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JPS6241410B2 - - Google Patents
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JPS6241410B2 - - Google Patents

Info

Publication number
JPS6241410B2
JPS6241410B2 JP2918179A JP2918179A JPS6241410B2 JP S6241410 B2 JPS6241410 B2 JP S6241410B2 JP 2918179 A JP2918179 A JP 2918179A JP 2918179 A JP2918179 A JP 2918179A JP S6241410 B2 JPS6241410 B2 JP S6241410B2
Authority
JP
Japan
Prior art keywords
resin
coil
temperature
prepolymer
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2918179A
Other languages
Japanese (ja)
Other versions
JPS55121625A (en
Inventor
Yasuhiro Suzuki
Takamitsu Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2918179A priority Critical patent/JPS55121625A/en
Publication of JPS55121625A publication Critical patent/JPS55121625A/en
Publication of JPS6241410B2 publication Critical patent/JPS6241410B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12Insulating of windings
    • H01F41/127Encapsulating or impregnating

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulating Of Coils (AREA)

Description

【発明の詳細な説明】 この発明は樹脂成形されるコイルの製造方法に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a resin-molded coil.

従来から広く用いられている樹脂成形コイルの
製造方法は金型を用いた方法によるものである。
この方法は、金型内にコイルを静置し、エポキシ
樹脂などの樹脂(無溶剤ワニス)を含浸注型して
加熱炉中で硬化させた後、金型を取りはずし樹脂
成形コイルを得るものである。従つてこの方法で
は、コイル製造工程の最終段階まで高価な金型が
使用されたままで製造されるので、多数の金型を
用意しておく必要があり、極めて不経済である。
このことは多機種少量生産の場合特に顕著であ
る。さらに金型には、使用の都度離型剤を塗布す
るなど離型処理をしなければならないし、型ばら
しや再組立てなど煩雑な作業が多くあり、著しく
作業能率を低下させるなど欠点のあるものであつ
た。
A conventionally widely used method for manufacturing resin molded coils is a method using a mold.
In this method, a coil is placed in a mold, impregnated with a resin such as epoxy resin (solvent-free varnish) and cured in a heating furnace, and then the mold is removed to obtain a resin-molded coil. be. Therefore, in this method, an expensive mold is used until the final stage of the coil manufacturing process, and a large number of molds must be prepared, which is extremely uneconomical.
This is particularly noticeable in the case of high-mix, low-volume production. Furthermore, molds must be released each time they are used, such as by applying a mold release agent, and there are many complicated operations such as disassembling and reassembling the molds, which can significantly reduce work efficiency. It was hot.

このため、上記金型を使用せずに樹脂成形コイ
ルを合理的に製造する方法の出現には強い要望が
あり、このような要望を満たすために、例えば樹
脂含浸されたコイルを熱収縮フイルムでカバーす
る方法や、上記コイルにワツクスなどの固形状物
質を溶融して塗布する方法、さらには上記コイル
を回転させながら樹脂を硬化させる方法などが試
みられている。これらの製造方法はいずれも含浸
後コイルから流れ落ちる樹脂をどのように防ぐか
という問題に対処しようというものであるが、そ
れぞれ次に示すような欠点を有しており、広く実
用化されるまでには至つていない。その理由は、
コイルの含浸注型に使用される樹脂の特性のう
ち、特に加工作業面に要求される低粘度で、長い
可使時間を有するという特性より由来する制約が
上記改良技術では、コイルから樹脂洩れを防止す
ることができない点にある。
For this reason, there is a strong demand for the emergence of a method for rationally manufacturing resin-molded coils without using the above-mentioned molds. Attempts have been made to cover the coil, to melt and apply a solid substance such as wax to the coil, and to cure the resin while rotating the coil. All of these manufacturing methods attempt to deal with the problem of how to prevent resin from flowing out of the coil after impregnation, but each has the following drawbacks, and it has not been possible for them to be widely put into practical use. has not been reached yet. The reason is,
Among the characteristics of the resin used for coil impregnation casting, the limitations stem from the characteristics of low viscosity and long pot life, which are particularly required for processing surfaces. The point is that it cannot be prevented.

