JPS6262461B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device manufacturing apparatus, and particularly to a semiconductor device group (workpiece) that is a semi-finished product in which pellet bonding, wire bonding, and resin sealing are sequentially performed on a lead frame (connecting body). group), marking is applied, and each workpiece is cut and separated while being molded from the lead frame.
The present invention further relates to a semiconductor device manufacturing apparatus that selects the characteristics of a workpiece.

Resin molded packages are often used as a type of package for semiconductor devices because they can be mass-produced and are inexpensive.When assembling this type of semiconductor device, for example, multiple unit lead patterns are connected in series as shown in Figure 1. This is carried out using a lead frame 1 consisting of seven metal plates connected in series.

To assemble a semiconductor device using such a lead frame 1, first, the pellet 3 is fixed on the tab 4 (pellet bonding), wire bonding is performed with the wire 9, and then the pair of sub-frames 2 and the dam are bonded. A mold region 10 surrounded by 7 is molded with resin to form a mold part 11.

Next, the lead 6 is cut at the base of the main frame 1, and the dam 7 is cut and removed. Thereafter, the tab leads 5 are cut and the leads 6 are bent in the same direction to manufacture a dual in-line type semiconductor device as shown in FIG.

Incidentally, conventionally, the work steps after resin molding have been performed in the order shown in FIG. In other words, after resin molding, cutting is performed to separate each semiconductor device from the lead frame, the marking surface on the surface of the mold is cleaned by cleaning with an organic solvent such as trichlorethylene, a mark is printed on this marking surface, and ink is applied. After drying the (thermosetting ink), the electrical characteristics of each semiconductor device are inspected, and the semiconductor devices are sorted by grade, including defects. Each of these operations is performed using independent equipment.

However, such conventional working devices have the following drawbacks.

(1) Since each work is carried out using individual equipment, transporting workpieces between each equipment is troublesome, and the installation of a series of equipment requires a large area, so taking into account the work space, It occupies a large area.

(2) Since the workpiece is transported between each device by hand, dirt tends to adhere to the marking surface, making the mark unclear. In particular, in the conventional process, the leads are cut and formed before marking.
A large amount of metal scraps and resin scraps are generated during this cutting and forming process, and even if cleaning is performed afterwards, these pieces cannot be removed well, resulting in frequent marking defects and low yields.

(3) Since each work is performed using individual equipment, work efficiency is poor and it takes a long time to complete the work. In particular, since the ink used for marking is a thermosetting ink, it takes several hours to dry. Furthermore, in conventional work processes, cleaning work and mark drying work are performed by batch processing, so the process is mixed with single item processing, making it impossible to continuousize and automate the entire work. It is.

(4) Each work is carried out using individual equipment, and workpieces are transferred between each equipment manually, so many workers touch each other and the labor costs are high.

Therefore, an object of the present invention is to solve the conventional problems by providing an apparatus that allows continuous work such as marking, lead cutting, molding, and characteristic selection for workpieces that have been resin molded and cleaned. The purpose of this system is to improve yields, shorten process completion, reduce manpower, and reduce costs.

The present invention will be explained below with reference to Examples.

FIG. 6 is a schematic plan view of an embodiment of the semiconductor device manufacturing apparatus of the present invention. This equipment consists of, from left to right, a loading device 12, a wiping device 13, a marking device 14, a UV drying device (a drying device using ultraviolet rays) 15, a cutting and forming device 16, and a storing device 17. An inspection device 18 and a sorting and packaging device 19 are arranged in sequence. Further, each device is connected by a transfer mechanism 20 shown in FIGS. 9a and 9b or an air transfer mechanism 21 shown in FIG. It's starting to move. Furthermore, although not shown, the workpiece transfer space and processing space are covered with a cover or the like to prevent dust from adhering to the workpieces.

