JPS6310161B2 - - Google Patents
Info
- Publication number
- JPS6310161B2 JPS6310161B2 JP55013407A JP1340780A JPS6310161B2 JP S6310161 B2 JPS6310161 B2 JP S6310161B2 JP 55013407 A JP55013407 A JP 55013407A JP 1340780 A JP1340780 A JP 1340780A JP S6310161 B2 JPS6310161 B2 JP S6310161B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- hydroxyl group
- component
- reaction
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 44
- 239000011347 resin Substances 0.000 claims description 44
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 38
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims description 28
- -1 fatty acid ester Chemical class 0.000 claims description 16
- 239000007795 chemical reaction product Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 239000003607 modifier Substances 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 15
- 150000003377 silicon compounds Chemical class 0.000 description 15
- 229920001296 polysiloxane Polymers 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 235000019198 oils Nutrition 0.000 description 6
- 239000002966 varnish Substances 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000010186 staining Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 229920000180 alkyd Polymers 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Chemical compound C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 239000004359 castor oil Substances 0.000 description 2
- 235000019438 castor oil Nutrition 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- IJTNSXPMYKJZPR-UHFFFAOYSA-N parinaric acid Chemical compound CCC=CC=CC=CC=CCCCCCCCC(O)=O IJTNSXPMYKJZPR-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- 239000003981 vehicle Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- IYQYZZHQSZMZIG-QYNFOATHSA-N (1S,7R)-4,9-dimethyltricyclo[5.2.1.02,6]deca-3,8-diene Chemical compound CC1=CC2C(C1)[C@H]1C[C@@H]2C(C)=C1 IYQYZZHQSZMZIG-QYNFOATHSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QZPSOSOOLFHYRR-UHFFFAOYSA-N 3-hydroxypropyl prop-2-enoate Chemical compound OCCCOC(=O)C=C QZPSOSOOLFHYRR-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical group CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical group C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- KXYDGGNWZUHESZ-UHFFFAOYSA-N 4-(2,2,4-trimethyl-3h-chromen-4-yl)phenol Chemical compound C12=CC=CC=C2OC(C)(C)CC1(C)C1=CC=C(O)C=C1 KXYDGGNWZUHESZ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 240000006240 Linum usitatissimum Species 0.000 description 1
- 235000004431 Linum usitatissimum Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 description 1
- XKXKHKMJDTUHMM-UHFFFAOYSA-J [Zr+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O Chemical compound [Zr+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O XKXKHKMJDTUHMM-UHFFFAOYSA-J 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- IJTNSXPMYKJZPR-WVRBZULHSA-N alpha-parinaric acid Natural products CCC=C/C=C/C=C/C=CCCCCCCCC(=O)O IJTNSXPMYKJZPR-WVRBZULHSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 235000004426 flaxseed Nutrition 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000005673 monoalkenes Chemical class 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- WXNYILVTTOXAFR-UHFFFAOYSA-N prop-2-en-1-ol;styrene Chemical compound OCC=C.C=CC1=CC=CC=C1 WXNYILVTTOXAFR-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000005691 triesters Chemical class 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Description
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The present invention relates to a method for producing a novel modified resin suitable as a resin for printing ink, and more specifically, a cyclopentadiene resin, a higher fatty acid ester, a hydroxyl group-containing modifier, a silicon compound, and optionally an α,β-unsaturated dicarboxylic acid. This invention relates to a method for producing a novel modified resin using an anhydride. In recent years, much research has been conducted to improve lithographic printing technology, and one example of this is the development of a dry lithographic printing method that uses a thin film made of a non-adhesive material such as silicone rubber for non-image areas. This method eliminates the need for dampening water, so it eliminates the problems that often occur with dampening water in conventional lithographic printing methods (for example, emulsification of printing ink, loss of gloss due to water loss, set-off, ghosting, etc.). (e.g., the occurrence of blemishes, etc.), and excellent printing effects can be obtained. However, if this method is used to print at high speeds for a long period of time using regular ink, the temperature on the printing plate will rise, causing the ink to adhere to non-image areas and easily causing plate staining. As a means to solve this problem, methods have been proposed in which various ink materials are modified with silicon compounds. For example, silicon-modified alkyd resin (Japanese Patent Publication No. 51-10124, Japanese Patent Publication No. 51-22405), silicon-modified vegetable oil (Japanese Patent Publication No. 52-10041, Japanese Patent Publication No. 52-10042),
Silicone-modified oil-soluble phenolic resin
60706, No. 52-62506), but these methods are not sufficiently effective in improving plate staining, and it is desired to develop ink materials that cause even less plate staining. Ta. Therefore, an object of the present invention is to provide a method for producing a modified resin suitable as a vehicle for dry planographic printing ink that causes less plate staining at high temperatures.
