JPS6260263B2 - - Google Patents

Description

[Detailed description of the invention]

The present invention relates to an embossed, stress-free tile surface cover and a method for forming the same, and more particularly to an embossed, stress-free tile surface cover that has a deep uneven pattern and an excellent reproduction of the embossed surface of an embossing plate. It has long been known to produce embossed resin surface coverings that are chemically or mechanically embossed. Furthermore, it is also well known to provide decorative patterns on such surface coverings by applying inks of various colors to the upper surface of the base material or to the film wear layer thereon before and after embossing the structure. It is. However, the conventional methods have various problems, such as distortion of the material and the pattern on it, problems with pattern registration and embossing, inability to perfectly reproduce the details of the embossing surface, and residues on the product that occur during product manufacturing. These include stress generation and product dimensional instability when mechanically embossing is performed where varying depths of embossing are required as well as perfect replication of the embossing surface. U.S. Pat. No. 3,562,059 discloses placing the printed side of a polymer film onto a foam, covering the film with a woven Teflon cloth, applying heat and pressure to the side of the cloth, and then peeling the cloth from the film. The present invention relates to a method of decorating plastic forks with. U.S. Pat. No. 3,180,776 discloses the production of plastic products by forming a color-supporting blank of incompletely cured, filled resin material, printing decorations thereon with a suitable ink, and then subjecting the blank to high-frequency heat treatment to harden the ink. Concerning decoration. A clear, partially cured, filled plastic sheet of a similar resinous material is then placed over the previously formed blank, bringing the printing surface on the color support blank into contact with the transparent sheet. The product is formed by molding and melting materials using heat and pressure. U.S. Pat. No. 3,024,154 discloses a process in which a relatively thick sheet of thermoplastic material is heated to a temperature above its curing temperature and the softening temperature of the film, and one side of the film is brought into contact with the surface of the thick sheet in a relatively cold state. and sheet together between a cooled recessed embossing element and a receiver, pressing the film and sheet into the recesses of the embossing element, and subsequently cooling the composite structure. This invention relates to a technique for embossing plastic films. U.S. Pat. No. 3,325,332 converts a relatively thick plastic film into a compatible plastic foam by heating and curing the plastic foam, preheating only the contacting surfaces of the film, and then pressing the film and foam together. Regarding the method of laminating. The above-mentioned problems have not been satisfactorily solved by the above-mentioned prior art. The present invention relates to a stress-free, embossed, decorative surface covering that can be formed into a floor tile or wall tile, and a method for producing the same.
placed on the top surface of a low-density thermoplastic base material;
The decorative surface of the film is interfaced with the upper surface of the base material. The porous base material is a lightly sintered resinous dry blend structure containing hollow, non-plastic particles therein and reinforced with a material such as a glass scrim. As used herein, the term "permeable" means that the film can be permeable initially or at a later stage in the process prior to embossing of the surface cover and melting of the internal resin. While on the release carrier, the film was cut to the desired tile dimensions to match the patterned area thereon without cutting the carrier, interfaced with the top surface of a similarly sized piece of base material, and removed. A release carrier or film is interfaced with the top surface of the sheet of base material, and after removal of the release carrier, the film and base material are similarly cut to match the pattern on the film. The adhesive is applied to the base material contacting surface of the film, or the adhesive is included in the ink used to decorate the film. When laminating the film to the base material, heat at a temperature sufficient to activate only the adhesive and light pressure are applied to ensure bonding of the film to the base material. In both cases, the base material with the decorative film on top is then embossed under high frequency electrical energy and pressure in a flatbed press with a cooled embossing plate and a cooled backing plate, so that the resin melts and the film becomes impermeable. become. The film can be made of vinyl. Small holes are then drilled to allow air trapped in the deep recesses of the embossing plate to escape through the