Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6311124B2 - - Google Patents
[go: Go Back, main page]

JPS6311124B2 - - Google Patents

Info

Publication number
JPS6311124B2
JPS6311124B2 JP17268282A JP17268282A JPS6311124B2 JP S6311124 B2 JPS6311124 B2 JP S6311124B2 JP 17268282 A JP17268282 A JP 17268282A JP 17268282 A JP17268282 A JP 17268282A JP S6311124 B2 JPS6311124 B2 JP S6311124B2
Authority
JP
Japan
Prior art keywords
resin
base material
prepreg
impregnated
microwave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17268282A
Other languages
Japanese (ja)
Other versions
JPS5962111A (en
Inventor
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP17268282A priority Critical patent/JPS5962111A/en
Publication of JPS5962111A publication Critical patent/JPS5962111A/en
Publication of JPS6311124B2 publication Critical patent/JPS6311124B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

この発明はプリプレグの製法に関するものであ
る。 紙基材銅張積層板等の積層板は、その基板が絶
縁性に富んでいることが求められる。この基板
は、セルロース基材に樹脂液を含浸させたプリプ
レグにより構成されているため、積層板の製造に
際し、電気絶縁性を損う水分をプリプレグから除
去することが行われている。すなわち、プリプレ
グを熱風、蒸気、電熱等により加熱しプリプレグ
中の水分を除去することが行われている。しかし
ながら、このプリプレグ中の水分は、セルロース
基材中の7〜10%含まれる水分によるものであ
り、セルロース基材自身が親水性に富んでいるこ
ともあつて上記のような外部加熱方式によつては
簡単に除去できない。また、130℃以上の高温度
になると、角質化現象が生じ基材の脆弱化が生じ
る。そのうえ、外部外熱方式によれば、プリプレ
グの含浸樹脂の硬化が先行するため、水分除去に
は限界がある。そのため、得られる積層板は電気
絶縁性(特に煮沸後電気絶縁性)に問題があつ
た。セルロース基材として薄手のものを用いるこ
とも考えられたが、このようにすると生産性が悪
くなりコストアツプを招くため、これも問題があ
る。 そこで、この発明者は、このような問題を解消
するために研究を重ねた結果、セルロース基材に
樹脂液を含浸させた樹脂含浸基材(プリプレグ)
に対して湿熱雰囲気下においてマイクロ波加熱を
施したのち乾燥すると所期の目的を達成しうるこ
とを見いだしこの発明に到達した。 すなわち、この発明は、セルロース基材に樹脂
液を含浸させた樹脂含浸基材に対して、湿熱雰囲
気下においてマイクロ波加熱を施したのち乾燥す
ることをその要旨とするものである。 従来使用されている赤外加熱は、10-4〜10-6m
の波長領域であるのに対し、この発明のマイクロ
波加熱は1〜10-1mの波長領域である。この発明
により良好な結果が得られるのは、つぎのような
理由によるものと考えられる。すなわち、樹脂含
浸基材(プリプレグ)をマイクロ波加熱すること
により、セルロース基材中の水分のみが選択的に
加熱(内部加熱)され気化されて外部へ排出さ
れ、それによつて内部の組織が粗になり、これが
マイクロ波加熱の中止により冷却されると内部が
減圧状態になり、その後の乾燥によりセルロース
基材の表面側の樹脂が内部に移行し、水分が殆ど
なく樹脂が均一に含浸された状態のプリプレグが
得られるようになると考えられる。そして、マイ
クロ波加熱を湿熱雰囲気中で行うことにより、マ
イクロ波の分布の均一化と対流による冷却防止効
果が得られるようになり、マイクロ波加熱による
効果が一層向上するようになる。 つぎに、この発明について詳しく説明する。 この発明で用いるセルロース基材としては、ク
ラフト原紙、コツトンリンター紙、模様紙、平織
綿布などセルロースを含む種々の基材があげられ
る。樹脂液としては、例えば、フエノール樹脂
(水溶性レゾール樹脂)、アミノ樹脂(ユリア、メ
ラミン)、不飽和ポリエステル樹脂またはエポキ
シ樹脂を適当な溶剤に溶かしたものがあげられ
る。特に溶剤を加えなくとも、上記樹脂にモノマ
ーが含まれていて、そのモノマーが溶剤の役目を
果すものであつてもよい。液状を呈する樹脂であ
ればそのままでも使用できる。なお、上記の溶剤
としては、水、メタノール、エタノール、アセト
ンまたはメチルエチルケトンを主成分とするもの
などがある。場合によつては、これらのうちの2
以上の溶剤が混ざつていてもよい。 樹脂液の濃度は、不揮発分(樹脂分)の含有量
がフエノール樹脂、アミノ樹脂の場合60〜100重
量%(以下「%」と略す)、エポキシ樹脂の場合
70〜100%であつても充分含浸させることが可能
であるが、実用上は70〜90%とするのが好まし
い。しかしながら、樹脂液の濃度はこのような範
囲に限定するものではなく、これよりも濃度の低
いもの、例えば40%程度の樹脂液を用いることが
できることはいうまでもない。 基材に樹脂液を含浸させる方法は、ロールコー
ター法、浸漬法、刷毛塗り法など種々の方法を採
用することができる。樹脂液の塗布に際しては、
樹脂液を基材の片面のみに塗布しておいてもよ
く、両面に塗布しておいてもよい。基材に含浸さ
せる樹脂液の量は、乾燥後のプリプレグの樹脂含
有量が10〜60%となるような範囲が好ましい。 プリプレグに対する湿熱雰囲気下におけるマイ
クロ波加熱は、公知のマイクロ波加熱装置を用
い、湿熱雰囲気中、例えば相対湿度100%の加熱
雰囲気中において行われる。加熱時間は、樹脂液
の種類や濃度、基材の厚み等に応じて適宜に選ば
れる。前もつてテストを行い最適な時間が選ばれ
る。この場合、マイクロ波加熱により、基材内部
の水分のみが直接加熱されるため通常の外部加熱
に比べて加熱時間を1/10〜1/100に短縮しうる。
すなわち、プリプレグの樹脂の温度は上昇せずに
水分の温度のみが上昇し気化してプリプレグ表面
より蒸散する。この蒸散によりセルロース基材の
内部組織が水分の蒸散によつて粗の状態となる。
湿熱雰囲気は、このマイクロ波加熱の効率を向上
させる。 マイクロ波加熱後の乾燥は、通常公知の熱風乾
燥機を用いて行われる。この熱風乾燥時には、セ
ルロース基材内部はマイクロ波加熱時よりも低温
になり、いわば冷却された状態となるため、基材
内部が減圧状態となり表面側の含浸樹脂が内部の
粗な状態の部分に浸透する。その結果、水分が殆
どなく、しかも樹脂が均一な状態で含浸されてい
るプリプレグが得られるようになる。 第1図はこの発明にかかる製法に供される装置
の実施例をあらわす。同図において、樹脂液槽1
1を通つたロールペーパなどの基材1は樹脂含浸
基材2となり、スクイズロール12を経て湿熱マ
イクロ波処理室13に送り込まれる。この室13
内には加温された湿り空気が保持されており、こ
こで樹脂含浸基材2に対し湿熱雰囲気下における
マイクロ波加熱が施される。この場合、湿熱マイ
クロ波処理室13の湿度は100%RHに設定され
ている。マイクロ波加熱は、樹脂含浸基材に対し
て加熱水蒸気を直接吹き付けながら行つてもよ
