JPS6246981B2 - - Google Patents
Info
- Publication number
- JPS6246981B2 JPS6246981B2 JP54163776A JP16377679A JPS6246981B2 JP S6246981 B2 JPS6246981 B2 JP S6246981B2 JP 54163776 A JP54163776 A JP 54163776A JP 16377679 A JP16377679 A JP 16377679A JP S6246981 B2 JPS6246981 B2 JP S6246981B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- appearance inspection
- mounting table
- storage section
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は半導体基板製造工程における各工程後
の半導体基板外観検査を行う半導体基板外観検査
装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor substrate appearance inspection apparatus that performs an appearance inspection of a semiconductor substrate after each step in a semiconductor substrate manufacturing process.
半導体基板製造工程における結晶成長処理、写
真真食刻処理、各薬品又は電気的エツチング処理
等の各処理工程において、その処理状態を検査す
る方法として、各処理後の半導体基板の表面を金
属顕微鏡又はカメラ等により所望の倍率に拡大
し、目視により観察する検査方法が一般的に行わ
れる。 In each processing step such as crystal growth processing, photoetching processing, chemical or electrical etching processing in the semiconductor substrate manufacturing process, the surface of the semiconductor substrate after each processing is examined using a metallographic microscope or A commonly used inspection method is to magnify the image to a desired magnification using a camera or the like and visually observe it.
上記半導体基板外観検査は、その前処理におけ
る処理条件の適正の確認、又処理条件不適の場合
はその不良内容の把握及び適正処理条件への修正
指示等の為に必要な作業であり、半導体基板製造
工程の各処理工程において、不良発生率の低減化
を計る等の重要な作業である。 The above-mentioned semiconductor substrate appearance inspection is a necessary work to confirm the appropriateness of the processing conditions in the pre-processing, and if the processing conditions are inappropriate, to understand the details of the defect and give instructions to correct the processing conditions. This is an important task to reduce the incidence of defects in each processing step of the manufacturing process.
半導体基板外観検査に用いられている従来の半
導体基板外観検査装置は、第1図の平面図及び第
2図の正面図に示す概略図により説明すると、モ
ータによる上下機能を備えた半導体基板供給部1
と、手動又はモータ駆動方式により水平方向及び
回転方向へ可動し真空固定法により半導体基板を
保持する半導体基板搭載台2と、金属顕微鏡又は
カメラ等による観察部3と、モータによる上下機
能を備えた半導体基板の良品収納部4及び不良品
収納部5と、各収納部へ半導体基板をエアローダ
方式、ベルトローダ方式等により搬送する半導体
基板搬送機構6とから構成され、複数枚の半導体
基板を収納したキヤリア8を供給部1へセツト
し、搬送機構6によりキヤリアに収納された半導
体基板9を1枚ずつ搭載台2へ搬送し、搭載台2
に保持された半導体基板の表面を観察部3を通し
作業者が目視検査を行つて良品、不良品の判定操
作を行い、各々の収納部へ半導体基板を収納する
ものである。 A conventional semiconductor substrate appearance inspection apparatus used for semiconductor substrate appearance inspection will be explained with reference to the schematic diagrams shown in the plan view of FIG. 1 and the front view of FIG. 1
, a semiconductor substrate mounting table 2 that can be moved horizontally and rotationally manually or by a motor drive system and holds the semiconductor substrate by a vacuum fixing method, an observation section 3 using a metallurgical microscope or camera, etc., and a vertical function using a motor. It is composed of a non-defective storage section 4 and a defective storage section 5 for semiconductor substrates, and a semiconductor substrate transport mechanism 6 that transports semiconductor substrates to each storage section by an air loader method, a belt loader method, etc., and stores a plurality of semiconductor substrates. The carrier 8 is set in the supply section 1, and the transport mechanism 6 transports the semiconductor substrates 9 stored in the carrier one by one to the mounting stand 2.
An operator visually inspects the surface of the semiconductor substrate held in the storage section 3 through the observation section 3 to determine whether it is a good product or a defective product, and then stores the semiconductor substrate into each storage section.
