JPS6260266B2 - - Google Patents
Info
- Publication number
- JPS6260266B2 JPS6260266B2 JP13556179A JP13556179A JPS6260266B2 JP S6260266 B2 JPS6260266 B2 JP S6260266B2 JP 13556179 A JP13556179 A JP 13556179A JP 13556179 A JP13556179 A JP 13556179A JP S6260266 B2 JPS6260266 B2 JP S6260266B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- varnish
- resin
- laminate
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 35
- 229920000647 polyepoxide Polymers 0.000 claims description 35
- 239000002966 varnish Substances 0.000 claims description 17
- 230000001588 bifunctional effect Effects 0.000 claims description 14
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 13
- 229920001568 phenolic resin Polymers 0.000 claims description 11
- 239000005011 phenolic resin Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 6
- 238000010292 electrical insulation Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
この発明は積層板の製法に関するものである。
フエノール樹脂積層板の曲げ強度の向上は、こ
れまでフエノール樹脂ワニスに２官能性エポキシ
樹脂を添加して変性することにより行われてい
た。しかしながらこのようにする場合には、曲げ
強度は向上するが電気絶縁抵抗が悪くなるという
問題があつた。
この発明者は、このような問題を解決するため
に一連の研究を重ねた結果、フエノール樹脂ワニ
スに、２官能性エポキシ樹脂と多官能性エポキシ
樹脂とを所定の割合で所定量含有させて変性する
ことが極めて有効であることを見いだしここにこ
の発明を完成した。
すなわち、この発明は、フエノール樹脂ワニス
に、２官能性エポキシ樹脂および多官能性エポキ
シ樹脂を含有させてなる含浸用変性フエノール樹
脂ワニスを用いて積層板を製造する方法であつ
て、２官能性エポキシ樹脂と多官能性エポキシ樹
脂の合計含有量がフエノール樹脂ワニスの固形分
100重量部に対して50〜110重量部に選ばれ、かつ
２官能性エポキシ樹脂と多官能性エポキシ樹脂と
の相互の含有割合が重量比で、（２官能性エポキ
シ樹脂）／（多官能性エポキシ樹脂）＝９／１〜
６／４に選ばれていることをその要旨とするもの
である。
このようにすることにより、電気絶縁抵抗を悪
化させることなく積層板の曲げ強度を向上させる
ことができるものである。
２官能性エポキシ樹脂と多官能性エポキシ樹脂
（３官能性以上のもの）の合計含有量が、フエノ
ール樹脂ワニスの固形分100重量部（以下「部」
と略す）に対して50部未満になると、得られる積
層板の曲げ強度は殆ど向上しない。逆に110部を
越えると、積層板の絶縁抵抗が低下して絶縁性が
極めて悪くなる。したがつて、２官能性エポキシ
樹脂と多官能性エポキシ樹脂の合計含有量は、フ
エノール樹脂の固形分100部に対して50〜110部の
範囲内に選ぶことが必要である。
また、２官能性エポキシ樹脂と多官能性エポキ
シ樹脂の相互の含有割合は、重量比で、（２官能
性エポキシ樹脂）／（多官能性エポキシ樹脂）＝
９／１よりも多官能性エポキシ樹脂の含有割合が
少なくなると、得られる積層板の絶縁抵抗が低下
する。逆に、（２官能性エポキシ樹脂）／（多官
能性エポキシ）＝６／４よりも多官能性エポキシ
樹脂の含有割合が多くなるとワニスの硬化が不均
一となり積層ができなくなる。したがつて、２官
能性エポキシ樹脂と多官能性エポキシ樹脂の相互
の含有割合は、重量比で、（２官能性エポキシ樹
脂）／（多官能性エポキシ樹脂）＝９／１〜６／
４の範囲内になるように選ぶことが必要である。
なお、この発明で用いるフエノール樹脂ワニス
とは、フエノール類とアルデヒド類をアミン等の
アルカリ触媒下で合成したレゾール型フエノール
樹脂ワニスのことである。また、ワニスの基材
（紙、布、不織布等が用いられる）に対する含浸
およびワニスが含浸された基材の積層成形は通常
の方法によつて行われる。
この発明は、以上のようにして積層板を製造す
るようにするため、電気絶縁性を損なうことなく
曲げ強度の優れた積層板を製造することができる
のである。
つぎに、実施例について比較例と併せて説明す
る。
実施例１〜２、比較例１〜４
フエノール（Ｐ）とホルムアルデヒド(F)を、
(F)／（Ｐ）モル比が1.2になるように配合し、
NH3触媒によりフエノール樹脂ワニスを製造し
た。また、２官能性エポキシ樹脂として、シエル
化学社から販売されているエピコート827を準備
するとともに、多官能性エポキシ樹脂として大日
本インキ社から販売されているエピクロンEp−
430を準備した。また、硬化剤として、四国フア
インケミカル社から販売されているイミダゾール
系の2PZを準備しした。これらの原料を第１表に
示すように配合してワニスをつくつた。
This invention relates to a method for manufacturing a laminate. Up to now, the bending strength of phenolic resin laminates has been improved by adding a bifunctional epoxy resin to phenolic resin varnish to modify it. However, in this case, although the bending strength is improved, there is a problem in that the electrical insulation resistance is deteriorated. As a result of a series of studies to solve these problems, this inventor modified a phenolic resin varnish by adding a predetermined amount of a bifunctional epoxy resin and a polyfunctional epoxy resin in a predetermined ratio. They found that it is extremely effective to do this and have now completed this invention. That is, the present invention provides a method for manufacturing a laminate using a modified phenolic resin varnish for impregnation, which is made by adding a difunctional epoxy resin and a polyfunctional epoxy resin to the phenolic resin varnish, the method comprising: The total content of resin and polyfunctional epoxy resin is the solid content of phenolic resin varnish.
