Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6262022B2 - - Google Patents
[go: Go Back, main page]

JPS6262022B2 - - Google Patents

Info

Publication number
JPS6262022B2
JPS6262022B2 JP55006602A JP660280A JPS6262022B2 JP S6262022 B2 JPS6262022 B2 JP S6262022B2 JP 55006602 A JP55006602 A JP 55006602A JP 660280 A JP660280 A JP 660280A JP S6262022 B2 JPS6262022 B2 JP S6262022B2
Authority
JP
Japan
Prior art keywords
semiconductor
light
substrate
photoconductive element
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55006602A
Other languages
Japanese (ja)
Other versions
JPS56103480A (en
Inventor
Yosha Fukunaga
Shinji Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP660280A priority Critical patent/JPS56103480A/en
Publication of JPS56103480A publication Critical patent/JPS56103480A/en
Publication of JPS6262022B2 publication Critical patent/JPS6262022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/36Photoelectric screens; Charge-storage screens
    • H01J29/39Charge-storage screens
    • H01J29/45Charge-storage screens exhibiting internal electric effects caused by electromagnetic radiation, e.g. photoconductive screen, photodielectric screen, photovoltaic screen

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は、空間的に分光感度が異なるヘテロ接
合光導電素子に関する。 単管カラーカメラ、単板カラーカメラにおいて
は、1つの素子から、赤(R)、緑(G)、青(B)の光
の信号を電気的信号に変換してとり出す方式が採
用されている。この様な方式においては光導電素
子の前面に有機フイルター又は、無機フイルター
を置き、空間的に分光透過率を変化させて色選別
を行つているが、このフイルターは、光の損失が
多く、かつ、高価であるという問題がある。 本発明は、上述のフイルターを用いず、ヘテロ
接合素子の光導電分光感度の違いを利用して、直
接的に色選別を行なうことができる光導電素子を
提供するものである。 第1図に本発明の原理を説明するためのヘテロ
接合光導電素子の構造を示す。図において1,2
はそれぞれR1、R2の抵抗及びEg1、Eg2の禁止帯
幅を有する半導体層であり、 R1≪R2、Eg1>Eg2 なる関係を有するように、それぞれの材料、寸法
形状が選定されている。4は半導体層1上に形成
された透明電極、5は半導体層2上に形成された
電極である。この素子に、光3を透明電極4を通
して禁止帯幅大なる半導体層1側から入射する場
合を考える。このとき素子に電圧を印加すると電
圧は、ほぼ半導体層1よりも抵抗大なる半導体層
2に加わり、半導体層2が感度層となり光電流の
分光感度は第2図のようになる。分光感度の短波
長限界は、入射側の半導体層1の禁止帯幅Eg1
相当する波長λで決まる。長波長限界は、厚さ
が十分厚く、不純物による光導電が少ないとき
は、感度層である半導体層2の禁止帯幅Eg2に相
当する波長λで決まる。 これは次のように説明できる。波長λより短
波長の光は半導体層1により吸収され、電子正孔
対が発生するが半導体層1には電界がほとんどか
かつていないため、電子正孔の再結合が起こり光
電流には寄与しない。半導体層1に吸収されない
で透過したλより長波長の光のうちλより短
波長の光は半導体層2により吸収され電子正孔対
が発生し、半導体層2には電界が印加されている
ので半導体層2から光電流として検出される。 この性質を利用して、ヘテロ接合を構成する材
料として任意の禁止帯幅Eg1、Eg2を有するもの
を選択すれば、分光感度を任意に制御できる。し
たがつて、ある特定の材料のヘテロ接合素子を複
数個、又はそれぞれ異なつた材料により構成され
た複数個を、帯状又は島状に空間的に配置するこ
とにより、場所的に分光感度の異なる光導電素子
を得ることができる。 本発明の光導電素子は、可視光のうち青色光を
吸収し絶縁光及び赤色光を透過する第1の半導
体、青色光及び緑色光を吸収し赤色光を透過する
第2の半導体、可視光全域を吸収する第3の半導
体を少なくとも構成要素として含む光導電体が基
板上に形成され、前記第1、第2、第3の半導体
で順に抵抗が大であり、かつ前記第2の半導体は
前記基板上全面に形成され、前記基板上に第1の
半導体及び第3の半導体は島状又は帯状に形成さ
れ、前記第1、第2、第3の半導体の一部は互に
接触して積層され、前記第1の半導体の前記第2
または第3の半導体と接しない面側より前記可視
光を入射させるものである。 光導電素子をカラーカメラ等に用いる場合に
は、半導体材料を選定するに際して分光感度が可
視域にあるような禁止帯幅Egを有するものを選
択すればよい。例えば、カラーカメラに要求され
るNTSC方式の理想的な撮像特性の相対感度は、
第3図に示すようなものと規定されている。第3
図において負の撮像特性を持たせることは実際に
不可能であることから、負の部分を省略したり、
多少変形させる等の方策が通常用いられている。
したがつて、本発明の光導電素子として、第3図
に示す分光感度の3原色RGB分解特性を持たせ
るためには、分光温度の短波長限を決める半導体
層として700nmより短波長に禁止帯幅を持つも
のとし、長波長限界を決める半導体としては
400nmより長波長に禁止帯幅を持つものを用い
ればよい。このような可視光領域に分光度を持つ
材料としては−族化合物やGaP等の−族
化合物等がある。 実施例 1 第4図は本実施例に係る光導電素子の平面図で
あり、第5図はその断面図を示す。本実施例の光
導電素子は以下に示すような工程で製造される。
透明電極9を有するガラス基板8上にバツフア層
としてZnS10を0.05μm全面に形成する。その上
に第4図、第5図に示すように第1の半導体とし
てのCdS6を幅50μm、ピツチ50μmの帯状で、
厚さ0.05μmを形成する。さらにこの上に交叉さ
せる形で第3の半導体としてのCdSe7を幅50μ
m、ピツチ50μmの帯状で、厚さ1.0μmを形成
する。最後に第2の半導体としてのZnTe11を
厚さ1.0μm全面に形成する。この光導電体を撮
像管ターゲツトとして用い基板8側より光を入射
させ電子ビームで走査して半導体からの信号を処
理すると色分解された信号が得られる。 なお、抵抗はCdS6、CdSe7、ZnTe11の順
に大で、ZnS10は最も小さいとともに上の3層
の結晶性を高めるためのバツフア層で必ずしも必
要なものではない。第11図は上記各半導体層の
分光感度特性を示す。 このようにして形成された素子は、第4図、第
5図に示す4種類の積層領域A、B、C、Dに分
けられる。この4つの領域の分光感度は第5図の
ヘテロ接合、第11図の特性、抵抗の関係により
下表に示すようになる。なお、Gは緑、Rは赤、
Bは青を示す。第6図はこれを示した図である。