又、通常の外観検査作業方法は、作業能率の向
上の為、半導体基板の中央及び周辺の1個所又は
4〜5個所程度を観察し、良、不良の判定を行
う。したがつて、半導体基板表面上の観察部以外
の部分に汚れ、キズ等が存在した場合、それを発
見する事は困難であつた。このように半導体基板
表面上に汚れ、キズ等が存在する状態で後処理を
行つた場合、その部分が不良となるばかりでな
く、同時に処理された他の半導体基板に悪影響を
及ぼし、さらに後処理を行う装置を汚染する場合
もある。 In addition, in a normal appearance inspection work method, in order to improve work efficiency, one place or about four to five places at the center and periphery of a semiconductor substrate are observed and judged as good or bad. Therefore, if dirt, scratches, etc. are present on the surface of the semiconductor substrate other than the observation area, it is difficult to discover them. If post-processing is performed with dirt, scratches, etc. present on the surface of a semiconductor substrate, not only will that part become defective, but it will also have an adverse effect on other semiconductor substrates processed at the same time. It may also contaminate the equipment used.
上記、後処理に対する悪影響を防止する為に
は、外観検査作業において、半導体基板表面上の
一部の汚れ、キズ等を発見する事も必要である
が、従来の半導体基板外観検査装置では、観察部
3を通し半導体基板全面を観察しなければならな
くなる為、作業能率が著しく低下する。又、半導
体基板表面上の一部の汚れ、キズ等は、一般照明
下において肉視で観察しても、拡散光である為発
見しがたいものである。 In order to prevent the above-mentioned negative effects on post-processing, it is necessary to discover some dirt, scratches, etc. on the surface of the semiconductor substrate during appearance inspection work, but conventional semiconductor substrate appearance inspection equipment does not allow observation. Since the entire surface of the semiconductor substrate must be observed through part 3, work efficiency is significantly reduced. Further, it is difficult to detect some dirt, scratches, etc. on the surface of a semiconductor substrate even when visually observed under general illumination because of the diffused light.
本発明は、従来の外観検査装置に対し、作業能
率を低下する事なく、半導体基板表面上の一部の
汚れ、キズ等を容易に発見し、前記後処理におけ
る悪影響を防止するための半導体基板外観検査装
置を提供するものである。 The present invention provides a semiconductor substrate for easily discovering dirt, scratches, etc. on a part of the surface of a semiconductor substrate without reducing work efficiency in contrast to conventional appearance inspection equipment, and for preventing adverse effects in the post-processing. The present invention provides an appearance inspection device.
本発明を第3図の平面図及び第4図の正面図に
示す概略図により説明すると、本発明は第1図、
第2図により説明した従来の半導体基板外観検査
装置に対し、回転可能な搭載台2に保持された半
導体基板表面に平行光線又は疑似平行光線を任意
の方向から照射する照射装置7を付加したもので
ある。この照射装置7は、反射鏡を用いて平行光
線又は出来るだけ平行光線に近い光線、すなわち
疑似平行光線を照射できるようにした装置であ
る。搭載台2に保持された半導体基板表面に、照
射装置7より平行光線又は疑似平行光線を照射
し、半導体基板を回転させ、その反射光を肉視で
観察する事により、前記半導体基板表面上の全面
にわたり、汚れ、キズ等を容易に発見する事がで
きる。 The present invention will be explained with reference to the schematic diagrams shown in the plan view of FIG. 3 and the front view of FIG. 4.
An irradiation device 7 that irradiates the surface of a semiconductor substrate held on a rotatable mounting table 2 with parallel light or pseudo-parallel light from any direction is added to the conventional semiconductor substrate appearance inspection apparatus described in FIG. 2. It is. This irradiation device 7 is a device that uses a reflecting mirror to irradiate parallel rays or rays as close to parallel rays as possible, that is, pseudo-parallel rays. The surface of the semiconductor substrate held on the mounting table 2 is irradiated with parallel light or quasi-parallel light from the irradiation device 7, the semiconductor substrate is rotated, and the reflected light is observed with the naked eye. Dirt, scratches, etc. can be easily found on the entire surface.