The object of the present invention is to produce a reaction product of (a) a cyclopentadiene resin and (b) a higher fatty acid ester having a conjugated double bond, or both components (a) and (b) and (c)
A hydroxyl group-containing resin () obtained by reacting the reaction product (I) of an α,β-unsaturated dicarboxylic acid anhydride with (d) a hydroxyl group-containing modifier (e) a hydroxyl group or an alkoxy group bonded to a silicon atom This is achieved by reacting a silicon compound containing . The reaction product (I) used in the present invention is usually
(a) Cyclopentadiene resin 98-35% by weight, preferably 95-50% by weight, (b) Higher fatty acid ester having a conjugated double bond 2-65% by weight, preferably 5-5% by weight
(c) unsaturated dicarboxylic acid anhydride 0-30% by weight, preferably 0.3-15% by weight of the reaction product. At this time, if the amount of component (b) is small, the wettability with the pigment will be poor, whereas if it is large, gelation will easily occur during the reaction. In addition, the presence of component (c) further improves pigment wettability and suppresses gel by-products, but if too much is present, the hue deteriorates and the plate is likely to smear when used as an ink. Become. (a) used in the synthesis of reaction product (I)
The component is prepared by a conventional method using a cyclopentadiene monomer such as cyclopentadiene, methylcyclopentadiene, dimer, trimer, codimer, etc., or a cyclopentadiene monomer in a subordinate position. It is obtained by thermally polymerizing a mixture of this and a comonomer that can be copolymerized, and has a softening point of 80~
Those with a Gardner chromaticity of 13 or less at 200â, especially 100 to 170â, are prized. Specific examples of comonomers used include monoolefins such as ethylene, propylene, butene, and styrene, 1,3-butadiene, isoprene,
Examples include conjugated dienes such as 1.3-pentadiene, and polar vinyl monomers such as vinyl acetate, acrylic esters, methacrylic esters, acrylonitrile, and allyl alcohol. Among these, homopolymers of cyclopentadiene monomers or copolymers of cyclopentadiene monomers with hydrocarbon comonomers such as moreolefin and conjugated dienes are preferred. On the other hand, component (b) consists of a monocarboxylic acid having 12 or more carbon atoms and a conjugated double bond in the molecular chain, such as eleostearic acid and parinaric acid, methanol, ethanol, butanol, octanol, ethylene glycol, glycerin, Such as pentaerythritol, trimethylolpropane, etc.1
These are esters with alcohols or polyhydric alcohols, and among them, triester of glycerin is preferred.
These glycerin triesters are contained in natural drying oils such as tung oil, dehydrated castor oil, oiticica oil, and eno oil, and in the present invention, these natural drying oils are used as higher fatty acid esters. Specific examples of component (c) include maleic anhydride, citraconic anhydride, itaconic anhydride, and alkyl substituted products thereof. will be awarded. The reaction product (I) may be a product obtained by reacting these three components in any order, and is not particularly limited by the order of the reactions, but may be a reaction product that is polymerized while preventing gelation. In order to obtain the product, it is preferable to form an adduct of components (a) and (c) and an adduct of components (b) and (c) in advance and then react them. (c) without adding any component (a)
When reacting the component with the component (b), sufficient care must be taken to control the reaction since gelation of the component (b) tends to proceed. The reaction of each component is usually carried out at 190-300â under an atmosphere of inert gas such as nitrogen or argon.
