JPS6249567B2 - - Google Patents
Info
- Publication number
- JPS6249567B2 JPS6249567B2 JP56010953A JP1095381A JPS6249567B2 JP S6249567 B2 JPS6249567 B2 JP S6249567B2 JP 56010953 A JP56010953 A JP 56010953A JP 1095381 A JP1095381 A JP 1095381A JP S6249567 B2 JPS6249567 B2 JP S6249567B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- lead wire
- metal plate
- resistant metal
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 238000005219 brazing Methods 0.000 description 7
- 230000005494 condensation Effects 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 230000007257 malfunction Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【発明の詳細な説明】
本発明は被加熱容器の外底面に接触して温度検
知を行う温度センサーの構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a temperature sensor that detects temperature by contacting the outer bottom surface of a heated container.
従来この種の温度センサーには一般的に感温抵
抗体からなるサーミスターが用いられている。し
かしこのサーミスターが高温から急激に温度降下
すると、温度抵抗体膜や電極膜とリード線の接続
部に結露が生じ絶縁不良となつて誤動作をおこ
し、温度センサーとしての役目を果さなくなる。
また絶縁性基板の底面に設けられた電極膜とリー
ド線との接続も不十分でリード線になんらかの引
張り荷重が加わるとリード線の接続部が簡単に断
線してトラブルが発生するという欠点があつた。 Conventionally, this type of temperature sensor generally uses a thermistor made of a temperature-sensitive resistor. However, if the temperature of this thermistor suddenly drops from a high temperature, dew condensation will occur at the connection between the temperature resistor film or electrode film and the lead wire, resulting in poor insulation and malfunction, making it unable to function as a temperature sensor.
In addition, the connection between the electrode film provided on the bottom of the insulating substrate and the lead wire is insufficient, and when some kind of tensile load is applied to the lead wire, the connection part of the lead wire easily breaks, causing trouble. Ta.
本発明はこのような従来の温度センサーの欠点
を解消し簡単な構造でしかも誤動作のない温度セ
ンサーを提供するもので、以下本発明の一実施例
を第１図から第８図にもとづいて説明する。 The present invention eliminates the drawbacks of the conventional temperature sensor and provides a temperature sensor that has a simple structure and does not malfunction.One embodiment of the present invention will be explained below based on FIGS. 1 to 8. do.
第１図において１はコンロのバーナ２部中央に
設けられた温度センサーの本体で、上記バーナー
２部に被加熱容器（図示せず）が載置されたとき
本体１の感熱ヘツド３がバーナー２で直接加熱さ
れないように遮熱筒４で覆われる。 In FIG. 1, reference numeral 1 denotes the main body of a temperature sensor installed in the center of the burner 2 section of the stove. When a container to be heated (not shown) is placed on the burner 2 section, the heat-sensitive head 3 of the main body 1 It is covered with a heat shield cylinder 4 to prevent it from being directly heated.