い。この湿熱雰囲気中におけるマイクロ波加熱に
より、樹脂含浸基材中の含浸樹脂の乾燥を防ぎな
がら基材中の水分のみを選択的に加熱し、基材外
に追い出しうるのである。そして、湿熱マイクロ
波処理室13を出た樹脂含浸基材2は乾燥機16
に送られ乾燥されて乾燥機16から出てくる。図
中、15はマイクロ波発振装置、17は乾燥機1
6内に吸入された空気を加熱するための蒸気加熱
エロフイン、18は排気ダクトである。 つぎに、実施例について比較例および従来例と
併せて説明する。 〔実施例、比較例および従来例〕 つぎの配合の樹脂を用意した。 (樹脂A) 臭素化エポキシ樹脂(大日本インキ化学工業社
製エピクロン153)
27重量部(以下「部」と略す) 鎖状エポキシ樹脂(大日本インキ化学工業社製
エピクロン1600) 10部 硬化剤 パラビニルフエノール 10部 促進剤 ベンジルジメチルアミン 0.005部 (樹脂B) ビスフエノールA型固型エポキシ樹脂(エポキ
シ当量475) 70部 液状エポキシ樹脂(エポキシ当量180) 18部 硬化剤 ジシアンジアミド 4部 促進剤 ベンジルジメチルアミン 0.1部 (樹脂C) ビスフエノールA型エポキシ樹脂(エピコート
828) 37部 硬化剤 パラビニルフエノール 10部 促進剤 ベンジルジメチルアミン 0.005部 (樹脂D) 撹拌器、温度計、冷却器を付したフラスコに、
フエノール940g(10モルに相当)、桐油470g、
パラトルエンスルホン酸1.75gを入れ、撹拌混合
した。この混合物を撹拌しながら加熱し、約40分
後に110℃とし、その後、30分間還流した。還流
後直ちに冷却し、約30分間で室温とした。これ
に、37%ホルムアルデヒド1095g(ホルムアルデ
ヒド13.5モルに相当)と25%アンモニア水27.2
(アンモニア0.4モルに相当)を添加し、充分に撹
拌混合した。この混合物を、撹拌を続けながら加
熱し、約30分間で沸とうさせ、その後60分間還流
した。還流終了後、直ちにフラスコ内を100〜150
mmHgの内圧に減じ、加熱を続けながら減圧脱水
し、樹脂を得た。得られた樹脂の樹脂含有率は87
%であつた。 (樹脂E) キシレンホルムアルデヒド樹脂(分子量450)
1700g、フエノール850gおよびパラトルエンス
ルホン酸4.0gを撹拌棒、冷却器を付した四つ口
フラスコに入れ、100〜105℃に加熱し30分間反応
させた後、脱水しながらさらに120分間反応させ
た。これを40℃まで冷却し、パラホルムアルデヒ
ド330g、トリエチルアミン5.2gおよび溶媒とし
てトルエン800gを加え、90℃で150分間反応さ
せ、つぎに減圧下で濃縮し、トルエン含有量20
%、樹脂含有率70%の樹脂を得た。 (樹脂F) 撹拌器、冷却器を付した四つ口フラスコ中で、
フエノール940g(10モルに相当)、80%ホルムア
ルデヒド488g(ホルムアルデヒド13モルに相
当)、アニリン15g(0.16モルに相当)および触
媒としてトリエチルアミン10.1g(0.1モルに相
当)を、100℃で90分間反応させ、アニリン変性
レゾール樹脂を得た。この樹脂の樹脂含有率は73
%であつた。 (樹脂G) 撹拌器、冷却器を付した四つ口フラスコ中で、
フエノール940g(10モルに相当)、55%ホルムア
ルデヒド655g(ホルムアルデヒド12モルに相当)
および触媒としてトリエチルアミン10.1g(0.1
モルに相当)を、100℃で45分間還流下で反応さ
せ、レゾール樹脂を得た。樹脂含有率は63%であ
つた。 〔実施例 1〕 樹脂Aをメチルエチルケトンで希釈して樹脂含
有率75%の樹脂液とした。基材として、密度0.52
g/cm3、厚み10ミルス(254μm)のコツトンリン
ター紙を用い、これに前記樹脂液を浸漬塗布した
樹脂含浸基材を100℃の水蒸気(100%RH)中に
おいて2450MHzのマイクロ波(5KW)で5秒間
処理した。しかるのち熱風乾燥を行い、樹脂含有
量50〜51%のプリプレグを得た。 〔実施例 2〕 樹脂Bをアセトンで希釈して樹脂含有率85%の
樹脂液とした。樹脂液として、この樹脂液を用い
たほかは、上記実施例1と同様な条件で処理し
て、樹脂含有量50〜51%のプリプレグを得た。 〔実施例 3〕 樹脂Cを、他の溶剤を添加することなく樹脂液
として用いた。これを密度0.48g/cm3、厚み20ミ
ルス(508μm)のコツトンリンター紙に浸漬塗布
し、ついで100℃の水蒸気中において2450MHzの
マイクロ波(5KW)を10秒間照射した。しかる
のち乾燥を行い、樹脂含有量51%のプリプレグを
得た。 〔実施例 4〕 樹脂Dをメタノールで希釈して樹脂含有率50%
の樹脂液とした。基材として、密度0.51g/cm3
厚み20ミルス(508μm)のクラフト原紙を用い、
これに前記樹脂液を浸漬塗布し、ついで100℃の
水蒸気を吹きつけながら2450MHzのマイクロ波
(5KW)を5秒間照射した。しかるのち熱風乾燥
を行い、樹脂含有量49〜50%のプリプレグを得
た。 〔実施例 5〕 樹脂Dをメタノールで希釈して樹脂含有率65%
の樹脂液とした。基材として、密度0.45g/cm3
厚み30ミルス(762μm)のクラフト原紙を用い、
これに前記樹脂液を浸漬塗布し、ついで100℃の
水蒸気を吹きつけながら2450MHzのマイクロ波
(5KW)を5秒間照射した。しかるのち高周波加
熱装置を用いて乾燥を行い、樹脂含有量50〜51%
のプリプレグを得た。 〔実施例 6〕 実施例5で用いた樹脂液を、密度0.65g/cm3
厚み13ミルス(330μm)のクラフト原紙に片面だ
け塗布し、ついで100℃の水蒸気を吹きつけなが
ら2450MHzのマイクロ波(5KW)を10秒間照射
した。しかるのち熱風乾燥を行い、樹脂含有量48
〜50%のプリプレグを得た。 〔実施例 7〕 樹脂Dをメタノールで希釈して樹脂含有率75%
の樹脂液とした。基材として、密度0.68g/cm3
厚み20ミルス(508μm)のクラフト原紙を用い、
その他は実施例4と同様な条件で処理して、樹脂
含有量49〜50%のプリプレグを得た。 〔実施例 8〕 樹脂Dをメタノールで希釈して樹脂含有率80%
の樹脂液とした。基材として、密度0.51g/cm3
厚み10ミルス(254μm)のクラフト原紙を用い、
これに前記樹脂液を浸漬塗布し、ついで100℃の
水蒸気を吹きつけながら2450MHzのマイクロ波
(5KW)を5秒間照射した。しかるのち熱風乾燥
し、樹脂含有量49%のプリプレグを得た。 〔実施例 9〕 樹脂Eをそのまま樹脂液として使用した。その
他は実施例8と同様な条件で処理してプリプレグ
を得た。 〔実施例 10〕 樹脂Gをそのまま樹脂液として用いた。基材と
して、密度0.47g/cm3、厚み10ミルス(254μm)
のコツトンリンター紙を用い、これに前記樹脂液
を浸漬塗布し、ついで100℃の水蒸気を吹きつけ
ながら2450MHzのマイクロ波(5KW)を10秒間
照射した。しかるのち熱風乾燥し、樹脂含有量46
%のプリプレグを得た。 〔実施例 11〕 樹脂Fをメタノールで希釈し、樹脂含有率70%
の樹脂液とした。そして、基材として平織綿布を
用い、これに前記樹脂液を浸漬塗布し、ついで
100℃の水蒸気雰囲気中で2450MHzのマイクロ波
(5KW)を15秒間照射した。しかるのち熱風乾燥
し、樹脂含有量50%のプリプレグを得た。 〔実施例 12〕 樹脂Dをメタノールで希釈し、樹脂含有率65%
の樹脂液とした。そして、基材として、密度0.51
g/cm3、厚み10ミルス(254μm)のクラフト原紙
を用い、これに前記樹脂液を浸漬塗布し、つい
で、水蒸気を吹き出して温度80℃、相対湿度50%
にした室に塗装基材を導き2450MHzのマイクロ波
(5KW)を10秒間照射した。しかるのち熱風乾燥
を行ない、樹脂含有量49%のプリプレグを得た。 〔実施例 13〕 水蒸気処理の条件を、温度60℃、相対湿度30%
の室内で5秒間処理することとした以外は、上記
実施例12と同様な条件で処理してプリプレグを得
た。 〔比較例 1〜11〕 実施例1〜11において、それぞれ対応する番号
の実施例の製造条件と同様な条件を用いたが、湿
