JPS6244779B2 - - Google Patents
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- Publication number
- JPS6244779B2 JPS6244779B2 JP14172681A JP14172681A JPS6244779B2 JP S6244779 B2 JPS6244779 B2 JP S6244779B2 JP 14172681 A JP14172681 A JP 14172681A JP 14172681 A JP14172681 A JP 14172681A JP S6244779 B2 JPS6244779 B2 JP S6244779B2
- Authority
- JP
- Japan
- Prior art keywords
- polyethylene
- molecular weight
- film
- added
- acid value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】
本発明は優れた帯電防止性を有するエチレン系
樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an ethylene resin composition having excellent antistatic properties.
ポリエチレンはその優れた化学的及び物理的性
質によりフイルム、パイプ、繊維その他の成形品
の原料として広く使用されているが、他の多くの
プラスチツクと同様に、高い電気絶縁抵抗を有す
るため、摩擦などにより静電気を帯びやすく、
種々の障害ならびに災害を起こす原因となり、ま
たほこりなどが付着して成形品の表面が汚れたり
する欠点がある。したがつてポリエチレンの帯電
を防止することは実用上極めて重要である。 Polyethylene is widely used as a raw material for films, pipes, fibers, and other molded products due to its excellent chemical and physical properties, but like many other plastics, it has high electrical insulation resistance and is therefore susceptible to friction, etc. more likely to be charged with static electricity,
It causes various troubles and disasters, and also has the disadvantage that the surface of the molded product becomes dirty due to the adhesion of dust. Therefore, it is extremely important in practice to prevent polyethylene from being charged.
ポリエチレンなどの帯電防止剤には、帯電防止
性のほか樹脂との相溶性、加工安定性等の性能が
要求される。また帯電防止剤が過度に表面に析出
(ブリード)することにより、ベタツキ、白化な
どを生じて成形品表面の外観及び物性を著しく低
下させるものは好ましくない。しかしこれらのす
べての要求を満足させる帯電防止剤はまだ見当ら
ない。 Antistatic agents such as polyethylene are required to have properties such as compatibility with resins and processing stability in addition to antistatic properties. Further, it is not preferable that the antistatic agent excessively precipitates (bleeds) on the surface, causing stickiness, whitening, etc., and significantly deteriorating the appearance and physical properties of the surface of the molded product. However, an antistatic agent that satisfies all these requirements has not yet been found.
本発明者らは、これらの点で優れた帯電防止性
を有する親規なポリエチレン系樹脂組成物を得る
ため鋭意研究を重ねた結果、特定の第三級アミン
及び酸化ポリエチレンワツクスを併用することに
より、ベタツキ性を改良し、しかも防電効果が相
乗的に改善されることを見出した。 The present inventors have conducted extensive research to obtain a polyethylene resin composition with excellent antistatic properties in these respects, and as a result, the inventors have found that a specific tertiary amine and an oxidized polyethylene wax can be used in combination. It has been found that this method improves the stickiness and synergistically improves the antistatic effect.
本発明は、一般式
(式中Rは炭素数12〜22のアルキル基又はアルケ
ニル基を示す)で表わされるアルキル−又はアル
ケニルジヒドロキシエチルアミン及び分子量1000
〜9000で酸価5〜70の酸化ポリエチレンワツクス
を、エチレン系重合物中に含有することを特徴と
する、防電性樹脂組成物である。 The present invention is based on the general formula (In the formula, R represents an alkyl group or alkenyl group having 12 to 22 carbon atoms) and an alkyl- or alkenyldihydroxyethylamine having a molecular weight of 1000
This is an electrically-proof resin composition characterized by containing an oxidized polyethylene wax having an acid value of 5 to 9000 and an ethylene polymer of 5 to 70.