５はコンロのバーナーはり６にビス７で固定さ
れた本体１の取付台で、この取付台５には本体１
を構成する中空の案内シヤフト８が貫通される挿
入孔９を設けている。１０は案内シヤフト８に設
けられたスプリング１１の受台で、スプリング１
１によつて案内シヤフト８は常に上方へ押し上げ
られている。１２は案内シヤフト８の下端部に挿
入されたピンで、取付台５から案内シヤフト８が
抜けないように設けられたものである。１３は案
内シヤフト８の上端部に設けられた拡大部、１４
は感熱ヘツド３と案内シヤフト８の上端の拡大部
１３間に設けられたばねで、このばね１４は感熱
ヘツド３を常に上方へ付勢し、感熱ヘツド３の下
端部に設けられたつめ１５部によつて感熱ヘツド
３が案内シヤフト８の拡大部１３から抜けないよ
うに構成されている。この感熱ヘツド３内に設け
られたばね１４と、案内シヤフト８の受台１０に
設けられたスプリング１１の初圧縮力はばね１４
の方が多少強く形成されている。１６は第２図に
示す如くサーミスター部１７の一部を構成しアル
ミナなどで形成された絶縁性基板で、この絶縁性
基板１６の上面にメタライズ層１８を形成して感
熱ヘツド３にロウ付１９し、底面には電極膜２０
と、炭化珪素などからなる感温抵抗体膜２１が形
成されている。２２はステンレス鋼又は鉄、ニツ
ケル、クロムなどのコバール合金からなる耐熱性
金属板で、この耐熱性金属板を第３図、第４図ａ
に示す如く一体に形成し、ロウ付面２３をそれぞ
れの電極膜２０にロウ付け２４して固着し、更に
リード線２５の被覆部２６から僅かに突出した芯
線２７を耐熱性金属板２２の接続面２８に接続し
た後切断面２９を切断して第３図、第４図ｂの如
く２分割する。第３図ｂの３０は耐熱性金属板２
２の切断面２９に形成された折曲部、第４図ａ，
ｂの３０は耐熱性金属板２２に設けられた折曲部
で、この折曲部３０にリード線２５の被覆部２６
がかしめられて芯線２７の接続部が補強される。
３１はサーミスター部１７を構成する絶縁性基板
１６と、耐熱性金属板２２に接続されたリード線
２５の端部とを覆い結露発生による絶縁不良を防
止する絶縁体で、シリコン樹脂などで構成されて
いる。３２は耐熱性金属板２２の折曲部３０下方
に形成されたリード線２５の旋回部で、スプリン
グ性を有し感熱ヘツド３が案内シヤフト８の拡大
部１３に沿つて上下動するのに十分対応するよう
に構成されている。 Reference numeral 5 denotes a mounting base for the main body 1 fixed to the burner beam 6 of the stove with screws 7, and the main body 1 is mounted on this mounting base 5.
An insertion hole 9 is provided through which a hollow guide shaft 8 forming the structure is passed. 10 is a cradle for a spring 11 provided on the guide shaft 8;
1, the guide shaft 8 is constantly pushed upward. Reference numeral 12 denotes a pin inserted into the lower end of the guide shaft 8, and is provided to prevent the guide shaft 8 from coming off from the mounting base 5. 13 is an enlarged portion provided at the upper end of the guide shaft 8;
is a spring provided between the thermal head 3 and the enlarged part 13 at the upper end of the guide shaft 8, and this spring 14 always urges the thermal head 3 upwardly, and the pawl 15 provided at the lower end of the thermal head 3 Therefore, the thermal head 3 is configured so as not to come off from the enlarged portion 13 of the guide shaft 8. The initial compression force of the spring 14 provided in the heat-sensitive head 3 and the spring 11 provided in the pedestal 10 of the guide shaft 8 is
is formed somewhat more strongly. As shown in FIG. 2, 16 is an insulating substrate made of alumina or the like, which constitutes a part of the thermistor section 17. A metallized layer 18 is formed on the upper surface of this insulating substrate 16 and soldered to the heat-sensitive head 3. 19, and an electrode film 20 on the bottom surface.
A temperature-sensitive resistor film 21 made of silicon carbide or the like is formed. 22 is a heat-resistant metal plate made of stainless steel or a Kovar alloy such as iron, nickel, or chromium;
As shown in the figure, the brazing surface 23 is fixed to each electrode film 20 by brazing 24, and the core wire 27 slightly protruding from the covering portion 26 of the lead wire 25 is connected to the heat-resistant metal plate 22. After connecting to the surface 28, the cut surface 29 is cut to divide it into two parts as shown in FIGS. 3 and 4b. 30 in Fig. 3b is a heat-resistant metal plate 2
2, the bent portion formed on the cut surface 29 of FIG. 4a,
30 in b is a bent portion provided on the heat-resistant metal plate 22, and the covering portion 26 of the lead wire 25 is attached to this bent portion 30.
The connecting portion of the core wire 27 is reinforced by caulking.
