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JPS6249288B2 - - Google Patents
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JPS6249288B2 - - Google Patents

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Publication number
JPS6249288B2
JPS6249288B2 JP59279029A JP27902984A JPS6249288B2 JP S6249288 B2 JPS6249288 B2 JP S6249288B2 JP 59279029 A JP59279029 A JP 59279029A JP 27902984 A JP27902984 A JP 27902984A JP S6249288 B2 JPS6249288 B2 JP S6249288B2
Authority
JP
Japan
Prior art keywords
oil
weight
liquid
parts
properties
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59279029A
Other languages
Japanese (ja)
Other versions
JPS61157517A (en
Inventor
Shinji Tsukamoto
Kenji Ueda
Naokatsu Hisanaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SANYUREJIN KK
Original Assignee
SANYUREJIN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SANYUREJIN KK filed Critical SANYUREJIN KK
Priority to JP59279029A priority Critical patent/JPS61157517A/en
Publication of JPS61157517A publication Critical patent/JPS61157517A/en
Publication of JPS6249288B2 publication Critical patent/JPS6249288B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions

Landscapes

  • Organic Insulating Materials (AREA)
  • Polyurethanes Or Polyureas (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

産業上の利用分野 本発明は、防湿絶縁性に優れた樹脂組成物に関
する。 従来の技術及びその問題点 電子部品の高密度化、高集積化が進むにつれて
各部品に対する信頼性向上の要求が高まり、各部
品それぞれを樹脂封止するだけでなく、プリント
基板全体を樹脂封止することにより防湿絶縁性を
向上させようとする試みがなされている。 従来、溶剤型の樹脂塗料をプリント基板に塗布
して防湿絶縁性を向上させる方法が知られている
が、この方法では、充分な防湿絶縁性を得るため
には塗膜を厚くすることが必要となる。しかしな
がら、一度に樹脂塗料を厚塗りすると内部に溶剤
が残存するので乾燥に長時間を要し、また塗膜に
亀裂が発生し易いという問題があり、このため塗
料を数回に分けて重ね塗りすることが必要とな
る。また、溶媒型樹脂塗料で塗膜を形成させた基
板では、高温高湿テストやヒートサイクルテスト
により絶縁不良やハンダ割れ等の故障が発生し易
く、特性面においても実用上満足のいくものでは
ない。 問題点を解決するための手段 本発明者は、上記の如き従来技術の問題点に鑑
みて、鋭意研究を重ねた結果、水分吸収剤として
のゼオライトを含む特定の樹脂組成物が電子部品
等の防湿絶縁用に好適であることを見出し、ここ
に本発明を完成した。 即ち、本発明は、 (i) 液状ポリブタジエン系ポリオール100重量
部、ヒマシ油エステル交換物30〜150重量部、
水酸基を有しない可塑剤60〜80重量部及びゼオ
ライト1〜4重量部からなるA液、並びに (ii) ポリイソシアネートからなるB液 を必須成分とする樹脂組成物に係る。 本発明では、ポリオールとして液状ポリブタジ
エン系ポリオールとヒマシ油エステル交換物とを
併用することが必要である。液状ポリブタジエン
系ポリオールとヒマシ油エステル交換物とは相溶
性が良く、併用した場合には、粘度が低下して注
型性が良好になると共に、ポツトライフも長くな
る。また、両者を併用する場合には、ウレタン硬
化物の物性が向上し、特に電気特性が良好にな
る。 本発明では、液状ポリブタジエン系ポリオール
としては、分子700〜8000好ましくは1000〜3000
の液状ポリブタジエン系ポリオールが使用でき、
一例としてあげればポリブタジエン液状ゴムR−
45HT、R−45M(いずれもARCO社製)などの
商標名で市販されているブタジエン単独ポリオー
ル、あるいはスチレンとブタジエンとのコポリマ
ー、アクリロニトリルとブタジエンとのコポリマ
ー、例えばCS−15、CN−15(いずれもARCO社
製)、PBDG−1500DS(三洋化成工業社製)等の
商標名で市販されているポリオールが用いられ
る。 ヒマシ油エステル交換物とは、ヒマシ油と水酸
基を実質上有しない天然油脂とのエステル交換反
応物である。水酸基を実質上有しない天然油脂と
は具体的には、アマニ油、キリ油、ナタネ油、大
豆油、ヤシ油、パーム油、えの油、くるみ油、米
ぬか油、綿実油、つばき油、オリーブ油、らつか
せい油などの植物油、牛脂、豚脂、魚油、肝油、
鯨油などの動物油が例示できる。 ヒマシ油と天然油脂とのエステル交換は、通常
のエステル交換反応と同様の条件でよく、例えば
水酸化アルカリ、アルカリ金属アルコラート、炭
酸ソーダ等のアルカリ触媒やリサージなどの触媒
を使用し、180〜260℃、15分〜6時間反応を行な
えばよい。 ヒマシ油と天然油脂との割合は、広く変えるこ
とができるがヒマシ油90〜30重量%、天然油脂10
〜70重量%の範囲から選択することが特に好まし
い。天然油脂の割合が少なすぎると耐水性や電気
特性が低下し、一方、天然油脂の割合が余りに多
いと、ヒマシ油エステル交換物がウレタン化反応
に寄与できずに単なる配合物となり、硬化物の物
性にマイナスに作用する傾向があるので好ましく
ない。ヒマシ油エステル交換物の具体例として
は、YX−403、YX−406、YX−410(いずれも伊
藤製油(株)製)等の商標名により市販されているも
のがあげられる。 本発明では、液状ポリブタジエン系ポリオール
とヒマシ油エステル交換物との配合割合は、液状
ポリブタジエン系ポリオール100重量部に対して
ヒマシ油エステル交換物を30〜150重量部とする
ことが適当である。 水酸基を有しない可塑剤としては、AC−12、
AC−460(いずれも出光興産(株)製)などの商標名
で市販されている芳香族系プロセスオイル、NS
−100、NM−26(いずれも出光興産(株)製)など
の商標名で市販されているナフテン系プロセスオ
イル、ジオクチルフタレート、トリクレジルホス
フエート、トリオクチルフオスフエートなどのエ
ステル類、ナタネ油、大豆油、アマニ油、キリ油
などの天然油脂類が用いられる。これらの可塑剤
の添加により、樹脂の粘度が低下し、注型性が良
好になる。更にまた、これらの可塑剤の添加によ
り、硬化物の電気特性、特に耐湿電気特性が向上
し、かつ高特性が長期間維持される。可塑剤の添
加量は、液状ポリブタジエン系ポリオール100重
量部に対して60〜80重量部が適当である。 本発明では、更に、A液中にゼオライトを配合
する。ゼオライトは、水分吸収剤として作用する