すなわち、コイル含浸注型用の樹脂は、電線や
各種の薄葉絶縁材などの構成要素からなる組織の
微細な空間隙を完全に、しかも短時間に満すこと
が要求されるから、低粘度であることが重要であ
る。さらに金型の省略を具現しようとするもので
あるから、被処理コイルは一般に多量の樹脂を満
した槽内で全含浸されることになり、適用される
樹脂としては繰返しの使用が安定した作業下で行
なわれることが重要で、かつ、長い可使時間を有
するものでなければならない。ところで、低粘度
化のためには反応性希釈剤を配合するシステムが
あるが、この反応性希釈剤を多量に添加すると硬
化物特性が悪くなり、例えばもろくて亀裂が生じ
易く、また熱変形温度が低下するなどの好ましく
ない傾向をもつようになる。従つて、希釈剤は添
加しないか、添加するとしても少量にし、樹脂自
体を中温程度に加熱することによつて低粘度にす
ることが多い。しかし、この場合には、可使時間
に対しては相反した条件がもち込まれたことにな
り、樹脂は短時間で増粘し、繰返しの使用ができ
なくなる。樹脂には通常硬化促進剤が配合されて
いるが、上記のような事態を避けるため、高温で
促進作用が生ずるような反応促進剤を用いるシス
テムとしている。しかしながら、このようなシス
テムでは当然樹脂の硬化反応は高温・長時間を要
するから、被処理コイルの大きい熱容量という条
件と相まつて加熱硬化時には樹脂の粘度が著しく
低下し、コイルから樹脂が洩れることを防止する
のは極めて困難になり、上述したような改善策を
もつてしても完全に樹脂の洩れを防止するまでに
は到底達するものではない。
In other words, the resin used for coil impregnation casting is required to completely fill the minute voids in the structures made up of components such as electric wires and various thin insulation materials, and in a short period of time. It is important that there be. Furthermore, since it is intended to eliminate the need for molds, the coil to be treated is generally completely impregnated in a tank filled with a large amount of resin, and the resin used is suitable for stable work that can be used repeatedly. It is important that the product is made at a low temperature and has a long pot life. By the way, in order to lower the viscosity, there is a system that mixes a reactive diluent, but if a large amount of this reactive diluent is added, the properties of the cured product deteriorate, for example, it becomes brittle and cracks easily, and the heat distortion temperature This leads to unfavorable trends such as a decrease in Therefore, the viscosity is often reduced by not adding a diluent, or by adding only a small amount, and by heating the resin itself to a medium temperature. However, in this case, contradictory conditions regarding pot life are introduced, and the resin thickens in a short period of time, making it impossible to use it repeatedly. A curing accelerator is usually blended into the resin, but in order to avoid the above-mentioned situation, the system uses a reaction accelerator that has an accelerating effect at high temperatures. However, in such a system, the curing reaction of the resin naturally requires a high temperature and a long period of time, which, combined with the large heat capacity of the coil to be treated, significantly reduces the viscosity of the resin during heating and curing, which prevents the resin from leaking from the coil. This becomes extremely difficult to prevent, and even with the above-mentioned improvement measures, it is far from possible to completely prevent resin leakage.

この発明は上記のような従来のものの欠点を除
去するためになされたもので、所望の性質を有す
るように配合調整された樹脂を製造工程の各段階
に活用することにより、金型を用いることなし
に、含浸されたコイルから樹脂が洩れることのな
い樹脂成形コイルが容易に製造できる方法を提供
することを目的としている。
This invention was made in order to eliminate the drawbacks of the conventional products as described above, and it is possible to use a mold by utilizing a resin blended and adjusted to have desired properties at each stage of the manufacturing process. It is an object of the present invention to provide a method for easily manufacturing a resin-molded coil in which resin does not leak from the impregnated coil without any process.

すなわち、この発明に用いられる樹脂の性質及
びこの樹脂を用いた樹脂成形コイルの製造工程の
骨子とするところについて説明すれば、まず、樹
脂の性質としては中温加熱によつて易液状化し、
中温域より低い温度の低温度(例えば常温域)で
は難流動性ないし半固形状を呈するような樹脂で
あつて光硬化性を有する樹脂を用いる。次に製造
工程としては、上記樹脂を充満した含浸槽などを
用いてコイルを中温加熱下で樹脂含浸(以下これ
を工程Aという)させた後、樹脂を低温域まで冷
却(以下これを工程Bという)し、次いで紫外線
照射を行つて表面層を硬化(以下これをB′工程と
いう)し、さらに加熱することによつて樹脂全体
の硬化処理(以下これをC工程という)を行うこ
とによつて樹脂成形コイルを得るものである。
That is, to explain the properties of the resin used in this invention and the gist of the manufacturing process of a resin-molded coil using this resin, first, the properties of the resin are that it becomes easily liquefied when heated at medium temperature;
A photocurable resin is used that exhibits difficulty in fluidity or a semi-solid state at low temperatures below the medium temperature range (for example, room temperature range). Next, in the manufacturing process, the coil is impregnated with resin under medium temperature heating using an impregnating bath filled with the above resin (hereinafter referred to as process A), and then the resin is cooled to a low temperature range (hereinafter referred to as process B). Then, the surface layer is cured by ultraviolet irradiation (hereinafter referred to as step B'), and the entire resin is cured by further heating (hereinafter referred to as step C). Then, a resin molded coil is obtained.