The present invention relates to a heterojunction photoconductive element having spatially different spectral sensitivities. Single-tube color cameras and single-chip color cameras use a method that converts red (R), green (G), and blue (B) light signals into electrical signals and extracts them from a single element. There is. In this type of system, an organic or inorganic filter is placed in front of the photoconductive element and color selection is performed by spatially changing the spectral transmittance, but this filter has a high loss of light and , there is a problem that it is expensive. The present invention provides a photoconductive element that can directly perform color selection by utilizing the difference in photoconductive spectral sensitivity of heterojunction elements without using the above-mentioned filter. FIG. 1 shows the structure of a heterojunction photoconductive element for explaining the principle of the present invention. 1, 2 in the figure
are semiconductor layers having resistances of R 1 and R 2 and bandgap widths of Eg 1 and Eg 2, respectively, and the respective materials and dimensions and shapes are such that they have the relationships R 1 ≪ R 2 and Eg 1 > Eg 2 . has been selected. 4 is a transparent electrode formed on the semiconductor layer 1, and 5 is an electrode formed on the semiconductor layer 2. Consider the case where light 3 is incident on this element through the transparent electrode 4 from the side of the semiconductor layer 1 where the forbidden band width is large. At this time, when a voltage is applied to the element, the voltage is applied to the semiconductor layer 2, which has substantially a higher resistance than the semiconductor layer 1, and the semiconductor layer 2 becomes a sensitive layer, and the spectral sensitivity of the photocurrent becomes as shown in FIG. The short wavelength limit of the spectral sensitivity is determined by the wavelength λ 1 corresponding to the bandgap Eg 1 of the semiconductor layer 1 on the incident side. When the thickness is sufficiently thick and there is little photoconductivity due to impurities, the long wavelength limit is determined by the wavelength λ 2 corresponding to the forbidden band width Eg 2 of the semiconductor layer 2, which is a sensitive layer. This can be explained as follows. Light with a wavelength shorter than wavelength λ1 is absorbed by the semiconductor layer 1, generating electron-hole pairs, but since there is little or no electric field in the semiconductor layer 1, electron-hole recombination occurs and contributes to the photocurrent. do not. Of the light with a wavelength longer than λ1 that is transmitted without being absorbed by the semiconductor layer 1 , the light with a wavelength shorter than λ2 is absorbed by the semiconductor layer 2, generating electron-hole pairs, and an electric field is applied to the semiconductor layer 2. Therefore, it is detected as a photocurrent from the semiconductor layer 2. Utilizing this property, if a material having arbitrary forbidden band widths Eg 1 and Eg 2 is selected as the material constituting the heterojunction, the spectral sensitivity can be controlled arbitrarily. Therefore, by spatially arranging a plurality of heterojunction elements made of a certain material, or a plurality of heterojunction elements each made of different materials, in a strip or island shape, light having different spectral sensitivities can be produced. A conductive element can be obtained. The photoconductive element of the present invention includes a first semiconductor that absorbs blue light among visible light and transmits insulating light and red light, a second semiconductor that absorbs blue light