JPS6252479B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming electrically conductive paths through electrical component mounting plates, particularly insulating materials.

In order to connect mutually facing sheet materials,
There are several conventional methods for making electrical connections through printed circuit boards. The most widely used method is plated through hole.
through hole). Plating requires many steps using different chemical baths that must be carefully regulated to maintain the correct chemical equilibrium. The aim of the invention is to make a through connection without the use of chemicals.
Other methods use eye holes or rods attached to the plate. The present invention does not use such devices.
There is a need in the art for a relatively quick and inexpensive method of making through connections. The object of the present invention is to provide such a method.

The present invention includes (a) forming a hole through an insulating plate; (b) disposing a conductive material over each opening of the hole and in flat contact with each surface of the insulating plate; c) applying mutually opposing forces to said electrically conductive materials, if these forces are of such magnitude and nature as to produce a metallurgical bond between said electrically conductive materials in the area of contact; A method of forming a conductive path through an insulating plate comprises driving the conductive materials through the holes and into contact with each other to effect solid state bonding.

When only such opposing forces are applied at room temperature (with the mold and the conductive sheet material exposed to room temperature), the cold weld is a cold weld. is formed. The opposing forces may be applied while raising the mold and/or conductive material above room temperature, but at a temperature that does not destroy the conductive material. In this case, this opposing force may be smaller than the opposing force when forming the cold weld.

The melting point of ceramic insulating plates has reached 1800℃, and the temperature limit at which existing organic material insulating plates break down is constantly rising.
It has exceeded 350 degrees Celsius.

In either case, solid state bonding is achieved without the use of vibrational or electrical energy.

Solid-phase bonding is defined as welding without the presence of a liquid phase in the base metal, i.e. without melting the base metal, either (i) by welding using only pressure at room temperature (cold welding) or (ii) by welding an insulating plate. Welding is performed by heating at a temperature that does not cause destruction, that is, by heating at a temperature of 350°C or less and applying pressure.

Therefore, according to the present invention, the mechanical bonding of the conductive materials of the printed circuit board and the electrical connection can be completed in just one step, and the conductive path can be formed with exquisite ease. In order to reduce the manufacturing process of printed circuit boards and simplify manufacturing,
Printed circuit boards can be made that are more reliable, easier to use, and more durable. Moreover, since no chemicals are used, environmental pollution can be greatly reduced.

or by fixing the ball so that it projects above the plate, or by attaching the rod so that it passes through the plate, or by optionally formed by chemically etching a metal plate to form a surface with a raised surface. Holes for ball or rod attachment are provided in the plate by the same through-hole pattern formed in the insulating plate separating the conductive sheet material.

Embodiments of the forming method of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIG. 1, each hole 11, 12 is
It is formed through 0. Each conductive sheet material 1
3 and 14 are located on mutually opposing surfaces of the insulating plate 10 and cover the hole 11. Each conductive sheet material 15,1
6 are located on mutually opposing surfaces of the insulating plate 10 and cover the hole 12. The mold 20 includes a mold surface 31 facing the hole 11 and a mold surface 33 facing the hole 12. The mold 21 includes a mold surface 32 facing the hole 11 and a mold surface 34 facing the hole 12.

As shown in FIG. 2, conductive sheet materials 13 and 14
are located on mutually opposing surfaces of the insulating plate 10 and contact within the hole 11. Conductive sheet material 15, 16
are located on mutually opposing surfaces of the insulating plate 10 and contact within the hole 12.

As shown in FIGS. 1 and 2, each hole 11, 1
2 is first formed on an insulating plate 10. Each hole 10, 11
After forming a sheet of conductive material, such as copper or aluminum, a sheet of conductive material, such as copper or aluminum, is brought into contact flatly with each side of the insulating plate 10, overlying the previously formed holes 10,11. Each mold 20, 21,
Constructed of materials such as hardened steel. Each mold surface 31,
32 are formed at positions facing each other. The insulating plate 10, on which the conductive layer, that is, the conductive sheet material 13, 14, 15, 16 is applied, is placed in each mold 20, 21 so that the holes formed in the insulating plate 10 are aligned between the mutually opposing mold surfaces. be located between.
Each type of insulating plate with each conductive sheet material is 2
After alignment between 0 and 21, the molds 20 and 21 are pressed against each other. The mold surface 31 contacts the conductive sheet material 13, and the mold surface 32 contacts the conductive sheet material 14. The two conductive sheets 13, 14 are bent inward until they meet each other. After the conductive sheets meet, the sheets are mechanically joined and electrically connected. This means that each conductive sheet material 1 is attached to each mold 20, 21.
This is done by using sufficient force to create a cold weld between 3 and 14. The resulting bond is shown in FIG. Each conductive sheet material 1
5 and 16 are similarly bonded to each other by mold surfaces 33 and 34. The resulting bond is shown in FIG. Each conductive sheet material 13, 14 is physically joined within the hole 11, and each conductive sheet material 15,
16 are physically joined within hole 12. In the illustrated embodiment, the opposing conductive sheets are adhered over all contact areas. However, if desired, each mold surface may be formed with a hole punched through the adhesive surface, leaving the sheet material in contact only around the periphery of the hole.