holes. The pores are sealed during embossing and melting of the resin in the composite structure. The problems of the prior art described above are solved by the present invention. Because the base material is initially a porous, low-density material containing hollow, non-plastic particles, it can be compressed vertically in a flatbed press with less lateral flow. This results in deep, well-defined embossing and less distortion of the product. Additionally, the present method utilizes a flatbed embossing press and substantially eliminates the pattern on the film and the distortion of the base material that is typically encountered when using low density compositions, which are particularly difficult to heat and cool. to be excluded. Furthermore, the present invention
Distortion is controlled by the use of high frequency heating and suitable compositions, coupled with cooling of the embossing and backup plates of the press, so that the material can be embossed while avoiding distortion of the film decoration under pressure. can be heated quickly at a sufficient temperature. Since there is no distortion of the decoration on the film in the method of the present invention, it can be easily embossed to match the decoration on the film. As is well known, thermoplastic films are dimensionally unstable when heated sufficiently to be embossed. These films tend to expand and contract differently in each part of the sheet. Avoiding heating the material to high temperatures before the final embossing and melting steps virtually eliminates the formation of stresses in the material. This is the flat cooling bottom surface of the embossing press, tempered glass
The built-in scrim, along with high frequency heating, produces a product that is dimensionally stable, stays flat, and does not curl under hot and humid conditions. As illustrated by the flowchart of FIG. 1, two embodiments of the invention are illustrated. The manufacturing method in the first embodiment begins with the formation of a porous, low density base material. A first dry blend layer is formed on the release carrier as shown in the flowchart of FIG. In forming the base material, a mixture of resinous dry blend grains and sea-stripe pearlite is prepared. The dry blend is in the form of a free-flowing homogeneous mixture of unmolten thermoplastic resin particles, including a liquid vinyl plasticizer, a filler,
Contains pigments and vinyl stabilizers. Although polyvinyl chloride is the preferred resin for molding the surface coverings of the present invention, vinyl chloride and small amounts of other materials such as vinyl acetate, vinylidene chloride, other vinyl esters (e.g., vinyl propionate, Copolymers with vinyl butyrate) and alkyl-substituted vinyl esters can also be used. Other thermoplastics capable of being radio-frequency heated or mixed into materials capable of radio-frequency heating can also be used. These include, for example, polyethylenes, polyurethanes, polyesters, polyamides, polyacrylates (eg polymethyl methacrylate) and polymers derived from acetates and cellulose esters. A free-flowing mixture of resin, plasticizer, stabilizer, pigment, and filler is prepared by adding the resin (e.g., vinyl chloride homopolymer in the form of individual particles) to a mixer or blender such as a Henschel blender. By adding vinyl resin plasticizers (e.g., di-2-ethylhexyl phthalate, butylbenzyl phthalate, epoxidized soybean oil, or tricresyl phosphate), fillers, pigments, and suitable vinyl resin stabilizers. easily generated. The components are then heated under suitable heat, e.g., at a temperature of about 71 to 104.4 °C (160 to 220 °C), so that the liquid plasticizers and stabilizers are absorbed and thus diffused throughout the resin granules and the remaining formulation components are deposited on the resin. mixed for sufficient time to be adsorbed. Care must be taken that melting of the resin particles does not occur during the mixing, and the temperature must be kept below the temperature at which such melting occurs. Generally, fillers and pigments are added to the mixture at the end of the mixing cycle when the resin particles are relatively warm, or after the dry blend particles have been mixed and cooled. The dry blend composition used in this invention contains the following ingredients in the indicated ranges based on 100 parts of resin:

TABLE The dry blend/perlite mixture used in this invention is produced by simply mixing or rolling the two dry materials together until a homogeneous blend is obtained. Approximately 90 parts by weight of dry blend and approximately 10.5 parts by weight of perlite are used. However, the amount of perlite used in the composition can vary considerably. However, the upper limit is determined by the ability of the composition to hold together in a useful manner after heating and consolidation. This upper limit is influenced by the particle size and density of the pearlite used. The preferred pearlite particles used in the present invention are Spherepack MM-100.
