JPS6245716B2 - - Google Patents
Info
- Publication number
- JPS6245716B2 JPS6245716B2 JP60110952A JP11095285A JPS6245716B2 JP S6245716 B2 JPS6245716 B2 JP S6245716B2 JP 60110952 A JP60110952 A JP 60110952A JP 11095285 A JP11095285 A JP 11095285A JP S6245716 B2 JPS6245716 B2 JP S6245716B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- substrate
- light
- diode elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Optical Couplings Of Light Guides (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
Description
【発明の詳細な説明】
(イ) 産業上の利用分野
本発明は基板面に平行な方向へ放射光を取出す
半導体発光装置に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a semiconductor light emitting device that emits emitted light in a direction parallel to a substrate surface.
(ロ) 従来の技術
従来複写機やプリンタに発光ダイオードを用い
ることが特公昭39−25849号公報等で知られてい
るが、特願昭50−60884号(特開昭51−143334号
公報)等においては発光ダイオードの光を線状に
取出すことが提案されている。ところが、基板上
に発光ダイオード素子を配線して光を取出すもの
(例えば上記出願や表示装置)に於ては、基板面
に垂直な方向へ放射光を取出すように構成されて
おり、基板をコネクタ等に取付ける際には発光装
置の光放出面に平行移動させて取付けている。従
つて取付面積が狭い場合、例えば上記プリンタの
如く感光面に電荷チヤージヤ、トナー、転写器等
多くの部品を対向配置させるための発光装置の取
付スペースが狭い時には従来の発光装置では取付
けることはできない。(b) Prior art The use of light emitting diodes in copiers and printers has been known from Japanese Patent Publication No. 39-25849, etc., but Japanese Patent Application No. 50-60884 (Japanese Patent Application Laid-open No. 143334-1984) et al., it has been proposed to extract light from a light emitting diode in a linear manner. However, in devices that extract light by wiring light emitting diode elements on a substrate (for example, the above-mentioned applications and display devices), the structure is such that the emitted light is extracted in a direction perpendicular to the substrate surface, and the substrate is connected to a connector. When attaching the light emitting device to a light emitting device, etc., the light emitting device is moved parallel to the light emitting surface of the light emitting device. Therefore, when the mounting area is narrow, for example, when the space for mounting a light emitting device such as the above-mentioned printer, in which many components such as a charger, toner, and transfer device are placed facing each other on the photosensitive surface, is narrow, it is not possible to mount the light emitting device using a conventional light emitting device. .
例えば第1図の発光装置に於いて、光放射面1
が基板2のプリント配線面3と同一面上にあり、
基板2を取付ける際には光放射面1に平行移動さ
せてコネクタに取付けなければならず不便である
が、さらに取付場所が細い隙間の場合には取付不
能となる。 For example, in the light emitting device shown in FIG.
is on the same surface as the printed wiring surface 3 of the board 2,
When attaching the board 2, it must be moved parallel to the light emitting surface 1 and attached to the connector, which is inconvenient, but furthermore, it becomes impossible to attach it if the attachment location is a narrow gap.
上記の欠点をカバーする方法として特開昭51−
110984号公報の如くパイロツトランプ形式のもの
を用いる事が考えられるがランプ天面を同一面内
に揃えることや駆動回路への取付配線のために必
要な基板又は特殊なコネクタが必要なことを考慮
すると取付作業も煩雑で全体の構成も複雑とな
る。また特殊なランプ(例えば浮子)においては
実開昭51−24866号公報の如く発光ダイオード素
子の真上に逆円錐状反射器を設けているが、発光
ダイオード素子1つ1つの真上に位置合せをして
逆円錐状反射器を設けかつ複数の発光ダイオード
素子の光を一方向にそろえるのは極めて困難であ
る。 As a method to cover the above drawbacks, JP-A-51-
It is conceivable to use a pilot lamp type lamp like the one in Publication No. 110984, but please take into consideration the need to align the top surfaces of the lamps on the same plane and the need for a board or special connector for installation wiring to the drive circuit. This makes the installation work complicated and the overall configuration complicated. In addition, in special lamps (for example, floats), an inverted conical reflector is provided directly above the light emitting diode elements as in Japanese Utility Model Application No. 51-24866; It is extremely difficult to provide an inverted conical reflector and align the light from a plurality of light emitting diode elements in one direction.
(ハ) 発明が解決しようとする問題点
本発明は上記の点を改良し、非常に簡単な構成
で、基板面と平行な方向へ発光ダイオード素子の
放射光を一列に導出する略板状の半導体発光装置
を提供するものである。(c) Problems to be Solved by the Invention The present invention improves the above-mentioned points and provides a substantially plate-like structure which has a very simple structure and directs the emitted light of the light emitting diode element in a line in a direction parallel to the substrate surface. A semiconductor light emitting device is provided.
