JPS6258645B2 - - Google Patents
Info
- Publication number
- JPS6258645B2 JPS6258645B2 JP58011995A JP1199583A JPS6258645B2 JP S6258645 B2 JPS6258645 B2 JP S6258645B2 JP 58011995 A JP58011995 A JP 58011995A JP 1199583 A JP1199583 A JP 1199583A JP S6258645 B2 JPS6258645 B2 JP S6258645B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode lead
- capacitor body
- electronic component
- recess
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 18
- 239000003985 ceramic capacitor Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
本発明は、電子部品の製造方法に係り、特にア
キシヤルリードタイプ（軸方向タイプ）の電極リ
ードを取付けることに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component, and particularly to attaching an axial lead type electrode lead.
従来のこの種の電子部品、例えばセラミツクコ
ンデンサの製造方法には第１図ａ〜ｄに示すもの
がある。この製造方法では、第１図ａに示すよう
に、先ず、電極が両面に形成されたコンデンサ本
体１とこれの両面に取付けられる１対の軸方向タ
イプの電極リード２，２を用意する。各電極リー
ド２，２の先端には半田等の導電性を有する接合
材３，３をつけておく。次に、第１図ｂに示すよ
うに、有底筒状の上・下の金型４，５を用意す
る。上の金型４の頂壁４ａと下の金型５の底壁５
ａとにはそれぞれ電極リード２，２を挿通するた
めの孔４ｂ，５ｂが形成されている。各電極リー
ド２，２をそれぞれの先端が各金型４，５の内側
に位置させられるように上記各孔４ｂ，５ｂに挿
通させる。その後、下の金型５にコンデンサ本体
１を挿入する。次いで、第１図ｃに示すように、
上の金型４を下の金型５にかぶせる。さらにその
後、加熱して電極リード２をコンデンサ本体１の
両面に接合させる。 Conventional methods for manufacturing electronic components of this type, such as ceramic capacitors, include those shown in FIGS. 1a to 1d. In this manufacturing method, as shown in FIG. 1a, first, a capacitor body 1 having electrodes formed on both sides and a pair of axial type electrode leads 2, 2 to be attached to both sides of the capacitor body 1 are prepared. A conductive bonding material 3, such as solder, is attached to the tip of each electrode lead 2,2. Next, as shown in FIG. 1b, upper and lower molds 4 and 5 each having a cylindrical shape with a bottom are prepared. Top wall 4a of upper mold 4 and bottom wall 5 of lower mold 5
Holes 4b and 5b are formed in the holes 4b and 5b for inserting the electrode leads 2 and 2, respectively. Each electrode lead 2, 2 is inserted into each hole 4b, 5b so that the tip of each electrode lead is positioned inside each mold 4, 5. Thereafter, the capacitor body 1 is inserted into the lower mold 5. Then, as shown in Figure 1c,
Cover the upper mold 4 with the lower mold 5. Thereafter, the electrode leads 2 are bonded to both sides of the capacitor body 1 by heating.
この接合の後、両金型４，５を外すことによ
り、第１図ｄに示すようなセラミツクコンデンサ
６を得る。ところが、このような従来方法では、
(i)コンデンサ本体のサイズごとに電極リードの取
付位置決め用の孔を形成した専用の金型が必要に
なり、(ii)電極リードのコンデンサ本体への固定の
ため電極リードの先端を特別の形状に加工する必
要があり、さらに、(iii)コンデンサ本体や電極リー
ドの金型への挿入や電極リード取付け後の製品の
取出しの工数が多くなるなど、電極リードの取付
位置決めおよび固定のために製造コストが高くつ
くものとなつている。 After this bonding, both molds 4 and 5 are removed to obtain a ceramic capacitor 6 as shown in FIG. 1d. However, with this conventional method,
(i) A special mold with a hole for mounting and positioning the electrode lead is required for each size of the capacitor body, and (ii) the tip of the electrode lead has a special shape in order to fix the electrode lead to the capacitor body. (iii) Inserting the capacitor body and electrode lead into the mold, and removing the product after the electrode lead is attached requires a lot of man-hours. The cost has become high.