ものであつてウレタン硬化物の防湿性向上に効果
がある。更に、ゼオライトは、樹脂組成物の注型
時に発生する泡を吸着して気泡の発生を抑える作
用も有し、硬化物の表面状態を良好なものとす
る。ゼオライトとしては、粒子径1〜10μm程度
の合成ゼオライトが好ましく、具体的には、モレ
キユラーシーブス3A、モレキユラーシーブス
4A、モレキユラーシーブス5A(いずれもユニオ
ン昭和(株)製)モレキユライトA−330、モレキユ
ライトA−430、モレキユライトA−530(いずれ
も栗田工業(株)製)などの商標名で市販されている
ものが用いられる。ゼオライトは、液状ポリブタ
ジエン系ポリオール100重量部に対して1〜4重
量部使用することが適当である。 本発明のB液として用いるポリイソシアネート
は、上記したポリオールの硬化剤として作用する
ものである。このようなポリイソシアネートとし
ては、トリレンジイソシアネート、ジフエニルメ
タンジイソシアネート、ナフタレンジイソシアネ
ート、キシリレンジイソシアネート、ジフエニル
スルホンジイソシアネート、トリフエニルメタン
ジイソシアネート、ヘキサメチレンジイソシアネ
ート、3−イソシアネートメチル−3・5・5−
トリメチルシクロヘキシルイソシアネート、3−
イソシアネートエチル−3・5・5−トリメチル
シクロヘキシルイソシアネート、3−イソシアネ
ートエチル−3・5・5−トリエチルシクロヘキ
シルイソシアネート、ジフエニルプロパンジイソ
シアネート、フエニレンジイソシアネート、シク
ロヘキシリレンジイソシアネート、3・3′−ジイ
ソシアネートジプロピルエーテル、トリフエニル
メタントリイソシアネート、ジフエニルエーテル
−4・4′−ジイソシアネートなどのポリイソシア
ネート或いはそのイソシアネートをフエノール
類、オキシム類、イミド類、メルカプタン類、ア
ルコール類、ε−カプロラクタム、エチレンイミ
ン、α−ピロリドン、マロン酸ジエチル、亜硫酸
水素ナトリウム、ホウ酸等でブロツク化したもの
があげられる。 本発明では、上記したA液とB液との配合割合
は、十分な硬化を図るためにB液中のイソシアネ
ート基1当量に対してA液中のポリオールの活性
水素が0.7〜1.2当量となるようにするのが好まし
い。 A液とB液とを混合した後、常法により注型
し、硬化させる。硬化は低温でゆつくり行なつて
もよく、加熱により促進させてもよい。 本発明の組成物には、タルク、クレー、炭酸カ
ルシウム、バライタ粉、シリカ粉、アルミナ、カ
ーボンブラツク、酸化チタン、酸化鉄をはじめと
する充填剤又は顔料、リン化合物、ハロゲン化合
物、酸化アンチモン等の難燃剤、酸化防止剤、老
化防止剤、紫外線吸収剤などの各種の添加剤を必
要に応じ配合してもよい。 発明の効果 本発明樹脂組成物は、防湿絶縁性に優れたもの
であつて、特にプリント基板等の樹脂封止に利用
することにより、水分の吸収による絶縁性の低下
を長期間防ぎ得る。更に該組成物は適度の粘度を
有するものであつて、注型性に優れた特徴を有
し、また適度の硬化性を有する。 実施例 以下に実施例を示して本発明を更に詳細に説明
する。 実施例1〜7及び比較例1〜7 第1表(実施例1〜7)及び第2表(比較例1
〜7)に示す各樹脂組成物を以下に示す方法によ
り調製した。 まず、液状ポリブタジエン系ポリオールとヒマ
シ油エステル交換物とを混合し、加熱、冷却、減
圧装置のついた反応釜に投入して、100℃、10mm
Hg以下の圧力下で2時間かけて脱水後、冷却し
た。次いで水酸基を有しない可塑剤をこれに加え
て50℃、10mmHg以下の圧力下で1時間脱水後、
合成ゼオライトを投入混合してA液とし、これに
ポリイソシアネートからなるB液を加えて、混
合、脱泡して本発明樹脂組成物を得た。 次いで、300×50×10mmのシリコン型中に298×
48×1mmの紙ポリエステル製プリント基板を型の
底面から2mmの間隔をあけて配置した成形用型に
上記樹脂組成物100gを注入した後、以下に示す
方法で、各樹脂組成物の相溶性、注型性、硬化
性、電気特性及び耐湿特性の試験を行なつた。こ
れらの結果を第3表(実施例)及び第4表(比較
例)に示す。なお、第1表及び第2表の数値は、
重量部を表わす。 Γ相溶性 A液及びB液の混合液の分離の有無を観察し、
分離の有るものを「不良」分離のないものを「良
好」とした。 Γ注型性 A液及びB液の混合液をプリント基板の上から
注型し、底部まで流れ込み気泡がないものを「良
好」、少し気泡が残るものを「普通」、流れ込まな
いものを「不良」とした。 Γ硬化性 A液及びB液の混合液を型に流し込み、80℃の
乾燥器に入れて、1時間で脱型でき、かつ表面状
態の良好なものを「良好」、それ以外のものを
「不良」とした。 Γ電気特性 JIS K6911の方法により、硬化物の体積固有抵
抗を23℃で測定し、1×1013Ω・cm以上のものを
「A」、1×1011〜1×1013Ω・cmのものを「B」、
1×1011未満のものを「C」とした。 Γ耐湿特性 上記電気特性測定の硬化物を40℃、95%RH雰
囲気中に500時間放置後、23℃で体積固有抵抗を
測定し、1×1011Ω・cm以上のものを「良好」、
1×1011未満のものを「不良」とした。
INDUSTRIAL APPLICATION FIELD The present invention relates to a resin composition with excellent moisture-proof insulation properties. Conventional technology and its problems As electronic components become more dense and highly integrated, there is a growing demand for improved reliability for each component. Attempts have been made to improve the moisture-proof insulation properties by doing so. Conventionally, it is known to improve moisture-proof insulation by applying solvent-based resin paint to printed circuit boards, but with this method, it is necessary to thicken the coating film in order to obtain sufficient moisture-proof insulation. becomes. However, if you apply a thick layer of resin paint at once, the solvent will remain inside, so it takes a long time to dry, and the paint film is likely to crack. Therefore, the paint is coated in several layers. It is necessary to do so. In addition, substrates coated with solvent-based resin paints tend to suffer from failures such as poor insulation and solder cracks during high-temperature, high-humidity tests and heat cycle tests, and their properties are unsatisfactory in practical terms. . Means for Solving the Problems In view of the problems of the prior art as described above, the present inventor has conducted intensive research and found that a specific resin composition containing zeolite as a water absorbent is suitable for use in electronic parts, etc. The present invention was completed based on the discovery that the material is suitable for moisture-proof insulation. That is, the present invention comprises (i) 100 parts by weight of liquid polybutadiene polyol, 30 to 150 parts by weight of castor oil transesterifier,