なお、この発明に好適に用いられる樹脂組成物
の例としては、低温域で固体の酸無水物を硬化剤
としたエポキシ樹脂に、光硬化性のモノマー又は
プレポリマー、あるいはモノマー及びプレポリマ
ーの混合物を15〜45重量%加え、さらに上記エポ
キシ樹脂の硬化促進剤と、上記光硬化性のモノマ
ー及び/又はプレポリマーの増感剤とをそれぞれ
少量ずつ添加し、低温域ではグリース状を、中温
域では低粘度液状(例えば100℃以下では10ポア
ズ以下)を呈する樹脂(無溶剤ワニス)系が、樹
脂成形コイルに要求される耐熱性、耐絶縁性、耐
力・耐摩耗性などの諸特性、あるいは価格の低廉
な点などを総合的に判断した場合、代表的なもの
として挙げられる。
Examples of resin compositions suitable for use in the present invention include epoxy resins that use solid acid anhydrides as curing agents at low temperatures, photocurable monomers or prepolymers, or mixtures of monomers and prepolymers. Add 15 to 45% by weight of In this case, a resin (solvent-free varnish) system that exhibits a low viscosity liquid state (for example, 10 poise or less at 100°C or lower) is required to meet the various properties required for resin molded coils, such as heat resistance, insulation resistance, strength, and abrasion resistance. If you evaluate it comprehensively in terms of its low price, etc., it can be cited as a typical product.

次にこの発明を具体的かつ詳細に説明する。工
程Aでは、上記樹脂組成物はほぼ60〜100℃に加
熱することによつて易液状化して低粘度となるも
のを用いればよく、コイルへの樹脂含浸性は良好
である。そして、この程度の中温加熱条件におい
ては樹脂の貯溜槽内寿命の面からは高温で促進作
用を有するものを樹脂成分の硬化促進剤として利
用すればよく、樹脂の槽内寿命を長くすることは
容易である。
Next, this invention will be explained specifically and in detail. In step A, the resin composition may be one that becomes easily liquefied and has a low viscosity when heated to about 60 to 100°C, and the resin composition has good impregnation into the coil. Under these medium-temperature heating conditions, in terms of the lifespan of the resin in the storage tank, it is sufficient to use a curing accelerator for the resin component that has an accelerating effect at high temperatures. It's easy.

次に、工程Bにおいては、樹脂が上記のような
特徴を有するものであるから、樹脂槽内では全体
の樹脂は硬化剤である酸無水物が冷却されること
により極微粒状となつて析出されることに由来
し、樹脂系としてはグリース状を呈しているの
で、含浸コイルを槽外に取出しても樹脂が洩れ出
てくることは完全に防止できる。なお、このと
き、コイル表面層のグリース状樹脂を必要によ
り、均一に平らな面にしたり、あるいは、本来樹
脂が付着しない方がよい部分(例えばコイル内面
部など)から付着樹脂を除去するなどの部分修正
は上記のように樹脂洩れがない状況を具現してい
るので容易に行なうことができる。
Next, in step B, since the resin has the above-mentioned characteristics, the entire resin is precipitated in the resin tank in the form of extremely fine particles as the acid anhydride, which is the hardening agent, is cooled. Because of this, the resin has a grease-like appearance, so even if the impregnated coil is taken out of the tank, leakage of the resin can be completely prevented. At this time, if necessary, the grease-like resin on the coil surface layer may be flattened evenly, or the adhered resin may be removed from areas where it is better not to have resin adhered (for example, the inner surface of the coil). Partial correction can be easily carried out because the situation is such that there is no resin leakage as described above.

次いで、ここで以下説明する工程B′を挿入す
る。すなわち、工程Bを経た樹脂含浸コイルの表
面や端面などコイル表面全体に紫外線などを照射
して表面を硬化させる。この場合、コイル表面は
白濁グリース状樹脂で被われており、その外観は
すりガラス状となり、紫外線照射によつて樹脂層
中の光硬化性成分をほぼ2〜5mmの厚さだけ硬化
することができる。この光照射後の樹脂層は光硬
化性成分の重合体中に熱硬化性のエポキシ樹脂成
分が閉じ込められたような状態となつて、樹脂層
の外観はグリース状から一挙に硬質皮革状ないし
はプラスチツク状に変化し、樹脂の流動性はさら
に無くなるので、樹脂洩れあるいは変形は全く防
止される。
Next, step B', which will be explained below, is inserted here. That is, the entire surface of the resin-impregnated coil that has gone through step B, including its surface and end surfaces, is irradiated with ultraviolet rays or the like to harden the surface. In this case, the coil surface is covered with a cloudy, grease-like resin, which has a frosted-glass appearance, and the photocurable component in the resin layer can be cured to a thickness of approximately 2 to 5 mm by UV irradiation. . After this light irradiation, the resin layer becomes in a state where the thermosetting epoxy resin component is trapped in the polymer of the photocurable component, and the appearance of the resin layer changes from a grease-like appearance to a hard leather-like or plastic-like appearance. Since the fluidity of the resin is further reduced, leakage or deformation of the resin is completely prevented.