Next, each device will be explained using FIGS. 7 to 18. The loading device 12 consists of a table 22 that rotates by 45 degrees and a separation mechanism 23 shown in FIG. The table 22 is provided with accommodating portions 25 consisting of through holes capable of accommodating magazines 24 containing workpieces having the structure shown in FIG. 7 at intervals of 45 degrees. The magazine 24 is provided with insertion holes 26 consisting of a pair of small holes on each end surface thereof, and a U-shaped stopper pin 27 is inserted into these insertion holes 26 as shown in FIG. When storing workpieces in a stacked manner in the magazine 24, a stopper pin 27 is inserted into the insertion hole 26 at the lowest stage of the magazine 24, and then resin-molded lead frames (workpieces) are sequentially stacked on top of the stopper pin 27. When, for example, 100 workpieces are loaded, the stopper pin 27 is inserted into the insertion hole 26 at the uppermost stage to accommodate the workpieces so that they do not fall out of the magazine 24. Note that it is preferable to clean the workpiece in this state. After loading the magazine 24 containing the work into the storage section 25 of the table 22, the upper and lower stopper pins 27 are pulled out. Each housing section 25
Since a shutter 28 is disposed at the bottom of each, the workpiece is placed on this shutter 28. Further, this shutter 28 is U-shaped, and a receiving rod 29, which will be described later, is inserted into this intermediate hollow portion from below.

On the other hand, a weight 31 that is pulled up by a motor 30 is disposed on the table 22 at the delivery station that sends out the workpiece, and this weight 31 is attached to the magazine 2 located at the delivery station.
It rests on the workpiece 32 in 4 and presses the workpiece 32 downward. This weight 31
is pulled upward by the motor 30 before the table 22 rotates, and is lifted out of the empty magazine.

On the other hand, a separation mechanism 23 is provided below the table 22 of the delivery station. Separation mechanism 2
3 is a separation guide 33, a pusher 34, and a receiving rod 29
The separation guide 33 is made up of two parallel plates. The upper plate 35 is provided with a guide hole 36 through which one workpiece (lead frame) can pass, and the lower plate 37 is provided with a guide hole 36 through which one workpiece (lead frame) can pass.
A passage hole 38 is provided through which 9 can pass. Moreover, one workpiece 3 is located between the upper plate 35 and the lower plate 37.
The distance is such that only 2 can be moved. The pusher 34 is configured to pass through a guide hole 36 and move a workpiece 32 placed on a lower plate 37 in parallel to the back between an upper plate 35 and a lower plate 37.

Further, the workpiece 32 sent to the back of the separation guide 33 is sent to the first wiping device 13 by the transfer mechanism 20 shown in FIGS. 9a and 9b. Work 32 is shown in figure b.
As shown, the lead frame frame 39 moves while being supported by guides (conveyance paths) 40 on both sides. The workpiece 32 is moved one pitch at a time by being hooked by a feed claw 43 rotatably attached to a feed block 41 via a pin 42. The movement is caused by the movement of the feed block 41, which moves along the cam curve of the feed cam 45 via a cam follower 47 which is always in contact with the feed cam 45 fixed to the rotating shaft 44 by means of a spring 46. Further, the feed claw 43 is supported at one end by a spring 48, and when returning, the feed claw 43 returns only by the feed claw while contacting the lower surface of the workpiece, so that the workpiece 32 is not moved backward. Furthermore, a return prevention claw 49 is provided above the workpiece.
This return prevention claw 49 is also rotatable around the pin 50, and when the work 32 moves forward, the spring 51 extends and the work 32 moves forward, but when the work 32 tries to move back, the tip of the return prevention claw 49 is It is placed in contact with the mold part 11 to prevent the workpiece from retreating. Note that the feed block 41 is provided with a large number of feed pawls 43. Further, the workpiece is transferred to the cutting and forming device 16 by a transfer mechanism 20 having this structure.

Here, loading of a work onto the wiping device 13 by the loading device 12 and the first transfer mechanism 20 will be explained. First, table 22
A magazine 24 containing a workpiece 32 is attached to each accommodating portion 25. Then, a weight 31 is placed in the magazine 24 located at the delivery station, and the workpiece 32 is pressed downward by the weight 31. Next, the receiving rod 29 of the separation mechanism 23 is raised, and its upper end is thrust into the shutter 28 to support the lower surface of the workpiece 32 in the lowest layer. After that, shutter 2
8, remove it from the housing part 25, and gradually remove the receiving rod 2.
9 is lowered and the workpiece 32 is placed on the lower plate 37 of the separation guide 33. Next, the lowermost workpiece 32 is pushed by the pusher 34 and slid along the lower plate 37, and the workpiece 32 is sent to the back of the separation guide 33. The workpiece 32 sent into the depths of the separation guide 33 is sent one pitch at a time by the feeding claw 43 of the transfer mechanism 20. In addition, the pusher 34 is connected to the feed claw 4.
3, the workpieces 32 are moved one by one into the depths of the separation guide 33. In this way, the workpiece is sent for each mold part interval (one pitch), and the mold parts reach the wiping device 13 one after another.

