JPS6254582B2 - - Google Patents
Info
- Publication number
- JPS6254582B2 JPS6254582B2 JP59076096A JP7609684A JPS6254582B2 JP S6254582 B2 JPS6254582 B2 JP S6254582B2 JP 59076096 A JP59076096 A JP 59076096A JP 7609684 A JP7609684 A JP 7609684A JP S6254582 B2 JPS6254582 B2 JP S6254582B2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- printed wiring
- wiring board
- coating device
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
- H05K3/3468—Application of molten solder, e.g. dip soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷配線板に電子部品等を半田付けす
る際に使用する自動半田付装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to an automatic soldering device used for soldering electronic components and the like to printed wiring boards.
従来例の構成とその問題点
一般に、印刷配線板に電子部品を半田付けする
際に使用する自動半田付装置は、印刷配線板にフ
ラツクスを塗布するフラツクス塗布装置と、フラ
ツクスが塗布された印刷配線板を予め予熱する予
備加熱装置と、予備加熱された印刷配線板を浸漬
半田付法によつて半田付けする半田付装置によつ
て構成されている。従来より使用されているこの
種の自動半田付装置において、フラツクス塗布装
置や予備加熱装置は第１図に示すように構成され
ることが多い。すなわち、第１図において、１は
フラツクス塗布装置を構成するフラツクス容器で
あり、このフラツクス容器１内にはノズル５及び
発泡管２が設けられており、発泡管２にパイプ３
を介して空気を送り込むことによりフラツクス容
器１内のフラツクス４を発泡させ、印刷配線板６
の下面にフラツクスを塗布するように構成されて
いる。そして、７は予備加熱装置を構成するヒー
タであり、フアン８によつて熱風を送り込むこと
により印刷配線板６に塗布されたフラツクスを乾
燥させ活性化させるようにしている。ところで、
この種の自動半田付装置において印刷配線板６に
塗布されるフラツクスの量は発泡管２の材質や発
泡管２に送り込まれる空気圧、フラツクスの濃度
等が一定であるとすると、そのフラツクスの液温
によつて大きく影響を受け液温が低い場合には均
一な発泡が得られず、一方液温が高い場合にはフ
ラツクスの発泡過剰となる。今、仮に均一な泡が
得られなかつたとすると、印刷配線板へのフラツ
クスの塗布状態に大きなムラが生じることにな
り、一方フラツクスの発泡過剰では定速度で流れ
る印刷配線板６に対してフラツクスが付き過ぎる
ことになり、そのフラツクスの付き過ぎた部分で
は次の予備加熱の段階でフラツクスの雫がヒータ
７の上に落下し、発火したり、悪臭を出すことに
なり、きわめて危険であるという問題がある。ま
た、印刷配線板に塗布されたフラツクスの量が多
過ぎると次の予備加熱の段階で、上記フラツクス
が充分に乾燥されず、活性化されないままで更に
次の半田付工程に至ることになり、半田付自体が
著しく悪い状態になるという問題がある。Conventional configuration and its problems In general, automatic soldering equipment used when soldering electronic components to printed wiring boards consists of a flux applicator that applies flux to the printed wiring board, and a printed wiring that has been applied with flux. It consists of a preheating device that preheats the board, and a soldering device that solders the preheated printed wiring board by immersion soldering. In conventional automatic soldering devices of this type, the flux coating device and the preheating device are often constructed as shown in FIG. That is, in FIG. 1, reference numeral 1 denotes a flux container constituting a flux coating device, and a nozzle 5 and a foaming tube 2 are provided in the flux container 1. A pipe 3 is connected to the foaming tube 2.
The flux 4 in the flux container 1 is foamed by blowing air through the printed wiring board 6.
The device is configured to apply flux to the underside of the device. A heater 7 constitutes a preheating device, and a fan 8 blows hot air to dry and activate the flux applied to the printed wiring board 6. by the way,
In this type of automatic soldering device, the amount of flux applied to the printed wiring board 6 is determined by the liquid temperature of the flux, assuming that the material of the foam tube 2, the air pressure sent into the foam tube 2, the concentration of flux, etc. are constant. When the liquid temperature is low, uniform foaming cannot be obtained, while when the liquid temperature is high, excessive foaming of the flux occurs. Now, if uniform bubbles cannot be obtained, there will be large unevenness in the state of application of the flux to the printed wiring board.On the other hand, if the flux is foamed excessively, the flux will not be applied to the printed wiring board 6 flowing at a constant speed. The problem is that the excessively fluxed parts fall onto the heater 7 during the next preheating stage, causing a fire or emitting a bad odor, which is extremely dangerous. There is. Furthermore, if too much flux is applied to the printed wiring board, the flux will not be sufficiently dried during the next preheating stage and will not be activated until the next soldering process is carried out. There is a problem in that the soldering itself becomes extremely poor.