本発明は、軸方向タイプの電極リードの取付け
の位置決めおよび固定を簡単にかつ確実に行える
ようにして製造コストを低減することを目的とす
る。 SUMMARY OF THE INVENTION An object of the present invention is to reduce manufacturing costs by easily and reliably positioning and fixing an axial type electrode lead.
以下、本発明を図示の実施例に基づき詳細に説
明する。 Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
この実施例はセラミツクコンデンサに適用して
説明される。この実施例では、第２図ａ，ｂに示
すようなコンデンサ本体８を用意する。このコン
デンサ本体８は、円形のセラミツク基板８ａの両
面にそれぞれ電極８ｂ，８ｂを蒸着、印刷、メツ
キ等の方法で形成してなる。このコンデンサ本体
８両面の各中央部にはそれぞれ電極リード取付部
９，９を形成する。各電極リード取付部９，９は
半凹球面状に形成されている。一方、このコンデ
ンサ本体８に取付けられる電極リード用の部材１
０を用意する。この電極リード用の部材１０は、
第３図に示すように、テープ状のホルダ１１に対
して内向きのリツプ部１０ａを有するＵ字形に形
成されて取付けられている。このリツプ部１０ａ
の先端の間隙１０ｂは、コンデンサ本体８の電極
リード取付部９における厚みｔよりも若干小さく
してある。なお、このホルダ１１には多数の電極
リード用部材１０，１０…が取付けられている。
このようなコンデンサ本体８と電極リード用部材
１０とを用意した後、第４図ａに示すように、電
極リード用部材１０の間隙１０ｂにコンデンサ本
体８を押し込みながら、上記リツプ部１０ａの先
端を電極リード取付部９の半凹球面状を利用して
その取付部９に挿入する。これにより、電極リー
ド用部材１０は簡単に位置決めされて取付部９に
挿入されることになる。そして、第４図ｂに示す
ように、各リツプ部１０ａをその取付部９に対し
て半田や導電性接着材１３で接合する。この接合
は例えば半田浴への浸漬により行なわれる。次
に、第４図ｃに示すように、電極リード用部材１
０のＵ字形底部１０ｃを切断して、その両脚部１
０ｄを互いに独立させる。その後、第４図ｄに示
すように、電極リード用部材１０をホルダ１１か
ら抜き取り、第４図ｅに示すように、電極リード
用部材１０の両脚部１０ｄをリツプ部１０ａと一
直線となるように矢印方向に開く。このようにし
て、軸方向タイプの電極リード１２を有するセラ
ミツクコンデンサ１３が得られる。 This embodiment will be described as applied to a ceramic capacitor. In this embodiment, a capacitor body 8 as shown in FIGS. 2a and 2b is prepared. This capacitor body 8 is formed by forming electrodes 8b, 8b on both sides of a circular ceramic substrate 8a, respectively, by methods such as vapor deposition, printing, plating, etc. Electrode lead attachment portions 9, 9 are formed in the center portions of both sides of the capacitor body 8, respectively. Each electrode lead attachment portion 9, 9 is formed into a semi-concave spherical shape. On the other hand, an electrode lead member 1 attached to this capacitor body 8
Prepare 0. This electrode lead member 10 is
As shown in FIG. 3, it is attached to a tape-shaped holder 11 in a U-shape having an inwardly directed lip portion 10a. This lip portion 10a
The gap 10b at the tip of the capacitor body 8 is made slightly smaller than the thickness t of the electrode lead attachment portion 9 of the capacitor body 8. Note that a large number of electrode lead members 10, 10, . . . are attached to this holder 11.
After preparing the capacitor body 8 and the electrode lead member 10, as shown in FIG. 4a, while pushing the capacitor body 8 into the gap 10b of the electrode lead member 10, the tip of the lip portion 10a is The electrode lead is inserted into the mounting portion 9 by utilizing the semi-concave spherical shape of the electrode lead mounting portion 9. Thereby, the electrode lead member 10 can be easily positioned and inserted into the attachment part 9. Then, as shown in FIG. 4b, each lip portion 10a is bonded to its attachment portion 9 using solder or a conductive adhesive 13. This bonding is performed, for example, by immersion in a solder bath. Next, as shown in FIG. 4c, the electrode lead member 1
Cut the U-shaped bottom part 10c of 0 and make both legs 1.