It will be carried out for 30 minutes to 8 hours, and at this time, (a)
When forming an adduct between a component and a component (c) or an adduct between a component (b) and a component (c) in advance, the component (a) or the component (b) and the component (c) are prepared by a conventional method. According to e.g. 150
A method of preparing in advance by reacting at ~250â for about 10 minutes to 5 hours, and reacting components (a), (b), and (c) simultaneously to form each adduct in the system. You may follow any method. In this case, the amount of component (c) used is the same as that of component (a).
(b) 100% of each component in order to increase the reactivity with the component.
It is preferably 0.1 part by weight or more, and usually 0.2 to 30 parts by weight. In particular, when modifying into an ink resin, it is appropriate to use 0.3 to 15 parts by weight per 100 parts by weight of each of component (a) and component (b). This reaction is usually carried out in the absence of a diluent, but diluents can be used if desired, such as common hydrocarbon solvents such as benzene, toluene, xylene, tetralin, mineral oil, etc., as well as linseed Examples include natural oils that are inert to the reaction, such as oil and soybean oil. Also, if desired, titanium,
Compounds of metals such as zirconium, tin, lead, etc. can also be used as catalysts. In the present invention, the hydroxyl group-containing resin (2) is obtained by reacting the reaction product (I) thus obtained with the hydroxyl group-containing modifier (d).
The hydroxyl group-containing modifier to be subjected to the reaction may be any one that can introduce a hydroxyl group into the reaction product (I) through reaction with the reaction product (I), such as an acid anhydride group. Polyhydric alcohols and alkanolamines are examples of modifiers that utilize a reaction with unsaturated bonds, and unsaturated acid esters containing hydroxyl groups are examples of modifiers that utilize an addition reaction to unsaturated bonds. Specific examples of such modifiers include ethylene glycol, propylene glycol, diethylene glycol, dipropylene glycol, butylene glycol, neopentyl glycol, glycerin, trimethylolethane, trimethylolpropane, pentaerythritol, solpitol,
Low molecular weight polyhydric alcohols such as diglycerol, bis(hydroxylmethyl)benzene, etc.; Alkanolamines such as monoethanolamine, diethanolamine, triethanolamine, etc.; dicyclopentadiene-allyl alcohol copolymer resin, styrene-allyl alcohol copolymer resin Resinous polyhydric alcohols such as castor oil, polyethylene glycol, polypropylene glycol, etc.; Hydroxyl group-containing unsaturated acid esters such as hydroxyethyl acrylate, hydroxypropyl acrylate, pentaerythritol triacrylate, etc.; N-methylol Examples include hydroxyl group-containing unsaturated acid amides such as acrylamide and N-methylolmethacrylamide. The reaction between reaction product (I) and component (d) is usually 80~
It is carried out at 280°C for 10 minutes to 5 hours. The amount of the hydroxyl group-containing modifier used is appropriately selected, but is usually in a range such that the hydroxyl value of the hydroxyl group-containing resin () to be produced is 1 to 120, preferably 3 to 100. In the present invention, a modified resin is obtained by reacting the thus obtained hydroxyl group-containing resin (2) with (e) a silicon compound containing a hydroxyl group or an alkoxy group bonded to a silicon atom. The silicon compound to be subjected to the reaction contains at least one silicon compound in the molecule.
