JPS6252942B2 - - Google Patents
Info
- Publication number
- JPS6252942B2 JPS6252942B2 JP54158438A JP15843879A JPS6252942B2 JP S6252942 B2 JPS6252942 B2 JP S6252942B2 JP 54158438 A JP54158438 A JP 54158438A JP 15843879 A JP15843879 A JP 15843879A JP S6252942 B2 JPS6252942 B2 JP S6252942B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- mold
- molding
- movable
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 8
- 230000006835 compression Effects 0.000 description 9
- 238000007906 compression Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- 238000013459 approach Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Wire Processing (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明はリード端子同一方向形のリード端子を
所定の形状に成形すると同時に所定の寸法に切断
する機構を備えたリード成形装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lead forming apparatus having a mechanism for forming lead terminals in the same direction into a predetermined shape and simultaneously cutting them into predetermined dimensions.
従来、リード端子を有する電子部品は電子機器
への組込み、プリント基板への挿入を容易にした
り自動挿入装置を使用するのに、該リード端子同
一方向形のリード端子を所定の形状、寸法に成
形、切断加工していた。すなわち、従来の成形方
法は第１図イ，ロ，ハ，ニに示す工程で加工さ
れ、まずイに示すように成形固定型３の溝の部分
へ電子部品の本体１およびリード端子２が入るよ
うに供給し、次工程にて加工板および型が容易に
リード端子２，２の間に入るようにリード端子２
を少し広げて、ロに示すようにリード広げ板４を
成形固定型３に接近させてさらに広げ、次にリー
ド曲げ板５が成形固定型３に対して前進し、該成
形固定型３との間でハに示すようにリード端子２
を直角に折り曲げ、さらに成形移動型６によつて
成形固定型３との間でニに示すようにリード端子
２を折り曲げ成形し、成形移動型６の側面Ａ，
A′および成形固定型３の側面Ｂ，B′と同一面で
ニツパーなどを用いてリード端子２を切断してホ
に示すように成形、切断を行なつていた。 Conventionally, electronic components having lead terminals have been molded into a predetermined shape and size in order to facilitate integration into electronic equipment, insertion into printed circuit boards, or use automatic insertion equipment. , was being cut. That is, in the conventional molding method, processing is carried out in the steps shown in FIG. Supply the lead terminal 2 so that the processed plate and mold can easily enter between the lead terminals 2 and 2 in the next process.
The lead spreading plate 4 is moved closer to the molding fixed mold 3 as shown in B and further spread, and then the lead bending plate 5 moves forward with respect to the molding fixed mold 3, and the lead bending plate 5 moves forward with respect to the molding fixed mold 3. Lead terminal 2 as shown in C between
The lead terminal 2 is bent at a right angle, and then the lead terminal 2 is bent and formed between it and the fixed molding mold 3 by the movable molding mold 6 as shown in D, and the sides A,
The lead terminal 2 was cut on the same surface as A' and the sides B and B' of the molding and fixing mold 3 using nippers, and the molding and cutting were performed as shown in E.
このような方法にて成形、切断する場合、加工
工程が多く、また手作業による工程もあるために
生産性が悪く、コスト的に高くなつたり、折り曲
げ寸法にバラツキを生じて品質的にも良くないと
いう欠点があつた。 When forming and cutting using this method, there are many processing steps and some manual steps, resulting in poor productivity and high costs, and variations in bending dimensions, resulting in poor quality. There was a drawback that there was no.
本発明は上述の欠点を除去し、リード端子同一
方向形のリード端子を折り曲げ成形すると共に同
時に該リード端子を切断する機構を備えたリード
成形装置を提供しようとするものである。 SUMMARY OF THE INVENTION The present invention aims to eliminate the above-mentioned drawbacks and provide a lead forming apparatus having a mechanism for bending and forming lead terminals in the same direction and cutting the lead terminals at the same time.
以下、本発明のリード成形装置を第２図〜第４
図に示す実施例について説明する。 Hereinafter, the lead forming apparatus of the present invention will be explained in Figs. 2 to 4.
The embodiment shown in the figure will be described.