熱マイクロ波処理は行なわず、樹脂液を塗布した
のち直ちに乾燥を行なつた。 〔従来例 1〕 樹脂Aをメチルエチルケトンで希釈して、樹脂
含有率65%の樹脂液とした。これを、密度0.52
g/cm3、厚み10ミルス(254μm)のコツトンリン
ター紙に浸漬塗布し、ついで乾燥を行ない、樹脂
含有量50〜51%のプリプレグを得た。 〔従来例 2〕 樹脂Dをメタノールで希釈して、樹脂含有率50
%の樹脂液とした。これを、密度0.50g/cm3、厚
み10ミルス(254μm)のクラフト原紙に浸漬塗布
し、ついで熱風乾燥を行ない、樹脂含有量49〜50
%のプリプレグを得た。 (積層板の製造) 上記各実施例、比較例、従来例で得られたプリ
プレグを、それぞれ所定枚数重ね合わせ、さら
に、その上から各1枚の接着剤付銅箔(厚み
35μm)を重ねて、金属プレートにはさみ常法に
より加熱成形して、製品である片面銅貼板を製作
した。製作条件は、第1表の通りであつた。 (性 能) 得られた片面銅貼板の性能を第2表に示す。
This invention relates to a method for manufacturing prepreg. Laminated boards such as paper-based copper-clad laminates are required to have highly insulating substrates. Since this substrate is made of prepreg, which is a cellulose base material impregnated with a resin liquid, moisture that impairs electrical insulation is removed from the prepreg during production of the laminate. That is, moisture in the prepreg is removed by heating the prepreg with hot air, steam, electric heat, or the like. However, the moisture in this prepreg is due to the 7 to 10% moisture contained in the cellulose base material, and because the cellulose base material itself is highly hydrophilic, it is difficult to use the external heating method described above. It cannot be easily removed. Furthermore, when the temperature is high, such as 130° C. or higher, a keratinization phenomenon occurs and the base material becomes brittle. Moreover, according to the external heating method, the impregnated resin of the prepreg is cured first, so there is a limit to how much water can be removed. Therefore, the obtained laminate had a problem in electrical insulation (particularly electrical insulation after boiling). It has been considered to use a thin cellulose base material, but this also poses a problem, as this would result in poor productivity and increased costs. Therefore, as a result of repeated research to solve these problems, the inventor developed a resin-impregnated base material (prepreg) in which a cellulose base material is impregnated with a resin liquid.
The inventors have discovered that the desired objective can be achieved by applying microwave heating to a material under a moist heat atmosphere and then drying it, and have thus arrived at this invention. That is, the gist of the present invention is to subject a resin-impregnated base material, which is a cellulose base material impregnated with a resin liquid, to microwave heating in a moist heat atmosphere, and then to dry it. Traditionally used infrared heating is 10 -4 to 10 -6 m
In contrast, the microwave heating of the present invention is in the wavelength range of 1 to 10 -1 m. The reason why the present invention provides good results is considered to be due to the following reasons. In other words, by heating the resin-impregnated base material (prepreg) with microwaves, only the water in the cellulose base material is selectively heated (internal heating), vaporized, and discharged to the outside, thereby coarsening the internal structure. When this was cooled by stopping the microwave heating, the inside was in a reduced pressure state, and the resin on the surface side of the cellulose base material was transferred to the inside by subsequent drying, and the resin was evenly impregnated with almost no moisture. It is thought that it will become possible to obtain a prepreg of the same condition. By performing microwave heating in a moist heat atmosphere, it becomes possible to obtain a uniform distribution of microwaves and a cooling prevention effect due to