As shown in FIG. 10, the wiping device 13 has an endless cloth belt 52 that moves along the moving area of the workpiece 32 (describing an endless track). The cloth belt 52 is guided by a number of guide rollers 53 and passes through a tank 55 containing an organic solvent (for example, trichlorethylene) 54 . Moreover, this cloth belt 52 is attached to the tank 5.
When the organic solvent leaves the cloth belt 52, it also passes between a pair of squeezing rollers 56, and the squeezing rollers 56 cause an appropriate amount of organic solvent to adhere to the cloth belt 52. Further, this cloth belt 52 is guided by a wiping guide 57, and when passing through this wiping guide 57, the workpiece 32 passing directly under the wiping guide 57
The upper surface (marking surface) of the mold part 11 is wiped with the impregnated organic solvent to remove dust and dirt adhering to the marking surface.

A marking device 14 as shown in FIG. 11 is disposed at a station next to the station in which the wiping device 13 is provided. The marking device 14 has a transfer cylinder 58 that transfers marks onto the marking surface of the workpiece 32. This transfer cylinder 58
is fixed to a shaft 60 to which a planetary gear 59 is attached. This planetary gear 59 meshes with the internal gear 61 and performs rotational (planetary) movement. Further, a cylindrical marking cylinder 62 is disposed above the internal gear 61, and the transfer cylinder 58, which has rotated and moved upward, comes into rolling contact with the outer peripheral surface of the marking cylinder 62. Also,
An inking roller 63 is in contact with the outer periphery of the marking cylinder 62 and serves to apply ink to the marking cylinder 62.
Further, an ink applicator roller 64 comes into contact with the outer circumferential surface of the inking roller 63 to cause ink 66 from an ink tank 65 to adhere to the inking roller 63. Also, the ink 6 is applied to the ink application roller 64.
Adjustment of the supply amount of 6 is performed by a doctor 67.

According to such a marking device, marks are sequentially printed on the marking surface of the mold portion 11 of each semiconductor device integrated by the lead frame frame 39. That is, when the transfer cylinder 58 is positioned above and moves from right to left, an original mark that is an inversion of the mark on the marking cylinder 62 is transferred to the outer peripheral transfer surface of the transfer cylinder 58. Then, the transfer cylinder 58 descends and prints a mark on the marking surface of the stopped workpiece 32. Note that the ink used for marking is an ultraviolet curing ink that is cured by ultraviolet (UV) irradiation. This type of ink is cured by ultraviolet irradiation for several seconds to several tens of seconds.

The UV drying device 15 for curing the ink after marking has a long lamp 68 extending along the transfer path of the workpiece 32, as shown in FIG. This lamp 68 emits ultraviolet light. Also,
The lamp 68 is housed in a lamp house 69, and covers the upper and side parts of the lamp 68 and exposes the workpiece 32 below the ultraviolet light emitted from the lamp 68.
It has a reflective mirror 70 that directs the light toward the target. Further, a shutter 71 is provided on the side of the lamp 68. This shutter 71 is the workpiece 32
When the movement of the workpiece 32 stops, it automatically moves below the lamp 68 and acts as a light shielding plate that prevents the ultraviolet rays emitted from the lamp 68 from reaching the workpiece.
This prevents excessive heating of the semiconductor device, thereby preventing deterioration of the characteristics of the semiconductor device due to heat. The workpiece passes under the lamp house in about 20 seconds, and the ink hardens.

