JPS6243360B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a bonder head for mounting a reflow chip. A reflow chip is a process in which a solder layer is formed in advance on the surface of a board such as a printed circuit board, and a current is passed through the chip while the heat generating part is brought into contact with the solder layer and the solder layer is melted by Joule heat to attach the component to the board. It is fixed by soldering.

Conventionally, a reflow chip is attached to a shank holder of a head, and two power supply cables (a positive electrode and a negative electrode) are connected to the shank holder, as shown by broken lines in FIG. This cable must have a large cross-section because the current that must be supplied to the chip is quite large (100-200 amperes) and the voltage drop is to be kept low. However, a cable with a large cross-sectional area has a high rigidity, and therefore, when the head is rotated for use, the cable is twisted and cannot be rotated smoothly. Furthermore, since the cable is attached near the chip (shank holder), there is a problem in that the cable narrows the field of view for bonding work, making the work difficult.

SUMMARY OF THE INVENTION An object of the present invention is to provide a structure of a bonder head that facilitates rotation and movement of the bonder head for attaching a reflow chip, and widens the working field of view to facilitate bonding work.

Hereinafter, the present invention will be explained in detail with reference to the drawings.

In FIG. 1, an insulating tube 2 is provided on the outside of a pipe-like shaft 1, and a pipe-like shaft 3 is further provided on the outside. These shafts 1, 3 are insulated from each other by an insulating tube 2. These shafts 1 and 3 are supported by an insulating head body 4 so that they can rotate together. A shank holder 5 is connected to the lower end of the shaft 1 projecting downward from the shaft 3, and a shank holder 6 is connected to the lower end of the shaft 3 projecting downward from the head body 4 so as not to contact each other. Both ends of the reflow chip 7 are fixed to the lower ends of the shank holders 5 and 6 with screws or the like. Conventionally, as described above, cables 8 and 9 were connected to the shank holders 5 and 6, respectively (dashed lines in FIG. 1), and power was supplied to the reflow chip 7 through the cables 8 and 9.

In the present invention, power is supplied to the reflow chip 7 via the shafts 1 and 3. That is, shaft 1,
3 protrudes upward from the head body 4, and the shaft 1 protrudes upward from the shaft 3, and terminals 10 and 11 are attached to the upper part of the head so as not to touch each other. flexible cables 12, 13
are connected to power supply units 14 and 15, respectively. Therefore, the current is e.g.
The flow flows from the mesh cable 13, the terminal 11, the outer shaft 3, the shank holder 6, and the reflow chip 7, and further passes through the shank holder 5, the inner shaft 1, the terminal 10, the mesh cable 12, and then the power supply section 14.
Return to When a current flows through the reflow chip 7, it is heated, and the solder layer (not shown) on the substrate is melted by the generated heat, and bonding is performed. Note that cables 17 and 1 are connected to the power supply units 14 and 15.
8 (FIG. 3).

As shown in FIG.
0 and 11, there is little tolerance for the axial movement of the shafts 1 and 3 and the terminals 10 and 11, but the reticular cables 12 and 13 It deforms itself easily and has considerable rotational tolerance. Even if the shafts 1 and 3 rotate, the power supply parts 14 and 15
remains stationary, so cables 17 and 18
(Figure 3) has no risk of twisting or twisting. In addition, in FIG. 1, 19 is the power supply section 1.
4 and 15, and 20 is a spacer.

As described above, according to the structure of the bonder head of the present invention, the shafts 1 and 2, and thus the reflow chip 7, can be freely rotated without twisting the cables 17 and 18, and since there are no cables near the reflow chip 7, bonding This allows you to have a wider field of view, making it easier to perform bonding work.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view showing the structure of the bonder head of the present invention, FIG. 2 is a view of the structure of FIG. 1 viewed from above, and FIG. 3 is a sectional view taken along the line - in FIG. 1, 3...Shaft, 2...Insulating tube, 4...Head body, 5, 6...Shank holder, 7...Reflow chip.

Claims (1)

[Claims] 1. An insulating tube 2 is provided on the outside of one shaft 1, and the other shaft 3 is provided on the outside of the insulating tube 2.
The refloating chip 7 is attached to positive and negative shank holders 5 and 6, which are supported by the head body 4 so as to be able to rotate together, and connected to the lower ends of the shafts 1 and 3 protruding from the head body, respectively. Both shafts 1 and 2 are made to protrude upward from the head body 4, and a flexible cable 1 is attached to the upper end protrusion of these shafts 1 and 3.
A structure of a bonder head configured to supply power to the reflow chip via 2 and 13.