(Product sold by Patentech Corporation in the United States). The pearlite used in the present invention has a particle size of about 35-850 microns. Spherepack MM−100
The average particle size of pearlite is approximately 60μ. The effective range of pearlite amount used is approximately 98-80% by weight
2-20% by weight when mixed with dry blend of
It is. The preferred range of perlite used is about 5-15% by weight, optimally 8-12% by weight.
Levels of other types of perlite are e.g.
Materials with a bulk density of 0.056-0.16 g/cm ³ (3.5-10 lb/ft ³ ) differ due to their large particle size and/or density. Although the base material is preferably formed using expanded perlite as hollow particles, hollow particles of, for example, glass, ceramic or organic materials can also be used within the scope of the invention. Next, an approximately 100 mil (2.54 mm) thick perlite-containing dry blend mixture layer is formed on the surface exfoliation carrier, causing the surface portions of the resin particles to melt slightly at their mutual contact points and stick together. heated to a temperature sufficient to A nonwoven glass scrim reinforcing layer is then placed over the thus formed perlite-containing dry blend layer and light consolidation pressure is applied thereto. Glass scrim approximately 10-50
It has a basis weight of g/m ² . The desired reinforced, sintered dry blend and expanded perlite composite is a unique porous structure in which the individual pores are reinforced by the rigid cellular structure of individual expanded perlite particles. The collective action of a large number of reinforcing pores contributes significantly to the necessary dimensional stability and light weight of the product, and at the same time has the possibility of crushing with limited lateral flow during the embossing process. Although it is desirable for the base material to be as described above, other porous structures such as open cell thermoplastic foam (eg, vinyl foam), thermoplastic mat, etc. can also be used. However, print distortion, material extrusion, and structural collapse occur during subsequent processing steps.
The results are generally poor. A dimensionally stable release carrier is then provided with a resinous thermoplastic film, preferably about 0.1 mm thick and having a decorative pattern on the surface remote from the carrier. However, the film is about 0.0025~
It can range from 0.1 to 15.0 mils and can be gas permeable or non-permeable at this point, but must be gas permeable when the composite structure is subsequently embossed. The film is casted, extruded, or laminated onto the release carrier, and the pattern or decoration is applied before or after application of the film to the release carrier. The decoration is also applied to the upper surface of the base material and the undecorated film or coating applied thereon. Preferably, the film is comprised of polyvinyl chloride and/or copolymers thereof, such as vinyl chloride and acrylic monomers and ethylene-acrylic acid.
However, polyester, polyurethane, polyamide, polyolefin (e.g. polyethylene),
Other thermoplastic materials can also be used in the present invention, such as polyacrylates and the like. The adhesive is applied to the decorative surface of the film, or the adhesive is included in or mixed with the ink. The film is then die cut to the desired size while it is on the release carrier without cutting the carrier in a pattern. The base material is cut into a shape that corresponds to the shape of the cut portion of the film. The decorative surface of the cut portion of the film then interfaces with the upper surface of the shaped portion of the base material. The release carrier is removed and a small hole is made in the film. The die-cut film pieces are preheated to warm only the adhesive so that lamination can be done at a relatively low temperature. The pieces of base material are also preheated, but not extensively. The composite structure thus formed is then loaded into a flatbed press consisting of a cooled deep embossing plate and a cooled flat backing. Close the press and then apply radio frequency energy. The temperature of the material will be approximately 177℃ (350℃) from the ambient temperature. The radio frequency power is then turned off and the pieces (composite structures) are left under pressure for about 4 to 20 seconds. Next, open the press, take out the pieces, align them, and die-cut them. Apply adhesive to the back of the pieces and add release paper. In a second embodiment of the invention, after the patterned surface of the film has been interfaced with the top surface of the base material and after the release carrier has been separated from the film, the film and base material are aligned simultaneously with the patterned portion on the film. The same materials and methods are used except that they are die cut. The following examples are for illustration and the invention is not limited to these examples. All parts and percentages are by weight unless otherwise specified. EXAMPLE In forming the base material for surface coverings of the present invention, dry blended grains are processed from ambient conditions to the next through a thermal history of 104.4°C in a conventional Herschel dry blending apparatus using the ingredients listed below. Prepared by mixing the ingredients:

[Table] The dry blend grains produced as above are
It was then mixed with perlite grains in the following proportions: dry blended grains 90 parts by weight Perlite (Spherepack MM−100) 10.5 100.5 * Low-density, hollow silica glass grains obtained from Patentech, Inc., Seafared Grove, IL, USA. The above dry ingredients were mixed together by a simple tumbling operation until a uniform blend was obtained. The dry blend mixture was deposited onto the release surface carrier to form a uniform layer approximately 100 mils thick. Next, the upper surface is irradiated with infrared rays, and the lower plate is electrically heated for about 2 minutes to bring the mixture to about 190°C (375°C).