FIG. 14 shows a cutting and forming apparatus that cuts and forms leads and separates each semiconductor device from a lead frame frame. The cutting and forming device 16 includes a press section 72 consisting of a pair of upper and lower molds for removing resin, cutting dams, and cutting leads, and a bending section 73 for cutting tab leads and forming leads. The press section 72 is provided with a resin drop mold section 74, a dam cutting mold section 75, and a lead cutting mold section 76, respectively, along the direction in which the workpiece 32 is transferred. The resin dropping mold part 74 is the upper mold 7 of the press part 72.
7 is provided with a pair of thin resin removing punches 78, and the lower die 79 of the press section 72 is provided with a die 80 corresponding to the resin removing punch 78, and the lead 6, the mold section 11 and the dam 7 It is designed to shoot off unnecessary resin that has flowed out and solidified inside the machine. Further, the dam cutting die section 75 has a dam cutting punch 81 on the upper die 77 of the press section 72, and a corresponding die 82 on the lower die 79. Further, in the lead cutting die section 76, an upper die 77 is provided with a lead cutting punch 83, and a lower die 79 is provided with a corresponding die 84. This lead cutting die section 76 is designed to cut only one of the sub-frames 2 of the lead frame, that is, one of the lead frame frames 39 extending in a direction orthogonal to the moving direction of the workpiece 32. Therefore, the press section 72
In one press operation by relatively approaching the upper mold 77 and the lower mold 79, resin dropping work, dam cutting work, and lead cutting work are performed at the same time, and workpiece 3
These processes are sequentially performed on one workpiece by moving one pitch at a time. And press section 72
In the state where the semiconductor device has passed through, the semiconductor device is connected to the lead frame frame 39 only by the tab lead 5.

The bending section 73 consists of an upper stripper 85 located above the work 32, a lower stripper 86 located below the work 32, and a pair of rollers 87 located slightly below the upper stripper 85. The upper and lower strippers 85 and 86 are adapted to sandwich only the base portion of the lead 6 protruding from the mold portion 11 from above and below. During operation, the upper and lower strippers 85 and 86 approach the workpiece 32 and pinch and grip the base of the lead 6, and then rise. At this time, tab lead 5
is torn apart between the mold part 11 and the sub frame 2 of the lead frame frame 39. Note that a groove (V-shaped groove) is provided in advance at this fractured portion so that stress can be concentrated and the blade can be easily cut. Further, as the upper and lower strippers 85 and 86 are subsequently raised, the leads 6 protruding from the mold part 11 are gradually bent downward by the rollers 87, and a dual in-line type semiconductor device (workpiece) 32 is manufactured. Ru. Thereafter, the upper stripper 85 is raised and the lower stripper 86 is lowered and returned to their respective predetermined positions. The workpiece 32 is simply placed on the lower stripper 86. Therefore, the plunger 89 of the cylinder mechanism 88 moves forward from the side of the lower stripper 86 and pushes one end surface of the workpiece 32.
Air is blown out from the tip of 9 and the workpiece 32 is
It is fed into an air transport mechanism (air shooter) 21 having a cross-sectional shape shown in FIG. Air shooter 21
The workpiece 32 that has entered the storage device 32 is sent to the storage device 17 shown in FIG. 16 by the airflow flowing through the air shooter 21.

As shown in FIG. 16, the store device 17 is disposed in the middle of the air conveyance mechanism 21 and includes a rotating drum 91 having a plurality of storage portions 90 provided in parallel along the outer circumferential generatrix direction on its outer circumference, and an air shooter. an air injection mechanism 93 having a plurality of air nozzles 92 provided along the upper part of the extension line of 21;
It is made up of. As shown in FIG. 17, the storage section 90 has a convex pedestal 94 at the center bottom on which the workpiece 32 can slide astride, and consists of a transport storage space 97 surrounded by side wall plates 95 and a ceiling plate 96. There is. Further, a narrow air passage hole 98 extending along the axial direction is provided in the center of the ceiling plate 96. This air passage hole 98 is connected to the housing portion 9.
0 is located directly below the air injection mechanism 93, the air ejected from the air nozzle 92 of the air injection mechanism 93 passes through and enters the transport accommodation space 9.
7, and the workpiece 32 moves while sliding on the pedestal 94 due to the flow created by these airs. Note that if the measurement time of the characteristic inspection device 18 in the next process is short and shorter than the index time of the cutting and forming device 16 in the previous process, this storage device 17 does not rotate and simply stores one item. The storage section 90 functions as a conveyance path for the workpiece 32.
However, the measurement time varies depending on the product, and is not necessarily shorter than the index time; in many cases, the measurement time is longer than the index time. Then, the stopper 99 located near the end of the air injection mechanism 93 is lowered to close the end surface of the transport accommodation space 97 and stop the movement of the workpiece 32. When a predetermined number of works 32 are placed in one storage section 90, the drum 91 rotates one pitch and the stopper 99 rises. Therefore, the transported workpiece 32 is transferred to the next characteristic inspection device 1.
8 and entered the adjacent storage section 90.
2 is housed in the drum 91. Further, when a predetermined number of works 32, that is, a slightly oversupplied number of works 32 are sent to the characteristic testing device 18, the stopper 99 is lowered again to perform a storing operation. In this way, the work is automatically performed while adjusting the difference between the measurement time in the characteristic testing device 18 and the index time in the previous process. In addition, all the housing parts 9 of the drum 91
When the workpiece 32 is accommodated in the cutting/forming device 1
6 and earlier devices automatically stop operating. And now drum 9
1 sequentially rotates one pitch at a predetermined time interval, and the workpieces 32 in each storage section 90 are sequentially inspected by the characteristic inspection device 18.
supply to. Therefore, the characteristic testing device 18 always operates continuously. After that, the storage section 90 of the drum 91
When all of the machines are empty, the cutting and forming device 16 and the devices in the previous processes start operating again.

