JPS62527B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic device such as an electronic computer or a communication device having a structure for supplying power to an electronic circuit package.

Referring to FIG. 1, in a conventional electronic device such as an electronic computer, an electronic circuit section formed by mounting a plurality of electronic circuit packages 1 on a back panel 2;
A power supply section 3 that supplies power required by the electronic circuit section is arranged and configured separately. In this configuration, power is supplied from the power supply section 3 to the electronic circuit section via the power cable 4 to which the power supply section 3 and the back panel 2 are connected, the power layer and ground layer of the back panel 2, and the multipolar connectors 6 and 7. It is being done.

In recent years, as electronic circuit components have become more highly integrated and faster, electronic circuit packages have become more densely packaged, and the power per electronic circuit package has increased, making it necessary to supply low voltage and high current power. A need is emerging. Furthermore, as device performance improves, it is necessary to mount the entire electronic circuit unit compactly in order to shorten the wiring length between electronic circuit packages. However, in the conventional mounting structure described above, the power supply section and the electronic circuit section are mounted separately, so power loss in the aforementioned power supply path is large.
The voltage drop also becomes large, and as a result, circuit function is impaired. To prevent this, it is necessary to strengthen the power supply system on a large scale, such as by increasing the cross-sectional area of power cables and increasing the number of layers in the power supply layer and ground layer of the back panel. Furthermore, since the power loss turns into heat, the cooling capacity of the cooling component 5 must be increased beyond its capacity to remove the heat generated by the electronic circuit components. The conventional mounting structure has the disadvantage that these reinforcements and reinforcements must be performed, which hinders the improvement of the mounting density.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic device that overcomes the above-mentioned drawbacks.

The device of the present invention is an electronic device having a back panel on which a plurality of electronic circuit packages are mounted, in which the electronic circuit packages and the power supply device are arranged in plane-symmetrical positions with the back panel surface as a symmetrical plane, and a connector provided on the back panel is provided. The electronic circuit package is characterized in that power is supplied from the power supply device to the electronic circuit package via the power supply device.

Next, the present invention will be explained in detail with reference to the drawings.

Referring to FIG. 2, one embodiment of the present invention has a back panel 2 as a symmetrical surface, a plurality of sets of electronic circuit packages 1 and power supply devices 3 are arranged symmetrically, and a power connector 8 is provided on the back panel 2. The electronic circuit package 1 is configured to connect the two and supply power to each electronic circuit package 1.

Referring to FIG. 3, which is an enlarged view of the connecting portion by the power connector, a socket 9 is fixed to the back panel 2, and the power supply device 3 and the electronic circuit package 1 are connected through pins 10. In the embodiment shown in Fig. 3, power is supplied directly from the power supply to the electronic circuit package, but if the socket 9 is connected to the power supply layer or ground layer of the back panel via a through hole, the impedance of the power supply path will be reduced. can be kept low and is very effective electrically. Referring to FIG. 4, electrical connections are made between the multi-pole connector 6 of the electronic circuit package 1 and the multi-pole connector 7 of the back panel 2, and in particular, the power supply is connected via the power connector 8. In addition to this connection configuration, if the socket 9 shown in FIG. It is also effective for reducing impedance and preventing noise. Further, if it is necessary to wire between the packages, it can be done on the power supply side using the pins of the multi-pole connector 7.

By employing the above-mentioned mounting structure, the electronic circuit section and the power supply section can be placed close to each other, thereby solving the drawbacks of the conventional mounting structure. i.e. power cables (or power bus bars) etc.
Since power is supplied without using the power supply layer and ground layer of the back panel, power loss and heat generation caused by conventional mounting structures are eliminated, and voltage drop can be kept small. As a result, reinforcement of the power supply system and cooling components is not required, and packaging density can be improved.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an example of a conventional mounting configuration, FIG. 2 is a diagram showing an embodiment of the present invention, and FIG. 3 is a diagram showing an example of a conventional mounting configuration.
FIG. 4 is a perspective view showing the connection portion between the electronic circuit package 1 and the back panel 2 shown in FIG. 2. 1 to 4, 1... electronic circuit package, 2... back panel, 3... power supply, 4... power cable, 5... cooling component, 6...
...Multi-pole connector, 7...Multi-pole connector, 8...Power connector, 9...Socket, 10...Pin,
11...Housing.

Claims (1)

[Scope of Claims] 1. In an electronic device having a back panel on which a plurality of electronic circuit packages are mounted, the electronic circuit packages and the power supply device are disposed in plane-symmetrical positions with the back panel surface as a plane of symmetry, and are provided on the back panel. An electronic device characterized in that power is supplied from the power supply device to each of the electronic circuit packages via a connector.