31 is an insulator that covers the insulating substrate 16 constituting the thermistor section 17 and the end of the lead wire 25 connected to the heat-resistant metal plate 22 to prevent insulation failure due to condensation, and is made of silicone resin or the like. has been done. Reference numeral 32 denotes a turning part of the lead wire 25 formed below the bent part 30 of the heat-resistant metal plate 22, which has a spring property and has enough strength to allow the heat-sensitive head 3 to move up and down along the enlarged part 13 of the guide shaft 8. configured to correspond.
また第５図に示す如く感熱ヘツド３内に設けら
れたサーミスター部を構成する他の実施例として
第６図に示すような感熱ヘツド３に溶接する脚３
３と、リード線２５の被覆部２６がかしめられる
折曲部３０とを有する補強金具３４を一体に形成
し耐熱性金属板２２を第７図ａ，ｂに示す如く一
体に形成してロウ付面２３をそれぞれ電極膜２０
にロウ付け２４した後リード線２５の芯線２７を
耐熱性金属板２２の接続面２８に接続して切断面
２９を切断してもよい。なお第２図、第５図の耐
熱性金属板２２はそれぞれの電極膜２０に別々に
ロウ付け２４しても良い。 In addition, as shown in FIG. 6, as another embodiment of configuring the thermistor section provided in the heat-sensitive head 3, a leg 3 welded to the heat-sensitive head 3 as shown in FIG.
3 and a reinforcing metal fitting 34 having a bent part 30 to which the covering part 26 of the lead wire 25 is caulked, and a heat-resistant metal plate 22 is integrally formed and soldered as shown in FIGS. 7a and 7b. Each surface 23 is covered with an electrode film 20.
After brazing 24, the core wire 27 of the lead wire 25 may be connected to the connection surface 28 of the heat-resistant metal plate 22, and the cut surface 29 may be cut. Note that the heat-resistant metal plates 22 in FIGS. 2 and 5 may be separately brazed 24 to each electrode film 20.
３５はリード線２５の固定手段で、中空の案内
シヤフト８内に保護されたリード線２５を第８図
に示す如くねじ３６の締めつけにより押え板３７
で固定し、外部からリード線２５に加わる引張り
荷重を縁切りするものである。この本体１の案内
シヤフト８内から導出されたリード線２５の他端
は、コンロの温度制御回路（図示せず）に接続さ
れ、バーナ２の加熱温度を制御する。 35 is a means for fixing the lead wire 25, and the lead wire 25 protected in the hollow guide shaft 8 is fixed to the holding plate 37 by tightening the screw 36 as shown in FIG.
The lead wire 25 is fixed in place to cut off the tensile load applied to the lead wire 25 from the outside. The other end of the lead wire 25 led out from inside the guide shaft 8 of the main body 1 is connected to a temperature control circuit (not shown) of the stove to control the heating temperature of the burner 2.
このように構成された本実施例の温度センサー
は、感熱ヘツド３の上に被加熱容器（図示せず）
を載置すると、案内シヤフトの拡大部１３に沿つ
て感熱ヘツド３が下方へ移動し、更に案内シヤフ
ト８が取付台５の挿入孔９から下方へ移動して感
熱ヘツド３の周囲は遮熱筒４で覆われバーナー２
で直接加熱されることがなくなる。そしてバーナ
２で加熱された被加熱容器（図示せず）の底面を
感熱ヘツド３内に設けられたサーミスター部１７
を通じて加熱温度が検知されこの信号をもつてリ
ード線２５の端部に接続された温度制御回路でバ
ーナー２の加熱温度を制御する。この感熱ヘツド
３内に設けられたサーミスター部１７を構成する
絶縁性基板１６、耐熱性金属板２２及びリード線
の芯線２７が絶縁体３１で保護されているため、
感熱ヘツド３内の温度が急激に降下しても絶縁性
基板１６の底面の電極膜２０にロウ付けされた耐
熱性金属板２２や耐熱性金属板２２に接続された
リード線の芯線２７部、また絶縁性基板１６の底
面に設けられた感温抵抗体膜２１などに結露が発
生することがないので絶縁不良による温度センサ
ーの誤動作は生じない。また絶縁性基板１６の上
面に設けられたメタライズ層１８と感熱ヘツド３
をロウ付け１９することにより温度センサーとし
ての熱応答性が一段とよくなる。また絶縁性基板
１６の底面に設けられた電極膜２０に耐熱性金属
板２２をロウ付け２４するとき耐熱性金属板２２
が第３図ａ、第４図ａ、第７図ａ，ｂに示すよう
に一体構成されているため一定の位置に取付けが
可能でロウ付け作業も容易である。また第３図ｂ
に示すように耐熱性金属板２２にリード線２５の
芯線２７を接続し切断面２９を切断して形成され
た折曲部３０でリード線２５の被覆部２６をかし
めることによりリード線２５の接続部が強化され
る。またこの耐熱性金属板２２を第７図ａ，ｂの
ように構成し第６図に示す補強金具３４を用いて
も同様の効果が得られる。 The temperature sensor of this embodiment configured as described above has a heated container (not shown) placed on top of the heat sensitive head 3.