The present invention relates to a resin composition having as essential components a liquid A consisting of 60 to 80 parts by weight of a plasticizer that does not have a hydroxyl group and 1 to 4 parts by weight of zeolite, and (ii) a liquid B consisting of a polyisocyanate. In the present invention, it is necessary to use a liquid polybutadiene polyol and a castor oil transesterified product together as the polyol. The liquid polybutadiene polyol and the castor oil transesterified product have good compatibility, and when used together, the viscosity is lowered, the castability is improved, and the pot life is extended. Furthermore, when both are used in combination, the physical properties of the cured urethane product are improved, and in particular, the electrical properties are improved. In the present invention, the liquid polybutadiene polyol has a molecular weight of 700 to 8000, preferably 1000 to 3000.
liquid polybutadiene polyols can be used,
As an example, polybutadiene liquid rubber R-
45HT, R-45M (all manufactured by ARCO), butadiene sole polyols, copolymers of styrene and butadiene, copolymers of acrylonitrile and butadiene, such as CS-15, CN-15 (both Polyols commercially available under trade names such as PBDG-1500DS (manufactured by Sanyo Chemical Industries, Ltd.) and PBDG-1500DS (manufactured by Sanyo Chemical Industries, Ltd.) are used. A castor oil transesterification product is a transesterification product of castor oil and a natural oil or fat that has substantially no hydroxyl groups. Natural oils and fats that do not substantially have hydroxyl groups include linseed oil, tung oil, rapeseed oil, soybean oil, coconut oil, palm oil, edible oil, walnut oil, rice bran oil, cottonseed oil, camellia oil, olive oil, Vegetable oils such as radish oil, beef tallow, pork fat, fish oil, liver oil,
An example is animal oil such as whale oil. Transesterification of castor oil and natural fats and oils may be carried out under the same conditions as for ordinary transesterification reactions, for example, using an alkali catalyst such as alkali hydroxide, alkali metal alcoholate, or soda carbonate, or a catalyst such as Lissage, The reaction may be carried out at a temperature of 15 minutes to 6 hours. The proportion of castor oil and natural fats can vary widely, but 90-30% castor oil and 10% natural fats and oils by weight.
It is particularly preferred to select from the range of ~70% by weight. If the proportion of natural oils and fats is too small, water resistance and electrical properties will deteriorate, while if the proportion of natural oils and fats is too high, the castor oil transesterified product will not be able to contribute to the urethanization reaction and will become a mere compound, resulting in poor cured products. It is not preferable because it tends to have a negative effect on physical properties. Specific examples of castor oil transesterification products include those commercially available under trade names such as YX-403, YX-406, and YX-410 (all manufactured by Ito Oil Co., Ltd.). In the present invention, the blending ratio of the liquid polybutadiene polyol and the castor oil transesterifier is suitably 30 to 150 parts by weight per 100 parts by weight of the liquid polybutadiene polyol. Examples of plasticizers without hydroxyl groups include AC-12,
