JPS625482B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for integrating multiple layers of triple-plate strip lines in which each layer is electrically connected.

Here, it is assumed that a microwave circuit having various functions is formed in the triplate stripline section.

FIG. 1 is a schematic cross-sectional view showing a conventional method for integrating multiple layers of a triple-plate stripline. 3d is a dielectric substrate, 4
a and 4b are internal conductors, 5 is a coupling hole, and 6 is an adhesive sheet (or adhesive).

This conventional method for integrating multiple layers of triplate strip lines will be described below.

An adhesive sheet 6 is sandwiched between the dielectric substrates 3a, 3b, 3c, and 3d and between each layer, that is, between the ground conductors 2b and 2c, and pressure and heat 1 are applied to the entirety to integrate the multi-layered triplate strip line. It was on.

However, a drawback of this integration method is that the electrical connections between the layers cannot be made sufficiently through the coupling holes 5, and this type of problem frequently occurs during the manufacturing process.

The reason is that the connection between the ground conductors 2b, 2c forming the bonding hole 5 and between the internal conductors 4a, 4b is only by crimping. 4b between the ground conductors 2b and 2c and between the internal conductors 4a and 4.
This is because the electrical connection between b and b was not sufficiently established.

This invention eliminates the above-mentioned drawbacks of the prior art, and its purpose is to reduce the problems that occur during the manufacturing process.

FIG. 2 is a schematic cross-sectional view showing a method for integrating multiple layers of a triple plate strip line in which each layer is electrically connected according to an embodiment of the present invention.
is pressure/heat, 2a, 2c, 2d are ground conductors, 3
a, 3b, 3c, 3d are dielectric substrates, 4a, 4b
5 is an internal conductor, 5 is a bonding hole, 6 is an adhesive sheet (or adhesive), and 7 is preliminary solder.

Hereinafter, the method for integrating multiple layers of triple plate strip lines according to the present invention will be explained in detail.

One ground conductor between each layer is replaced with an adhesive sheet 6, and the adhesive sheet 6 is also inserted between the dielectric substrates 3a, 3b, 3c, and 3d, and the inner conductors 4a and 4b portions forming the bonding holes 5 are also inserted. Spare solder 7
Then, by applying pressure and heat to the entire structure, multi-layer integration of the triple plate strip line was realized. According to this integration method, there is a ground conductor 2c between each layer.
Since the joint hole 5 is shared, the problem of electrical connection between the ground conductors that conventionally occurred is eliminated, and at the same time, the connection hole 5
Since the internal conductors 4a and 4b forming the circuit are soldered, the electrical connection between each layer is sufficient, and the problems caused by the multilayer integration of the triple plate strip line that occurred during the manufacturing process have been avoided. It can be reduced to a width.

Here, even if the adhesive sheet 6 sandwiched between the dielectric substrates 3a, 3b, 3c, and 3d and between the ground conductor 2c and the dielectric substrate 3b is an insulator, there is no particular problem except for loss.

Although the method for integrating multiple layers of triplate strip lines using contact-type coupling holes formed by contacting the internal conductors of each layer has been described above, the present invention is not limited to this, and the coupling holes may be formed by slots, etc. It can also be used in a multilayer integration method for non-contact triplate strip lines.

As described above, according to the method for integrating multiple layers of a triplate strip line according to the present invention, by replacing one ground conductor between each layer with an adhesive sheet and pre-soldering the internal conductor forming the bonding hole, various Problems in electrical connections between layers can be greatly reduced.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing a conventional method for integrating multiple layers of triple-plate strip lines, and FIG. 2 is a schematic sectional view showing an embodiment of the present invention. In the figure, 1 is pressure/heat, 2a, 2b, 2c, 2d
3 is a ground conductor, 3a, 3b, 3c, and 3d are dielectric substrates, 4a, 4b are internal conductors, 5 is a bonding hole, 6 is an adhesive sheet, and 7 is a preliminary solder. It should be noted that the same or corresponding parts in the figures are indicated by the same reference numerals.

Claims (1)

[Claims] 1. Replace one ground conductor between each layer of the multi-layered triplate strip line with an adhesive or an adhesive sheet, pre-solder the internal conductor that forms the bonding hole, and also apply adhesive between the dielectric substrates. Alternatively, a multilayer integration method for triplate strip lines is characterized in that adhesive sheets are sandwiched and pressure and heat are applied to the entire structure to integrate the multilayers.