本装置はリード端子同一方向形のリード端子２
の折り曲げ成形および切断の仕上り基準となる成
形型１３と該電子部品の本体を保持するエジエク
ター１４とからなる成形固定型と、該リード端子
２の引出し方向に対し垂直方向に移動するリード
広げ針１５と、該リード端子２の引出し方向に移
動する第１の成形移動型８と、該第１の成形移動
型８を圧縮バネ１２で支持する第２の成形移動型
９と、該第２の成形移動型８をバネで支持する切
断移動型６，６′とによつて構成され、該電子部
品のリード端子２を成形型１３の溝１３ａ内に供
給した後電子部品の本体１を保持する。次いでリ
ード広げ針１５が下方に降下してリード端子２が
第４図イに示すように広げられ、該リード広げ針
１５が元にもどつた後に成形移動型８，９および
切断移動型６，６′からなる移動型がガイドブロ
ツク１６上に沿つて移動するホルダー１０ととも
に成形型１３に対して接近し、成形型１３との間
でまず成形移動型８によつてリード端子２を90゜
に折り曲げ、さらに成形移動型９が接近して第４
図ロに示すように鋭角に折り曲げる。そして成形
移動型８および９はリード端子２を折り曲げ成形
した状態を保つていて、圧縮バネ１２はさらに圧
縮され、圧縮バネ１１もその間に圧縮され、圧縮
バネ１１および１２が圧縮された分だけ切断移動
型６，６′が成形型１３に接近した状態となり、
第４図ロに示すようにリード端子は所定の形状に
切断される。 This device has 2 lead terminals with same direction type.
a molding stationary mold consisting of a molding die 13 that serves as a finishing reference for bending and molding and an ejector 14 that holds the main body of the electronic component; and a lead spreading needle 15 that moves in a direction perpendicular to the direction in which the lead terminal 2 is pulled out. a first movable mold 8 that moves in the direction of pulling out the lead terminal 2; a second movable mold 9 that supports the first movable mold 8 with a compression spring 12; It is composed of a movable cutting die 8 supported by a spring, and a cutting movable die 6, 6', which holds the main body 1 of the electronic component after supplying the lead terminal 2 of the electronic component into the groove 13a of the mold 13. Next, the lead spreading needle 15 descends downward to spread the lead terminal 2 as shown in FIG. A movable mold consisting of a holder 10 moving along a guide block 16 approaches the mold 13, and between the movable mold 13 and the mold 13, the lead terminal 2 is first bent at 90 degrees by the movable mold 8. , the molding movable mold 9 approaches the fourth
Bend it at an acute angle as shown in Figure B. The molding movable molds 8 and 9 keep the lead terminal 2 bent and molded, the compression spring 12 is further compressed, the compression spring 11 is also compressed during that time, and the compression springs 11 and 12 are cut by the amount compressed. The movable molds 6, 6' are in a state approaching the mold 13,
As shown in FIG. 4B, the lead terminal is cut into a predetermined shape.
リード端子２の成形は圧縮バネ圧によつて行な
われるもので、圧縮バネ１２はリード端子２の曲
げ強さに負けない弾力を有し、圧縮バネ１１の弾
力は圧縮バネ１２の弾力より大きく、リード端子
２が所定の寸法にて切断されるまでの間はリード
端子２はバネ圧により押しつけられている。この
とき、リード端子２の潰れが発生する恐れがある
ので、成形型１３の成形部分１３ｂにはリード端
子２の太さと同寸法に段差を設けてリード端子の
潰れを防止している。 The lead terminal 2 is formed by compression spring pressure, and the compression spring 12 has elasticity comparable to the bending strength of the lead terminal 2, and the elasticity of the compression spring 11 is greater than the elasticity of the compression spring 12. Until the lead terminal 2 is cut to a predetermined size, the lead terminal 2 is pressed against the lead terminal 2 by spring pressure. At this time, there is a risk that the lead terminal 2 may be crushed, so a step is provided in the molding portion 13b of the mold 13 with the same size as the thickness of the lead terminal 2 to prevent the lead terminal from being crushed.
次にリード端子２が成形、切断された後にエジ
エクター１４が上昇してリード端子同一方向形を
上方に押し出し、電子部品のリード成形、切断が
終了する。 Next, after the lead terminals 2 are formed and cut, the ejector 14 rises and pushes out the lead terminals in the same direction upwards, thereby completing the lead forming and cutting of the electronic component.
なお、エジエクター１４は電子部品の本体１お
よびリード端子２を同時に押し出すようになつて
おり、成形、切断されたリード端子２の変形を防
止している。また上述の固定型と移動型の形状は
図示したものに限定するものではなく、リード端
子の折り曲げの形状に合せて種々変形することが
できる。 The ejector 14 is designed to simultaneously push out the main body 1 of the electronic component and the lead terminals 2, thereby preventing deformation of the molded and cut lead terminals 2. Further, the shapes of the fixed type and the movable type described above are not limited to those shown in the drawings, and can be modified in various ways according to the shape of the bending of the lead terminal.
