JPS6249142B2 - - Google Patents
Info
- Publication number
- JPS6249142B2 JPS6249142B2 JP12520178A JP12520178A JPS6249142B2 JP S6249142 B2 JPS6249142 B2 JP S6249142B2 JP 12520178 A JP12520178 A JP 12520178A JP 12520178 A JP12520178 A JP 12520178A JP S6249142 B2 JPS6249142 B2 JP S6249142B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tube
- coating layer
- immersed
- inner tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Molten Solder (AREA)
- Non-Disconnectible Joints And Screw-Threaded Joints (AREA)
Description
【発明の詳細な説明】
本発明は金属管たとえば銅管とアルミニウム管
の超音波はんだ付け方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for ultrasonic soldering of metal tubes, such as copper tubes and aluminum tubes.
従来、銅管とアルミニウム管の接合にはフラツ
シユ溶接法あるいはバツト溶接法等の種々の方法
が使用されているが、必ずしも堅牢な結合を得る
ことができなかつた。そこで従来においては互い
に嵌合しうる形態となされた金属管の少くとも一
方の端部に、予めはんだ被覆層を形成しておき、
両金属管を嵌合、加熱してはんだを溶融した状態
で超音波振動を付与することによりフラツクスを
使用しないで結合する方法が考慮されている。 Conventionally, various methods such as flash welding and butt welding have been used to join copper pipes and aluminum pipes, but it has not always been possible to obtain a robust joint. Therefore, conventionally, a solder coating layer is formed in advance on at least one end of metal tubes that are shaped so that they can fit into each other.
Consideration has been given to a method of joining without using flux by fitting both metal tubes together and applying ultrasonic vibrations to the melted solder.
しかしながら上記従来の超音波はんだ付け方法
においては予め金属管の端部に形成するはんだ被
覆層の厚さは極めて薄いものであり、両金属管を
嵌合したときの間〓を充填するに足るだけのはん
だ量には至らず、そのため置きろうを使用して不
足量を補つたり、ろうを使用しない場合は金属管
の嵌合部のクリヤランスに厳しい精度を要求され
金属管の成形加工上の障害となつていた。 However, in the conventional ultrasonic soldering method described above, the thickness of the solder coating layer formed in advance on the end of the metal tube is extremely thin, and is only sufficient to fill the gap between the two metal tubes when they are fitted. Therefore, if solder is not used, strict accuracy is required for the clearance of the fitting part of the metal tube, which causes problems in the forming process of metal tubes. It was becoming.
本発明は一方を拡径して嵌合される外管と内管
の一端部に超音波振動が付与されたはんだ浴に浸
漬することによつて予めはんだ被覆層を形成後そ
れら一端部どうしを嵌合しさらに加熱と超音波振
動を付与してはんだ付けする方法において、内管
を浸漬するはんだ浴をはんだの融点近傍とし外管
を浸漬するはんだ浴の温度をはんだの融点近傍と
し外管を浸漬するはんだ浴の温度を上記内管を浸
漬するはんだ浴の温度より高くすることにより強
度の高い接合部が得られる超音波はんだ付け方法
を提供するものである。 The present invention involves forming a solder coating layer in advance by immersing one end of an outer tube and an inner tube, which are fitted together with one end enlarged in diameter, in a solder bath to which ultrasonic vibrations are applied. In the method of fitting and soldering by applying heat and ultrasonic vibration, the temperature of the solder bath in which the inner tube is immersed is near the melting point of the solder, and the temperature of the solder bath in which the outer tube is immersed is near the melting point of the solder, and the outer tube is immersed in the solder bath at a temperature near the melting point of the solder. The present invention provides an ultrasonic soldering method in which a high-strength joint can be obtained by making the temperature of the solder bath in which the inner tube is immersed higher than the temperature of the solder bath in which the inner tube is immersed.
以下、本発明を図面に示す実施例にもとづいて
詳細に説明する。 Hereinafter, the present invention will be explained in detail based on embodiments shown in the drawings.
第1図は本発明に係る方法によつて超音波はん
だ付けを行う一対の金属管の断面を示し、1は銅
管、2はアルミニウム管である。この銅管1は外
管であつて、内管となるアルミニウム管2と嵌合
できるように端部が拡径されている。 FIG. 1 shows cross sections of a pair of metal tubes to be ultrasonically soldered by the method according to the present invention, 1 being a copper tube and 2 being an aluminum tube. This copper tube 1 is an outer tube, and its end portion is enlarged in diameter so that it can be fitted with an aluminum tube 2 that will become an inner tube.