以上の様に、本発明は顕微鏡観察と肉視観察と
を併用することにより半導体基板外観検査作業の
作業能率を低下する事なく不良の見逃しを防止
し、各処理工程における不良の発生率を低減する
事ができる。 As described above, the present invention uses microscopic observation and visual observation in combination to prevent defects from being overlooked without reducing the efficiency of semiconductor substrate appearance inspection work, and to reduce the incidence of defects in each processing process. I can do that.
第1図、第2図は従来の検査装置を示すそれぞ
れ平面図及び正面図、第3図、第4図は本発明の
検査装置を示すそれぞれ平面図及び正面図であ
る。
1……半導体基板供給部、2……半導体基板搭
載台、3……半導体基板観察部、4……半導体基
板良品収納部、5……半導体基板不良品収納部、
6……半導体基板搬送機構、7……平行又は疑似
平行光線照射装置、8……半導体基板収納キヤリ
ア、9……半導体基板。
1 and 2 are a plan view and a front view, respectively, showing a conventional inspection apparatus, and FIGS. 3 and 4 are a plan view and a front view, respectively, showing an inspection apparatus of the present invention. 1... Semiconductor substrate supply section, 2... Semiconductor substrate mounting stand, 3... Semiconductor substrate observation section, 4... Semiconductor substrate good product storage section, 5... Semiconductor substrate defective product storage section,
6...Semiconductor substrate transport mechanism, 7...Parallel or quasi-parallel light irradiation device, 8...Semiconductor substrate storage carrier, 9...Semiconductor substrate.
Claims (1)
該搭載台と半導体基板移動用ローダーで結合され
た半導体基板供給部、良品収納部および不良品収
納部を有し、該搭載台の上部に顕微鏡を備えた半
導体基板外観検査装置に於て、該顕微鏡検査前の
目視検査用照射装置として、該搭載台に載置され
た半導体基板表面に任意の方向から平行光線又は
疑似平行光線を照射する装置を付加したことを特
徴とする半導体基板外観検査装置。1. A rotatable mounting table on which a semiconductor substrate is placed;
In a semiconductor substrate appearance inspection apparatus that has a semiconductor substrate supply section, a non-defective product storage section, and a defective product storage section that are connected to the mounting table by a loader for moving semiconductor substrates, and is equipped with a microscope on the top of the mounting table, A semiconductor substrate appearance inspection apparatus, characterized in that a device is added as an irradiation device for visual inspection before microscopic inspection, which irradiates the surface of the semiconductor substrate mounted on the mounting table with parallel light or pseudo-parallel light from any direction. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16377679A JPS5685834A (en) | 1979-12-17 | 1979-12-17 | External appearance inspecting device for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16377679A JPS5685834A (en) | 1979-12-17 | 1979-12-17 | External appearance inspecting device for semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5685834A JPS5685834A (en) | 1981-07-13 |
| JPS6246981B2 true JPS6246981B2 (en) | 1987-10-06 |
Family
ID=15780495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16377679A Granted JPS5685834A (en) | 1979-12-17 | 1979-12-17 | External appearance inspecting device for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5685834A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4772126A (en) * | 1986-10-23 | 1988-09-20 | Inspex Incorporated | Particle detection method and apparatus |
| CN110479643B (en) * | 2019-09-18 | 2020-06-19 | 青岛亚洲湾包装有限公司 | Code spraying detection device for production package |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52125451U (en) * | 1976-03-19 | 1977-09-24 | ||
| JPS5355983A (en) * | 1976-10-31 | 1978-05-20 | Konishiroku Photo Ind Co Ltd | Automatic micro defect detector |
-
1979
- 1979-12-17 JP JP16377679A patent/JPS5685834A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5685834A (en) | 1981-07-13 |
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