convection, thereby further improving the effect of microwave heating. Next, this invention will be explained in detail. Examples of the cellulose base material used in this invention include various base materials containing cellulose, such as kraft paper, cotton linter paper, patterned paper, and plain-woven cotton cloth. Examples of the resin liquid include those obtained by dissolving a phenolic resin (water-soluble resol resin), an amino resin (urea, melamine), an unsaturated polyester resin, or an epoxy resin in a suitable solvent. Even if no particular solvent is added, the resin may contain a monomer and the monomer may serve as a solvent. Any resin that exhibits a liquid state can be used as is. Note that the above-mentioned solvents include those containing water, methanol, ethanol, acetone, or methyl ethyl ketone as a main component. In some cases, two of these
The above solvents may be mixed. The concentration of the resin liquid is such that the non-volatile content (resin content) is 60 to 100% by weight (hereinafter abbreviated as "%") for phenolic resins and amino resins, and for epoxy resins.
Although it is possible to achieve sufficient impregnation even at a concentration of 70 to 100%, it is preferably 70 to 90% in practice. However, the concentration of the resin liquid is not limited to this range, and it goes without saying that a resin liquid with a lower concentration than this, for example, about 40%, can be used. Various methods can be used to impregnate the base material with the resin liquid, such as a roll coater method, a dipping method, and a brush coating method. When applying resin liquid,
The resin liquid may be applied to only one side of the base material, or may be applied to both sides. The amount of resin liquid impregnated into the base material is preferably in a range such that the resin content of the prepreg after drying is 10 to 60%. Microwave heating of the prepreg in a moist heat atmosphere is performed using a known microwave heating device in a moist heat atmosphere, for example, in a heating atmosphere with a relative humidity of 100%. The heating time is appropriately selected depending on the type and concentration of the resin liquid, the thickness of the base material, and the like. Tests are conducted in advance to select the most suitable time. In this case, by microwave heating, only the moisture inside the base material is directly heated, so the heating time can be shortened to 1/10 to 1/100 compared to normal external heating.
That is, the temperature of the resin of the prepreg does not rise, but only the temperature of the water rises, vaporizes, and evaporates from the surface of the prepreg. This evaporation causes the internal structure of the cellulose base material to become coarse due to the evaporation of water.
A moist heat atmosphere improves the efficiency of this microwave heating. Drying after microwave heating is usually performed using a known hot air dryer. During this hot air drying, the inside of the cellulose base material is at a lower temperature than during microwave heating, and is in a cooled state, so the inside of the base material is under reduced pressure, and the impregnated resin on the surface side is transferred to the rough areas inside. Penetrate. As a result, a prepreg with almost no moisture and uniformly impregnated with resin can be obtained. FIG. 1 shows an embodiment of an apparatus used for the manufacturing method according to the present invention. In the same figure, resin liquid tank 1