嵌合部をもつ上記一対の金属管の嵌合部のそれ
ぞれに、はんだ被覆層を形成するために、第2図
に示すはんだ浴3に上記金属管の端部を1回だけ
浸漬し、超音波ホーン4)より振動して行うが、
はんだ被覆層の形成について、内管と外管とで以
下のとうり異ならしめている。すなわち、使用す
るはんだは両者に共通しているものであり、亜鉛
95%、アルミニウム5%の組成になる亜鉛基合金
で、融点が382℃の性状を有する。アルミニウム
管に対しては、このはんだをはんだ浴3にて、上
記融点の近傍である410〜420℃の温度に保ち、常
温に放置されたその管の一端部を浸漬する。この
場合、浸漬される一端部の長さは外管となる銅管
1の嵌合長より好ましくは1.5倍とし、また、4
〜6秒間浸漬して超音波振動を付与した後引き上
げる。このような操作によつて、第3図に示すよ
うにはんだ被覆層5aが形成される。一方、銅管
1に対しては、はんだを430〜450℃に保つた後、
常温になるその管の拡径された端部を4〜6秒間
浸漬して超音波振動を付与した後引き上げる。こ
のようにして形成されたはんだ被覆層5の断面形
状を第3図に示す。第3図Aは外管に形成された
はんだ被覆層であり、はんだは嵌合部に薄く一様
に被着している。第3図Bは内管に形成されたは
んだ被覆層であり、はんだは嵌合部の先端付近に
おいてはその厚さは一様に被着しており、先端か
ら遠ざかるにつれて徐々に肉厚が増している。こ
のように内管のはんだ被覆層5aが一部厚肉にな
るのは、はんだ浴の温度が低いため内管自体充分
加熱されず、また嵌合部先端から先に行くほど温
度は低下するので内管をはんだ浴から引き上げた
際、内管に接触しているはんだは流れ落ちる間も
なく凝固し、そのまま上記のような形状のはんだ
被覆層5aが形成される為である。 In order to form a solder coating layer on each of the fitting portions of the pair of metal tubes having fitting portions, the ends of the metal tubes are dipped only once in the solder bath 3 shown in FIG. It is performed by vibrating from a sonic horn 4),
Regarding the formation of the solder coating layer, the inner tube and the outer tube are different as follows. In other words, the solder used is common to both, and zinc
It is a zinc-based alloy with a composition of 95% aluminum and 5% aluminum, and has a melting point of 382°C. For aluminum tubes, this solder is kept in a solder bath 3 at a temperature of 410 to 420 DEG C., which is near the above melting point, and one end of the tube, which has been left at room temperature, is immersed. In this case, the length of one end to be immersed is preferably 1.5 times longer than the fitting length of the copper tube 1 serving as the outer tube, and
After soaking for ~6 seconds and applying ultrasonic vibration, it is pulled up. Through such operations, a solder coating layer 5a is formed as shown in FIG. On the other hand, for copper tube 1, after keeping the solder at 430 to 450℃,
The enlarged end of the tube, which has reached room temperature, is immersed for 4 to 6 seconds to apply ultrasonic vibrations and then pulled up. FIG. 3 shows the cross-sectional shape of the solder coating layer 5 formed in this manner. FIG. 3A shows a solder coating layer formed on the outer tube, and the solder is thinly and uniformly applied to the fitting portion. Figure 3B shows the solder coating layer formed on the inner tube.The solder is uniformly thick near the tip of the fitting part, and gradually increases in thickness as it moves away from the tip. ing. The reason why the solder coating layer 5a of the inner tube is partly thick is because the temperature of the solder bath is low, so the inner tube itself is not sufficiently heated, and the temperature decreases as it goes from the tip of the fitting part. This is because when the inner tube is pulled up from the solder bath, the solder that is in contact with the inner tube solidifies before it flows down, and the solder coating layer 5a having the above-mentioned shape is formed as it is.