and green light and transmits red light, and a second semiconductor that absorbs blue light and green light and transmits red light. A photoconductor is formed on a substrate, and includes at least as a component a third semiconductor that absorbs the entire area, and the first, second, and third semiconductors have higher resistances in that order, and the second semiconductor has a higher resistance than the other. A first semiconductor and a third semiconductor are formed on the entire surface of the substrate, and a first semiconductor and a third semiconductor are formed in an island shape or a band shape, and a portion of the first, second, and third semiconductors are in contact with each other. stacked, the second semiconductor of the first semiconductor
Alternatively, the visible light is allowed to enter from the surface side not in contact with the third semiconductor. When a photoconductive element is used in a color camera or the like, a semiconductor material having a forbidden band width Eg such that the spectral sensitivity is in the visible range may be selected. For example, the relative sensitivity of the ideal imaging characteristics of the NTSC system required for a color camera is:
It is specified as shown in Figure 3. Third
Since it is actually impossible to have negative imaging characteristics in the figure, the negative part may be omitted,
Measures such as slightly deforming are usually used.
Therefore, in order for the photoconductive element of the present invention to have the three primary color RGB decomposition characteristics of the spectral sensitivity shown in FIG. As a semiconductor that has a width and determines the long wavelength limit,
A material having a forbidden band width at a wavelength longer than 400 nm may be used. Examples of such materials having a spectral intensity in the visible light region include - group compounds and - group compounds such as GaP. Example 1 FIG. 4 is a plan view of a photoconductive element according to this example, and FIG. 5 is a sectional view thereof. The photoconductive element of this example is manufactured by the steps shown below.
ZnS 10 is formed as a buffer layer over the entire surface of the glass substrate 8 having a transparent electrode 9 to a thickness of 0.05 μm. On top of that, as shown in Figures 4 and 5, CdS6 as the first semiconductor is placed in a strip shape with a width of 50 μm and a pitch of 50 μm.
Form a thickness of 0.05 μm. Furthermore, CdSe7 as a third semiconductor is placed on top of this in a crosswise manner with a width of 50 μm.
Form a strip with a pitch of 50 μm and a thickness of 1.0 μm. Finally, ZnTe 11 as a second semiconductor is formed to a thickness of 1.0 μm over the entire surface. Using this photoconductor as an image pickup tube target, light is incident from the substrate 8 side, scanned with an electron beam, and the signals from the semiconductor are processed to obtain color-separated signals. Note that the resistance is highest in the order of CdS6, CdSe7, and ZnTe11, and ZnS10 is the smallest and is not necessarily a buffer layer for improving the crystallinity of the upper three layers. FIG. 11 shows the spectral sensitivity characteristics of each of the above semiconductor layers. The device thus formed is divided into four types of lamination regions A, B, C, and D shown in FIGS. 4 and 5. The spectral sensitivities of these four regions are shown in the table below based on the relationship between the heterojunction shown in FIG. 5 and the characteristics and resistance shown in FIG. 11. In addition, G is green, R is red,
B indicates blue. FIG. 6 is a diagram showing this.