さらに、この工程B′を経たコイルは次の工程C
に移行させ、高温(例えば130〜150℃)下で本硬
化させるが、このときにも樹脂の洩れは完全に防
止できるものである。
Furthermore, the coil that has gone through this process B' is then processed through the next process C.
The resin is cured at high temperatures (for example, 130 to 150°C), but even at this time, leakage of the resin can be completely prevented.

このようにこの発明は樹脂組成分の特性をコイ
ル製造工程の各段階において有効に活用するプロ
セスと一体化することによつて、従来方法におけ
る諸欠点を解決した合理的な樹脂成形コイルの製
造方法を提供するものである。
In this way, the present invention provides a rational method for manufacturing resin-molded coils that solves the drawbacks of conventional methods by integrating the characteristics of the resin composition into a process that effectively utilizes the characteristics of the resin composition at each stage of the coil manufacturing process. It provides:

次にこの発明に好適に用いられる樹脂系の各組
成分について説明する。エポキシ樹脂としては、
分子中に2個以上のオキシラン環を有するもの
で、例えばビスフエノールAのジブリシジルエー
テル、脂環式エポキシ、ノボラツク形エポキシな
どがあり、これに常温で固体の酸無水物、例えば
無水フタル酸、無水テトラヒドロフタル酸、無水
コハク酸、無水マレイン酸、無水ヘキサヒドロフ
タル酸などを単独又は混合系で配合したものであ
る。また、硬化促進剤としては、三弗化ホウ素の
アミン錯体、トリ−(ジメチルアミノメチル)フ
エノール及びその塩、α−メチルベンジルジメチ
ルアミンなどの第3級アミン類、さらにはオクチ
ル酸亜鉛、オクチル酸コバルトなどの遷移金属の
塩もしくは錯体を、通常0.1〜3phr(所定の物質
100gに対して添加する物質の重量)添加すれば
よい。光硬化性のモノマー及び/又はプレポリマ
ーとしては、分子中に重合性不飽和基を1個以上
有する化合物、例えばエチレングリコールジ(メ
タ)アクリルエステル、プロピレングリコールジ
(メタ)アクリルエステル、ネオペンチルグリコ
ールジ(メタ)アクリルエステル、トリメチロー
ルプロパントリ(メタ)アクリレートなど高沸点
で、かつ低粘度の多官能性モノマーを単独で、又
は混合系で、さらにはポリエステルポリオールと
(メタ)アクリル酸との縮合物、エポキシアクリ
レートなどのプレポリマーを単独で、又は上記モ
ノマーとの併用系で用いる。さらにまた、(メ
タ)アクリル酸アルキル(例えばトリデシル、ス
テアリルなど)、グリシジル(メタ)アクリレー
ト、グリコールのモノ(メタ)アクリレート、ス
チレン、ビニルトルエンなどビニルモノマーと上
記多官能性モノマー又はプレポリマーとの混合系
で用いることなどが挙げられる。またこれら光硬
化性のモノマー及び/又はプレポリマーに添加す
る増感剤としては、特定波長域の光でラジカルを
発生するような化合物、例えばベンゾインメチル
エーテル、ベンゾインエチルエーテル、ベンゾイ
ンイソブチルエーテルなどカルボキシル化合物、
アントラキノン、ベンゾキノン、ナフトキノンな
どキノン系化合物、ジフエニルジスルフイドなど
スルフイド化合物を通常0.01〜5重量%配合すれ
ばよい。
Next, each component of the resin system suitably used in this invention will be explained. As an epoxy resin,
Those having two or more oxirane rings in the molecule, such as dibricidyl ether of bisphenol A, alicyclic epoxy, novolac type epoxy, etc., and acid anhydrides that are solid at room temperature, such as phthalic anhydride, Tetrahydrophthalic anhydride, succinic anhydride, maleic anhydride, hexahydrophthalic anhydride, etc. are blended singly or in a mixed system. In addition, as curing accelerators, amine complexes of boron trifluoride, tri-(dimethylaminomethyl)phenol and its salts, tertiary amines such as α-methylbenzyldimethylamine, zinc octylate, octylic acid Salts or complexes of transition metals such as cobalt are usually added from 0.1 to 3 phr (for a given substance
The weight of the substance to be added per 100g) can be added. Photocurable monomers and/or prepolymers include compounds having one or more polymerizable unsaturated groups in the molecule, such as ethylene glycol di(meth)acrylic ester, propylene glycol di(meth)acrylic ester, and neopentyl glycol. Condensation of polyfunctional monomers with high boiling points and low viscosity, such as di(meth)acrylic ester and trimethylolpropane tri(meth)acrylate, alone or in a mixed system, and also with polyester polyol and (meth)acrylic acid. Prepolymers such as monomers and epoxy acrylates are used alone or in combination with the above monomers. Furthermore, a mixture of vinyl monomers such as alkyl (meth)acrylates (e.g. tridecyl, stearyl, etc.), glycidyl (meth)acrylate, mono(meth)acrylate of glycol, styrene, vinyltoluene, etc. with the above polyfunctional monomer or prepolymer. For example, it can be used in a system. Sensitizers added to these photocurable monomers and/or prepolymers include compounds that generate radicals when exposed to light in a specific wavelength range, such as carboxyl compounds such as benzoin methyl ether, benzoin ethyl ether, and benzoin isobutyl ether. ,
Quinone compounds such as anthraquinone, benzoquinone and naphthoquinone, and sulfide compounds such as diphenyl disulfide may be blended in an amount of usually 0.01 to 5% by weight.