Any material having hydroxyl or alkoxy groups may be used, specifically vinyltrimethoxysilane, vinyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, etc. Alkoxysilane compounds; hydroxyl group-containing organopolysiloxanes such as hydroxyl group-containing polydimethylsiloxanes, hydroxyl group-containing dimethylsiloxane/diphenylsiloxane copolymers; methoxy group-containing polydimethylsiloxanes, methoxy group-containing dimethylsiloxane/diphenylsiloxane copolymers, etc. Examples include alkoxy group-containing organopolysiloxanes such as the following. The reaction between the hydroxyl group-containing resin () and the silicon compound (e) is usually carried out at a temperature of 50 to 250°C, preferably 100 to 200°C for 30°C.
The silicon compound is introduced into the resin by a dehydration reaction between the hydroxyl group in the resin and the hydroxyl group in the silicon compound or a dealcoholization reaction with an alkoxy group. The amount of (e) silicon compound used can vary over a wide range, but usually ranges from 1 to 80 parts by weight of hydroxyl-containing resin ().
Part by weight, preferably 5 to 60 parts by weight, and the amount of hydroxyl or alkoxy group in the silicon compound is 0.3 to 4 per equivalent of hydroxyl group in the hydroxyl group-containing resin ().
It is appropriate that the amount is equivalent, more preferably 0.5 to 3 equivalents. In this way, by introducing the silicon compound (e) into the hydroxyl group-containing resin (2), a modified resin can be obtained that can be used to prepare a printing ink for dry planography with improved plate staining at high temperatures. Among them, (a) adducts of cyclopentadiene resins and (c) α.β-unsaturated dicarboxylic acid anhydrides, and (b) higher fatty acid esters (c) additions with α.β-unsaturated dicarboxylic acid anhydrides. The reaction product obtained by reacting both adducts of a compound has superior performance as an ink resin compared to conventional cyclopentadiene resins (Japanese Patent Application Laid-Open No. 125494-1982).
(I).
When used as a modified resin, a particularly good modified resin can be obtained. The modified resin of the present invention thus obtained usually has a softening point of 40 to 180°C, and can be used in paints, adhesives,
In addition to being used in fields where cyclopentadiene resins are commonly used, such as varnish, it is particularly suitable as an ink resin, and is particularly useful as a vehicle for dry lithographic printing inks. The present invention will be explained in more detail with reference to Examples below. Note that parts and percentages in Examples are based on weight unless otherwise specified. Example 1 Cyclopentadiene in the presence of xylene at 260
Cyclopentadiene resin with a softening point of 135°C and a Gardner chromaticity of 4 obtained by thermal polymerization at â for 4 hours.
After heating and melting 100 parts and 50 parts of tung oil at 170â,
5 parts of maleic anhydride was added and reacted at 180°C for 1 hour, and 1 part of zirconium octenoate was added, the temperature was raised to 240°C, and reaction was carried out for 5 hours. To 100 parts of the reaction product obtained in this way, 6.8 parts of trimethylolpropane was added and the reaction was carried out at 160°C for 1 hour, resulting in a softening point of 128°C, acid value of 18, and hydroxyl value.
35 hydroxyl group-containing resins were obtained. Next, a predetermined amount of hydroxyl group-containing polydimethylsiloxane (silicone oil RFL manufactured by Shin-Etsu Chemical Co., Ltd., hydroxyl group content 3.1%) is applied to 100 parts of this hydroxyl group-containing resin.
was charged and a condensation reaction was carried out at 160°C for 3 hours to obtain a modified resin. The softening point and Gardner chromaticity of the obtained modified resin were measured, and then 40 parts of the modified resin was dissolved in 60 parts of petroleum solvent (Nippon Oil Co., Ltd., No. 5 Solvent), and the viscosity (Gardner display) was measured. It was measured. In addition, 100 parts of modified resin and 42.8 parts of petroleum solvent were heated to 180°C.
Make a varnish by heating and stirring for 20 minutes.