(ニ) 問題点を解決するための手段
本発明は複数の発光ダイオード素子を基板の一
側面の近傍に整列配置させ、複数の発光ダイオー
ド素子を一体に覆う導光体又は複数の発光ダイオ
ード素子の各々を区切りながら全体を覆う断面略
L字状の反射枠からなる指向性付与体を設けたも
のである。(d) Means for solving the problem The present invention arranges a plurality of light emitting diode elements in the vicinity of one side of a substrate, and uses a light guide body or a plurality of light emitting diode elements that integrally covers the plurality of light emitting diode elements. A directivity imparting body is provided, which is a reflective frame having a substantially L-shaped cross section that covers the entirety while dividing each part.
(ホ) 作 用
これにより複数の発光ダイオード素子の光を一
様に一方向に揃え、かつその方向は基板面に平行
であるから狭いところへも取付けやすい。(e) Function This allows the light from the plurality of light emitting diode elements to be uniformly aligned in one direction, and since the direction is parallel to the substrate surface, it is easy to install even in narrow spaces.
(ヘ) 実施例
第2図は本発明の一実施例を示す斜視図、第3
図は第2図のA−A断面図である。図に於いて4
はプリント配線された端子5を有する基板で、そ
の上に発光ダイオード素子6を配置してプリント
配線された端子5と接続している。上記の基板4
上に発光ダイオード素子6を囲む空間7を有した
導光体8を設け、接着剤等で固定する。導光体8
の表面は右側面9を除いて全面メツキ又は塗料が
塗布されており、発光ダイオード素子6から放射
された光は、反射されて右側面9からのみ導出さ
れる。端子5はこの光放射面である導光体の右側
面9と反対側にあたる基板4の一側にあつめられ
るのでコネクタ等への取付けは容易であり、第1
図および後述する第4図の如く発光ダイオード素
子を複数個整列させたのち直列に配線すれば右側
面9からの光は一直線状の光束となつて照光取出
される。(f) Embodiment Figure 2 is a perspective view showing an embodiment of the present invention, and Figure 3 is a perspective view showing an embodiment of the present invention.
The figure is a sectional view taken along the line AA in FIG. 2. In the diagram 4
is a board having a printed wiring terminal 5, on which a light emitting diode element 6 is arranged and connected to the printed wiring terminal 5. Above board 4
A light guide 8 having a space 7 surrounding the light emitting diode element 6 is provided on top and fixed with an adhesive or the like. Light guide 8
The entire surface except the right side 9 is plated or coated with paint, and the light emitted from the light emitting diode element 6 is reflected and led out only from the right side 9. Since the terminals 5 are gathered on one side of the substrate 4 opposite to the right side surface 9 of the light guide, which is the light emitting surface, attachment to a connector etc. is easy.
If a plurality of light emitting diode elements are arranged and wired in series as shown in the figure and FIG. 4, which will be described later, the light from the right side surface 9 is extracted as a linear luminous flux.
この導光体8の裏面にも金属メツキされた場合
には、端子5が短絡される可能性があるため、端
子面と導光体8とをスルホール等により基板4の
異なる面に設けるようにする事が望ましい。また
上記の空間7を除去する構造として、上記の導光
体8のメツキ又は塗料面に該当したケースを設
け、ケース内に樹脂材を注入して導光体を形成す
る事も行なわれる。 If the back side of the light guide 8 is also plated with metal, the terminal 5 may be short-circuited, so the terminal surface and the light guide 8 should be provided on different sides of the board 4 using through holes or the like. It is desirable to do so. Further, as a structure for eliminating the space 7, a case corresponding to the plated or painted surface of the light guide 8 is provided, and a resin material is injected into the case to form the light guide.
第4図と第5図は他の実施例を示す斜視図及び
B−B断面図である。第2図、第3図と同一のも
のには同一の符号を用いる。 FIGS. 4 and 5 are a perspective view and a sectional view taken along the line B-B of another embodiment. The same reference numerals are used for the same parts as in FIGS. 2 and 3.
図に於いて10は断面略L字型の反射枠で、空
間7に発光ダイオード素子6を内蔵し、ケース1
1の光放射面12へ光を導いている。発光ダイオ
ード素子6は4つが基板4の一側面に添つて整列
して設けられ、空間7は仕切15,15により
各々の発光ダイオード素子6に1対1に設けてあ
る。ケース11の内面には好ましくは散乱シート
13が有り、光を均一化している。さらに突起1
4を設けて反射枠10との結合を強化している。 In the figure, 10 is a reflective frame with a substantially L-shaped cross section, a light emitting diode element 6 is built in a space 7, and a case 1
The light is guided to the light emitting surface 12 of 1. Four light emitting diode elements 6 are arranged in a row along one side of the substrate 4, and a space 7 is provided for each light emitting diode element 6 one to one by partitions 15, 15. There is preferably a scattering sheet 13 on the inner surface of the case 11 to make the light uniform. Further protrusion 1
4 is provided to strengthen the connection with the reflective frame 10.
