JPS6249983B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for aligning and bonding electrodes of an integrated circuit (hereinafter abbreviated as IC) and lead wires extending from openings in a circuit board at positions corresponding to each electrode. The present invention relates to a young bonding device.

As shown in FIG. 1, FIG. 2, FIG. 3, and FIG. A positioning device 5 for aligning the IC 1 and a moving device 8 for moving the image receiver 6 and the bonding tool 7 installed at the same position on the IC 1 to two positions are provided. For this reason, first
When aligning the electrodes 4 of the IC 1 with the many lead wires 3 protruding from the circuit board 2, the bonding tool 7 is moved back and the image receiver 6 is attached to the IC 1.
The relative positions of the electrodes 4 of the IC 1 and the lead wires 3 of the circuit board 2 are observed under magnification, and the position of the electrodes 4 of the IC 1 and the lead wires 3 of the circuit board 2 is determined by moving the circuit board 2 in the plane direction using the alignment device 5. Perform the matching.

Next, the bonding tool 7 advances and descends to perform bonding.

In this case, since the bonding tool 7 moves, it is impossible to keep the position of the bonding tool 7 constant, and the relative positions of the bonding tool 7 and the IC 1 will shift. As an example, if the bonding tool 7 is misaligned in the X direction with respect to the IC 1 as shown in FIG. 4, the forming shape of the lead wire 3 will become the shape shown in FIG. In the case of
Au-Sn eutectic alloy 9 protrudes, edge 1 of IC1
This results in the product being shot as 0, resulting in a defective product.

Since the conventional gigantic bonding apparatus moves the bonding tool 7, it is impossible to prevent edge firing due to the structure of the apparatus.

Another disadvantage of the conventional gigantic bonding device is that since it is provided with a moving device 8 for moving the bonding tool 7 to two positions, there is play at least in the sliding portion, making it difficult to maintain a constant parallelism between the IC 1 and the bonding tool 7. If this is not possible and the parallelism is not maintained, there will be a difference in the pressure applied to each lead wire 3 when bonding a large number of lead wires 3 at the same time, and lead wires with weak pressure may not be bonded or This resulted in some products having weak bonding strength. Bonding tool 7 for stable bonding
The parallelism between IC1 and IC1 is generally considered to be 2 to 3 μm or less, but by providing the moving device 8, the parallelism can be reduced to 2 to 3 μm.
It is virtually impossible to maintain parallelism of μm,
It was impossible to achieve stable bonding.

The present invention has been made in order to eliminate such drawbacks, and its purpose is to provide a gang bonding method in which the positions of the bonding tool and the IC electrodes are kept constant, and the lead wires of the circuit board can be bonded in a fixed position to prevent the lead wires from edging. The goal is to provide equipment.

A guyung bonding device according to the present invention is a guyang bonding device that aligns and simultaneously bonds electrodes of an integrated circuit and lead wires extending from openings in a circuit board to positions corresponding to each of the electrodes. An IC holding stand for holding an integrated circuit, an alignment device disposed above the IC holding stand for holding the circuit board and moving in a plane direction, and a bonding tool for bonding the lead wire to the electrode. a vertical movement device that is installed coaxially with the integrated circuit and moves in the vertical direction; and an image receiver that is locked to the vertical movement device and set at a position apart from the bonding tool and on a planar, substantially colinear line. a prism that refracts the alignment state of the electrode and the lead wire on two slopes and projects it onto the receiver; and a prism that holds the prism and is disposed between the alignment device and the vertical movement device. a prism moving device that is installed and moves horizontally, the prism has one slope coaxial with the integrated circuit and the bonding tool, the other slope substantially parallel to the one slope, and the prism with the image receiving It is characterized by being located on the same axis of the machine.

An embodiment of the present invention will be explained with reference to FIGS. 5 and 6. As explained in FIGS. 1, 2, and 3, 1 is an IC, 2 is a circuit board, and 3 is from a circuit board. An overhanging lead wire, 4 is an IC electrode, 5 is an alignment device, 6 is a TV camera that is a receiver, 7 is a bonding tool, 12 is a vertical movement device that simply moves the bonding tool 7 up and down, 13 is a lead wire A prism 14 holds the prism 13 and guides the alignment state of the electrode 4 to the image receiver 6, which is set at a position apart from the bonding tool 7 and substantially on the same plane in a plane, and a prism 14 is positioned below the bonding tool. A prism moving device 15 is an IC holding stand for horizontally moving the prism to release it.