このような各組成分による樹脂は上記酸無水物
硬化型エポキシ樹脂に光硬化性のモノマー及び/
又はプレポリマーを15〜45重量%、好ましくは20
〜35重量%配合することによつて得られる。な
お、上記モノマー及び/又はプレポリマーの配合
量が少ない場合には、上述した工程Cに移行させ
るとき、主剤である上記エポキシ樹脂の洩れが発
生することがあり、例えば静止状態で本硬化させ
ることができず、被処理物を回転させて硬化させ
るなど作業が煩雑となつて好ましくない。逆に、
上記モノマー及び/又はプレポリマーの配合量が
多すぎる場合には上述した工程Bの段階で樹脂系
を、例えばグリース状まで増粘ないし半固形状に
するためにかなり低温にまで冷却しなければなら
ず、高温度の作業環境のような場所では水分が樹
脂槽内や被処理物に露結し、硬化特性に悪影響を
及ぼすようになり好ましくない。従つて上記のよ
うな配合域から添加量を決めればよい。
Resins made from each of these compositions include the above acid anhydride-curable epoxy resin, a photocurable monomer and/or
or 15 to 45% by weight of prepolymer, preferably 20
It can be obtained by blending up to 35% by weight. In addition, if the blending amount of the monomer and/or prepolymer is small, the epoxy resin, which is the main ingredient, may leak when moving to the above-mentioned step C. This is not preferable because it makes the work such as rotating and curing the object complicated. vice versa,
If the amount of the above-mentioned monomer and/or prepolymer is too large, the resin system must be cooled to a considerably low temperature in Step B, for example, in order to thicken it to a grease-like state or make it semi-solid. First, in places such as high-temperature work environments, moisture condenses in the resin tank or on the objects to be treated, which is undesirable since it has an adverse effect on the curing characteristics. Therefore, the amount to be added may be determined from the above-mentioned blending range.

次にこの発明を実施するプロセスについて説明
する。樹脂槽には加温及び冷却させる機能と、真
空及び加圧する機構とを付備させておき、工程A
の樹脂含浸と工程Bの冷却を迅速に行なえるよう
にする。また、工程B′の光照射における光源とし
ては紫外線を効率よく発生するものであればよ
く、例えば低圧水銀灯、高圧ないし超高圧水銀
灯、殺菌灯、クセノンランプ、さらには太陽光な
どいずれも利用することができる。これらの紫外
線発生源は被処理物全面に照射できるように配置
の仕方や数などを適宜調整できるものとする。ま
た、被処理物を回転治具などに取付けて回転させ
ながら光照射を行なつたり、さらにはこの照射時
に雰囲気を炭酸ガスやチツ素ガスなどの不活性ガ
スに置換するなどすれば、光硬化を効果的に行な
うことができて好ましい。
Next, a process for implementing this invention will be described. The resin tank is equipped with a heating and cooling function and a vacuum and pressurizing mechanism.
To enable rapid resin impregnation and cooling in step B. In addition, the light source for the light irradiation in step B' may be any source that efficiently generates ultraviolet rays, such as low-pressure mercury lamps, high-pressure or ultra-high-pressure mercury lamps, germicidal lamps, xenon lamps, and even sunlight. Can be done. The arrangement and number of these ultraviolet radiation sources can be adjusted as appropriate so that the entire surface of the object to be treated can be irradiated. In addition, photocuring can be achieved by attaching the workpiece to a rotating jig and irradiating it with light while rotating it, or by replacing the atmosphere with an inert gas such as carbon dioxide or nitrogen gas during the irradiation. This is preferable because it can be carried out effectively.