式のアミンのRとしては、炭素原子数12〜22
のアルキル基又はアルケニル基が適している。炭
素数が11以下のものは沸点が低く、樹脂と加熱混
練する際に蒸発するおそれがある。また炭素数が
23以上のものは、原料面からみて工業的入手が制
約されるので好ましくない。 R of the amine in the formula has 12 to 22 carbon atoms;
Alkyl or alkenyl groups are suitable. Those with a carbon number of 11 or less have a low boiling point and may evaporate when heated and kneaded with a resin. Also, the number of carbon
Polymers of 23 or more are not preferred because their industrial availability is restricted from the viewpoint of raw materials.
酸化ポリエチレンワツクスは、分子量1000〜
9000、酸価5〜70のものが用いられる。分子量が
1000未満のものは融点が低く、耐熱性が悪く、樹
脂表面に析出(ブリード)し易くなり、また分子
量が9000を超えると融点が高すぎて加工性が悪く
なるなどの欠点がある。また酸価が5未満では充
分な相乗効果が得られず、70を超えると熱安定性
が悪くなる。 Oxidized polyethylene wax has a molecular weight of 1000~
9000, and those with an acid value of 5 to 70 are used. molecular weight
If the molecular weight is less than 1,000, it has a low melting point, poor heat resistance, and tends to precipitate (bleed) on the resin surface.If the molecular weight exceeds 9,000, the melting point is too high, resulting in poor processability. Further, if the acid value is less than 5, a sufficient synergistic effect cannot be obtained, and if it exceeds 70, thermal stability deteriorates.
エチレン系重合物としてはポリエチレンならび
にエチレンの共重合体が用いられる。これらの重
合体の混合物も当然用いられる。 As the ethylene polymer, polyethylene and ethylene copolymers are used. Mixtures of these polymers can of course also be used.
ポリエチレン低密度、中密度及び高密度ポリエ
チレンのいずれも用いることができる。エチレン
の共重合体としては、エチレンが60%以上の共重
合体例えばエチレン・酢酸ビニル共重合体、エチ
レン・アクリル酸エステル共重合体等が用いられ
る。 Any of low density, medium density and high density polyethylene can be used. As the ethylene copolymer, a copolymer containing 60% or more of ethylene, such as an ethylene/vinyl acetate copolymer, an ethylene/acrylic acid ester copolymer, etc., is used.
本発明の防電性樹脂組成物を製造するに際して
は、ポリエチレン又はエチレン共重合物に式の
アミン及び酸化ポリエチレンワツクスを添加す
る。添加量は、樹脂組成物に対し、アミン0.05〜
2重量%、酸化ポリエチレンワツクス0.05〜5重
量%が好ましい。これらの成分の配合比は、最終
成形品の帯電防止性及び表面状態の要求度に応
じ、適宜に変更することができる。 When producing the electrically conductive resin composition of the present invention, an amine of the formula and an oxidized polyethylene wax are added to polyethylene or an ethylene copolymer. The amount of amine added is 0.05 to 0.05 to the resin composition.
2% by weight, and 0.05-5% by weight of oxidized polyethylene wax is preferred. The blending ratio of these components can be changed as appropriate depending on the required antistatic properties and surface condition of the final molded product.
次いでこの混合物を、ローラーミル、バンバリ
ーミキサー、押出機等の混練装置を用いて、均一
に混練すると本発明の組成物が得られる。 Next, this mixture is uniformly kneaded using a kneading device such as a roller mill, Banbury mixer, or extruder to obtain the composition of the present invention.
そのほか本発明の組成物には、酸化防止剤、光
安定剤、滑剤、顔料その他の添加剤を配合するこ
ともできる。 In addition, the composition of the present invention may also contain antioxidants, light stabilizers, lubricants, pigments, and other additives.
本発明の樹脂組成物から得られるフイルムその
他の成形品はベタツキ性が改良され、防電性に優
れている。 Films and other molded products obtained from the resin composition of the present invention have improved stickiness and excellent electrical resistance.
下記実施例中の%は重量を意味する。 In the examples below, % means weight.