【表】 このように、各半導体層の組合せによる異なる
接合を形成し、場所的に分光感度の異なる光導電
素子を形成することができ、得られた光電流を処
理すればR、G、Bに対応した信号を得ることが
できる。 実施例 2 第7図に示す3種類の異なる分光感度をもつ領
域をもつ光導電素子で、その領域の分光感度を第
8図とする構成は次のようにしてできる。まず、
基板上に蒸着されたAu電極17の上に第9図イ
のように島状に、CdSeとほぼ同様の分光感度特
性を有する第3の半導体としてCd0.3Zn0.7Te12
を厚さ1μmで形成する。その上にZnTeとほぼ
同様の分光感度特性を有する第2の半導体として
のCdS0.5、Se0.513を1μmの厚さで全面に形
成する(第9図ロ)。さらに第9図ハに示すよう
に帯状に第1の半導体としてのCdS14を0.1μ
m形成する。 最後に電極形成のためのバツフア層としての
ZnS0.4Se0.615を全面に0.05μm形成し(第9図
ニ)、電極として半透明電極Au16a,16b,
16c……を第9図ホのように島状に蒸着形成す
る。 この例においても、抵抗は第1、第2、第3の
順で大きく、バツフア層15が最も小さいととも
にこの層15も必ずしも必要でない。第10図に
第9図ホのでき上つた光導電素子のB−B′線での
断面図を第7図のE,F,Gと対応させて示す。
この各半透明電極16上に微小なワイヤーボンデ
イング等で走査素子に接続し、電極17と16,
16a,16b,16c間に順次電圧を印加する
と、第8図の色信号が得られる。 以上のように、本発明によれば、場所的にヘテ
ロ接合の材料の組みあわせを変えることが可能で
ある。したがつて場所的に分光感度の異なる領域
をもつ光導電素子を形成できる。この素子を用い
ることにより、フイルターを用いることなしに、
色選別が可能となる。 R、G、B3色のフイルターを形成した後、可
視光全域に感度をもつ光導電体を積層する方法に
比較して、半導体の2回(電極も入れると3回)
と少ない工程で作成できる。干渉フイルターのよ
うに多層膜半導体層を3層で構成できるというす
ぐれた特長を発揮することが可能となる。
[Table] In this way, by forming different junctions by combining semiconductor layers, it is possible to form photoconductive elements with locally different spectral sensitivities, and by processing the resulting photocurrent, R, G, It is possible to obtain a signal corresponding to Embodiment 2 A photoconductive element having regions having three different spectral sensitivities shown in FIG. 7 can be configured to have the spectral sensitivities of those regions as shown in FIG. 8 as follows. first,
Cd 0 . 3 Zn 0 . 7 Te 12 is deposited on the Au electrode 17 deposited on the substrate in an island shape as shown in FIG.
is formed with a thickness of 1 μm. CdS 0.5 and Se 0.5 13 as a second semiconductor having almost the same spectral sensitivity characteristics as ZnTe are formed thereon to a thickness of 1 μm (FIG. 9B). Furthermore, as shown in FIG.
m form. Finally, as a buffer layer for electrode formation.
ZnS 0 . 4 Se 0 .
16c... is formed by vapor deposition into an island shape as shown in FIG. 9(e). In this example as well, the resistance increases in the order of the first, second, and third layers, and the buffer layer 15 is the smallest, and this layer 15 is not necessarily required. FIG. 10 shows a cross-sectional view taken along the line B-B' of the photoconductive element produced in FIG. 9E, corresponding to E, F, and G in FIG. 7.
The electrodes 17 and 16 are connected to the scanning element using minute wire bonding or the like on each semitransparent electrode 16.
When voltages are sequentially applied between 16a, 16b, and 16c, the color signal shown in FIG. 8 is obtained. As described above, according to the present invention, it is possible to change the combination of materials of the heterojunction depending on the location. Therefore, it is possible to form a photoconductive element having regions with locally different spectral sensitivities. By using this element, without using a filter,
Color sorting becomes possible. Compared to the method of forming R, G, and B three-color filters and then layering a photoconductor that is sensitive to the entire visible light range, it takes two times (three times if electrodes are included) for semiconductors.
It can be created with few steps. It becomes possible to exhibit the excellent feature that the multilayer film semiconductor layer can be composed of three layers like an interference filter.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の原理を説明するためのヘテロ
接合光導電素子の一例の構成断面図、第2図はヘ
テロ接合光導電素子の一例の分光特性図、第3図
はNTSC方式カラーカメラの理想的な撮像特性を
示す図、第4図は本発明の一実施例である2つの
材料を交叉形に形成した光電変換素子の平面図、
第5図は第4図のA−A′断面図、第6図は第
4,5図に対応する領域の分光感度を示す図、第
7図は実施例2の空間的な感度分布を示す図、第
8図は同実施例2に対応する分光感度図、第9図
イ〜ホは同実施例2の光電変換素子の作成順序を
示す平面図、第10図は第9図ホのB−B′線断面
図、第11図は各半導体の分光特性図である。 6……CdS、7……CdSe、8……ガラス基
板、9……透明電極、11……ZnTe。
Fig. 1 is a cross-sectional view of the configuration of an example of a heterojunction photoconductive element for explaining the principle of the present invention, Fig. 2 is a spectral characteristic diagram of an example of a heterojunction photoconductive element, and Fig. 3 is a diagram of an NTSC color camera. A diagram showing ideal imaging characteristics, FIG. 4 is a plan view of a photoelectric conversion element in which two materials are formed in a cross shape, which is an embodiment of the present invention.
Figure 5 is a sectional view taken along line A-A' in Figure 4, Figure 6 is a diagram showing the spectral sensitivity of the area corresponding to Figures 4 and 5, and Figure 7 is a diagram showing the spatial sensitivity distribution of Example 2. 8 are spectral sensitivity diagrams corresponding to Example 2, FIG. 9 A to E are plan views showing the order of fabrication of the photoelectric conversion element of Example 2, and FIG. 10 is B of FIG. 9 E. -B' line cross-sectional view and FIG. 11 are spectral characteristic diagrams of each semiconductor. 6...CdS, 7...CdSe, 8...Glass substrate, 9...Transparent electrode, 11...ZnTe.

