2 (en) * | 1986-04-25 | 1995-06-07 | 株式会社日立製作所 | Plate-shaped transfer device |
| JP2747518B2 (en) * | 1988-12-09 | 1998-05-06 | 住友シチックス株式会社 | Wafer handling equipment |
| JP4249869B2 (en) * | 1999-12-22 | 2009-04-08 | 株式会社オーク製作所 | Substrate transfer device |
| KR100420983B1 (en) * | 2001-05-04 | 2004-03-02 | 주식회사 신성이엔지 | Hand of robot for transferring wafer |
| JP4043019B2 (en) * | 2002-04-26 | 2008-02-06 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP4538849B2 (en) * | 2005-05-31 | 2010-09-08 | 村田機械株式会社 | Non-contact holding device |
| JP4564022B2 (en) * | 2007-01-16 | 2010-10-20 | 東京エレクトロン株式会社 | Substrate transfer device and vertical heat treatment device |
| JP4926931B2 (en) * | 2007-12-14 | 2012-05-09 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP4926932B2 (en) * | 2007-12-14 | 2012-05-09 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP5178495B2 (en) * | 2008-12-22 | 2013-04-10 | 株式会社日立ハイテクノロジーズ | Sample transport mechanism and scanning electron microscope equipped with sample transport mechanism |
| ITUD20090042A1 (en) * | 2009-02-23 | 2010-08-24 | Applied Materials Inc | PINZA DI BERNOULLI |
| CN102332420B (en) * | 2011-05-25 | 2013-01-02 | 湖南红太阳光电科技有限公司 | Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc |
| JP2013004845A (en) * | 2011-06-20 | 2013-01-07 | Tokyo Electron Ltd | Separation system, separation method, program and computer storage medium |
| JP5951989B2 (en) * | 2011-12-28 | 2016-07-13 | 日本特殊陶業株式会社 | Non-contact transfer device, method for manufacturing wiring board |
| DE102012215798B4 (en) * | 2012-09-06 | 2016-08-11 | J. Schmalz Gmbh | area vacuum |
| KR101403458B1 (en) * | 2012-11-13 | 2014-06-30 | 삼성디스플레이 주식회사 | Apparatus for transfering substrate and processing substrate |
| JP2014123501A (en) * | 2012-12-21 | 2014-07-03 | Nissan Motor Co Ltd | Fuel cell separator adsorber |
| DE102017115738B4 (en) * | 2017-07-13 | 2021-07-22 | J. Schmalz Gmbh | Bernoulli gripper |
| TWI791561B (en) | 2017-07-21 | 2023-02-11 | 美商伊雷克托科學工業股份有限公司 | Non-contact handler and method of handling workpieces using the same |
| CN109461691A (en) * | 2017-09-06 | 2019-03-12 | 富士迈半导体精密工业（上海）有限公司 | Wafer support device |
| GB2584069B (en) * | 2019-03-27 | 2023-11-08 | Millitec Food Systems Ltd | Flow gripper |
| AU2020344932A1 (en) | 2019-09-10 | 2022-03-31 | A O Formaflon Swiss AG | Suction unit and suction device |
| CN110697418B (en) * | 2019-10-29 | 2021-12-07 | 台州市永安机械有限公司 | Non-contact sucking disc based on fluid pressure |
| JP7219426B2 (en) * | 2020-02-19 | 2023-02-08 | Smc株式会社 | Non-contact transfer device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51112463U (en) * | 1975-03-06 | 1976-09-11 | ||
| JPS5638454U (en) * | 1979-08-31 | 1981-04-11 |
-
1982
- 1982-02-17 JP JP57025130A patent/JPS58141536A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010094786A (en) * | 2008-10-17 | 2010-04-30 | Ngk Spark Plug Co Ltd | Apparatus and method for non-contact transport of wiring board, and method of manufacturing resin wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58141536A (en) | 1983-08-22 |
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