JPS6256660B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for assembling and adjusting a bonding head for a wire bonding machine.

A bonding arm having a tool attached to one end is attached to the bonding head so as to be moved up and down by a drive mechanism. The upper and lower limit positions of the bonding arm are set by an upper and lower limit detector built into the bonding head. The upper and lower limit positions must be adjusted so that the bonding arm can move up and down within a range where no excessive force is applied to the device. The tool also needs to be mounted vertically on the bonding arm for good bonding.

However, in the past, these adjustments were made by feeling, which had the disadvantage of extremely poor workability. In addition, the above adjustment is carried out by placing the bonding head on a fixed table, and each time the worker adjusts the assembly of the assembled parts on each side of the bonding head, the operator lifts the bonding head and moves it to a position that is easier to work with. Otherwise, the operator has to move to the surface where the adjustment work is to be performed, and from this point of view as well, the work efficiency is poor.

The present invention has been made in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a method for assembling and adjusting a bonding head that allows easy assembly and adjustment.

Hereinafter, the present invention will be explained with reference to illustrated embodiments.

Figure 1 is a front view showing one embodiment of the present invention, Figure 2 is a front view showing one embodiment of the present invention;
The figures are a view taken along the line A-A' in FIG. 1, and FIG. 3 is a view taken along the line B-B' in FIG. 1 is a workbench fixed or placed on the floor, 2 is a base of an assembly jig, and bolts 3 are screwed into each of the four corners so that the horizontal height of the base 2 can be adjusted to a constant level. It's summery. 4 is a hollow cylindrical boss fixed to the base 2. Reference numeral 5 denotes a column rotatably fitted into the hollow portion of the boss 4, and a groove 5a is formed in the portion inserted into the hollow portion of the boss 4. Reference numeral 6 denotes a set screw whose tip end is inserted into the groove 5a of the support column 5 in order to prevent the support column 5 from coming off, and is screwed into the boss 4.
Reference numeral 7 designates a fixing screw whose tip is inserted into the groove 5a of the column 5 and presses the column 5 in order to fix the column 5 to the boss 4, and is screwed into the boss 4. 8 is a rotary table fixed to the upper part of the support column 5.

Reference numeral 10 denotes a bonding head of a wire bonding apparatus placed on a rotary table 8. A bonding arm 12 holding a tool 11 at the tip is attached to the bonding head 10 so as to move up and down in the vertical direction. Lower limit detection section 1
3 is provided. The upper and lower limit detection unit 13 includes a detection plate 14 that is attached to the bonding arm 12 and sets the upper and lower limits of the bonding arm 12.
, an upper limit detector 15 and a lower limit detector 16 fixed to the bonding head 10.

20 is a height adjustment jig for setting the lower limit position of the bonding arm 12, and 21 is a vertical adjustment jig for adjusting the vertical direction of the tool 11.

Next, a method of assembling and adjusting the bonding head will be explained. The bonding head 10 is easily fixed on the rotary table 8 with one or two bolts (not shown), and placed and fixed. Further, the fixing screw 7 is loosened to make the rotary table 8 freely rotatable. Therefore, the operator rotates the rotary table 8 in a direction that makes it easier for the operator to work.

First, a method for adjusting the lower limit position of the bonding arm 12 will be explained. It is easier to adjust the lower limit position of the bonding arm 12 by rotating the rotary table 8 so that the position shown in FIG. 1 is in front of the operator. With the bonding arm 12 raised, the height adjustment jig 20 is set on the rotary table 8 below the bonding arm 12. Next, the drive mechanism of the bonding arm 12 is manually driven to release the bonding arm 12.
vertically lower the bonding arm 12.
When the lower surface of the height adjustment jig 20 comes into contact with the upper surface of the height adjustment jig 20, the height adjustment jig 20 is stopped. Thereafter, the lower limit detector 16 is aligned with the lower limit detecting portion 14b of the detection plate 14, and the lower limit detector 16 is fixed to the bonding head 10. The upper limit position of the bonding arm 12 can be adjusted by manually driving the drive mechanism of the bonding arm 12 as in the conventional case.
2 and align the upper limit detector 15 with the upper limit detecting portion 14a of the detection plate 14, allowing for a margin, and then move the upper limit detector 15 to the bonding head 1.
Fixed at 2.

Next, the verticality adjustment of the tool 11 will be explained. In this case, the rotary table 8 is rotated 90 degrees from the above-mentioned state (the state shown in FIG. 1) so that the front surface of the bonding arm 12, that is, the state shown in FIG. 3, is located in front of the operator. Then, set the vertical alignment jig 21 on the rotary table 8 so that the vertical surface of the vertical alignment jig 21 comes into contact with the side surface of the tool 11, and turn the bonding arm 12 in the direction of the arrow shown in FIG. Align the side surface of the tool 11 with the vertical surface of the alignment jig 21 and move the bonding arm 12.
is fixed to the bonding arm support portion 12a of this bonding arm 12.

As is clear from the above description, according to the method of the present invention, the bonding head is placed on the rotary table, and the lower limit of the bonding arm is adjusted using the height adjustment jig of the bonding arm and the vertical adjustment jig of the tool. Adjusting the verticality of the tool makes work quick and easy.

[Brief explanation of the drawing]

Figure 1 is a front view showing one embodiment of the present invention, Figure 2 is a front view showing one embodiment of the present invention;
The figures are a view taken along the line A-A' in FIG. 1, and FIG. 3 is a view taken along the line B-B' in FIG. 8... Rotating table, 10... Bonding head, 11... Tool, 12... Bonding arm, 12a... Bonding arm support part, 1
4...detection plate, 14b...lower limit detection section, 16...
Lower limit detector, 20... height alignment jig, 21... vertical alignment jig.

Claims (1)

[Claims] 1 Place the bonding head on a rotatable rotary table, set a height adjustment jig on the rotary table below the bonding arm that is movable up and down on the bonding head, and lower the bonding arm. The lower limit detector is fixed to the bonding head in alignment with the lower limit detection part of the detection plate fixed to the bonding arm, and the lower limit detector is fixed to the bonding head, and the lower limit detector is fixed to the lower limit detection part of the detection plate fixed to the bonding arm. The vertical alignment jig is set on the rotary table so that the vertical surface of the tool is in contact with the side surface of the tool, and the bonding arm is rotated so that the side surface of the tool is aligned with the vertical surface of the vertical alignment jig. A method for assembling and adjusting a bonding head, which comprises fixing a bonding arm to a bonding arm support.