以上のようにこの発明によれば、中温下で樹脂
含浸された後、低温域まで冷却された被処理物は
チキソトロピツクなグリース状の樹脂が含浸及び
皮覆された状況を呈しているので、そのまま放置
しても樹脂洩れがなく、従つてこの段階で被処理
物の美粧策、例えばコイル仕上りをよくするため
に表面を平らにする作業などを必要に応じて施す
ことも容易に行なうことができる。また、上記光
照射の工程において、例えば被処理物が高重量物
であるような場合には光源側を搬送可能にして光
照射したり、さらには、被処理物を回転可能なシ
ステムとして全体に光照射することもできる。こ
の光照射の工程を経た被処理物は、次の高温加熱
し、本硬化させる工程へ移すが、被処理物の表面
層はすでに樹脂がグリース状から固体状に変化し
ているので、回転乾燥などを行なわなくても静止
状態で本硬化させることができ、樹脂成形された
コイルを得ることができる。
As described above, according to the present invention, the workpiece that has been impregnated with resin at medium temperature and then cooled to a low temperature range is impregnated and coated with a thixotropic grease-like resin, so it remains as it is. There is no resin leakage even if the coil is left alone, so it is easy to apply cosmetic measures to the treated object at this stage, such as flattening the surface to improve the finish of the coil, if necessary. . In addition, in the above light irradiation process, if the object to be treated is heavy, for example, the light source side may be transportable for light irradiation, or the entire object may be rotated as a system. Light irradiation is also possible. The workpiece that has undergone this light irradiation process is heated to a high temperature and transferred to the main curing process, but since the resin on the surface layer of the workpiece has already changed from a grease-like state to a solid state, the workpiece is rotated and dried. It is possible to carry out the main curing in a stationary state without performing any other steps, and it is possible to obtain a resin-molded coil.

以下、この発明の一実施例を示す。 An embodiment of this invention will be shown below.

実施例 1 樹脂として低分子量ビスA型エポキシ樹脂(エ
ピコート828:シエル化学商品名、以下同じ)に
テトラヒドロ無水フタル酸80phr及びオクチル酸
亜鉛3phrを100℃程度に加温して均質溶解したエ
ポキシ樹脂を調合し、このエポキシ樹脂にトリメ
チロールプロパントリアクリレートを25重量%及
びベンゾインエチルエーテル4重量%を配合した
ものを用いる。この樹脂は60℃では粘度70センチ
ポアズの淡黄色透明液体で、30℃に冷却したとこ
ろ流動性の乏しい白濁グリース状になつた。
Example 1 As a resin, an epoxy resin was prepared by homogeneously dissolving 80 phr of tetrahydrophthalic anhydride and 3 phr of zinc octylate in a low molecular weight bis A type epoxy resin (Epicote 828: Ciel Chemical trade name, the same applies hereinafter) by heating it to about 100°C. This epoxy resin is mixed with 25% by weight of trimethylolpropane triacrylate and 4% by weight of benzoin ethyl ether. This resin was a pale yellow, transparent liquid with a viscosity of 70 centipoise at 60°C, and when cooled to 30°C, it became a cloudy, cloudy grease with poor fluidity.

素コイルを、加熱及び冷却させる機能を付設し
た真空含浸槽に入れ、次に上記樹脂を充填して60
〜70℃の中温下で樹脂含浸した後、この含浸槽を
冷却し槽内温度がほぼ30℃になつた時点でコイル
を取出した。このコイルはグリース状樹脂で全表
面が包まれた外観を示していた。次にこのコイル
表面のグリース状樹脂の波状のしわを除去するた
めに、コイルを回転治具に取付けてゆるやかに回
転させながらへら状治具を当てがつて平らにし
た。これらの工程中に、コイルから樹脂が洩れて
くることはなかつた。
The raw coil was placed in a vacuum impregnation tank equipped with heating and cooling functions, then filled with the above resin and heated for 60 minutes.
After resin impregnation at a medium temperature of ~70°C, the impregnation tank was cooled and the coil was taken out when the temperature inside the tank reached approximately 30°C. This coil appeared to have its entire surface covered with a grease-like resin. Next, in order to remove the wavy wrinkles in the grease-like resin on the surface of the coil, the coil was attached to a rotating jig and gently rotated, while a spatula-shaped jig was applied to flatten the coil. During these steps, no resin leaked from the coil.