FIG. 18 is a sectional view showing an outline of the characteristic testing device 18. As shown in the figure, the characteristic testing device 18
Four units (see FIG. 6) are provided in the middle of the air conveyance mechanism 21. This characteristic testing device 1
8 has a main body 100 that moves up and down between the air conveyance mechanisms 21. This main body 100 includes an upper stage,
Each of the lower stages has a work passage (space) 101. The workpieces 32 are designed to pass through these workpiece passageways 101 so as to straddle them, similar to the air conveyance mechanism 21 shown in FIG. 15 and the container 90 of the drum 91 shown in FIG. 17. However, at the center of the lower work passage 101, the lower portions on both sides are cut out so that the leads 6 protrude outside the main body. Further, a drive body 105 having a stopper piece 102 and a pressing piece 103 is provided at the upper part of the lower workpiece passage 101, and the stopper piece 102 normally protrudes into the lower workpiece passage 101 to prevent the moving workpiece from moving. 32 is adapted to be stopped by catching on this stopper piece 102. Further, on the side wall of the lower work passage 101, a work detection mechanism 10 consisting of a phototransistor, etc.
6 is provided, and the stopper piece 102 detects whether or not the workpiece 32 is stopped. Further, when the workpiece detection mechanism 106 detects that the workpiece 32 is stopped by the stopper piece 102, the driving body 105 descends to press and hold the upper surface of the mold portion 11 of the workpiece 32 downward. Thereafter, the main body 100 is lowered, and the socket 10 disposed below the main body 100 is opened.
The lead 6 of the workpiece 32 is pushed into the hole 7, and the characteristics of the workpiece are inspected. At this time, since the upper work passage 101 matches the height of the conveyance passage of the air conveyance mechanism 21, the work 32 that has moved through the air conveyance mechanism 21 passes through this upper work passage 101 and moves to the next one. The characteristic testing device 18 is reached. and,
The subsequent characteristic testing device 18 operates in the same manner. As a result, since four characteristic testing devices 18 are arranged, even if the store device 17 is not operated, the workpieces 32 can be continuously fed if the measurement time is within four times the index time. be able to.

Further, the workpieces leaving the characteristic testing device 18 are sorted based on the measurement results, divided into different grades including defective ones, and automatically stored in storage bodies such as stakes, magazines, and boxes. This operation is performed by the sorting and packaging device 19. Since a generally known device may be used as the sorting and packaging device 19, a description of its structure and the like will be omitted here. Note that a control device system for controlling each device and performing process management is built into the back, bottom, etc. of each device.