After adding 20 parts of phthalocyanine blue (manufactured by Dainippon Ink Co., Ltd., TGR) to 100 parts and kneading with three rolls, an ink with an inkometer value of 11.0 (400 rpm) was prepared by further adding a small amount of petroleum solvent. The ink thus obtained is Heidel.
Transferred onto a silicone dry lithography plate (manufactured by Toray Industries, Inc.) using a KORD monochromatic machine, observed the adhesion of ink to non-image areas at plate surface temperatures of 20°C and 40°C, and transferred onto coated paper using the same method. Color and set were measured. For comparison, we synthesized a silicone-modified alkyd resin that has been used in the past and evaluated it in the same manner. The results are shown in Table 1.
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ãã»ããã¯ïŒåã§ãã€ãã[Table] From these results, the ink using the modified resin of the present invention shows less adhesion to the non-printing areas of silicone dry lithographic plates even at 20°C or even 40°C, and also has extremely excellent performance in terms of setting. It can be seen that this shows that On the other hand, the silicone-modified alkyd resins that have been used in the past are inferior in terms of setting and have some difficulty in adhesion at high temperatures. Example 2 An experiment was conducted in the same manner as experiment number (1-3) of Example 1 except that a hydroxyl group-containing silicone varnish (Silicon Varnish KR216 manufactured by Shin-Etsu Chemical Co., Ltd., hydroxyl group content 5.5%) was used as the silicon compound, and softening was performed. point
A modified resin having a Gardner color number of 15 at 132°C and a solution viscosity of T to U was obtained. An ink was prepared using this modified resin in the same manner as in Example 1, and its performance was evaluated. As a result, the ink adhesion to the non-image areas of a silicone dry lithography plate was 20.
â and 40â, and the setting time was 10 minutes. Example 3 A methoxy group-containing silicone varnish (manufactured by Shin-Etsu Chemical Co., Ltd., silicone varnish KR218,
An experiment was carried out in the same manner as in Experiment No. (1-3) of Example 1, except that methoxy group content 15%) was used, and a modified resin with a softening point of 120°C, a Gardner color number of 15, and a solution viscosity of R was obtained. . An ink was prepared using this modified resin in the same manner as in Example 1, and its performance was evaluated.
It was not observed at either temperatures of 40°C or 40°C, and it took 8 minutes to set.
Claims (1)
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èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®æ¹æ³ã[Scope of Claims] 1. A reaction product of (a) a cyclopentadiene resin and (b) a higher fatty acid ester having a conjugated double bond, or both components (a) and (b) above, and (c) α, β- A hydroxyl group-containing resin (2) obtained by reacting the reaction product (I) of an unsaturated dicarboxylic acid anhydride with (d) a hydroxyl group-containing modifier, and (e) silicon containing a hydroxyl group or an alkoxy group bonded to a silicon atom. A method for producing a novel modified resin () characterized by reacting compounds. 2. The method according to claim 1, wherein the modified resin has a softening point of 40 to 180°C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1340780A JPS56110706A (en) | 1980-02-06 | 1980-02-06 | Production of novel modified resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1340780A JPS56110706A (en) | 1980-02-06 | 1980-02-06 | Production of novel modified resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56110706A JPS56110706A (en) | 1981-09-02 |
| JPS6310161B2 true JPS6310161B2 (en) | 1988-03-04 |
Family
ID=11832271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1340780A Granted JPS56110706A (en) | 1980-02-06 | 1980-02-06 | Production of novel modified resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56110706A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59117568A (en) * | 1982-12-24 | 1984-07-06 | Toyo Ink Mfg Co Ltd | Ink for dry lithography |
| DD256721A1 (en) * | 1986-01-29 | 1988-05-18 | Akad Wissenschaften Ddr | METHOD FOR ACTIVATING CELLULOSE-CONTAINING SOLID CARBON SURFACES |
-
1980
- 1980-02-06 JP JP1340780A patent/JPS56110706A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56110706A (en) | 1981-09-02 |
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