次いで、出力8KWの超高圧水銀灯の下15cmの
距離で上記コイル全面に紫外線照射を5分間行な
つた。この工程を経たコイルは表面層約3mmが固
相状となつており、外観は淡黄白濁の硬質皮革状
である。次に、このコイルを150℃の加熱炉中で
静止状態にして10時間熱硬化したところ、樹脂洩
れなどの問題はなく良好な樹脂成形コイルが得ら
れた。
Next, the entire surface of the coil was irradiated with ultraviolet rays for 5 minutes at a distance of 15 cm under an ultra-high pressure mercury lamp with an output of 8 KW. The coil that has undergone this process has a surface layer of about 3 mm in solid phase, and has a pale yellowish-white, hard leather-like appearance. Next, when this coil was kept stationary in a heating furnace at 150°C and thermally cured for 10 hours, a good resin-molded coil was obtained with no problems such as resin leakage.

実施例 2 樹脂としてエピコート828にテトラヒドロ無水
フタル酸40phrとヘキサヒドロ無水フタル酸
40phrと三弗化ホウ素モノエチルアミン1phrを80
〜90℃に加温して均質溶解したエポキシ樹脂を調
合し、このエポキシ樹脂にネオペンチルグリコー
ルジアクリレート10重量%およびエポキシアクリ
レート(エピコート828を1モルとメタクリル酸
を2モルの付加物)15重量%とベンゾインイソブ
チルエーテル4重量%を配合したものを用いた。
この樹脂は60℃では粘度100センチポアズの淡黄
色透明液体で、20℃に冷却したところ白濁グリー
ス状となつた。
Example 2 40 phr of tetrahydrophthalic anhydride and hexahydrophthalic anhydride in Epicote 828 as resin
40phr and boron trifluoride monoethylamine 1phr 80
Mix an epoxy resin homogeneously dissolved by heating to ~90°C, and add 10% by weight of neopentyl glycol diacrylate and 15% by weight of epoxy acrylate (adduct of 1 mole of Epicote 828 and 2 moles of methacrylic acid) to this epoxy resin. % and 4% by weight of benzoin isobutyl ether was used.
This resin was a pale yellow transparent liquid with a viscosity of 100 centipoise at 60°C, and when cooled to 20°C it became cloudy and grease-like.

第1の素コイルを、加熱及び冷却させる機能を
付設した真空含浸槽に入れ、次に上記樹脂を充填
して60〜70℃の中温下で樹脂含浸した後、この含
浸槽を冷却し槽内温度がほぼ20℃になつた時点で
コイルを取出し、グリース状樹脂で包まれたこの
コイルを回転治具に取付け静止させたまま放置し
ておいた。次に、第2の素コイルを上記第1のコ
イルと同様に樹脂処理を行なつた後、冷却し、含
浸槽から取出した。この間放置状態にあつた第1
のコイルからは何ら樹脂洩れは認められなかつ
た。
The first coil is placed in a vacuum impregnation tank equipped with heating and cooling functions, then filled with the above resin and impregnated with the resin at a medium temperature of 60 to 70°C. When the temperature reached approximately 20°C, the coil was removed, and the coil wrapped in grease-like resin was attached to a rotating jig and left stationary. Next, the second coil was treated with a resin in the same manner as the first coil, cooled, and taken out from the impregnation tank. The first one, which had been abandoned for a while,
No resin leakage was observed from the coil.

次いでこれら第1及び第2のコイルを同時に実
施例1と同様に紫外線照射し、さらに加熱硬化さ
せて良好な樹脂成形コイルが得られた。
Next, these first and second coils were simultaneously irradiated with ultraviolet rays in the same manner as in Example 1, and further heat-cured to obtain a good resin-molded coil.

比較例 樹脂としてエピコート828に液状酸無水物であ
るHN−2200(日立化成商品名)を80phr、及び
ベンジルジメチルアミンを1phr配合したものを
用いた。この樹脂は75℃で粘度80センチポアズ、
25℃で950センチポアズであつた。
Comparative Example As a resin, a mixture of Epicote 828, 80 phr of liquid acid anhydride HN-2200 (trade name of Hitachi Chemical), and 1 phr of benzyldimethylamine was used. This resin has a viscosity of 80 centipoise at 75°C.
It was 950 centipoise at 25°C.