As shown in FIG.
It is formed in Each conductive sheet material 43, 44
are located on mutually opposing surfaces of the plate 40, and the holes 41
cover. The conductive sheet materials 45 and 46 are the plate 40
are located on mutually opposing surfaces and cover the hole 42.
The mold 50 has a mold surface 52 facing the hole 41 and a mold surface 52 facing the hole 41.
A mold surface 53 facing the mold surface 53 is provided. The plate 51 is
It has a flat surface facing the mold 50.

As shown in FIG. 4, each conductive sheet material 43,
44 are located on mutually opposing surfaces of the plate 40, but are joined to each other through the holes 41. Each conductive sheet material 45, 46 having a similar shape has a hole 42
They are connected to each other by penetrating them.

FIGS. 3 and 4 show similar bonding structures compared to FIGS. 1 and 2, except that only one mold has a protruding mold surface. The conductive sheet materials are adhered to each other by the force exerted on the plate 51 by the respective mold surfaces 52 and 53. The only difference from the previous method is that the contact area is not in the center of the hole but in the plane of the underlying sheet material 44,46.

As shown in FIG. 5, each insulating plate 60, 61, 6
2 are held aligned, and each hole 75, 76 is formed through these insulating plates. The conductive sheet materials 63 and 71 are located on the upper surface of the insulating plate 60. The conductive sheet materials 64, 72 are the insulating plates 60,
It is between 61 and 61. The conductive sheet materials 65 and 73 are
It is located between the insulating plates 61 and 62. Conductive sheet material 6
6 and 74 are located on the lower surface of the insulating plate 62. Each conductive sheet material 63, 64, 65, 66 covers the hole 75. Each conductive sheet material 71, 72, 73, 7
4 covers the hole 76. The mold surface 82 of the mold 80 has the hole 7
5 and faces the mold surface 84 of the mold 81. A mold surface 83 of the mold 80 is aligned above the hole 76 and faces a mold surface 85 of the mold 81 .

As shown in FIG. 6, each insulating plate 60, 61, 6
2 and each conductive sheet material 63, 64, 65, 6
6, 71, 72, 73, and 74 are arranged in the same manner as in FIG.

In the embodiment shown in FIGS. 5 and 6, multiple layers of conductive sheet material are electrically connected. Mechanical bonding of these multiple layers is carried out in the same manner as described above. Furthermore, multiple layers can be connected using only one mold having a mold surface such as that shown in FIGS. 3 and 4.

This paper has described room temperature welding, or cold welding, as a method for metallurgically joining conductive sheet materials. However, the mold and/or conductive sheet material may be heated to a temperature below 350°C. In this case, it is only necessary to apply a force less than that required for cold welding. In either case, a solid state bond is formed between the conductive sheet materials.

Such high temperatures should not be applied, because when temperatures above 350° C. are applied, the insulating plate 10 will be destroyed, resulting in severe distortion.

Although metal sheet material was used in each of the above embodiments,
Of course, wires or metal ribbons can be joined in this way. Also, any combination of sheet material, wire and ribbon can be used.

In FIG. 7, metallization 102 is applied onto the conductive sheet material in the bond area after the bond has been formed, such as by cold welding techniques as shown in FIG. 4, as previously described. The metallization 102 is a solder layer applied by wave soldering or by dipping, or a conductive metal plated onto a conductive sheet material.

FIG. 8 shows an example of a mold for performing the above-mentioned cold welding. component board
116 consists of conductive sheets 118, 120 on each side of an insulating plate 122 having holes 124 therein.
To form a cold weld, a conductive sheet material is bonded to a plate 104 having a surface 106 with holes 108 and a surface 11.
It is compressed between the plate 112 which has 4. Ball 110 within hole 108 deforms the conductive sheet material against surface 114 to cold weld the conductive sheet material. Ball 1
If the pressure with which 10 is pressed against surface 114 is sufficiently great, the conductive sheet material will be cold welded and perforated to form through holes.

Another mold for cold welding is illustrated in FIG. Component plate 172 includes insulating plate 17 with holes 180.
conductive layers 174, 178 on each side of 6. Plate 184 is provided with holes 186 and rod 1
88 is placed within this hole. Rod 188 has a circular head 188a. A support plate 190 is joined to plate 184 by bolts 192 to hold rod 188 in place.

Component plate 172 to form the joint.
is compressed between plates 182 and 184. Conductive sheet material or layers 174, 178 are deformed together and adhered by the pressing action of rod 188 against plate 182.

When the conductive sheet materials 174 and 178 are vibrated relative to each other when they come into contact, room temperature welding can be performed with less compressive force. By vibrating plate 184 and rod 188 or by vibrating plate 182, the conductive sheet material can be vibrated.

Offset joints are formed as illustrated in FIGS. 10 and 11. Component plate 234 has holes 2
The electrically conductive sheet material 236, 238 is provided on each side of an insulating plate 242 having a diameter of 40 mm. Upper mold 244
has a recess 246, and the lower mold 248 has a protrusion 250 opposite the recess 246.
The dimensions of the recess 246 are made large enough to accommodate the protrusion 250.