A base material 1 such as a roll paper passed through the wafer 1 becomes a resin-impregnated base material 2, and is fed into a moist heat microwave processing chamber 13 via a squeeze roll 12. This room 13
Warmed humid air is held inside, and the resin-impregnated base material 2 is subjected to microwave heating in a moist heat atmosphere. In this case, the humidity in the moist heat microwave processing chamber 13 is set to 100% RH. Microwave heating may be performed while directly spraying heated steam onto the resin-impregnated base material. By microwave heating in this moist heat atmosphere, only the moisture in the base material can be selectively heated and expelled from the base material while preventing the impregnated resin in the resin-impregnated base material from drying. Then, the resin-impregnated base material 2 that has left the wet heat microwave treatment chamber 13 is placed in a dryer 16.
It is sent to dryer 16, dried, and comes out from dryer 16. In the figure, 15 is a microwave oscillator, 17 is a dryer 1
18 is an exhaust duct. Next, examples will be described together with comparative examples and conventional examples. [Examples, Comparative Examples, and Conventional Examples] A resin having the following formulation was prepared. (Resin A) Brominated epoxy resin (Epicron 153 manufactured by Dainippon Ink Chemical Industries, Ltd.)
27 parts by weight (hereinafter referred to as "parts") Chain epoxy resin (Epiclon 1600 manufactured by Dainippon Ink and Chemicals) 10 parts Curing agent Paravinylphenol 10 parts Accelerator Benzyldimethylamine 0.005 parts (Resin B) Bisphenol type A Solid epoxy resin (epoxy equivalent: 475) 70 parts Liquid epoxy resin (epoxy equivalent: 180) 18 parts Curing agent Dicyandiamide 4 parts Accelerator Benzyldimethylamine 0.1 part (Resin C) Bisphenol A type epoxy resin (Epicoat)
828) 37 parts Hardening agent Paravinylphenol 10 parts Accelerator Benzyldimethylamine 0.005 parts (Resin D) In a flask equipped with a stirrer, thermometer, and condenser,
940g of phenol (equivalent to 10 moles), 470g of tung oil,
1.75 g of para-toluenesulfonic acid was added and mixed with stirring. The mixture was heated with stirring to 110° C. after about 40 minutes and then refluxed for 30 minutes. Immediately after refluxing, the mixture was cooled to room temperature in about 30 minutes. In addition, 1095 g of 37% formaldehyde (equivalent to 13.5 moles of formaldehyde) and 27.2 g of 25% aqueous ammonia are added.
(equivalent to 0.4 mol of ammonia) was added and thoroughly stirred and mixed. The mixture was heated with continued stirring to boiling for approximately 30 minutes and then refluxed for 60 minutes. Immediately after refluxing, pump the inside of the flask to 100 to 150 ml.
The internal pressure was reduced to mmHg, and dehydration was performed under reduced pressure while continuing heating to obtain a resin. The resin content of the obtained resin is 87
It was %. (Resin E) Xylene formaldehyde resin (molecular weight 450)
1700 g, 850 g of phenol, and 4.0 g of para-toluenesulfonic acid were placed in a four-necked flask equipped with a stirring bar and a condenser, heated to 100-105°C, reacted for 30 minutes, and then reacted for an additional 120 minutes while dehydrating. . This was cooled to 40°C, 330g of paraformaldehyde, 5.2g of triethylamine and 800g of toluene were added as a solvent, reacted at 90°C for 150 minutes, and then concentrated under reduced pressure to reduce the toluene content to 20%.