〓), the surface portion of the dry blend grains was partially melted and they were adhered at the contact points. A sheet of non-woven glass scrim having a basis weight of approximately 35 g/m ² and dimensions similar to the linear dimensions of the dry blend layer is then placed thereon and lightly consolidated by passing through a roll laminator. gave pressure. Another layer of the same dry blend mixture of the same thickness as the first layer was deposited on top of the glass scrim cover and similarly heated and lightly set. After cooling, the approximately 2.54 mm thick composite sheet will fit approximately 7 x 7 inch (18 x 18 cm) tiles.
Cut to size, they were low density, porous, high strength, and easy to handle and suitable for subsequent processing. A 0.1 mm (4 mil) thick polyvinyl chloride coating was applied to a 0.036 mm (1.42 mil) thick polyester release carrier and the interface temperature was heated to approximately 143°C (290°C). The resulting film was then printed with a decorative pattern using vinyl ink. An acrylic lacquer with the following composition was then applied to the decorative surface of the film to ensure bonding of the film to the base material: parts by weight A21 LV resin 13 ethyl acetate 43 methyl ethyl ketone 13 69 *: Pennsylvania, USA; of philadelphia
Methyl methacrylate resin obtained from Rohm & Haass The decorated film was then cut to the shape and dimensions of the base material without cutting the release carrier. The decorated surface of the film was then interfaced with the top surface of a piece of base material that was preheated and only the top surface was warmed. The adhesive on the surface of the film to be decorated is softened by the heat from the silicone roller heated to approximately 204℃ (400℃), and the roll and
The film was bonded to the base material by applying light pressure with a laminator. After cooling, the release carrier was removed. The decorated film was then perforated using a pin roll to create holes approximately 0.8 cm (5/16 in) apart. The composite structure was then placed in a flatbed press with a water-cooled embossing plate and a backup plate. High frequency electrical energy was applied to melt the resin of the structure and the resin was embossed by downward pressure applied by an embossing plate. The product was then allowed to cool under pressure, removed from the press, aligned and die cut to remove excess trim. Next, a water-based acrylic adhesive having the following composition was applied to the back side of the final product (piece) to facilitate attachment to surfaces such as walls and floors. Weight part ^* Polyacrylic emulsion (UCAR174)
98.62 ^** Sodium polyacrylic solution (Alcogum
6940) 1.31 ^*** 1,2-benzisothiazoline-3-one (Proxel CRL) 0.7 *: Obtained from Union Carbide Company, Danbury, CT, USA **: Obtained from Arco Chemical Company, Philadelphia, Pennsylvania, USA ***: Wilmington, Delaware, USA
Obtained from ICI America, Inc. Release coated paper was then added over the adhesive.