実施例 1
市販のポリエチレン(商品名:旭ダウポリエチ
レンF1920)にテトラデシル−ジヒドロキシエチ
ルアミン0.15%及び酸化ポリエチレンワツクス
(分子量2000、酸価10)0.15%を添加し、V型タ
ンブラーで混合したのち、押出機を用いてペレツ
ト状に造粒し、これを用いてインフレーシヨン法
によりフイルム(A)を製造した。Example 1 0.15% of tetradecyl-dihydroxyethylamine and 0.15% of oxidized polyethylene wax (molecular weight 2000, acid value 10) were added to commercially available polyethylene (trade name: Asahi Dow Polyethylene F1920), mixed in a V-shaped tumbler, and then extruded. The mixture was granulated into pellets using a machine, and a film (A) was produced using the pellets by an inflation method.
比較のため同様にして、ただしテトラデシル−
ジヒドロキシエチルアミン0.15%のみをポリエチ
レンに添加したフイルム(B)及び添加物なしでポリ
エチレンのみからのフイルム(C)を製造した。これ
らのフイルムの表面固有抵抗及びベタツキ性を下
記の方法で調べた。 For comparison, use the same method, but with tetradecyl-
A film with only 0.15% dihydroxyethylamine added to polyethylene (B) and a film made only of polyethylene without additives (C) were produced. The surface resistivity and stickiness of these films were examined using the following methods.
表面固有抵抗は、東亜電波工業社製SM−5E型
の超絶縁計を用いて測定した。試料を成形後、温
度20℃、相対湿度65%の標準条件下で7日間調整
し、同じ条件下で測定を行つた。 The surface resistivity was measured using a super megohmmeter SM-5E manufactured by Toa Denpa Kogyo. After molding the sample, it was conditioned for 7 days under standard conditions of a temperature of 20°C and a relative humidity of 65%, and measurements were conducted under the same conditions.
ベタツキ性は、2枚の試料を幅3cm、長さ4cm
にわたり重ね合わせ、この上に500gのおもりを
載せ、温度20℃、相対湿度65%の雰囲気中で24時
間調整したのち、2枚の試料を手で剥離し、剥離
の容易度から大、中、小の三段階に分けて評価し
た。 For stickiness, measure two samples with a width of 3 cm and a length of 4 cm.
After placing a 500g weight on top of this and adjusting it for 24 hours in an atmosphere with a temperature of 20℃ and a relative humidity of 65%, the two samples were peeled off by hand and graded according to the ease of peeling: large, medium, The evaluation was divided into three levels: small.
試験結果を第1表に示す。なお市販のポリエチ
レンには酸化防止剤が添加されている。この結果
によればAの表面固有抵抗の優れていることが認
められる。 The test results are shown in Table 1. Note that antioxidants are added to commercially available polyethylene. According to this result, it is recognized that A has an excellent surface resistivity.
第 1 表
試料 表面固有抵抗 ベタツキ性
A 3×1010Ω 中
B 2×1011Ω 大
C >1014Ω 小
実施例 2
実施例1で用いたポリエチレンに、オクタデシ
ル−ジヒドロキシエチルアミン0.3%及び酸化ポ
リエチレンワツクス(分子量2000、酸価10)0.3
%を添加し、実施例1と同様にしてフイルム(D)を
製造した。 Table 1 Sample Surface specific resistance Stickiness A 3 x 10 10 Ω Medium B 2 x 10 11 Ω Large C > 10 14 Ω Small Example 2 To the polyethylene used in Example 1, 0.3% octadecyl-dihydroxyethylamine and polyethylene oxide were added. Wax (molecular weight 2000, acid value 10) 0.3
% was added, and a film (D) was produced in the same manner as in Example 1.