%, a resin with a resin content of 70% was obtained. (Resin F) In a four-necked flask equipped with a stirrer and a condenser,
940 g of phenol (equivalent to 10 mol), 488 g of 80% formaldehyde (equivalent to 13 mol of formaldehyde), 15 g of aniline (equivalent to 0.16 mol) and 10.1 g of triethylamine (equivalent to 0.1 mol) as a catalyst were reacted at 100°C for 90 minutes. , an aniline-modified resol resin was obtained. The resin content of this resin is 73
It was %. (Resin G) In a four-necked flask equipped with a stirrer and a condenser,
940 g of phenol (equivalent to 10 moles), 655 g of 55% formaldehyde (equivalent to 12 moles of formaldehyde)
and 10.1 g (0.1
(corresponding to moles) were reacted under reflux at 100°C for 45 minutes to obtain a resol resin. The resin content was 63%. [Example 1] Resin A was diluted with methyl ethyl ketone to obtain a resin liquid with a resin content of 75%. As a base material, density 0.52
g/cm 3 , 10 mils (254 μm) thick cotton linter paper, the resin-impregnated base material was dip-coated with the resin solution and heated with 2450 MHz microwave (5 KW) in water vapor at 100°C (100% RH). ) for 5 seconds. Thereafter, hot air drying was performed to obtain a prepreg with a resin content of 50 to 51%. [Example 2] Resin B was diluted with acetone to obtain a resin liquid with a resin content of 85%. A prepreg with a resin content of 50 to 51% was obtained by processing under the same conditions as in Example 1, except that this resin liquid was used as the resin liquid. [Example 3] Resin C was used as a resin liquid without adding any other solvent. This was applied by dip coating onto cotton linter paper having a density of 0.48 g/cm 3 and a thickness of 20 mils (508 μm), and then irradiated with 2450 MHz microwave (5 KW) for 10 seconds in water vapor at 100°C. After that, it was dried to obtain a prepreg with a resin content of 51%. [Example 4] Resin D was diluted with methanol to give a resin content of 50%.
It was made into a resin liquid. As a base material, density 0.51g/cm 3 ,
Using kraft paper with a thickness of 20 mils (508 μm),
The resin liquid was applied by dip coating, and then 2450MHz microwave (5KW) was irradiated for 5 seconds while spraying water vapor at 100°C. Thereafter, hot air drying was performed to obtain a prepreg with a resin content of 49 to 50%. [Example 5] Resin D was diluted with methanol to give a resin content of 65%.
It was made into a resin liquid. As a base material, density 0.45g/cm 3 ,
Using kraft paper with a thickness of 30 mils (762 μm),
The resin liquid was applied by dip coating, and then 2450MHz microwave (5KW) was irradiated for 5 seconds while spraying water vapor at 100°C. Afterwards, it is dried using a high-frequency heating device to reduce the resin content to 50-51%.
prepreg was obtained. [Example 6] The resin liquid used in Example 5 had a density of 0.65 g/cm 3 ,
It was coated on only one side of 13 mils (330 μm) thick kraft paper, and then irradiated with 2450 MHz microwave (5 KW) for 10 seconds while spraying water vapor at 100°C. Afterwards, hot air drying is performed to reduce the resin content to 48.
~50% prepreg was obtained. [Example 7] Resin D was diluted with methanol to give a resin content of 75%.
It was made into a resin liquid. As a base material, density 0.68g/cm 3 ,
Using kraft paper with a thickness of 20 mils (508 μm),
Other conditions were the same as in Example 4 to obtain a prepreg with a resin content of 49 to 50%. [Example 8] Resin D was diluted with methanol to achieve a resin content of 80%.