Aromatic process oils, NS, commercially available under trade names such as AC-460 (all manufactured by Idemitsu Kosan Co., Ltd.)
-100, NM-26 (all manufactured by Idemitsu Kosan Co., Ltd.), naphthenic process oils, esters such as dioctyl phthalate, tricresyl phosphate, trioctyl phosphate, and rapeseed oils. Natural oils and fats such as oil, soybean oil, linseed oil, and tung oil are used. Addition of these plasticizers reduces the viscosity of the resin and improves castability. Furthermore, the addition of these plasticizers improves the electrical properties of the cured product, particularly the moisture-resistant electrical properties, and maintains the high properties for a long period of time. The appropriate amount of the plasticizer added is 60 to 80 parts by weight per 100 parts by weight of the liquid polybutadiene polyol. In the present invention, zeolite is further blended into the A liquid. Zeolite acts as a moisture absorbent and is effective in improving the moisture resistance of cured urethane products. Furthermore, zeolite also has the effect of adsorbing bubbles generated during casting of the resin composition and suppressing the generation of bubbles, thereby improving the surface condition of the cured product. As the zeolite, synthetic zeolites with a particle size of about 1 to 10 μm are preferable, and specifically, molecular sieves 3A, molecular sieves
4A, Molecular Sheaves 5A (all manufactured by Union Showa Co., Ltd.), Moleculite A-330, Moleculite A-430, Moleculite A-530 (all manufactured by Kurita Water Industries, Ltd.), and other trademark names. things are used. It is appropriate to use 1 to 4 parts by weight of zeolite per 100 parts by weight of liquid polybutadiene polyol. The polyisocyanate used as liquid B in the present invention acts as a curing agent for the polyol described above. Such polyisocyanates include tolylene diisocyanate, diphenylmethane diisocyanate, naphthalene diisocyanate, xylylene diisocyanate, diphenylsulfone diisocyanate, triphenylmethane diisocyanate, hexamethylene diisocyanate, 3-isocyanate methyl-3, 5, 5-
Trimethylcyclohexyl isocyanate, 3-
Isocyanate ethyl-3,5,5-trimethylcyclohexyl isocyanate, 3-isocyanate ethyl-3,5,5-triethylcyclohexyl isocyanate, diphenylpropane diisocyanate, phenylene diisocyanate, cyclohexylylene diisocyanate, 3,3'-diisocyanate dipropyl ether , triphenylmethane triisocyanate, diphenyl ether-4,4'-diisocyanate, and other polyisocyanates, or their isocyanates are combined with phenols, oximes, imides, mercaptans, alcohols, ε-caprolactam, ethyleneimine, α-pyrrolidone , diethyl malonate, sodium bisulfite, boric acid, etc. In the present invention, the blending ratio of the above-mentioned A liquid and B liquid is such that the active hydrogen of the polyol in the A liquid is 0.7 to 1.2 equivalents per 1 equivalent of isocyanate group in the B liquid in order to achieve sufficient curing. It is preferable to do so. After mixing liquid A and liquid B, the mixture is cast and cured by a conventional method. Curing may be carried out slowly at low temperatures or may be accelerated by heating. The composition of the present invention contains fillers or pigments such as talc, clay, calcium carbonate, baryta powder, silica