Make 0d independent of each other. Thereafter, as shown in FIG. 4d, the electrode lead member 10 is removed from the holder 11, and as shown in FIG. 4e, both legs 10d of the electrode lead member 10 are aligned with the lip portion 10a. Open in the direction of the arrow. In this way, a ceramic capacitor 13 having an axial type electrode lead 12 is obtained.
第５図ａ〜ｄは他の実施例を示す説明図であ
る。本例では、第４図ａ，ｂと同様の製造手順を
有しているが、その説明は重複をさけるため省略
する。本例では、第４図ｂに示された接合の後
に、第５図ａに示すように、絶縁性合成樹脂で外
装塗装１４を行なう。この外装は、例えばデイツ
プ法が用いられる。その後、第５図ｂに示すよう
に、電極リード用部材１０のＵ字形底部１０ｃを
切断して、その両脚部１０ｄを互いに独立させ
る。その後、第５図ｃに示すように、電極リード
用部材１０をホルダ１１から抜き取り、第５図ｄ
に示すように、電極リード用部材１０の両脚部１
０ｄをリツプ部１０ａと一直線となるように開く
とともに、必要により外装塗装１４の不要部分を
除去する。 FIGS. 5a to 5d are explanatory diagrams showing other embodiments. This example has a manufacturing procedure similar to that shown in FIGS. 4a and 4b, but the description thereof will be omitted to avoid duplication. In this example, after the joining shown in FIG. 4b, the exterior coating 14 is applied with an insulating synthetic resin, as shown in FIG. 5a. For this packaging, for example, the dip method is used. Thereafter, as shown in FIG. 5b, the U-shaped bottom portion 10c of the electrode lead member 10 is cut to make the two leg portions 10d independent of each other. Thereafter, as shown in FIG. 5c, the electrode lead member 10 is removed from the holder 11, and as shown in FIG.
As shown, both legs 1 of the electrode lead member 10
0d is opened so as to be in line with the lip portion 10a, and unnecessary portions of the exterior coating 14 are removed if necessary.
このようにして、軸方向タイプの電極リード１
２，１２を有するセラミツクコンデンサ１３′が
得られる。 In this way, the axial type electrode lead 1
A ceramic capacitor 13' having 2,12 is obtained.
第６図は上記各実施例で用いられる電極リード
用部材の変形例の平面図である。図中、第３図に
対応する部分には同じ符号を付してある。この電
極リード用部材１０′は、リツプ部１０′ａの先端
部を半円状に折返した点に特徴がある。その他の
構成は第３図のものと同様に構成してある。この
ようにリツプ部１０′ａの先端を半円状に折返し
た場合には、コンデンサ本体８の挿入〔第４図
ａ〕の際にその電極８ｂがリツプ部の先端で傷付
けられることを防止できる。なお、上述の実施例
では、セラミツクコンデンサに適用して説明した
が、軸方向タイプの電極リードを有する電子部品
の全てに適用することができることは勿論であ
る。また電子部品に形成する電極リード取付部の
形状も任意である。 FIG. 6 is a plan view of a modified example of the electrode lead member used in each of the above embodiments. In the figure, parts corresponding to those in FIG. 3 are given the same reference numerals. This electrode lead member 10' is characterized in that the tip of the lip portion 10'a is folded back into a semicircular shape. The rest of the structure is similar to that of FIG. 3. When the tip of the lip portion 10'a is folded back into a semicircular shape as described above, it is possible to prevent the electrode 8b from being damaged by the tip of the lip portion when the capacitor body 8 is inserted (FIG. 4a). . Although the above-mentioned embodiments have been described as being applied to ceramic capacitors, it goes without saying that the present invention can be applied to all electronic components having axial type electrode leads. Further, the shape of the electrode lead attachment portion formed on the electronic component is also arbitrary.