本発明のリード成形装置は以上のような構成、
動作によりリード成形加工と同時に切断加工がで
き、リード端子２の形状、寸法が均一となり、品
質、コスト共に大幅に改善できた。 The lead forming device of the present invention has the above configuration,
Through this operation, the lead forming process and the cutting process were performed simultaneously, and the shape and dimensions of the lead terminal 2 were made uniform, resulting in a significant improvement in both quality and cost.
叙上のように本発明のリード成形装置はリード
端子同一方向形電子部品のリード成形が均一で、
安定化されると共に生産性の面で極めて有利とな
り、工業的ならびに実用的価値の大なるものであ
る。 As mentioned above, the lead forming device of the present invention can uniformly form the leads of electronic components with lead terminals in the same direction.
It is stabilized and extremely advantageous in terms of productivity, and is of great industrial and practical value.
第１図イ，ロ，ハ，ニは従来のリード成形過程
を示す説明図、第１図ホは電子部品のリード成形
後の正面図、第２図は本発明のリード成形装置の
要部横断面図、第３図は本発明のリード成形装置
の要部縦断面図、第４図は本発明のリード成形装
置のリード成形過程を示す説明図で、イはリード
端子を広げたところ、ロはリード端子を成形し切
断した後である。
１：電子部品の本体、２：電子部品のリード端
子、８：第１の成形移動型、９：第２の成形移動
型、６，６′：切断移動型、７：ガイド板、１
０：ホルダー、１１，１２：圧縮バネ、１３：仕
上り基準となる成形固定型、１４：エジエクタ
ー、１５：リード広げ針、１６：ガイドブロツ
ク。
Figure 1 A, B, C, and D are explanatory diagrams showing the conventional lead forming process, Figure 1 E is a front view after lead forming of an electronic component, and Figure 2 is a cross-sectional view of the main part of the lead forming apparatus of the present invention. FIG. 3 is a vertical sectional view of the main part of the lead forming device of the present invention, and FIG. 4 is an explanatory view showing the lead forming process of the lead forming device of the present invention. is after forming and cutting the lead terminal. 1: Main body of electronic component, 2: Lead terminal of electronic component, 8: First movable molding mold, 9: Second movable molding mold, 6, 6': Cutting movable mold, 7: Guide plate, 1
0: Holder, 11, 12: Compression spring, 13: Molding fixed mold serving as finishing standard, 14: Ejector, 15: Lead expansion needle, 16: Guide block.
Claims (1)
を折り曲げ成形、切断するリード成形装置におい
て、該電子部品の本体を保持し、該リード端子を
折り曲げ成形および切断の仕上り基準となる成形
固定型と、該リード端子の引出し方向に対し垂直
方向に移動するリード広げ針と、該リード端子の
引出し方向で移動する第１の成形移動型と、該第
１の成形移動型をバネで支持する第２の成形移動
型と、該第２の成形移動型をバネで支持する切断
移動型とを備えたことを特徴とするリード端子同
一方向形電子部品のリード成形装置。1. A lead forming device for bending, forming and cutting lead terminals of electronic components with lead terminals in the same direction. A lead spreading needle that moves in a direction perpendicular to the direction in which the lead terminal is pulled out, a first molding movable mold that moves in the direction in which the lead terminal is pulled out, and a second molding mold that supports the first molding movable mold with a spring. 1. A lead molding apparatus for an electronic component having lead terminals in the same direction, comprising a movable mold and a movable cutting mold that supports the second movable molding mold with a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15843879A JPS5680123A (en) | 1979-12-05 | 1979-12-05 | Device for forming lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15843879A JPS5680123A (en) | 1979-12-05 | 1979-12-05 | Device for forming lead wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5680123A JPS5680123A (en) | 1981-07-01 |
| JPS6252942B2 true JPS6252942B2 (en) | 1987-11-07 |
Family
ID=15671762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15843879A Granted JPS5680123A (en) | 1979-12-05 | 1979-12-05 | Device for forming lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5680123A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6471114A (en) * | 1987-05-02 | 1989-03-16 | Hope Seiki | Assembly and manufacturing device for tip type electrolytic capacitor |
| KR910005845Y1 (en) * | 1989-07-10 | 1991-08-05 | 삼성전관 주식회사 | Manufacturing and cutting equipment of a filament for crt |
-
1979
- 1979-12-05 JP JP15843879A patent/JPS5680123A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5680123A (en) | 1981-07-01 |
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