またオクタデシル−ジヒドロキシエチルアミン
0.3%のみを添加したフイルム(E)、ならびに酸化
ポリエチレンワツクス(分子量2000、酸価10)
0.3%のみを添加したフイルム(F)を製造した。こ
れらのフイルム及び無添加フイルム(C)を用いて、
実施例1と同じ試験を行つた。その結果を第2表
に示す。試料Dでは明らかな相乗効果が認められ
た。 Also, octadecyl-dihydroxyethylamine
Film (E) with only 0.3% added and oxidized polyethylene wax (molecular weight 2000, acid value 10)
A film (F) containing only 0.3% was produced. Using these films and additive-free film (C),
The same test as in Example 1 was conducted. The results are shown in Table 2. In sample D, a clear synergistic effect was observed.
第 2 表
試料 表面固有抵抗 ベタツキ性
D 5×1010Ω 中
E 9×1011Ω 大
F >1014Ω 小
C >1014Ω 小
実施例 3
実施例1で用いたポリエチレンに、テトラデシ
ル−ジヒドロキシエチルアミン0.3%及び酸化ポ
リエチレンワツクス(分子量2000、酸価10)1.5
%を添加したフイルム(G)、ならびにテトラデシル
−ジヒドロキシエチルアミン0.3%及び酸化ポリ
エチレンワツクス(分子量5000、酸化30)0.3%
を添加したフイルム(H)を、実施例1と同様にして
製造した。またテトラデシル−ジヒドロキシエチ
ルアミン0.3%のみを添加したフイルム(I)を製造
し、実施例1と同じ試験を行つた。その結果を第
3表に示す。そのほか比較としてフイルム(C)も使
用した。試料GとHでは明らかな相乗効果が認め
られた。 Table 2 Sample Surface specific resistance Stickiness D 5 x 10 10 Ω Medium E 9 x 10 11 Ω Large F > 10 14 Ω Small C > 10 14 Ω Small Example 3 Tetradecyl-dihydroxy was added to the polyethylene used in Example 1. Ethylamine 0.3% and oxidized polyethylene wax (molecular weight 2000, acid value 10) 1.5
% added film (G), as well as 0.3% tetradecyl-dihydroxyethylamine and oxidized polyethylene wax (molecular weight 5000, oxidation 30) 0.3%
A film (H) to which was added was produced in the same manner as in Example 1. Further, a film (I) containing only 0.3% of tetradecyl-dihydroxyethylamine was produced and the same test as in Example 1 was conducted. The results are shown in Table 3. In addition, film (C) was also used for comparison. A clear synergistic effect was observed in samples G and H.
第 3 表 試料 表面固有抵抗 タベツキ性 G 2×109Ω 中 H 8×108Ω 中 I 7×1010Ω 大 C >1014Ω 小 Table 3 Sample Surface specific resistance Surface resistance G 2×10 9 Ω Medium H 8×10 8 Ω Medium I 7×10 10 Ω Large C >10 14 Ω Small
Claims (1)
ニル基を示す)で表わされるアルキル−又はアル
ケニルジヒドロキシエチルアミン及び分子量1000
〜9000で酸価5〜70の酸化ポリエチレンワツクス
を、エチレン系重合物中に含有することを特徴と
する、防電性樹脂組成物。[Claims] 1. General formula (In the formula, R represents an alkyl group or alkenyl group having 12 to 22 carbon atoms) and an alkyl- or alkenyldihydroxyethylamine having a molecular weight of 1000
9,000 and an acid value of 5 to 70 in an ethylene polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14172681A JPS5845241A (en) | 1981-09-10 | 1981-09-10 | Antistatic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14172681A JPS5845241A (en) | 1981-09-10 | 1981-09-10 | Antistatic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5845241A JPS5845241A (en) | 1983-03-16 |
| JPS6244779B2 true JPS6244779B2 (en) | 1987-09-22 |
Family
ID=15298773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14172681A Granted JPS5845241A (en) | 1981-09-10 | 1981-09-10 | Antistatic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5845241A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4439248A1 (en) * | 1994-11-03 | 1996-05-09 | Hoechst Ag | Polyolefin molding compound with reduced tendency to peel |
-
1981
- 1981-09-10 JP JP14172681A patent/JPS5845241A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5845241A (en) | 1983-03-16 |
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