JPS627067B2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an integrated circuit holding tool that accommodates a large number of dual-in-line integrated circuits in a row and allows transportation, testing, etc. .

[Conventional technology]

A conventional holding tool for accommodating and transporting a large number of integrated circuits of this type is shown in a perspective view in FIG. Reference numeral 1 denotes a container body, which serves as a holding tool and is made of a synthetic resin material or the like in a long length, and is open on both sides so that a large number of integrated circuits can be sequentially arranged and packed therein. Reference numeral 2 denotes a receiving portion projecting inward from the bottom and receiving the lower surface of the packed integrated circuit 4, as shown in a front view in FIG.
Reference numeral 3 denotes a slit provided in the upper part in the longitudinal direction so that marks on the integrated circuit 4 can be checked. Reference numeral 4a denotes a large number of lead wires extending from both sides of the integrated circuit 4.

[Problem that the invention seeks to solve]

Conventional holding devices such as those described above do not allow the integrated circuit 4
The integrated circuits 4 are taken out one by one from the container body 1 each time during testing and other processes.
For example, they had to be inserted into an operating life test board, removed after the test, and packed into the storage container 1 one by one again, which required a great deal of effort and time.

This invention was made to solve these problems, and it allows a large number of integrated circuits to be stored and transported side by side in a container body, and it is also possible to test the integrated circuits without taking them out. The object of the present invention is to provide an integrated circuit holding tool that improves work efficiency and saves labor.

[Means for solving problems]

The integrated circuit holding tool according to the present invention has a cylindrical container body with a longitudinal slit in the upper part, and a bottom wall provided with a number of through holes for the lead wires of the integrated circuit. A cradle is removably inserted into a protrusion on the bottom wall of the cradle, an integrated circuit is received and housed on the cradle, and an insertion plate having a downward protrusion at one end is inserted into the slit,
It is intended to be stored or transported. Furthermore, to test the integrated circuits inside the container body, adjust the position of the integrated circuits all at once in the longitudinal direction using the insertion plate, pull out the cradle and lower the integrated circuits so that each lead wire protrudes from each through hole. This is what I did.

[Effect]

In this invention, the integrated circuits are arranged in order on a pedestal inserted into the bottom wall of the container body, and stored or transported with the leads on both sides straddling both sides of the pedestal.

To test the housed integrated circuits, place the protruding part of the insertion plate against the outer edge of the group of integrated circuits, adjust the position in the longitudinal direction all at once, align each lead over the corresponding lead through hole, Each integrated circuit is lowered by pulling out the cradle, and each lead wire is exited downwardly through each through hole for testing.

〔Example〕

FIG. 3 is a perspective view of an integrated circuit holding tool according to an embodiment of the present invention, showing a state in which it is used for transporting integrated circuits and for a loader and unloader of an automatic machine. 5 is a holding tool, which is constructed as follows. Reference numeral 6 denotes a container body, which has a cylindrical shape with a rectangular cross section, is made of a synthetic resin material, etc., and is open at both ends, so that a large number of integrated circuits can be packed in one after another. Reference numeral 7 denotes a slit provided in the upper part in the longitudinal direction, and guide grooves 7a in the longitudinal direction are provided on both sides. The mark of the integrated circuit, etc. can be confirmed through this slit 7. Reference numeral 8 denotes a pair of guide protrusions provided on the bottom wall of the container body 6 to face each other in the longitudinal direction, and an engaging portion 8a formed of, for example, an insertion groove in the longitudinal direction is provided on the outer surface. Note that the engaging portion of this protrusion may be shaped like a rail. 9 has the above-mentioned engaging portion 8 at the bottom on both sides.
The pedestal is inserted into and supported by the cradle, and is formed into a long piece consisting of an upper side and both sides.As shown in the front view in Fig. The lead wires 4a on both sides extend over both sides. This pedestal 9 is made of a conductive material, or both sides in contact with the lead wires 4a of the integrated circuit 4 are made of a conductive material, or a conductive material is coated and adhered to it. We are trying to prevent destruction. A large number of through holes 10 for the leads of each integrated circuit 4 are bored on both sides of the bottom wall of the container body 6. Note that the lead wire 4 of the integrated circuit 4
the container body 6 so that a can easily pass through the through hole 10.
Guide slopes 6a are provided at the lower portions of both side walls. The through holes 10 may be individual round holes through which each lead 4a passes, or a slit-like hole made up of several holes. Reference numeral 11 denotes an insertion plate that is inserted into and removed from the slit 7 in the longitudinal direction, and has a protrusion 12 bent downward at a right angle at one end.