In the above configuration, the IC 1 is set on the IC holding stand 15, and the IC electrode 4 and the numerous lead wires 3 protruding from the circuit board 2 at positions corresponding to the IC electrodes 4 are attached.
The alignment state with the prism 13 is reflected by the two parallel slopes of the prism 13, projected by the TV camera of the receiver 6, and displayed on a TV monitor (not shown).

Next, the positional deviation between the IC electrode 4 and the lead wire 3 is detected visually or by electrical pattern recognition means based on the projected image, and the circuit board 2 is moved in the plane direction by the alignment device 5, and the IC electrode 4 is and the lead wire 3 are aligned. Next, after the prism 13 is moved by the prism moving device 14 to a position where it will not hit even if the bonding tool 7 descends,
The bonding tool 7 is lowered by the vertical movement device 12 to perform bonding work.

With such a device, the bonding tool 7 only moves up and down, so the amount of deviation in the relative position of the IC 1 and the bonding tool 7 in the plane direction can be reduced to zero, so stable bonding without edge shots can be achieved. It can be carried out.

Furthermore, since there is no need for a two-position moving device for the bonding tool 7 that was required in conventional bonding equipment, it is possible to always maintain the parallelism between the bonding tool 7 and the IC 1 at 3 μm or less, making stable bonding possible. Summer.

In the above description, a prism was used as the light guiding means, but any optical fiber, mirror, etc. may be used.

As described above, according to the present invention, the bonding tool for bonding the electrodes of an IC and the lead wires of a circuit board is mounted on a vertical movement device that moves only up and down, and the image receiver is latched to the vertical movement device to observe the alignment state. The electrodes and lead wires can be aligned by placing the prism on the same plane as the bonding tool, and by installing a prism moving device that holds the prism and moves it horizontally between the IC holding table and the vertical moving device. The state is reflected by the two parallel slopes of the prism and projected onto the receiver, allowing the positioning device to accurately position the bonding tool relative to it, and also eliminates horizontal movement of the bonding tool. There is no need for high accuracy in horizontality, and by bonding only by vertical movement of the bonding tool so that the relative position in the plane direction is zero, it is possible to perform stable bonding with high bonding strength without edges.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional gigantic bonding device. FIG. 2 is a plan view showing the Guyang bonding state. FIG. 3 is a sectional view of FIG. 2. FIG. 4 is a cross-sectional view during Guiang bonding. FIG. 5 is a perspective view of the gigantic bonding apparatus of the present invention. FIG. 6 is a conceptual diagram of the gigantic bonding apparatus of the present invention. 1...IC, 2...circuit board, 3...lead wire, 4...
electrode, 5... alignment device, 6... image receiver, 7... bonding tool, 8... moving device, 9... eutectic alloy,
DESCRIPTION OF SYMBOLS 10... Edge, 11... Tool, 12... Vertical movement device, 13... Prism position, 14... Prism moving device, 15... IC holding stand.

Claims (1)

[Claims] 1. An IC holder in which the integrated circuit is held in a gang bonding device that aligns and simultaneously bonds the electrodes of the integrated circuit and the lead wires protruding from the openings of the circuit board at positions corresponding to each of the electrodes. A stand, an alignment device disposed above the IC holding stand that holds the circuit board and moves it in a planar direction, and a bonding tool that bonds the lead wires to the electrodes are positioned coaxially with the integrated circuit. a vertical moving device that is attached to the bonding tool and moves in the vertical direction; an image receiver that is locked to the vertical moving device and set at a position apart from the bonding tool and on substantially the same plane as the bonding tool; and the electrode and the lead. a prism that refracts the alignment state with the line with two slopes and projects it on the receiver;
a horizontally moving prism moving device that holds the prism and is disposed between the positioning device and the vertical moving device, and the prism moves one slope between the integrated circuit and the bonding tool. A gigantic bonding device characterized in that the other slope is located coaxially with the one slope, substantially parallel to the one slope, and coaxially with the image receiver.