素コイルを、実施例1と同様の樹脂含浸槽に入
れ、上記樹脂を75℃の中温下で真空含浸させた。
このコイルを直ちに含浸槽から取出したところ激
しい樹脂洩れが生じた。また、上記と同様75℃の
中温下で含浸させた後、この含浸槽を冷却し、槽
内温度が25℃になつた時点でコイルを取出しても
樹脂洩れは著しいものであつた。これらのコイル
を150℃の加熱炉中で静止状態にし熱硬化したと
ころ、多量の樹脂洩れがあり、絶縁組織にボイド
や空隙が発生していた。
The raw coil was placed in the same resin impregnation tank as in Example 1, and vacuum impregnated with the resin at a medium temperature of 75°C.
When this coil was immediately removed from the impregnation bath, severe resin leakage occurred. Further, after impregnating at a medium temperature of 75°C as described above, the impregnation tank was cooled and the coil was removed when the temperature inside the tank reached 25°C, but resin leakage was still significant. When these coils were kept stationary in a heating furnace at 150°C and thermally cured, a large amount of resin leaked, and voids and voids were generated in the insulation structure.

Claims (1)

【特許請求の範囲】 1 中温加熱によつて易液状化し、低温域では難
流動性ないし半固形状を呈しかつ光硬化性を有す
る樹脂を、槽内において中温加熱下でコイルに含
浸させた後、上記樹脂を低温域まで冷却し、次い
で槽内から取出したコイルに紫外線を照射するこ
とによつて表面層を硬化させ、さらに高温加熱す
ることを特徴とする樹脂成形コイルの製造方法。 2 樹脂は、常温で固体の酸無水物を硬化剤とし
たエポキシ樹脂に、光硬化性のモノマー又はプレ
ポリマー15〜45重量%を加え、さらに上記エポキ
シ樹脂の硬化促進剤と上記モノマー又はプレポリ
マーの増感剤とをそれぞれ少量ずつ添加し、常温
ではグリース状を、中温では低粘度液状を呈する
組成物とした特許請求の範囲第1項記載の樹脂成
形コイルの製造方法。 3 樹脂は、常温で固体の酸無水物を硬化剤とし
たエポキシ樹脂に、光硬化性のモノマー及びプレ
ポリマー15〜45重量%を加え、さらに上記エポキ
シ樹脂の硬化促進剤と上記モノマー及びプレポリ
マーの増感剤とをそれぞれ少量ずつ添加し、常温
ではグリース状を、中温では低粘度液状を呈する
組成物とした特許請求の範囲第1項記載の樹脂成
形コイルの製造方法。
[Claims] 1. After impregnating a coil with a resin that becomes easily liquefied when heated at medium temperature, exhibits difficulty in flowing or semi-solid at low temperatures, and has photocurability in a tank while heating at medium temperature. . A method for producing a resin molded coil, which comprises cooling the resin to a low temperature range, then curing the surface layer by irradiating the coil taken out from the tank with ultraviolet rays, and further heating at a high temperature. 2. The resin is made by adding 15 to 45% by weight of a photocurable monomer or prepolymer to an epoxy resin using an acid anhydride that is solid at room temperature as a curing agent, and then adding a curing accelerator for the epoxy resin and the monomer or prepolymer. 2. The method for producing a resin molded coil according to claim 1, wherein a small amount of a sensitizer and a sensitizer are added to form a composition that exhibits a grease-like state at room temperature and a low-viscosity liquid state at medium temperature. 3. The resin is made by adding 15 to 45% by weight of a photocurable monomer and a prepolymer to an epoxy resin using an acid anhydride as a curing agent that is solid at room temperature, and then adding a curing accelerator for the epoxy resin and the monomer and prepolymer. 2. The method for producing a resin molded coil according to claim 1, wherein a small amount of a sensitizer and a sensitizer are added to form a composition that exhibits a grease-like state at room temperature and a low-viscosity liquid state at medium temperature.
JP2918179A 1979-03-13 1979-03-13 Manufacture of resin molded coil Granted JPS55121625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2918179A JPS55121625A (en) 1979-03-13 1979-03-13 Manufacture of resin molded coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2918179A JPS55121625A (en) 1979-03-13 1979-03-13 Manufacture of resin molded coil

Publications (2)

Publication Number Publication Date
JPS55121625A JPS55121625A (en) 1980-09-18
JPS6241410B2 true JPS6241410B2 (en) 1987-09-02

Family

ID=12269036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2918179A Granted JPS55121625A (en) 1979-03-13 1979-03-13 Manufacture of resin molded coil

Country Status (1)

Country Link
JP (1) JPS55121625A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475119A (en) * 1987-09-18 1989-03-20 Mitsubishi Heavy Ind Ltd Tension roller leveler

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4331086A1 (en) * 1993-09-11 1995-03-16 Herberts Gmbh Process for the fixation of wound goods with radically polymerizable masses

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475119A (en) * 1987-09-18 1989-03-20 Mitsubishi Heavy Ind Ltd Tension roller leveler

Also Published As

Publication number Publication date
JPS55121625A (en) 1980-09-18

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