This insertion plate 11 is shown in a perspective view in FIG. 5, and the protrusions 11a on both sides are fitted into the guide grooves 7a and inserted and removed in the longitudinal direction. This insert plate 1
1 is made of a synthetic resin material or the like, and when inserted into the slit 7, it blocks out external light.

The integrated circuit 4 is an EPROM (eresable and electrically
reprogramable ROM), the conventional holding tool 1 had an adverse effect due to external light entering through the slit 3, but the holding tool 5 of the above embodiment
In this case, since the insertion plate 11 is inserted into the slit 7 and transported, the influence on the integrated circuit 4 can be prevented.

Note that if the integrated circuit 4 has a characteristic that it is not affected by ultraviolet rays, the material of the insertion plate 11 does not need to be one that blocks external light.

Next, the use of the tool of the above-mentioned embodiment will be explained in the case of the process of transporting the integrated circuit 4, testing it, and transporting it. First, as shown in the side sectional view in Figure 6,
A holder 9 is inserted into both protrusions 8 on the bottom wall of the container body 6, and each integrated circuit 4 is sequentially packed therein. Subsequently, the insertion plate 11 is inserted into the slit 7, the projections 12 are brought into contact with the outer ends of the group of integrated circuits 4, and the integrated circuits are transported in this transport position.

In the test process, the longitudinal position of each integrated circuit 4 is adjusted all at once using the insertion plate 11, and the lead wires 4a
Align in the longitudinal direction so that it is at the center of the through hole 10. (The through hole 10 is for each lead wire 4.
Although a large number are provided corresponding to a, only some are shown in the figure. ) In this way, all integrated circuits 4 are positioned at once. When the protrusion 12 of the insertion plate 11 is placed against the outer end of the four groups of integrated circuits and the position is held in place, when the pedestal 9 is pulled out toward the protrusion 12, each integrated circuit 4 is lowered and attached to each lead. The wire 4a passes through each through hole 10 and its tip side projects downward. This state is shown in a side sectional view in FIG. When each integrated circuit 4 is lowered, each lead wire 4a is guided to both guide slopes 6a, automatically aligned in the width direction, and passed through the through hole 10.

Next, when the insert plate 11 is pulled out, the state shown in the front sectional view in FIG. 8 is obtained. Each integrated circuit 4 is pressed down from above with this insertion plate 11, as shown in the front sectional view in FIG. to be done. In this way, it is used as a jig in the testing process.

When the test is completed, the insertion plate 11 is inserted between the pair of protrusions 8 and lifted, each integrated circuit 4 is pushed up, and each lead wire 4a is pulled out. Next, the container body 6 is turned upside down, the insertion plate 11 is removed and inserted into the slit 7, and the holder 9 is inserted by fitting the lower ends of both sides into the engaging portions 8a of the projections 8. When the container main body 6 in this state is turned over and returned to its original state, it becomes the state shown in FIG. 6, and is then stored or transported.

FIG. 10 is a perspective view of a storage container section showing another embodiment of the present invention, in which test sockets 13 are mounted on top of each other below the container body 6, and the lead wires 4a of each integrated circuit 4 are inserted into the test sockets 13 for testing. We are making sure that this is done. 14 is a lead pin into which each lead wire 4a is inserted and connected.