When placed, the thermal head 3 moves downward along the enlarged part 13 of the guide shaft, and the guide shaft 8 further moves downward from the insertion hole 9 of the mounting base 5, forming a heat shield cylinder around the thermal head 3. Burner 2 covered by 4
It will no longer be heated directly. Then, the bottom surface of the heated container (not shown) heated by the burner 2 is connected to a thermistor section 17 provided in the heat-sensitive head 3.
The heating temperature is detected through the burner 2, and the heating temperature of the burner 2 is controlled using this signal by a temperature control circuit connected to the end of the lead wire 25. Since the insulating substrate 16, the heat-resistant metal plate 22, and the core wire 27 of the lead wire, which constitute the thermistor section 17 provided in the heat-sensitive head 3, are protected by the insulator 31,
Even if the temperature inside the heat-sensitive head 3 suddenly drops, the heat-resistant metal plate 22 brazed to the electrode film 20 on the bottom of the insulating substrate 16, the core wire 27 of the lead wire connected to the heat-resistant metal plate 22, Furthermore, since no dew condensation occurs on the temperature-sensitive resistor film 21 provided on the bottom surface of the insulating substrate 16, malfunction of the temperature sensor due to poor insulation does not occur. Furthermore, the metallized layer 18 and the thermal head 3 provided on the upper surface of the insulating substrate 16
By brazing 19, the thermal response as a temperature sensor is further improved. Also, when the heat-resistant metal plate 22 is brazed 24 to the electrode film 20 provided on the bottom surface of the insulating substrate 16, the heat-resistant metal plate 22
As shown in FIGS. 3a, 4a, and 7a and 7b, they are integrally constructed, so that they can be mounted in a fixed position and the brazing work is easy. Also, Figure 3b
As shown in the figure, the core wire 27 of the lead wire 25 is connected to the heat-resistant metal plate 22, and the sheathing portion 26 of the lead wire 25 is caulked at the bent portion 30 formed by cutting the cut surface 29. Connections are strengthened. Further, the same effect can be obtained by constructing the heat-resistant metal plate 22 as shown in FIGS. 7a and 7b and using reinforcing metal fittings 34 shown in FIG. 6.
そして加熱調理が終了するとバーナ２部から被
加熱容器（図示せず）がおろされ、感熱ヘツド３
がばね１４の反発力でもとの位置にもどされる。
更に案内シヤフト８もスプリング１１の反発力で
もとの位置にもどされる。更に案内シヤフト８も
スプリング１１の反発力でもとの位置にもどされ
る。感熱ヘツド３内に形成されたリード線２５の
旋回部３２は感熱ヘツド３の上下動に十分対応
し、また案内シヤフト８内に挿入されたリード線
２５は、リード線の固定手段３５で固定されてい
るので外部からの引張り荷重にも十分耐えられる
ため断線や接触不良も生じない。 When the cooking is finished, the container to be heated (not shown) is taken down from the burner 2, and the heat-sensitive head 3
is returned to its original position by the repulsive force of the spring 14.