50 to 110 parts by weight per 100 parts by weight, and the mutual content ratio of bifunctional epoxy resin and polyfunctional epoxy resin is (bifunctional epoxy resin)/(polyfunctional epoxy resin). epoxy resin) = 9/1~
The gist of this is that it was selected as 6/4. By doing so, the bending strength of the laminate can be improved without deteriorating the electrical insulation resistance. The total content of bifunctional epoxy resin and polyfunctional epoxy resin (trifunctional or higher) is 100 parts by weight (hereinafter referred to as "parts") of the solid content of the phenolic resin varnish.
If the amount is less than 50 parts, the bending strength of the resulting laminate will hardly improve. On the other hand, if it exceeds 110 parts, the insulation resistance of the laminate decreases and the insulation becomes extremely poor. Therefore, the total content of the bifunctional epoxy resin and the polyfunctional epoxy resin must be selected within the range of 50 to 110 parts based on 100 parts of the solid content of the phenolic resin. Moreover, the mutual content ratio of bifunctional epoxy resin and polyfunctional epoxy resin is (bifunctional epoxy resin)/(polyfunctional epoxy resin)=
When the content of the polyfunctional epoxy resin is lower than 9/1, the insulation resistance of the resulting laminate decreases. On the other hand, if the content of the polyfunctional epoxy resin is higher than (bifunctional epoxy resin)/(polyfunctional epoxy) = 6/4, the varnish will not be cured uniformly and lamination will not be possible. Therefore, the mutual content ratio of the bifunctional epoxy resin and the polyfunctional epoxy resin is (bifunctional epoxy resin)/(polyfunctional epoxy resin)=9/1 to 6/
It is necessary to select a value within the range of 4. The phenolic resin varnish used in this invention is a resol type phenolic resin varnish prepared by synthesizing phenols and aldehydes under an alkali catalyst such as an amine. Further, impregnation of a base material (paper, cloth, nonwoven fabric, etc. is used) with varnish and lamination molding of the base material impregnated with varnish are performed by a conventional method. Since the present invention manufactures a laminate in the manner described above, it is possible to manufacture a laminate with excellent bending strength without impairing electrical insulation. Next, examples will be described together with comparative examples. Examples 1-2, Comparative Examples 1-4 Phenol (P) and formaldehyde (F),
Blend so that the (F)/(P) molar ratio is 1.2,
A phenolic resin varnish was produced by NH3 catalyst. In addition, we prepared Epicort 827, which is sold by Ciel Kagaku Co., as a bifunctional epoxy resin, and Epiclon Ep-, which is sold by Dainippon Ink Co., as a multifunctional epoxy resin.
