JPS6258649B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to electronic components, and particularly to a polarity display mechanism in a resin-molded solid electrolytic capacitor.

[Background technology]

Generally, this type of solid electrolytic capacitor is
As shown in the figure, a metal wire having a valve action is attached in advance to a capacitor element A which is formed by press-forming metal powder having a valve action into a prismatic shape and sintering it, and an anode lead B.
A plate-shaped first external lead member C is welded to this anode lead B, and a plate-shaped second external lead member C is welded to the anode lead B.
The external lead member D of the capacitor element A is bonded to the electrode lead layer E of the capacitor element A using a solder material, a conductive adhesive, etc., and the entire circumferential surface of the capacitor element A is molded and covered with a resin material F. There is.

By the way, in this capacitor, capacitor element A and anode lead B serve as an anode.
Since the electrode lead layer E functions as a cathode, the first and second external lead members C and D connected thereto need to be designated as an anode or a cathode by some method.

Therefore, in the past, as shown in Figure 1,
A notch-like irregularly shaped part G is formed on the upper surface end of the resin material F on the lead-out side of the first external lead member C, or a display symbol is stamped, and the external lead on the side where it is formed is formed. Polarity is indicated by using the member as an anode, but when mounting the capacitor on a printed circuit board, for example, as shown in Figure 2, the capacitor should be placed so that the irregularly shaped part G of the resin material F is on the lower side. If the polarity is reversed, it becomes impossible to recognize the abnormally shaped portion G, thereby making it impossible to determine the polarity. For this reason, it is necessary to invert the capacitor by some means, but
There is a problem that the equipment becomes complicated and the operation becomes complicated.

[Disclosure of the invention]

In view of these points, the present invention provides an electronic component that can reliably determine polarity even in an inverted state with a simple configuration. lead out in different directions, the main part including the component body is molded and covered with a resin material, and the external lead members are bent so that each lead-out end is located on the same surface of the resin material. This is characterized in that air vent traces are formed on the outer surface of one of the external lead members exposed from the resin material.

According to this invention, air vent marks are formed on one external lead member facing the air vent groove formed in the resin molding device by high temperature air discharged through the air vent groove or leaking resin material during resin mold operation. is formed. Therefore, by using the external lead member on which the air vent trace is formed as, for example, an anode, the polarity can be easily and reliably determined even when the electronic component is in an inverted state.

In particular, when the air vent trace is made of a resin material that leaks, the polarity discrimination function can be further enhanced by making the resin material a different color from the external lead member.

[Best mode for carrying out the invention]

An example of application of the present invention to a solid electrolytic capacitor will be described with reference to FIGS. 3 to 4.

In the figure, 1 is a capacitor element (component body) made by pressure-forming metal powder with valve action into a prismatic shape and sintering it. A functional metal wire is installed as an anode lead 2. Incidentally, the capacitor element 1 can be formed into an appropriate shape such as a columnar shape as well as a prismatic shape, and the anode lead 2 can also be welded to the circumferential surface of the capacitor element 1 to lead out. An electrode lead layer 3 is formed on the circumferential surface of the capacitor element 1 via an oxide layer and a semiconductor layer. On the other hand, a plate-shaped first external lead member 4 is welded to the anode lead 2, and a plate-shaped second external lead member 5 is connected to the electrode lead layer 3 using a conductive adhesive 6. ing. Note that these external lead members have a thickness of, for example, 0.1 ^t mm.
It is constructed by plating solder made of lead-tin (90) on the surface of nickel silver. The entire circumferential surface of the capacitor element 1 is molded and covered with a resin material 7 so that a deformed portion 8 is formed on the lead-out side of the first external lead member 4. And, first,
The second external lead members 4 and 5 are bent such that their respective lead-out ends are located on the lower surface 7a of the resin material 7. Furthermore, air vent marks 9 are formed on the outer surface of the first external lead member 4.

Next, a method of manufacturing this solid electrolytic capacitor will be explained with reference to FIGS. 5 to 7.

First, as shown in FIG.
0, the capacitor element 1 is placed on the first and second external lead members 4 and 5, and the anode lead 2 and the first
At the same time, the electrode lead layer 3 and the second external lead member 5 are connected using a conductive adhesive. Next, as shown in Figure 6,
The lead frame 10 is used as a cavity part 1 of an upper mold 11 and a lower mold 12 in a resin molding device.
3, the first and second external lead members 4 and 5 are set so as to be held between the upper mold 11 and the lower mold 12. Incidentally, an air vent groove 14 and a runner part 15 are formed on the parting surface of the upper mold 11, and the cavity part 1 of the lead frame 10
3, the air vent groove 14 is located approximately in the center of the first external lead member 4, and the runner portion 1
5 are respectively arranged in the frame portion on the second external lead member 5 side. In particular, the air vent groove 14 is influenced by the volume of the cavity part 13, but the width is 0.1 to 0.3.
mm, and the depth is set to about 0.01 to 0.03 mm.
In this state, when a molten resin material is injected into the cavity 13 through the runner 15 and a gate (not shown), the high temperature air inside the cavity is discharged to the outside through the air vent groove 14. At this time, air vent marks 9 are formed on the surface of the first external lead member 4 due to surface oxidation due to the passage of heated air, leaked resin, and the like. After the resin material has hardened, the state shown in FIG. 7 is obtained when it is taken out from the cavity. After that, the first and second external lead members 4 and 5 are separated from the lead frame 10,
Figures 3 to 4 are formed by bending along the resin surface.
The solid electrolytic capacitor shown in the figure is obtained.

According to this embodiment, the first external lead member 4
Air vent marks 9 were left on the outside surface during resin mold operation.
is formed, so even if the solid electrolytic capacitor is reversed as shown in FIG. 4 when mounted, the polarity can be easily and reliably determined by the air vent mark 9 of the first external lead member 4. .

In particular, if the air vent groove 14 is further enlarged to increase the leakage amount of the resin material 7, a resin strip (air vent trace) of a different color can be formed on the outer surface of the first external lead member 4. It is possible to further ensure polarity discrimination.

Furthermore, by forming the air vent groove 14 in the upper mold 11, most of the external lead member 4 shown in FIG. 1 can be clamped tightly between the upper mold 11 and the lower mold 12. Therefore, the occurrence of thin film-like burrs of the resin material in undesired areas can be reduced as much as possible.

In the present invention, the air vent groove can also be formed in the lower mold. In addition to solid electrolytic capacitors, electronic components can also be applied to resistors, varistors, semiconductor devices, ceramic capacitors, etc.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of the conventional example, FIG. 2 is a bottom view of FIG. 1, FIG. 3 is a side sectional view showing an embodiment of the present invention, FIG. 4 is a bottom view of FIG. Figures 5 to 7 are explanatory diagrams of the manufacturing method, with Figure 5 being a plan view showing the state in which the capacitor element is mounted on the lead frame, and Figure 6 showing the state in which the lead frame is set in the resin molding device. The side sectional view and FIG. 7 are plan views showing the state of resin molding. In the figure, 1 is the component body (capacitor element), 4 and 5 are external lead members, 7 is a resin material, 7
a is the bottom surface, and 9 is the air vent trace.

Claims (1)

[Claims] 1. Plate-shaped external lead members are led out in different directions from the component body, and the main parts including the component body are molded and covered with a resin material, and each lead-out end of the external lead member is positioned on the same surface of the resin material. 1. An electronic component characterized in that an air vent trace is formed on the outer surface of one of the external lead members exposed from the resin material, in which the electronic component is bent in such a manner as to be bent.