JPS6255300B2 - - Google Patents
Info
- Publication number
- JPS6255300B2 JPS6255300B2 JP60212498A JP21249885A JPS6255300B2 JP S6255300 B2 JPS6255300 B2 JP S6255300B2 JP 60212498 A JP60212498 A JP 60212498A JP 21249885 A JP21249885 A JP 21249885A JP S6255300 B2 JPS6255300 B2 JP S6255300B2
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- semiconductor package
- ceramic base
- solid
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
【発明の詳細な説明】
この発明は、固体撮像素子を組み込んだパツケ
ージを他の基板上所定位置に正確に取り付けるこ
とができる半導体パツケージに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor package in which a package incorporating a solid-state image sensor can be accurately attached to a predetermined position on another substrate.
一般に、集積回路にあつては、外部の湿気、塵
あい等をしや断し、素子の信頼性を向上するた
め、素子をパツケージ内に封入するようにしてい
る。 Generally, integrated circuit devices are enclosed in a package in order to keep out moisture, dust, etc. from the outside and improve the reliability of the device.
ところで、素子を組み込んだパツケージについ
ては、たとえば固体撮像素子を撮像カメラに取り
付ける時など、素子を他の基板上所定位置に正確
に取り付けることが必要な場合がある。 By the way, regarding a package incorporating an element, there are cases where it is necessary to accurately attach the element to a predetermined position on another substrate, such as when attaching a solid-state image sensor to an imaging camera.
このような場合、従来では何回もの試行錯誤に
より面倒な位置合わせをしながら取り付けている
のが実状である。特に、セラミツク製パツケージ
のものでは、セラミツク自体が焼成体であるた
め、外径方法で±0.2mm程度の誤差があり、パツ
ケージの外形を位置出しの基準として用いること
ができないので、その困難は大きい。しかし一
方、カメラレンズの光軸と固体撮像素子のセンタ
ーとが正確に位置合わせされないと、像や固体撮
像素子で絵素に分解され２値化されるとき、像の
一端が撮影されないようなことになつてしまう。 In such cases, in the past, the actual situation was to attach the parts while performing troublesome positioning through trial and error many times. In particular, with ceramic packages, since the ceramic itself is a fired body, there is an error of about ±0.2 mm in the outer diameter method, and the outer diameter of the package cannot be used as a reference for positioning, which is very difficult. . However, if the optical axis of the camera lens and the center of the solid-state image sensor are not aligned accurately, one end of the image may not be captured when the image is separated into picture elements and binarized by the solid-state image sensor. I'm getting used to it.
この発明はこのような問題を解決するためにな
されたもので、特に大型のセラミツク製パツケー
ジ（固体撮像素子の場合、素子の大きさは約10×
10mmで、一辺の絵素は100〜256程度である。）を
正確な位置に容易に取り付けるようにするもので
ある。 This invention was made to solve these problems, and is particularly suitable for large ceramic packages (in the case of solid-state image sensors, the size of the device is approximately 10×
At 10mm, each side has about 100 to 256 picture elements. ) can be easily installed in the correct position.
以下、この発明の内容について添付図面を参照
しながら詳述する。 Hereinafter, the content of the present invention will be explained in detail with reference to the accompanying drawings.
図示のものは、固体撮像素子のセラミツク製パ
ツケージであり、第１図に示すように、これは撮
像カメラ１側の部品取り付け基板２上にレンズ３
の光軸と軸を一にして取り付けられるべきもので
ある。このセラミツク製パツケージ４自体は、第
２図に示すように、セラミツクベース５上に固体
撮像素子が取り付けられ、その上を透明なガラス
キヤツプ６でおおわれ、セラミツクベース５の両
側にリード７を有するインラインタイプのパツケ
ージである。 What is shown is a ceramic package for a solid-state image sensor, and as shown in FIG.
It should be installed with the optical axis and axis of the As shown in FIG. 2, this ceramic package 4 itself has a solid-state image sensor mounted on a ceramic base 5, covered with a transparent glass cap 6, and an in-line package having leads 7 on both sides of the ceramic base 5. It is a type of package.
この発明の一実施例によれば、このようなセラ
ミツク製パツケージ４側に、位置決め穴８ａ，８
ｂを有する位置決め板９を取り付け、他方部品取
り付け基板２側の所定位置に、位置決めピン１０
ａ，１０ｂを取り付け、この位置決めピン１０
ａ，１０ｂに位置決め穴８ａ，８ｂをはめるよう
にしてセラミツク製パツケージ４を部品取り付け
基板２に取り付けるようにした点に特徴がある。
この場合、位置決め穴８ａ，８ｂおよびそれに対
応する位置決めピン１０ａ，１０ｂは、位置決め
を正確になすためそれぞれ２個設けている。した
がつて、位置決め板９をセラミツクベース５の上
面に取り付ける場合には、第３図Ａに示すよう
に、位置決め板９は左右２枚となり、他方、セラ
ミツクベース５の裏面側に取り付ける場合には、
第３図Ｂに示すように、位置決め板９は１枚とな
る。また、位置決めの精度を高めるため、位置決
め板９については、素子の完成後、Au―Snの共
晶が接着剤などでセラミツクベース５に取り付
け、その後、素子の中心から一定距離の個所に位
置決め穴８ａ，８ｂをあけるようにする。 According to one embodiment of the present invention, positioning holes 8a, 8 are provided on the ceramic package 4 side.