430 was prepared. In addition, as a curing agent, imidazole-based 2PZ sold by Shikoku Fine Chemical Co., Ltd. was prepared. Varnishes were prepared by blending these raw materials as shown in Table 1.
【表】
つぎに、このワニスを厚み254μ（10ミルス）
のクラフト紙に含浸して樹脂含有率が50％になる
ように乾燥しプリプレグをつくつた。つぎに、こ
れを積層成形して厚み1.6mmの積層板を得た。
このようにして得られた積層板の絶縁抵抗およ
び曲げ強度を第２表に示す。実施例の積層板は、
曲げ強度が大であり、しかも絶縁抵抗も大で電気
絶縁性にも優れていることがわかる。[Table] Next, apply this varnish to a thickness of 254μ (10 mils).
A prepreg was made by impregnating the resin into kraft paper and drying it to a resin content of 50%. Next, this was laminated and molded to obtain a laminate with a thickness of 1.6 mm. Table 2 shows the insulation resistance and bending strength of the laminate thus obtained. The laminate of the example is
It can be seen that it has high bending strength, high insulation resistance, and excellent electrical insulation.
【表】
表中で、絶縁抵抗はJISにもとづく試験方法に
より測定したもので2hr煮沸後の値であり、また
曲げ強度は、リングクラツシヤーにより測定した
値である。[Table] In the table, the insulation resistance is the value measured by a test method based on JIS and is the value after 2 hours of boiling, and the bending strength is the value measured by a ring crusher.
Claims (1)
樹脂および多官能性エポキシ樹脂を含有させてな
る含浸用変性フエノール樹脂ワニスを用いて積層
板を製造する方法であつて、２官能性エポキシ樹
脂と多官能性エポキシ樹脂の合計含有量がフエノ
ール樹脂ワニスの固形分100重量部に対して50〜
110重量部に選ばれ、かつ２官能性エポキシ樹脂
と多官能性エポキシ樹脂との相互の含有割合が重
量比で、（２官能性エポキシ樹脂）／（多官能性
エポキシ樹脂）＝９／１〜６／４に選ばれている
ことを特徴とする積層板の製法。1. A method for producing a laminate using a modified phenolic resin varnish for impregnation, which is obtained by adding a difunctional epoxy resin and a polyfunctional epoxy resin to a phenolic resin varnish, the method comprising: The total content of epoxy resin is 50 to 100 parts by weight of solid content of phenolic resin varnish.
110 parts by weight, and the mutual content ratio of bifunctional epoxy resin and polyfunctional epoxy resin is (bifunctional epoxy resin)/(multifunctional epoxy resin) = 9/1 to A manufacturing method for laminated boards characterized by being selected as 6/4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13556179A JPS5658863A (en) | 1979-10-20 | 1979-10-20 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13556179A JPS5658863A (en) | 1979-10-20 | 1979-10-20 | Manufacture of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5658863A JPS5658863A (en) | 1981-05-22 |
| JPS6260266B2 true JPS6260266B2 (en) | 1987-12-15 |
Family
ID=15154681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13556179A Granted JPS5658863A (en) | 1979-10-20 | 1979-10-20 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5658863A (en) |
-
1979
- 1979-10-20 JP JP13556179A patent/JPS5658863A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5658863A (en) | 1981-05-22 |
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