Furthermore, the guide shaft 8 is also returned to its original position by the repulsive force of the spring 11. Furthermore, the guide shaft 8 is also returned to its original position by the repulsive force of the spring 11. The pivoting portion 32 of the lead wire 25 formed inside the heat-sensitive head 3 sufficiently corresponds to the vertical movement of the heat-sensitive head 3, and the lead wire 25 inserted into the guide shaft 8 is fixed by a lead wire fixing means 35. Because it is fully durable, it can withstand external tensile loads without causing wire breakage or poor contact.
以上のように本発明の温度センサーは熱応答性
に優れなおかつサーミスター部を絶縁体で保護し
ているので温度が急激に降下しても結露発生する
ことがなく従つて誤動作をおこすことはない。ま
たサーミスター部を構成する電極膜に耐熱性金属
板をロウ付けするとき、耐熱性金属板は一体の状
態でロウ付けされるので一定の位置に取付が可能
で、かつ取付作業性もよい。さらに耐熱性金属板
から導出されるリード線は、耐熱性金属板又は補
強金具の折曲部と案内シヤフトに設けられた固定
手段で固定されているため外部からの引張り荷重
に対しても断線することのない優れた温度センサ
ーとして提供することができる。 As described above, the temperature sensor of the present invention has excellent thermal responsiveness and the thermistor part is protected by an insulator, so even if the temperature suddenly drops, no condensation occurs and malfunctions will not occur. . Furthermore, when the heat-resistant metal plate is brazed to the electrode film constituting the thermistor part, since the heat-resistant metal plate is brazed in an integral state, it can be mounted at a fixed position and the mounting work is easy. Furthermore, the lead wires derived from the heat-resistant metal plate are fixed by the bending part of the heat-resistant metal plate or reinforcing metal fittings and the fixing means provided on the guide shaft, so they will break even when subjected to external tensile loads. It can serve as an excellent temperature sensor.
第１図は本発明の一実施例を示す温度センサー
の本体を示す断面図、第２図は同第１図の本体の
サーミスター部を示す拡大断面図、第３図ａは第
２図の耐熱性金属板を示す斜視図、ｂは耐熱性金
属板にリード線を接続した状態を示す斜視図、第
４図ａ，ｂは第２図の耐熱性金属板の他の実施例
を示す斜視図、第５図は本発明の他の実施例を示
す本体のサーミスター部を示す拡大断面図、第６
図は第５図の補強金具を示す斜視図、第７図ａ，
ｂは第５図の耐熱性金属板を示す斜視図、第８図
はリード線の固定手段を示す断面図である。
１……本体、３……感熱ヘツド、８……案内シ
ヤフト、１６……絶縁性基板、１７……サーミス
ター部、１８……メタライズ層、１９……ロウ付
け、２０……電極膜、２１……感温抵抗体膜、２
２……耐熱性金属板、２４……ロウ付け、２５…
…リード線、２６……被覆部、３０……折曲部、
３１……絶縁体、３２……旋回部、３４……補強
金具、３５……固定手段。
FIG. 1 is a cross-sectional view showing the main body of a temperature sensor showing an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view showing the thermistor part of the main body of FIG. 1, and FIG. FIG. 4a and b are perspective views showing other embodiments of the heat-resistant metal plate shown in FIG. FIG. 5 is an enlarged sectional view showing the thermistor portion of the main body showing another embodiment of the present invention, and FIG.
The figures are a perspective view showing the reinforcing metal fittings in Fig. 5, Fig. 7a,
b is a perspective view showing the heat-resistant metal plate of FIG. 5, and FIG. 8 is a sectional view showing a means for fixing the lead wire. DESCRIPTION OF SYMBOLS 1... Main body, 3... Thermal head, 8... Guide shaft, 16... Insulating substrate, 17... Thermistor part, 18... Metallized layer, 19... Brazing, 20... Electrode film, 21 ...Temperature-sensitive resistor film, 2
2...Heat-resistant metal plate, 24...Brazing, 25...
...Lead wire, 26...Sheathing part, 30...Bending part,
31...Insulator, 32...Swivel portion, 34...Reinforcing metal fittings, 35...Fixing means.