FIG. 11 is a perspective view of a storage container section showing another different embodiment of the present invention, in which a number of lead pins 16 are arranged on contact plates 15 stacked below. An integrated circuit 4 is placed on this contact plate 15.
Container bodies 6 filled with the same are attached one on top of the other. At the time of testing, the integrated circuit 4 is lowered so that the lead wires 4a are inserted into the insertion holes on the upper end side of the lead pins 16. The lower end side of the lead pin 16 is inserted into a socket (not shown) of test equipment.

FIG. 12 is a perspective view of a board for operating life test showing still another embodiment of the present invention. A large number of contact holes 18 are arranged in a plurality of rows on the operating life test board 17, and the lead wires 4a of each integrated circuit 4 of the plurality of container bodies 6 can be inserted directly or through the socket 13 or the contact plate 15. The integrated circuits 4 in the plurality of rows of storage containers 6 are connected together so that each integrated circuit 4 in the plurality of rows of containers 6 can be tested simultaneously. This operating life test requires heat and cold resistance (approximately -50 to +200°C), and the material of the container body 6 is designed to withstand this temperature.

It is also possible to conduct a test by inserting and connecting a tool in which the socket 13 or the contact plate 15 is attached to the container body 6 into a multi-test jig.

〔Effect of the invention〕

As described above, according to the present invention, the integrated circuits are sequentially arranged and housed on the pedestal inserted into the bottom wall of the container body, and the insertion board is inserted into the slit provided at the top of the container body for storage. or transported, and in the testing process, the integrated circuit group is collectively moved and adjusted in the longitudinal direction using an insertion plate, and the above-mentioned holder is pulled out.
The integrated circuits are lowered to the bottom wall of the container body, and each integrated circuit is held down from above using an insertion plate so that the lead wires of the integrated circuits protrude downward from the numerous through holes formed in the bottom wall of the container body for testing. This allows a large number of integrated circuits to be stored, transported, tested, and other processes while still being packed into the container body, greatly improving work efficiency and saving labor, making it suitable for automation.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional integrated circuit holding tool;
2 is a front view showing a state in which the holding tool shown in FIG. 1 is packed with integrated circuits; FIG. 3 is a perspective view of the holding tool for integrated circuits according to an embodiment of the present invention;
5 is a perspective view of the insert plate of FIG. 3, FIG. 6 is a sectional view of the holding tool of FIG. 4 taken along the - line,
Fig. 7 is a side sectional view of the storage container section with the cradle shown in Fig. 6 in the pull-out test position, Fig. 8 is a front sectional view of the holding tool in the position shown in Fig. 7, and Fig. 9 is the state shown in Fig. 8. 10 to 12 are perspective views showing other different embodiments of the present invention;
0 shows a test socket stacked on the storage container of FIG. 3, FIG. 11 shows a contact plate stacked on the storage container of FIG. 3, and FIG. 12 shows an operating life test board. 4... Integrated circuit, 4a... Lead wire, 5... Holding tool, 6... Container body, 6a... Guide slope,
7...Slit, 8...Protrusion, 8a...Engaging portion,
9... cradle, 10... through hole, and the same reference numerals in the drawings indicate the same or corresponding parts.

Claims (1)

[Claims] 1 A container body that is cylindrical and has a longitudinal slit in the upper part and holes for the lead wires of a large number of integrated circuits on both sides of the bottom wall; The integrated circuit component is removably inserted into a pair of protrusions, and the stored integrated circuit component is received on the upper side and raised to the upper side of the container body for storage or transportation, and the integrated circuit component is pulled out during testing. It is provided with a cradle for lowering the container, and a belt-shaped projection part at one end, and an insertion plate that is inserted into the slit of the container body during storage or transportation, and the insertion plate allows the projection part to be lowered during testing. Then, the holder is inserted and the lowered integrated circuit group is pressed down from above by the insertion plate, and the lead wires protrude downward from the through hole. An integrated circuit holding tool, characterized in that the insertion plate is inserted between the protrusions and lifts the integrated circuit component after the test is completed.