Attach the positioning plate 9 having the positioning pin 10 at a predetermined position on the other component mounting board 2 side.
a, 10b, and this positioning pin 10
The ceramic package 4 is attached to the component mounting board 2 by fitting the positioning holes 8a and 8b into the holes 8a and 10b.
In this case, two positioning holes 8a, 8b and two corresponding positioning pins 10a, 10b are provided for accurate positioning. Therefore, when the positioning plate 9 is attached to the top surface of the ceramic base 5, there are two positioning plates 9 on the left and right sides, as shown in FIG. ,
As shown in FIG. 3B, there is only one positioning plate 9. In order to improve the accuracy of positioning, after the element is completed, the Au-Sn eutectic is attached to the ceramic base 5 with adhesive etc., and then a positioning hole is placed at a certain distance from the center of the element. Make sure to open 8a and 8b.
したがつて、この発明によれば、セラミツク製
パツケージ４を部品取り付け基板２上に取り付け
る時に、セラミツク製パツケージ４側の位置決め
ピン１０ａ，１０ｂにはめ込むことにより、容易
に正確な位置出しをすることができる。実際に得
られた精度は±0.01〜±0.02mm程度であつた。 Therefore, according to the present invention, when mounting the ceramic package 4 on the component mounting board 2, it is possible to easily and accurately position the ceramic package 4 by fitting it into the positioning pins 10a and 10b on the ceramic package 4 side. can. The accuracy actually obtained was about ±0.01 to ±0.02 mm.
なお、前記位置決め穴および位置決めピンを角
形にすることにより、それを各々１個にすること
もできるが、高い位置出し精度を得るにはやはり
複数個とするのが良い。 Note that by making the positioning holes and positioning pins rectangular, the number of each can be reduced to one, but in order to obtain high positioning accuracy, it is still preferable to use a plurality of them.
第１図はこの発明が適用される撮像カメラの既
略構成図、第２図はこの発明によるセラミツク製
パツケージの一実施例を示す平面図、第３図Ａお
よびＢはそれぞれ位置決め板の取り付け例を示す
斜視図である。
１……撮像カメラ、２……部品取り付け基板、
４……セラミツク製パツケージ、５……セラミツ
クベース、６……ガラスキヤツプ、７……リー
ド、８ａ，８ｂ……位置決め穴、９……位置決め
板、１０ａ，１０ｂ……位置決めピン。
Fig. 1 is a schematic configuration diagram of an imaging camera to which this invention is applied, Fig. 2 is a plan view showing an embodiment of a ceramic package according to this invention, and Figs. 3 A and B are examples of mounting a positioning plate. FIG. 1...Imaging camera, 2...Component mounting board,
4... Ceramic package, 5... Ceramic base, 6... Glass cap, 7... Lead, 8a, 8b... Positioning hole, 9... Positioning plate, 10a, 10b... Positioning pin.
Claims (1)
ベースの上部に形成された透明キヤツプと複数の
外部リードとからなり、その内部に固体撮像素子
を組み込んでなる半導体パツケージであつて、複
数個の位置決め用の穴が設けられた位置決め板が
上記固体撮像素子の下方に配置されるよう上記セ
ラミツクベースに取り付けられてなることを特徴
とする半導体パツケージ。 ２ 上記外部リードが上記セラミツクベースの主
面に対し垂直に延びるリードからなることを特徴
とする特許請求の範囲第１項記載の半導体パツケ
ージ。 ３ 上記穴が２個であることを特徴とする特許請
求の範囲第１項記載の半導体パツケージ。[Scope of Claims] 1. A semiconductor package comprising at least a ceramic base, a transparent cap formed on the top of the ceramic base, and a plurality of external leads, and in which a solid-state image sensing device is incorporated, the semiconductor package comprising a plurality of external leads. A semiconductor package characterized in that a positioning plate provided with a positioning hole is attached to the ceramic base so as to be disposed below the solid-state image sensor. 2. The semiconductor package according to claim 1, wherein the external lead is a lead extending perpendicularly to the main surface of the ceramic base. 3. The semiconductor package according to claim 1, wherein the number of holes is two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21249885A JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21249885A JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10915879A Division JPS5633865A (en) | 1979-08-29 | 1979-08-29 | Attachment of package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61111568A JPS61111568A (en) | 1986-05-29 |
| JPS6255300B2 true JPS6255300B2 (en) | 1987-11-19 |
Family
ID=16623656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21249885A Granted JPS61111568A (en) | 1985-09-27 | 1985-09-27 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61111568A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4037047B2 (en) | 2000-11-10 | 2008-01-23 | 富士フイルム株式会社 | Radiation image information reader |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5613396B2 (en) * | 1973-10-20 | 1981-03-27 | ||
| JPS529501A (en) * | 1975-07-11 | 1977-01-25 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
| JPS5855710Y2 (en) * | 1977-10-21 | 1983-12-21 | 日本電気株式会社 | solid-state imaging device |
-
1985
- 1985-09-27 JP JP21249885A patent/JPS61111568A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61111568A (en) | 1986-05-29 |
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