It was made into a resin liquid. As a base material, density 0.51g/cm 3 ,
Using kraft paper with a thickness of 10 mils (254 μm),
The resin liquid was applied by dip coating, and then 2450MHz microwave (5KW) was irradiated for 5 seconds while spraying water vapor at 100°C. Thereafter, it was dried with hot air to obtain a prepreg with a resin content of 49%. [Example 9] Resin E was used as it was as a resin liquid. The other conditions were the same as in Example 8 to obtain a prepreg. [Example 10] Resin G was used as it was as a resin liquid. As a base material, density 0.47g/ cm3 , thickness 10mils (254μm)
The resin solution was dip-coated using Kotsuton linter paper, and then 2450 MHz microwave (5 KW) was irradiated for 10 seconds while spraying water vapor at 100°C. After that, it is dried with hot air and the resin content is 46.
% prepreg was obtained. [Example 11] Resin F was diluted with methanol to give a resin content of 70%.
It was made into a resin liquid. Then, using a plain-woven cotton cloth as a base material, the resin liquid was dip-coated onto it, and then
2450MHz microwave (5KW) was irradiated for 15 seconds in a steam atmosphere at 100℃. Thereafter, it was dried with hot air to obtain a prepreg with a resin content of 50%. [Example 12] Resin D was diluted with methanol to give a resin content of 65%.
It was made into a resin liquid. And as a base material, density 0.51
g/cm 3 and 10 mils (254 μm) thick kraft paper, the above resin solution was applied by dip coating, and then water vapor was blown out at a temperature of 80°C and a relative humidity of 50%.
The coated substrate was introduced into a chamber where the coating was heated and irradiated with 2450MHz microwaves (5KW) for 10 seconds. Thereafter, hot air drying was performed to obtain a prepreg with a resin content of 49%. [Example 13] The conditions for steam treatment were a temperature of 60°C and a relative humidity of 30%.
A prepreg was obtained by processing under the same conditions as in Example 12, except that the processing was carried out in a room for 5 seconds. [Comparative Examples 1 to 11] In Examples 1 to 11, the same manufacturing conditions as those of the correspondingly numbered examples were used, but the wet heat microwave treatment was not performed and the resin liquid was applied and then dried immediately. I did it. [Conventional Example 1] Resin A was diluted with methyl ethyl ketone to obtain a resin liquid with a resin content of 65%. This has a density of 0.52
g/cm 3 and 10 mils (254 μm) thick cotton linter paper by dip coating, followed by drying to obtain a prepreg with a resin content of 50 to 51%. [Conventional example 2] Resin D was diluted with methanol to a resin content of 50
% resin liquid. This was applied by dip coating onto kraft base paper with a density of 0.50 g/cm 3 and a thickness of 10 mils (254 μm), and then dried with hot air to obtain a resin content of 49 to 50.
% prepreg was obtained. (Manufacture of laminates) A predetermined number of prepregs obtained in each of the above Examples, Comparative Examples, and Conventional Examples are stacked one on top of the other, and one piece of adhesive-coated copper foil (thickness
35 μm), sandwiched between metal plates, and heated and formed using a conventional method to produce a product, a single-sided copper clad plate. The manufacturing conditions were as shown in Table 1. (Performance) Table 2 shows the performance of the obtained single-sided copper clad board.