発明の目的
本発明は以上のような従来の欠点を除去するも
のであり、簡単な構成で信頼性の高い確実な半田
付けの可能な優れた自動半田付装置を提供するこ
とを目的とするものである。OBJECT OF THE INVENTION The present invention eliminates the above-mentioned conventional drawbacks, and aims to provide an excellent automatic soldering device that has a simple configuration and is capable of highly reliable and reliable soldering. It is.
発明の構成
上記の目的を達成するため、本発明の自動半田
付装置は、フラツクスが塗布された印刷配線板に
半田を付着させる以前に上記印刷配線板を加熱す
る予備加熱装置からフラツクス塗布装置に対する
上記印刷配線板の流れ方向の上流側に、上記フラ
ツクス塗布装置を構成するフラツクス容器に接す
るようにフードを延設したことを特徴とするもの
である。Structure of the Invention In order to achieve the above object, the automatic soldering device of the present invention includes a preheating device that heats the printed wiring board to which solder is applied before applying solder to the printed wiring board to which the flux is applied. The present invention is characterized in that a hood is provided on the upstream side of the printed wiring board in the flow direction so as to be in contact with a flux container constituting the flux coating device.
かかる構成により、フラツクス塗布装置はフー
ドを流れる熱風でフラツクスが熱せられ、フラツ
クスの温度検出にもとづく予備加熱装置の温度制
御により温度を一定に保つことができる。そし
て、上記フードを流れる熱風でフラツクス塗布に
先立つて印刷配線板は予備加熱され、その熱で塗
布されたフラツクスの希釈剤を飛散させて次の工
程で予備加熱装置によつてフラツクスを充分に乾
燥させることができる。 With this configuration, in the flux coating device, the flux is heated by hot air flowing through the hood, and the temperature can be kept constant by controlling the temperature of the preheating device based on temperature detection of the flux. The printed wiring board is preheated by the hot air flowing through the hood before flux application, and the heat scatters the diluent of the applied flux, and in the next step, the preheating device thoroughly dries the flux. can be done.
実施例の説明
以下、本発明の自動半田付装置について一実施
例の図面とともに説明する。第２図は本発明の自
動半田付装置における一実施例の要部断面図であ
り、図中、１〜８は第１図に示すものと同様のも
のを示している。第２図において、９は予備加熱
装置を構成するフードであり、その一部はフラツ
クス塗布装置の前工程まで延長されている。そし
て、延長されたフード９の先端にフード口１０を
設け、ここからフアン８によつて送り込まれた熱
風が噴出するように構成されている。また、フー
ド９はフラツクス塗布装置を構成するフラツクス
容器１に接するように設けられており、フード９
内の熱風によつて同時にフラツクス容器１内のフ
ラツクス４が加熱されるように構成されている。
１１はフラツクス容器１内に設けられたフラツク
ス４の温度を検出する検出片であり、その出力は
温度制御器１２に印加され温度制御器１２によつ
て自動的にヒータ７、フアン８等を制御し、フラ
ツクス４の温度を一定に保つように構成してい
る。DESCRIPTION OF EMBODIMENTS The automatic soldering apparatus of the present invention will be described below with reference to drawings of one embodiment. FIG. 2 is a sectional view of essential parts of an embodiment of the automatic soldering apparatus of the present invention, and in the figure, numerals 1 to 8 indicate the same parts as shown in FIG. 1. In FIG. 2, numeral 9 is a hood constituting a preheating device, a part of which extends to the front stage of the flux coating device. A hood opening 10 is provided at the tip of the extended hood 9, from which hot air sent by the fan 8 is blown out. Further, the hood 9 is provided so as to be in contact with the flux container 1 constituting the flux coating device.
The flux 4 in the flux container 1 is simultaneously heated by the hot air inside the flux container 1.
Reference numeral 11 denotes a detection piece that detects the temperature of the flux 4 provided in the flux container 1, and its output is applied to a temperature controller 12, which automatically controls the heater 7, fan 8, etc. However, the temperature of the flux 4 is kept constant.
尚、実施例で示すようにフラツクスの温度を検
出し、これによつてヒータやフアンを制御するよ
うに構成した場合にはフラツクスの温度を常に適
温に保つことができ、より確実な半田付けが可能
になるという利点を有する。 As shown in the example, if the temperature of the flux is detected and the heater or fan is controlled accordingly, the temperature of the flux can always be kept at an appropriate temperature, resulting in more reliable soldering. This has the advantage of being possible.