Claims (1)
にメタライズ層を設け、上記絶縁性基板の底面に
は電極膜と感温抵抗体膜を設けて構成されたサー
ミスターにおいて、前記感熱ヘツドとメタライズ
層をロウ付けし、前記電極膜に耐熱性金属板をロ
ウ付けしてこの耐熱性金属板にリード線を接続
し、前記サーミスター部とリード線の被覆部とを
絶縁体で保護する構成としたことを特徴とする温
度センサー。 ２ 前記リード線の被覆部を耐熱性金属板の折曲
部で固定しリード線の接続部を補強する構成とし
たことを特徴とする特許請求の範囲第１項に記載
の温度センサー。 ３ 前記リード線の被覆部を補強金具の折曲部で
固定し前記リード線の接続部を補強する構成とし
たことを特徴とする特許請求の範囲第１項に記載
の温度センサー。 ４ 前記リード線は耐熱性金属板の折曲部の下方
に旋回部を設け前記感熱ヘツドの上下動に対応す
る構成としたことを特徴とする特許請求の範囲第
１項に記載の温度センサー。 ５ 前記耐熱性金属板に接続されたリード線は案
内シヤフトで保護されて導出するとともに、前記
リード線の接続部に加わる外部からの引張荷重を
上記案内シヤフトに設けられた固定手段で縁切す
る構成としたことを特徴とする特許請求の範囲第
１項に記載の温度センサー。 ６ 前記耐熱性金属板は一体に形成されて電極膜
にロウ付けされ、かつリード線が接続された後二
分割される構成としたことを特徴とする特許請求
の範囲第１項に記載の温度センサー。[Claims] 1. In a thermistor configured by providing a metallized layer on the top surface of an insulating substrate provided in a heat-sensitive head, and providing an electrode film and a temperature-sensitive resistor film on the bottom surface of the insulating substrate. , the heat-sensitive head and the metallized layer are brazed, a heat-resistant metal plate is brazed to the electrode film, a lead wire is connected to the heat-resistant metal plate, and the thermistor part and the covering part of the lead wire are insulated. A temperature sensor characterized by being configured to be protected by the body. 2. The temperature sensor according to claim 1, wherein the covering portion of the lead wire is fixed by a bent portion of a heat-resistant metal plate to reinforce the connecting portion of the lead wire. 3. The temperature sensor according to claim 1, wherein the covering portion of the lead wire is fixed by a bent portion of a reinforcing metal fitting to reinforce the connecting portion of the lead wire. 4. The temperature sensor according to claim 1, wherein the lead wire has a rotating portion below the bent portion of the heat-resistant metal plate so as to correspond to the vertical movement of the heat-sensitive head. 5. The lead wire connected to the heat-resistant metal plate is guided out while being protected by a guide shaft, and the external tensile load applied to the connection portion of the lead wire is cut off by a fixing means provided on the guide shaft. The temperature sensor according to claim 1, characterized in that the temperature sensor has the following configuration. 6. The temperature according to claim 1, wherein the heat-resistant metal plate is integrally formed and brazed to the electrode film, and is divided into two after the lead wire is connected. sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56010953A JPS57125333A (en) | 1981-01-27 | 1981-01-27 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56010953A JPS57125333A (en) | 1981-01-27 | 1981-01-27 | Temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57125333A JPS57125333A (en) | 1982-08-04 |
| JPS6249567B2 true JPS6249567B2 (en) | 1987-10-20 |
Family
ID=11764549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56010953A Granted JPS57125333A (en) | 1981-01-27 | 1981-01-27 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57125333A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410174U (en) * | 1987-07-06 | 1989-01-19 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0365937U (en) * | 1989-10-31 | 1991-06-26 | ||
| JPH04152233A (en) * | 1990-10-16 | 1992-05-26 | Matsushita Electric Ind Co Ltd | Temperature sensor |
-
1981
- 1981-01-27 JP JP56010953A patent/JPS57125333A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6410174U (en) * | 1987-07-06 | 1989-01-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57125333A (en) | 1982-08-04 |
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