Claims (1)

【特許請求の範囲】[Claims] 1 可視光のうち青色光を吸収し緑色光及び赤色
光を透過する第1の半導体、青色光及び緑色光を
吸収し赤色光を透過する第2の半導体、可視光全
域を吸収する第3の半導体を少なくとも構成要素
として含む光導電体が基板上に形成され、前記第
1、第2、第3の半導体で順に抵抗が大であり、
かつ前記第2の半導体は前記基板上全面に形成さ
れ、前記基板上に第1の半導体及び第3の半導体
は島状又は帯状に形成され、前記第1、第2、第
3の半導体の一部は互に接触して積層され、前記
第1の半導体の前記第2または第3の半導体と接
しない面側より前記可視光を入射させることを特
徴とする光導電素子。
1 A first semiconductor that absorbs blue light among visible light and transmits green and red light, a second semiconductor that absorbs blue and green light and transmits red light, and a third semiconductor that absorbs the entire range of visible light. A photoconductor including a semiconductor at least as a component is formed on a substrate, and the first, second, and third semiconductors have a larger resistance in that order,
The second semiconductor is formed on the entire surface of the substrate, the first semiconductor and the third semiconductor are formed in an island shape or a band shape on the substrate, and one of the first, second, and third semiconductors is formed on the substrate. The photoconductive element is characterized in that the parts are stacked in contact with each other, and the visible light is incident from a side of the first semiconductor that is not in contact with the second or third semiconductor.
JP660280A 1980-01-22 1980-01-22 Photoconductive element Granted JPS56103480A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP660280A JPS56103480A (en) 1980-01-22 1980-01-22 Photoconductive element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP660280A JPS56103480A (en) 1980-01-22 1980-01-22 Photoconductive element