発明の効果
以上のように本発明の自動半田付装置は、フラ
ツクス塗布装置の前段に印刷配線板を予備加熱す
る予備加熱装置からフラツクス塗布装置のフラツ
クス容器に接するようにフードを延設し、上記予
備加熱装置によつて予備加熱された印刷配線板に
フラツクスを塗布し、再び予備加熱して半田付装
置に送り込むように構成したものであり、フラツ
クス塗布装置の前段で予備加熱するため、フラツ
クス塗布装置によつてフラツクスが塗布された場
合、印加配線板が予備加熱されていることでフラ
ツクスの希釈剤が飛び散ることになり、フラツク
ス塗布装置が温度制御下で加熱されることとあい
まつて常に均一にフラツクスが塗布されることに
なる。したがつて、本発明によれば、フラツクス
塗布装置の後段に設けた予備加熱装置によつてフ
ラツクスが常に充分に活性化されることになり、
次の半田付工程でも常に正確かつ確実な半田付け
が行なわれるという利点を有する。Effects of the Invention As described above, the automatic soldering device of the present invention has a hood extending from the preheating device for preheating the printed wiring board upstream of the flux coating device so as to be in contact with the flux container of the flux coating device. This device is configured to apply flux to a printed wiring board that has been preheated by a preheating device, preheat it again, and send it to a soldering device. When flux is applied by a device, the diluent of the flux is scattered because the application wiring board is preheated, and the fact that the flux application device is heated under temperature control ensures that the flux is always uniformly applied. Flux will be applied. Therefore, according to the present invention, the flux is always sufficiently activated by the preheating device provided after the flux coating device.
This has the advantage that accurate and reliable soldering is always performed even in the next soldering process.
第１図は従来の自動半田付装置の要部断面図、
第２図は本発明の自動半田付装置における一実施
例の要部断面図である。
１……フラツクス容器、２……発泡管、３……
パイプ、４……フラツクス、５……ノズル、６…
…印刷配線板、７……ヒータ、８……フアン、９
……フード、１０……フード口、１１……温度検
出片、１２……温度制御器。
Figure 1 is a sectional view of the main parts of a conventional automatic soldering device.
FIG. 2 is a sectional view of essential parts of an embodiment of the automatic soldering apparatus of the present invention. 1... flux container, 2... foaming tube, 3...
Pipe, 4...Flux, 5...Nozzle, 6...
...Printed wiring board, 7...Heater, 8...Fan, 9
...Hood, 10...Hood opening, 11...Temperature detection piece, 12...Temperature controller.
Claims (1)
付着させる以前に上記印刷配線板を予備加熱する
予備加熱装置からフラツクス塗布装置に対する上
記印刷配線板の流れ方向の上流側に、上記フラツ
クス塗布装置を構成するフラツクス容器に接する
ように熱風送りのためのフードを延設して、上記
フラツクス塗布装置を加熱すると共に上記フラツ
クス塗布装置に流れ込む印刷配線板を予備加熱
し、かつ上記フラツクス塗布装置のフラツクス温
度検出にもとづく上記予備加熱装置の温度制御手
段を備えたことを特徴とする自動半田付装置。1. The flux coating device is configured on the upstream side in the flow direction of the printed wiring board with respect to the flux coating device from a preheating device that preheats the printed wiring board before attaching solder to the printed wiring board coated with flux. A hood for sending hot air is extended so as to be in contact with the flux container to heat the flux coating device, preheat the printed wiring board flowing into the flux coating device, and detect the temperature of the flux in the flux coating device. An automatic soldering device characterized in that it is equipped with temperature control means for the preheating device based on the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59076096A JPS59209474A (en) | 1984-04-16 | 1984-04-16 | Automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59076096A JPS59209474A (en) | 1984-04-16 | 1984-04-16 | Automatic soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59209474A JPS59209474A (en) | 1984-11-28 |
| JPS6254582B2 true JPS6254582B2 (en) | 1987-11-16 |
Family
ID=13595318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59076096A Granted JPS59209474A (en) | 1984-04-16 | 1984-04-16 | Automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59209474A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63168273A (en) * | 1986-12-29 | 1988-07-12 | Tamura Seisakusho Co Ltd | Automatic soldering device |
| JP2509931B2 (en) * | 1987-03-30 | 1996-06-26 | 株式会社 タムラ製作所 | Jet soldering equipment |
| US6257480B1 (en) | 1998-07-07 | 2001-07-10 | Denso Corporation | Jet soldering method and apparatus |
| JP2009285719A (en) * | 2008-05-30 | 2009-12-10 | Nippon Dennetsu Co Ltd | Flux applicator |
-
1984
- 1984-04-16 JP JP59076096A patent/JPS59209474A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59209474A (en) | 1984-11-28 |
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