以上のように、本発明は、電子部品本体の電極
リード取付部のところに凹部を形成し、軸方向タ
イプの電極リードの端部を該凹部に挿入すること
によりその位置決めを行うとともに、該電極リー
ドをその凹部に接合して固定するようにしたの
で、高価な金型が不要になり、また、電極リード
の先端を特別な形状に形成することもなく電極リ
ードの位置決め及び固定を簡単にかつ確実に行う
ことができることになり、その結果製造コストを
大きく低減させることができる。 As described above, the present invention forms a recess at the electrode lead mounting portion of an electronic component body, positions the end of an axial type electrode lead by inserting it into the recess, and positions the electrode lead. Since the lead is fixed by joining it to the recess, there is no need for an expensive mold, and the electrode lead can be easily positioned and fixed without having to form the tip of the electrode lead into a special shape. This can be done reliably, and as a result, manufacturing costs can be significantly reduced.
第１図はそれぞれ従来例の説明に供する図、第
２図〜第６図は本発明の実施例を示し、第２図ａ
はコンデンサ本体の正面図、第２図ｂは第２図ａ
のＡ−Ａ線に沿う断面図、第３図は電極リード用
部材の平面図、第４図ａ〜ｅはこの実施例の説明
に供する図、第５図ａ〜ｄは他の実施例の説明に
供する図、第６図は他の電極リード用部材の平面
図である。
８…電子部品、９…電極リード取付部、１０，
１０′…電極リード用部材、１０ａ，１０′ａ…端
部、１２…電極リード。
Fig. 1 is a diagram for explaining a conventional example, Figs. 2 to 6 show an embodiment of the present invention, and Fig. 2a
is a front view of the capacitor body, Figure 2b is a front view of the capacitor body, Figure 2b is Figure 2a
FIG. 3 is a plan view of the electrode lead member, FIGS. 4 a to e are views for explaining this embodiment, and FIGS. 5 a to d are views of other embodiments. FIG. 6, which is used for explanation, is a plan view of another electrode lead member. 8...Electronic component, 9...Electrode lead attachment part, 10,
10'... Electrode lead member, 10a, 10'a... End portion, 12... Electrode lead.
Claims (1)
の電極リード取付部に軸方向タイプの電極リード
を取付けてなる電子部品の製造方法において、電
子部品本体には各電極リード取付部のところに凹
部を形成し、先端部を対向させた並行電極リード
の端部を該凹部に挿入することにより電極リード
の取付位置決めを行うとともに、該電極リードを
その凹部に接合して固定した後、並行電極リード
をアキシヤル状に伸線したことを特徴とする電子
部品の製造方法。1. In a method of manufacturing an electronic component in which the electronic component body has an electrode lead attachment portion and an axial type electrode lead is attached to the electrode lead attachment portion, the electronic component body has a recess at each electrode lead attachment portion. The mounting position of the electrode lead is determined by inserting the end of the parallel electrode lead with the tips facing each other into the recess, and after bonding and fixing the electrode lead to the recess, the parallel electrode lead A method for manufacturing an electronic component, characterized in that the wire is drawn into an axial shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011995A JPS59138324A (en) | 1983-01-27 | 1983-01-27 | Method of producing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011995A JPS59138324A (en) | 1983-01-27 | 1983-01-27 | Method of producing electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59138324A JPS59138324A (en) | 1984-08-08 |
| JPS6258645B2 true JPS6258645B2 (en) | 1987-12-07 |
Family
ID=11793161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58011995A Granted JPS59138324A (en) | 1983-01-27 | 1983-01-27 | Method of producing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138324A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6035236B2 (en) * | 2011-05-02 | 2016-11-30 | Ｌｉｔｔｅｌｆｕｓｅジャパン合同会社 | PTC device |
-
1983
- 1983-01-27 JP JP58011995A patent/JPS59138324A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59138324A (en) | 1984-08-08 |
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