Next, the operation (operating status) of such a semiconductor device manufacturing apparatus will be explained. First, semi-finished semiconductor devices (workpieces) connected by resin-molded and cleaned lead frames (connecting bodies) are loaded into the magazine 24 shown in FIG. At the same time, the stopper pins 27 are removed. Then start the entire device. Then, as shown in FIG. 8, a weight 31 enters the magazine 24 in the delivery station and pushes the workpiece 32 downward. Further, the shutter 28 of the storage section 25 of the delivery station is opened, and the work group moves downward and is placed on the lower plate 37 of the separation guide 33. At this time, the receiving rod 29 moves to hold down the workpiece 32 up to the height of the shutter. Separation guide 33
The lowermost workpiece 32 that has been moved to is sent to the back of the separation guide 33 by the pusher 34, and the workpiece 32 sent to the back is moved to the transfer mechanism 20 shown in FIGS. 9a and 9b.
reaches the wiping device 13, and this wiping device 13
mold part 1, which is the marking surface of the workpiece 32.
The top surface of 1 is wiped with an organic solvent to clean it. The cleaned workpiece 32 is transported again by the transport mechanism 20 and reaches the marking device 14 shown in FIG. 11, where the marking device 14 prints a mark made of UV ink on the marking surface. The marked workpiece 32 is transported again by the transfer mechanism 20, and the UV drying device 15 shown in FIG.
After being dried for several tens of seconds, it reaches the cutting and forming device 16 shown in FIG. In the cutting and forming device 16, the workpiece 32
After the resin burrs seeping out around the periphery of the mold part are removed, the dam is cut, and further the sub-frame 2 of the lead frame frame 39 is cut. Further, the tab lead 5 is separated at the bending portion 73 of the cutting and forming device 16, and the semiconductor device is removed from the lead frame frame 39. Further, as soon as the workpiece (semiconductor device) 32 is removed from the lead frame frame 39, the leads 6 are bent from the middle by a pair of rollers 87, resulting in a completed dual-in-line type semiconductor device (workpiece 32). When the bending of the lead is completed, the workpiece 32 is sent from the bending portion 73 to the air conveyance mechanism 21 as shown in FIG. 15 by the plunger 89 of the cylinder mechanism 88. A part of the workpiece 32 carried by the air conveyance mechanism 21 passes through the storage device 17 shown in FIG. 16 and is subjected to a characteristic inspection by the characteristic inspection device 18 shown in FIG. The materials are sorted and stored in containers such as stakes, magazines, and boxes for each category. Further, a part of the workpiece is temporarily stored in the storage device 17.

Such a device produces the following effects.

(1) Works such as marking workpieces, cutting leads, molding leads, inspecting characteristics, and sorting are performed continuously in an integrated process flow. Therefore, the number of workers can be reduced, and since the transfer between each device is automated, it is possible to downsize the series of devices, and the installation area is also reduced.

(2) The moving path of the workpiece is covered with a cover, etc., cutting and forming operations that tend to generate dust are performed after marking, and the reduction in the number of workers generates less dust, so dust on the marking surface is avoided. Good marking can be done without any adhesion.

(3) Each work on the workpiece is performed continuously and automatically, so the workpiece can be moved efficiently, and markings take a few seconds to several tens of seconds to dry, compared to conventional thermosetting inks. It is also possible to use ultraviolet curing ink, which takes much less time to complete.

(4) Since the lead is gradually bent by the rollers, no large force is applied to the lead during processing. Therefore, cracks do not occur between the resin and the lead, the lead does not come out, and moisture resistance does not deteriorate. Also,
Since the marked ink dries in a short time, the characteristics of the semiconductor device are less likely to deteriorate due to heat. Especially when the workpiece transportation stops,
Since the shutter 71 operates to prevent the workpiece from being overheated even if the ultraviolet lamp is not turned off, deterioration of the characteristics of the workpiece can be prevented even in the event of equipment failure. Because of this, the reliability of the product is also high.

(5) Conventionally, the process was as shown in Figure 4, so batch processing such as washing and drying was mixed with single product processing such as cutting, forming, marking, and sorting, and sorting was performed by product type. Testing times vary depending on the process and it is difficult to synchronize with other processes. Therefore, if you try to dock the many devices used in these processes for continuous consistency, the overall reliability will decrease and the operation rate will decrease. Difficult to secure. From this,
Conventionally, it has not been possible to perform this type of processing step continuously and consistently. However, in the present invention, as shown in FIG. 5, the order of each process is changed compared to the conventional one,
Items that can be processed with the same index are processed in a frame state, their feeding method is unified, and the items are sent to a stocker (store device) before sorting.
This prevents index unmatching due to differences in testing time, and UV drying is used to dry marks from batch processing to continuous processing, and cutting molding is performed individually to reduce the probability of mold failure. This is intended to improve the reliability of the device, and by marking the lead frame before cutting and molding, it is possible to prevent the adhesion of sealing resin residue and to prevent the marking from shifting. Therefore, the present invention can reduce the number of personnel, shorten the process completion period, improve yield, prevent the contamination of harmful substances, and further improve reliability.

Note that the present invention is not limited to the above embodiments.

As described above, according to the semiconductor device manufacturing apparatus of the present invention, by continuously automating operations such as marking, lead cutting molding, and characteristic selection for a workpiece after resin molding and cleaning,
It is possible to improve yield, shorten the completion time, reduce personnel, and reduce costs.