【表】【table】

【表】【table】

【表】【table】

【表】 第2表より、実施例品は、比較例品および従来
例品に比べて性能が優れていることがわかる。 以上のように、この発明は、セルロース基材に
樹脂液を含浸させた樹脂含浸基材に対して、湿熱
雰囲気下においてマイクロ波加熱を施したのち乾
燥することを特徴とするため、コストアツプを招
くことなく、水分がほぼ完全に除去され樹脂が均
一な含浸状態になつているプリプレグを得ること
ができる。
[Table] From Table 2, it can be seen that the Example product has superior performance compared to the Comparative Example product and the Conventional Example product. As described above, the present invention is characterized in that a resin-impregnated base material, which is a cellulose base material impregnated with a resin liquid, is subjected to microwave heating in a moist heat atmosphere and then dried, which increases costs. It is possible to obtain a prepreg in which water is almost completely removed and the resin is uniformly impregnated without any problem.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の実施に用いる装置の構成図
である。 1……基材、2……樹脂含浸基材、12……ス
クイズロール、13……湿熱マイクロ波処理室、
15……マイクロ波発振装置、16……乾燥器、
17……蒸気加熱エロフイン、18……排気ダク
ト。
FIG. 1 is a block diagram of an apparatus used for carrying out the present invention. 1...Base material, 2...Resin-impregnated base material, 12...Squeeze roll, 13...Moist heat microwave treatment chamber,
15...Microwave oscillation device, 16...Dryer,
17... Steam heating erofine, 18... Exhaust duct.

Claims (1)

【特許請求の範囲】 1 セルロース基材に樹脂液を含浸させた樹脂含
浸基材に対して、湿熱雰囲気下においてマイクロ
波加熱を施したのち乾燥することを特徴とするプ
リプレグの製法。 2 湿熱雰囲気が、相対湿度100%の加熱蒸気雰
囲気である特許請求の範囲第1項記載のプリプレ
グの製法。
[Scope of Claims] 1. A prepreg manufacturing method, which comprises subjecting a resin-impregnated base material, which is a cellulose base material impregnated with a resin liquid, to microwave heating in a moist heat atmosphere and then drying the base material. 2. The prepreg manufacturing method according to claim 1, wherein the moist heat atmosphere is a heated steam atmosphere with a relative humidity of 100%.
JP17268282A 1982-09-30 1982-09-30 Preparation of prepreg Granted JPS5962111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17268282A JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17268282A JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Publications (2)

Publication Number Publication Date
JPS5962111A JPS5962111A (en) 1984-04-09
JPS6311124B2 true JPS6311124B2 (en) 1988-03-11

Family

ID=15946405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17268282A Granted JPS5962111A (en) 1982-09-30 1982-09-30 Preparation of prepreg

Country Status (1)

Country Link
JP (1) JPS5962111A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5139861A (en) * 1990-06-21 1992-08-18 E. I. Du Pont De Nemours And Company Process for bonding blends of cellulosic pulp and fusible synthetic pulp or fiber by high-speed dielectric heating and products produced thereby
JP4736275B2 (en) * 2001-08-23 2011-07-27 日立化成工業株式会社 Manufacturing method of prepreg
DE102008032053A1 (en) * 2008-07-08 2010-01-14 Kaindl Decor Gmbh Method and apparatus for drying and precondensing impregnates formed from resin impregnated sheet-like sheet material; Melamine resin-free impregnate

Also Published As

Publication number Publication date
JPS5962111A (en) 1984-04-09

Similar Documents

Publication Publication Date Title
US5837355A (en) Multilayer printed circuit board and process for producing and using the same
JPS6311124B2 (en)
EP0048945A2 (en) Production of metal clad laminates
JPS58219005A (en) Method of impregnating treating liquid
JPS6223015B2 (en)
CN115028869B (en) Polyimide paper-based prepreg and copper-clad plate prepared from same
JP2002194692A (en) Method for producing aramid paper and method for producing laminate for printed wiring board
JPS633742B2 (en)
JPS59140024A (en) Impregnating machine
JP3211382B2 (en) Prepreg manufacturing method and electrical laminate
JPS6326133B2 (en)
JPH1177892A (en) Manufacture of copper-card laminate
JPS63270745A (en) Production of paper base phenolic resin laminate
JP2000064167A (en) Non-woven fabric for laminated board
JPH1191055A (en) Laminate
JPH07214554A (en) Method and apparatus for preparing preparing
JPS6345697B2 (en)
JPS59129233A (en) Treating agent for cellulose substrate for use in unsaturated polyester laminate for electrical equipment
JP2002225056A (en) Method for producing composite laminate
JPH09227699A (en) Production of prepreg
JPS58183251A (en) Manufacture of laminated board
JPS6346101B2 (en)
JPH1142637A (en) Production of prepreg
JPS59192567A (en) Manufacture of laminated board
JPH10324755A (en) Resin-impregnated base material and method for producing the same, laminate and method for producing the same