powder, alumina, carbon black, titanium oxide, iron oxide, phosphorus compounds, halogen compounds, antimony oxide, etc. Various additives such as flame retardants, antioxidants, anti-aging agents, and ultraviolet absorbers may be added as necessary. Effects of the Invention The resin composition of the present invention has excellent moisture-proof insulation properties, and when used particularly for resin sealing of printed circuit boards, etc., it can prevent deterioration of insulation properties due to moisture absorption for a long period of time. Furthermore, the composition has an appropriate viscosity, excellent castability, and appropriate curability. EXAMPLES The present invention will be explained in more detail with reference to Examples below. Examples 1 to 7 and Comparative Examples 1 to 7 Table 1 (Examples 1 to 7) and Table 2 (Comparative Example 1
Each resin composition shown in ~7) was prepared by the method shown below. First, liquid polybutadiene polyol and castor oil transesterified product were mixed, put into a reaction vessel equipped with heating, cooling, and pressure reduction equipment, and heated to 100°C with a diameter of 10 mm.
After dehydration for 2 hours under pressure below Hg, it was cooled. Next, a plasticizer without hydroxyl groups was added to this, and after dehydration at 50°C and a pressure of 10 mmHg or less for 1 hour,
Synthetic zeolite was added and mixed to obtain liquid A, to which liquid B consisting of polyisocyanate was added, mixed, and defoamed to obtain a resin composition of the present invention. Then, 298× into a 300×50×10mm silicone mold.
After injecting 100 g of the above resin composition into a mold in which a 48 x 1 mm paper polyester printed circuit board was placed at a distance of 2 mm from the bottom of the mold, the compatibility of each resin composition was determined by the method shown below. Tests were conducted on castability, curing properties, electrical properties, and moisture resistance properties. These results are shown in Table 3 (Example) and Table 4 (Comparative Example). The numbers in Tables 1 and 2 are as follows:
Represents parts by weight. Γ Compatibility Observe the presence or absence of separation of the mixture of liquid A and liquid B,
Those with separation were classified as "poor" and those without separation were classified as "good." Γ Castability A mixture of liquids A and B is poured over the printed circuit board, and if it flows to the bottom and there are no bubbles, it is ``good'', if some bubbles remain, it is ``normal'', and if it does not flow, it is ``bad''. ”. Γ Curing property Pour the mixture of liquids A and B into a mold, put it in a dryer at 80℃, and if it can be removed from the mold in 1 hour and has a good surface condition, it is rated "good", otherwise it is rated "good". "Defect". ΓElectrical properties The volume resistivity of the cured product was measured at 23℃ according to the method of JIS K6911, and those with a value of 1×10 13 Ω・cm or more were classified as “A”, and those with a resistance of 1×10 11 to 1×10 13 Ω・cm were classified as “A”. ``B'' for things;
Those with a value of less than 1×10 11 were designated as “C”. Γ Moisture resistance properties After leaving the cured product measured for the electrical properties above in an atmosphere of 40°C and 95% RH for 500 hours, measure the volume resistivity at 23°C. If it is 1 x 10 11 Ω・cm or more, it is "good".
Those with a value of less than 1×10 11 were considered “defective”.