[Brief explanation of the drawing]

Figures 1 to 3 are diagrams showing the manufacturing stages of a resin-sealed semiconductor device, in which Figure 1 is a plan view of the lead frame, and Figure 2 is after molding is completed and after lead and dam cutting is completed. Fig. 3 is a plan view of the workpiece, and Fig. 3 is an external view of the finished product. FIG. 4 is a process diagram showing each work step after completion of conventional molding. Fifth
The figure is a process diagram showing each work order in a semiconductor device manufacturing apparatus according to an embodiment of the present invention, FIG. 6 is a schematic plan view of the semiconductor device manufacturing apparatus, and FIGS. 7 to 18 show each device part. FIG. 7 is a perspective view of the magazine and stopper pin in the loading device, FIG. 8 is a sectional view showing the separation mechanism in the loading device, and FIGS. 9 a and 9 b show the work transfer mechanism on the conveyance path. A sectional view and a side sectional view, Fig. 10 is a schematic diagram of a wiping device for cleaning the marking surface of a workpiece, Fig. 11 is a schematic diagram of a marking device that prints a mark on the marking surface of a workpiece, and Fig. 12 is a schematic diagram of a marking device for cleaning the marking surface of a workpiece. Figure 13 is a cross-sectional view of a UV drying device for drying ink.
A schematic diagram showing the shutter mechanism in the UV drying device, FIG. 14 is a cross-sectional view of the cutting and forming device, FIG. 15 is a cross-sectional view of the shutter, FIG. 16 is a perspective view showing an overview of the store device, and FIG. 17 is a store device. FIG. 18 is an enlarged cross-sectional view showing a part of the characteristic testing device. 1...Main frame, 2...Subframe, 3...Pellet, 4
...Tab, 5...Tab lead, 6...Lead, 7
... Dam, 11 ... Mold section, 12 ... Loading device, 13 ... Wiping device, 14 ... Marking device, 15 ... UV drying device, 16 ... Cutting and forming device, 17 ... Store device, 18 ... Characteristic inspection device, 19 ... Sorting and packaging device, 20 ... Transfer mechanism, 21 ... Air conveyance mechanism, 22 ... Table, 23 ... Separation mechanism, 24 ... Magazine, 32
... Workpiece, 33 ... Separation guide, 34 ... Pusher, 39 ... Lead frame frame, 40 ... Guide, 43 ... Feed claw, 49 ... Return prevention claw, 52
...Cloth belt, 53...Guide roller, 54...
Organic solvent, 55... Tank, 56... Squeezing roller, 57... Wiping guide, 58... Transfer cylinder, 59
... Planetary gear, 61 ... Internal gear, 62 ... Stamp cylinder, 63 ... Inking roller, 64 ... Ink application roller, 65 ... Ink tank, 66 ... Ink,
67...Doctor, 68...Lamp, 71...Shutter, 72...Press part, 73...Bending part, 74
...Resin dropping mold part, 75...Dam cutting mold part, 7
6...Lead cutting mold section, 77...Upper mold, 79...
Lower mold, 85...Upper stripper, 86...Lower stripper, 87...Roller, 90...Accommodating part, 91...
...Drum, 92...Air nozzle, 93...Air injection mechanism, 97...Transportation accommodation space, 100...
Main body, 101... Work passage path, 102... Stopper piece, 103... Pressing piece, 105... Drive body,
106... Work detection mechanism, 107... Socket.

Claims (1)

[Claims] 1. A loading device that sequentially sends out a plurality of semiconductor devices connected to each other via a lead frame onto a transport path; a transfer mechanism that intermittently moves the semiconductor devices along the transport path and sequentially transfers the semiconductor devices between the devices; a cleaning device that cleans the marking surface of the stopped semiconductor device; a marking device that prints a mark on the cleaned marking surface of the semiconductor device; and a drying device that dries ink adhering to the marking surface of the semiconductor device. a device;
A cutting and molding device that separates the semiconductor device from the interconnection body and molds a part of the semiconductor device, a storage device that temporarily stores the individualized semiconductor devices, and a storage device that stores the semiconductor devices sent from the storage device. A semiconductor device manufacturing apparatus comprising an inspection device for inspecting characteristics, etc., and a sorting device for classifying the semiconductor devices according to the inspection results and packing the semiconductor devices into respective predetermined magazines.