Publications (2)

Publication Number Publication Date
JPS56103480A JPS56103480A (en) 1981-08-18
JPS6262022B2 true JPS6262022B2 (en) 1987-12-24

Family

ID=11642878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP660280A Granted JPS56103480A (en) 1980-01-22 1980-01-22 Photoconductive element

Country Status (1)

Country Link
JP (1) JPS56103480A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018956A (en) * 1983-07-12 1985-01-31 Seiko Epson Corp Color solid-state image pickup element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5125925A (en) * 1974-08-28 1976-03-03 Hitachi Ltd Karaasatsuzokan no menban
JPS5937592B2 (en) * 1975-09-04 1984-09-11 松下電器産業株式会社 photoconductive element

Also Published As

Publication number Publication date
JPS56103480A (en) 1981-08-18

Similar Documents

Publication Publication Date Title
US9423301B2 (en) Method for making wavelength-selective, integrated resonance detector for electromagnetic radiation
US5552603A (en) Bias and readout for multicolor quantum well detectors
US4438455A (en) Solid-state color imager with three layer four story structure
EP2239777A2 (en) Imaging device
US20150311242A1 (en) Image sensor with dual layer photodiode structure
US4404586A (en) Solid-state color imager with stripe or mosaic filters
JPH0566746B2 (en)
US4514755A (en) Solid-state color imager with two layer three story structure
EP3174276A1 (en) Image sensor and electronic device including the same
JPS6329415B2 (en)
US5138416A (en) Multi-color photosensitive element with heterojunctions
JP2004047682A (en) Solid-state imaging device
US3717724A (en) Solid state multi-color sensor
US5237185A (en) Image pickup apparatus with different gate thicknesses
JPH0676926B2 (en) Color filter device
JPS6262022B2 (en)
US4443813A (en) Solid-state color imager with two layer three story structure
JP3033242B2 (en) Solid-state imaging device
JPH0433147B2 (en)
JPH01205465A (en) Manufacture of solid-state image sensing device
KR102105054B1 (en) Organic photodiodes with wavelength selective electrodes
JPS6348234B2 (en)
JPS59229863A (en) Color sensor manufacturing method
Takada et al. CMOS color image sensor with overlaid organic photoconductive layers having narrow absorption band
JPH054877B2 (en)