次に第4図に示すように銅管1、アルミニウム
管2を嵌合・加熱かつアルミニウム管2の上端に
当接した超音波ホーン6により超音波振動を付与
する。これはまず最初にはんだ被覆層5aを形成
した一対の金属管を第5図Aに示すように矢印方
向に押し込んで、次に嵌合する。はんだ被覆層5
a,5bをガスバーナ7で加熱し溶融する。この
溶融したはんだと接触している金属管の表面は超
音波振動による溶融はんだの空洞現象によつて表
面に付着していた酸化皮膜が破壊されて活性な金
属面が露出しフラツクスを使用したと同様の様相
を呈し、溶融はんだと金属管とをなじませ、さら
にアルミニウム管の熱膨脹や毛細管現象により嵌
合部の間〓に効果的に侵入する。第3図Bのよう
にアルミニウム管2上に厚く形成されたはんだ被
覆層5aは加熱によりその表層部が流れ落ちて嵌
合部の間〓を充填する。 Next, as shown in FIG. 4, the copper tube 1 and the aluminum tube 2 are fitted and heated, and ultrasonic vibrations are applied by the ultrasonic horn 6 that is in contact with the upper end of the aluminum tube 2. First, a pair of metal tubes on which the solder coating layer 5a has been formed are pushed in the direction of the arrow as shown in FIG. 5A, and then they are fitted together. Solder coating layer 5
a and 5b are heated and melted with a gas burner 7. On the surface of the metal tube that is in contact with this molten solder, the oxide film adhering to the surface is destroyed by the cavitation phenomenon of the molten solder caused by ultrasonic vibration, exposing the active metal surface, which indicates that flux was used. In a similar manner, the molten solder blends with the metal tube, and furthermore, it effectively penetrates into the space between the fitting parts due to the thermal expansion of the aluminum tube and capillary action. As shown in FIG. 3B, the surface layer of the solder coating layer 5a formed thickly on the aluminum tube 2 flows down due to heating and fills the space between the fitting parts.
一定時間経過後加熱と超音波振動の付与を停止
し冷却を行うが、即時にガスバーナ7を停止する
と、嵌合部の間〓に充填しているはんだは外管に
接触している部分や上部露出面から凝固を開始す
る。しかしながら溶融はんだは凝固するにつれて
収縮しその容積が減少する。したがつて最終的に
凝固した時点では凝固収縮孔やブローホールなど
の種々の欠陥がはんだ内部に発生する。上記の欠
陥を防止するには上部露出面が最後に凝固するよ
うにしなければならない。そのため本発明に係る
方法では、嵌合部周辺を加熱後、第5図Bのよう
に内管をガスバーナ7で加熱して、嵌合部の間〓
に充填するはんだの上部露出面が溶融はんだとし
て最後まで残るようにする。 After a certain period of time has elapsed, heating and ultrasonic vibration are stopped and cooling is performed. However, if the gas burner 7 is immediately stopped, the solder filled between the mating parts will be removed from the parts that are in contact with the outer tube and the upper part. Start solidifying from the exposed surface. However, as the molten solder solidifies, it contracts and its volume decreases. Therefore, when the solder finally solidifies, various defects such as solidification shrinkage holes and blowholes occur inside the solder. To prevent the above defects, the upper exposed surface must be the last to solidify. Therefore, in the method according to the present invention, after heating the area around the fitting part, the inner tube is heated with a gas burner 7 as shown in FIG.
Make sure that the upper exposed surface of the solder to be filled remains as molten solder until the end.
上記方法においては、上記したように一方が拡
径された嵌合部をもつ一対の金属管のうち内管の
嵌合部に形成するはんだ被覆層5aを正常なはん
だ浴温度より低いはんだの融点近傍の温度に保た
れたはんだ浴に浸漬して外管の嵌合部に形成する
はんだ被覆層の厚さより厚く、しかも先端から遠
ざかるにつれて徐々に肉厚を増すようにしてい
る。このようにすると、この内管に多めに被着し
たはんだ被覆層5aが加熱により溶融落下して嵌
合部の間〓にはんだを供給するようになり、凝固
収縮により生ずる収縮孔を補うに充分な量のはん
だを供給できる。それゆえ、一対の金属管の嵌合
部のクリヤランスの寸法精度を厳しくする必要が
なくなり、金属管の成形加工が容易になる。はん
だの露出面の冷却を遅らせ凝固に伴うはんだの収
縮分を補うことにより、凝固収縮孔やブローホー
ルなどの欠陥の発生を抑制して、信頼性が高く結
合強度の大きい接合を得ることができた。 In the above method, the solder coating layer 5a formed on the fitting portion of the inner tube of a pair of metal tubes, one of which has a fitting portion with an enlarged diameter as described above, has a melting point of solder that is lower than the normal solder bath temperature. It is thicker than the solder coating layer formed on the fitting portion of the outer tube by immersing it in a solder bath maintained at a nearby temperature, and the thickness gradually increases as it moves away from the tip. By doing this, the solder coating layer 5a that has been deposited on the inner tube in a large amount will melt and fall due to heating, and will supply solder between the fitting parts, which will be sufficient to compensate for the shrinkage holes caused by solidification and shrinkage. It is possible to supply a large amount of solder. Therefore, there is no need to tighten the dimensional accuracy of the clearance of the fitting portion of the pair of metal tubes, and the metal tubes can be easily formed. By delaying the cooling of the exposed surface of the solder and compensating for the shrinkage of the solder due to solidification, it is possible to suppress the occurrence of defects such as solidification shrinkage holes and blowholes, and to obtain a bond with high reliability and high bonding strength. Ta.