Offset joint 252, shown in FIG. 11, is formed by compressing component plate 234 between molds 244,248. The protrusions 250 deform the conductive sheets 236, 238 into the recesses 246, and the pressure of the protrusions 250 against the mold 244 cold welds the conductive sheets together.

Offset junction 252 provides a common mounting contact for planar components such as resistors, capacitors, and inductors with conductive pads on top. The planar components mounted in this way are therefore raised above the surface of the component plate 234.

A conductive circuit 286 for use with the present invention illustrated in FIG. 12 can be made by placing an anticorrosive paint on a copper sheet and then adding a corrosive liquid. This procedure follows common industrial practice for making printed circuit boards. Conductive circuit 286 includes conductive wire 282 and conductive pad 284.
and on the top surface. The conductive pattern can also be made by stamping the copper sheet with a die having cut edges in the desired pattern.

In addition, a mold for performing room temperature welding according to the present invention,
It can be made as shown in FIG. Board 22
4, place an anti-corrosion paint (resist) such as RISTON (trade name of DuPont) at the joint points. A chemical etchant, such as ferric chloride for steel plates, is applied to remove the plate material and form islands 228 protected by a chemical anti-corrosion coating.

The procedure for making a component plate according to the present invention is as follows. A conductor pattern as shown in FIG. 12 is selected along with an appropriate through hole pattern. Create metal foils for each side of the component plate using a conductor pattern. Both the insulating plate and the metal plate are drilled according to the through-hole pattern. A collision piece, such as a ball or rod as described above, is placed within the hole in the perforated metal plate. The metal foil and the insulating piece are then aligned between the perforated metal plate and the second flat plate, and the cold welding procedure described above is carried out to connect the metal foils to each other.

Bonding between conductive sheet materials can also be achieved by compressing the conductive sheet materials together, but not with sufficient force to form a cold weld. This is shown in FIG. With less compressive force, the conductive sheet materials 43, 44 will not be glued together. Similarly, conductive sheet material 4
5 and 46 are also not bonded. However, the conductive sheet material is brought into electrical contact and the solder or plated metal coating 102 provides added mechanical strength and a more secure electrical connection.

Although the present invention has been described in detail with respect to its embodiments, it is of course possible to make various changes and modifications to the present invention without departing from its spirit.

[Brief explanation of the drawing]

FIG. 1 is a side view of a symmetric adhesive type, an insulating plate, and a conductive sheet material for carrying out the first embodiment of the forming method of the present invention, and FIG. FIG. 3 is a side view of a single mold, substrate, insulating plate and conductive sheet material for carrying out the second embodiment of the forming method of the present invention, and FIG. FIG. 4 is a longitudinal sectional view of the insulating plate of FIG. 3 with opposing conductive sheet materials bonded together; FIG. 5 is a side view of a symmetric adhesive type, multiple insulating plates and multiple conductive sheet materials implementing the third embodiment of the forming method of the present invention, and FIG. 6 is a diagram showing a state in which multiple conductive sheet materials are bonded FIG. Figure 7 is a side view of a compression bonded sheet material with a metal layer covering the joint; Figure 8 is a side view of a compression bonded type with metal balls;
The figure is a side view of a compression bonding type that utilizes a protruding rod to form a compression bond, Figure 10 is a side view of a compression type that has a recess on one side, and Figure 11 is a side view of a compression type that uses a protruding rod to form a compression bond. 12 is a plan view of a circuit pattern, and FIG. 13 is a perspective view of a template made by chemical milling. 10... Insulating plate, 11, 12... Hole, 13, 14,
15, 16... Conductive sheet material.

Claims (1)

[Scope of Claims] 1. (a) A hole is formed through the insulating plate, and (b) a conductive material is placed over each opening of the hole and in flat contact with each surface of the insulating plate. (c) If the opposing forces are of such magnitude and nature as to produce a metallurgical bond between the conductive materials in the area of contact, further comprising driving the conductive materials through the holes and into contact with each other to effect solid state bonding.
A method of forming a conductive path by penetrating an insulating plate. 2. Applying opposing forces to the conductive materials, driving the conductive materials through the holes and into contact with each other, and applying heat and pressure to the conductive materials at the point of contact, at a temperature of 350° C. or less. A method of forming a conductive path through an insulating plate according to claim 1, which comprises metallurgically bonding the conductive materials. 3 applying said forces to a first of said electrically conductive materials if said mutually opposing forces are of such magnitude and nature as to produce a metallurgical bond in the contact area between said electrically conductive materials; Additionally, forming a conductive path through the insulating plate of claim 1 comprising driving the first conductive material through the hole and into contact with the second conductive material. A method for forming conductive paths. 4. Applying the force to a first of the conductive materials, if the opposing forces have a magnitude and nature such that a metallurgical bond is created between the conductive materials; An insulating plate according to claim 1, comprising pressing a first electrically conductive material into contact with a second electrically conductive material and forming a hole through the electrically conductive materials in the contact area. A method of forming a conductive path through which a conductive path is formed.