【表】【table】

【表】【table】

【表】【table】

【表】【table】

【表】 第3表及び第4表から明らかな如く、本発明樹
脂組成物は、硬化剤とその他の成分との相溶性、
注型性、硬化性、電気特性(絶縁性)及び耐湿特
性に優れたものである。これに対して、比較例で
は、上記した5種類の特性が同時にすべて優れた
ものは得られない。
[Table] As is clear from Tables 3 and 4, the resin composition of the present invention has a high compatibility between the curing agent and other components,
It has excellent castability, hardenability, electrical properties (insulating properties), and moisture resistance properties. On the other hand, in the comparative example, it is not possible to obtain a product that is excellent in all of the above five types of characteristics at the same time.

Claims (1)

【特許請求の範囲】 1 (i) 液状ポリブタジエン系ポリオール100重
量部、ヒマシ油エステル交換物30〜150重量
部、水酸基を有しない可塑剤60〜80重量部及び
ゼオライト1〜4重量部からなるA液、並びに (ii) ポリイソシアネートからなるB液 と必須成分とする樹脂組成物。
[Scope of Claims] 1 (i) A consisting of 100 parts by weight of liquid polybutadiene polyol, 30 to 150 parts by weight of castor oil transesterifier, 60 to 80 parts by weight of a plasticizer having no hydroxyl group, and 1 to 4 parts by weight of zeolite. and (ii) a resin composition containing as an essential component a B solution consisting of a polyisocyanate.
JP59279029A 1984-12-28 1984-12-28 Resin composition Granted JPS61157517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59279029A JPS61157517A (en) 1984-12-28 1984-12-28 Resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59279029A JPS61157517A (en) 1984-12-28 1984-12-28 Resin composition

Publications (2)

Publication Number Publication Date
JPS61157517A JPS61157517A (en) 1986-07-17
JPS6249288B2 true JPS6249288B2 (en) 1987-10-19

Family

ID=17605397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59279029A Granted JPS61157517A (en) 1984-12-28 1984-12-28 Resin composition

Country Status (1)

Country Link
JP (1) JPS61157517A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011001426A (en) * 2009-06-17 2011-01-06 Dai Ichi Kogyo Seiyaku Co Ltd Polyurethane resin composition

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749517B2 (en) * 1985-12-23 1995-05-31 出光石油化学株式会社 Paste-shaped hygroscopic material composition for polyurethane or polyurethane prepolymer
JPH064779B2 (en) * 1986-02-13 1994-01-19 出光石油化学株式会社 Surface treatment agent
JP2606432B2 (en) * 1990-10-04 1997-05-07 日立化成工業株式会社 Urethane resin composition
JP4517115B2 (en) * 2007-09-10 2010-08-04 第一工業製薬株式会社 Polyurethane resin electrical insulation composition
WO2022221402A1 (en) * 2021-04-15 2022-10-20 Checkerspot, Inc. Cast polyurethane compositions and uses thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59197469A (en) * 1983-04-25 1984-11-09 Dai Ichi Kogyo Seiyaku Co Ltd metal coating composition
JPS59197466A (en) * 1983-04-25 1984-11-09 Dai Ichi Kogyo Seiyaku Co Ltd Coating composition for metal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011001426A (en) * 2009-06-17 2011-01-06 Dai Ichi Kogyo Seiyaku Co Ltd Polyurethane resin composition

Also Published As

Publication number Publication date
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