なお、本発明における実施例においては一対の
金属管の材種としては銅とアルミニウムを用いた
が、特にこれらに限定されることなく銅と銅、ア
ルミニウムとアルミニウムの同種金属を用いても
よい。また、ステンレスやチタン系合金をはじめ
とする他の金属を用いてもよい。 In the embodiments of the present invention, copper and aluminum were used as materials for the pair of metal tubes, but the materials are not limited to these, and similar metals such as copper and copper or aluminum and aluminum may be used. Other metals such as stainless steel and titanium alloys may also be used.
また、本発明はその要旨を変えない範囲で種々
変形実施可能であるのは勿論である。 Further, it goes without saying that the present invention can be modified in various ways without departing from the gist thereof.
第1図は超音波はんだ付けを行う一対の金属管
の要部断面図、第2図は金属管の嵌合部にはんだ
被覆層を形成する装置の断面図、第3図は一対の
金属管の嵌合部に形成されたはんだ被覆層を示す
断面図、第4図は一対の金属管の結合方法の説明
図、第5図は第4図の結合方法をより詳細に説明
するための図である。
1:銅管、2:アルミニウム管、3:はんだ
浴、5:はんだ被覆層、6:超音波ホーン、7:
ガスバーナ。
Figure 1 is a sectional view of the main parts of a pair of metal tubes that are used for ultrasonic soldering, Figure 2 is a sectional view of a device that forms a solder coating layer on the fitting part of the metal tubes, and Figure 3 is a sectional view of a pair of metal tubes. 4 is an explanatory diagram of a method of joining a pair of metal tubes, and FIG. 5 is a diagram illustrating the joining method of FIG. 4 in more detail. It is. 1: Copper tube, 2: Aluminum tube, 3: Solder bath, 5: Solder coating layer, 6: Ultrasonic horn, 7:
gas burner.
Claims (1)
嵌合される内管の一端部をそれぞれ超音波振動の
付与されたはんだ浴に浸漬してはんだ被覆層を形
成する工程と上記被覆層の形成された一端部どう
しを嵌合する工程とこの嵌合した部分に対して加
熱と超音波振動を付与してはんだ付けする工程と
を備えた超音波はんだ付け方法において、上記内
管を浸漬するはんだ浴の温度をはんだの融点近傍
とし外管を浸漬するはんだ浴の温度を上記内管を
浸漬するはんだ浴の温度より高くしたことを特徴
とする超音波はんだ付け方法。1. A step of forming a solder coating layer by immersing one end of the outer tube whose diameter has been expanded and one end of the inner tube fitted into this one end in a solder bath to which ultrasonic vibrations are applied, and the above coating layer. In the ultrasonic soldering method, the inner tube is immersed in an ultrasonic soldering method comprising a step of fitting the two formed ends together and a step of applying heat and ultrasonic vibration to the fitted portion and soldering. An ultrasonic soldering method characterized in that the temperature of the solder bath in which the outer tube is immersed is set to be near the melting point of the solder, and the temperature of the solder bath in which the outer tube is immersed is higher than the temperature of the solder bath in which the inner tube is immersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12520178A JPS5554263A (en) | 1978-10-13 | 1978-10-13 | Ultrasonic soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12520178A JPS5554263A (en) | 1978-10-13 | 1978-10-13 | Ultrasonic soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5554263A JPS5554263A (en) | 1980-04-21 |
| JPS6249142B2 true JPS6249142B2 (en) | 1987-10-17 |
Family
ID=14904401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12520178A Granted JPS5554263A (en) | 1978-10-13 | 1978-10-13 | Ultrasonic soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5554263A (en) |
-
1978
- 1978-10-13 JP JP12520178A patent/JPS5554263A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5554263A (en) | 1980-04-21 |
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