(ト) 発明の効果
以上の如く本発明は配線を有する基板と、基板
の一側面の近傍に整列配置された複数の発光ダイ
オード素子と、その複数の発光ダイオード素子を
覆い上記基板の面に平行な一方向へ反射光を導く
よう基板に固定された導光体又は反射枠の指向性
付与体とを具備した半導体発光装置であるから、
基板面と表示面とが垂直になり光放射面の面積が
小さくても基板の面積を大きく取ることができ、
狭い所へ発光装置を挿入して基板をコネクタ等に
取付ける際も着脱が容易である。(G) Effects of the Invention As described above, the present invention includes a substrate having wiring, a plurality of light emitting diode elements arranged in an array near one side of the substrate, and a structure that covers the plurality of light emitting diode elements and parallel to the surface of the substrate. Since it is a semiconductor light emitting device equipped with a directivity imparting body such as a light guide or a reflective frame fixed to a substrate so as to guide reflected light in one direction,
Since the substrate surface and display surface are perpendicular, the area of the substrate can be increased even if the area of the light emitting surface is small.
It is also easy to attach and detach when inserting the light emitting device into a narrow space and attaching the board to a connector or the like.
第1図は従来の発光装置の斜視図、第2図、第
3図は本発明の一例の斜視図及び断面図、第4
図、第5図は本発明の他の例を示す斜視図及び断
面図である。
4は基板、6は発光ダイオード素子、8は導光
体、10は反射枠である。
FIG. 1 is a perspective view of a conventional light emitting device, FIGS. 2 and 3 are perspective views and sectional views of an example of the present invention, and FIG.
5 are a perspective view and a sectional view showing another example of the present invention. 4 is a substrate, 6 is a light emitting diode element, 8 is a light guide, and 10 is a reflective frame.
Claims (1)
線からなる端子を有した基板と、基板の端子が設
けられていない側面に添つて配置された複数の発
光ダイオード素子と、その複数の発光ダイオード
素子を一体に覆い基板の面に平行な一方向へ放射
光を導いて略線状光束が得られるように前記複数
の発光ダイオード素子に対応した基板と略等しい
長さの光放出面を基板の前記側面の近傍に位置さ
せて基板に固定された、表面に光反射面を有した
導光体もしくは断面略L字状の反射枠からなる指
向性付与体とを具備した事を特徴とする半導体発
光装置。1. A board having a terminal made of printed wiring connected to a light emitting diode element, a plurality of light emitting diode elements arranged along the side surface of the board where no terminals are provided, and the plurality of light emitting diode elements integrated into one. A light emitting surface having a length approximately equal to that of the substrate corresponding to the plurality of light emitting diode elements is provided near the side surface of the substrate so that a substantially linear luminous flux is obtained by guiding the emitted light in one direction parallel to the surface of the cover substrate. 1. A semiconductor light emitting device comprising: a directivity imparting body consisting of a light guide having a light reflecting surface on its surface or a reflecting frame having a substantially L-shaped cross section, which is positioned and fixed to a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60110952A JPS6116581A (en) | 1985-05-23 | 1985-05-23 | Semiconductor light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60110952A JPS6116581A (en) | 1985-05-23 | 1985-05-23 | Semiconductor light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6116581A JPS6116581A (en) | 1986-01-24 |
| JPS6245716B2 true JPS6245716B2 (en) | 1987-09-28 |
Family
ID=14548697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60110952A Granted JPS6116581A (en) | 1985-05-23 | 1985-05-23 | Semiconductor light-emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6116581A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3025421B2 (en) * | 1995-06-14 | 2000-03-27 | 三菱電機株式会社 | Abnormality detection device for control system |
| JP5294219B2 (en) * | 2010-02-24 | 2013-09-18 | 京セラドキュメントソリューションズ株式会社 | Image reading apparatus and image forming apparatus having the same |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4813936Y1 (en) * | 1969-09-19 | 1973-04-17 | ||
| JPS4925893A (en) * | 1972-07-04 | 1974-03-07 | ||
| JPS5114880B2 (en) * | 1972-11-09 | 1976-05-12 | ||
| JPS5230239B2 (en) * | 1972-11-09 | 1977-08-06 | ||
| JPS5132379Y2 (en) * | 1972-12-21 | 1976-08-12 | ||
| JPS5347948Y2 (en) * | 1973-02-02 | 1978-11-16 | ||
| JPS5517512Y2 (en) * | 1973-07-13 | 1980-04-23 | ||
| JPS5758653Y2 (en) * | 1974-05-27 | 1982-12-15 | ||
| JPS5127097A (en) * | 1974-08-30 | 1976-03-06 | Toyota Motor Co Ltd | HYOJISOCHI |
| JPS5134697A (en) * | 1974-09-19 | 1976-03-24 | Toyota Motor Co Ltd | HYOJISOCHI |
| JPS5127098A (en) * | 1974-08-30 | 1976-03-06 | Toyota Motor Co Ltd | HYOJISOCHI |
| CA1023039A (en) * | 1975-02-28 | 1977-12-20 | Bowmar Canada Limited | Light emitting diode display |
| JPS51136293A (en) * | 1975-05-21 | 1976-11-25 | Oki Electric Ind Co Ltd | Wave length converter |
-
1985
- 1985-05-23 JP JP60110952A patent/JPS6116581A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6116581A (en) | 1986-01-24 |
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