The coated paper can be easily removed when the product is mounted on the substrate. The product is a non-curling, residual stress-free, decorative, embossed surface covering. EXAMPLE A residual stress-free embossed, decorative surface covering was made using the same base material dry blend-perlite mixture and method as in the example. Decorated films were also provided using the same materials and methods as in the examples. However, in making this surface cover, neither the decorated film nor the base material was cut prior to lamination of the film and base material. In this method, the decorative surface of the film was interfaced with the upper surface of the base material and heat and pressure were applied to activate the adhesive. After cooling, the release carrier was removed, holes were punched in the film, and the film and base material were simultaneously cut in alignment with the pattern on the film. Embossing the structure, melting the resin, die cutting to remove excess edges, and adding adhesive and release paper to the back of the product were done using the same methods and materials as in the example. As shown in FIG. 2, the surface cover manufactured by the method described above consists of a main body layer 1 having an upper surface 2 and a lower surface 3, and has hollow non-plastic particles 5 inside.
Resin dry blend melt matrix 4 with
Consisting of The upper surface 2 of the layer 1 has recesses 6, 7;
Recess 7 is substantially deeper than recess 6 and contains molten resin 8 in a substantially continuous phase with completely crushed non-plastic particles 9. The convex portion 10 is provided on the upper surface 2 of the main body layer 1 and is elevated relative to the concave portions 6,7. The convex portions 10 and the shallow recesses 6 are made of molten resin in a substantially discontinuous phase together with non-crushed and substantially only partially crushed non-plastic particles. A reinforcing non-woven glass scrim 11 is provided intermediate the upper and lower surfaces 2, 3 of the main body layer 1. A substantially non-transparent, transparent fused resin wear layer 12 is bonded to the upper surface 2 of layer 1 and a decoration 13 is provided between the wear layer 12 and the upper surface 2 of the main body layer 1. Ru. The peelable cover 14 is secured to the lower surface 15 of the top cover by an adhesive coating 15 to facilitate attachment of the top cover to a substrate such as a wall or floor upon removal thereof. The surface covering is virtually stress-free, has no tendency to curl, is relatively easy and economical to manufacture, and provides a superior aesthetically appealing product with excellent stability. .

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing a series of steps in carrying out the method of the invention. FIG. 2 is an enlarged cross-sectional view of a portion of a surface cover formed by the method of the present invention. Explanation of symbols, 1...Main body layer, 2...Top surface,
3... Bottom surface, 4... Resin dry blend molten matrix, 5... Hollow non-plastic particles, 6, 7...
... Concavities, 8 ... Molten resin in continuous phase, 9 ... Completely crushed non-plastic particles, 10 ... Protrusions, 11 ... Non-woven glass scrim for reinforcement, 12 ... Wear layer, 13
...Decoration (object), 14...Peelable cover, 15...
...adhesive coating.

Claims (1)

[Claims] 1. (a) providing on a release carrier a resinous thermoplastic film that is transparent and has a pattern on its surface facing away from the release carrier; (b) providing upper and lower surfaces of the film; (c) providing a layer of reinforcing material in an intermediate portion of said resin-based material; (d) interfacing the patterned film surface with the upper surface of the base material; (e) separating the release carrier from the film; (f) the resin material; The process comprises embossing the film and base material while applying heat and pressure employing a cooled embossing plate and radio frequency heating to melt the material and render the film substantially gas impermeable. stress,
Method for manufacturing embossed decorative surface covers. 2 (a) a main body layer comprising a molten matrix of a resinous dry blend having an upper surface and a lower surface and containing initially hollow non-thermoplastic particles uniformly dispersed therein; (b) said resin; (c) a first recess on the resinous main body layer consisting of a substantially continuous phase of molten resin and substantially completely crushed non-thermoplastic particles; (d) a convex portion on the resinous main body layer that is higher than the first and second concave portions; (e) a convex portion that is higher than the first and second concave portions; (f) a structure in which the concave portions and the convex portions are made of a relatively discontinuous phase of molten resin, and the resin contains uncrushed and only partially crushed non-thermoplastic particles; (f) the resinous main body layer; a layer of reinforcing material disposed between the upper and lower surfaces; (g) a substantially gas-impermeable transparent, fused resin wear layer comprising a thermoplastic film bonded to the upper surface of the resinous main body layer; and; (h) a stress-free, embossed, decorative surface cover comprising a decorative body located between the wear layer and the upper surface of the resinous main body layer.