JPS6313288B2 - - Google Patents
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- Publication number
- JPS6313288B2 JPS6313288B2 JP53121723A JP12172378A JPS6313288B2 JP S6313288 B2 JPS6313288 B2 JP S6313288B2 JP 53121723 A JP53121723 A JP 53121723A JP 12172378 A JP12172378 A JP 12172378A JP S6313288 B2 JPS6313288 B2 JP S6313288B2
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- Japan
- Prior art keywords
- wet paper
- particles
- polymer
- pulp
- short fibers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- Laminated Bodies (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Description
本発明は一般的に変圧器、リアクトル等の電磁
誘導器に用いられる油浸絶縁用ボードに係るもの
で、詳しくは帆用性のある耐熱性のすぐれた積層
絶縁用ボードの製造方法に関するものである。
近年変圧器の小型軽量化、難燃化が要求されて
おり、このために耐熱性のある絶縁材料が求めら
れてきた。芳香族ポリアミドは高い耐熱性とすぐ
れた電気特性を有することから、これらの用途に
最も適した材料であることが認められ、上記重合
体よりなるシートが使われ始めている。
上記シートはいずれも、芳香族ポリアミドより
なる短繊維と芳香族ポリアミドよりなる木材パル
プに類似した形状を有するパルプ状粒子とを混合
し、通常の抄紙機で抄造されたものであり、密度
が約0.3g/cm3を低く、厚さも0.5mm以下に限られ
ており、変圧器用の構造絶縁材料として用いるた
めには、これらを積層してボード状にする必要が
ある。
積層法としては、接着剤を用いる方法と、高温
高圧でシートを熱融着する方法がある。前者はシ
ートに耐熱性のある接着剤を塗布して積層し、加
熱加圧する方法に於て、接着剤として、芳香族ポ
リアミドを溶解する溶剤を塗布或は含浸すること
が提案されているが、使用する溶剤の毒性のため
環境面での対策を必要とし、又均一な内部構造を
持つボードが得られず、強度及び毒性が不満足で
あるという欠点を有する。又積層ボードの熱特性
は使用した接着剤のそれに支配され、いかに耐熱
性のある接着剤といえども芳香族系重合体よりも
耐熱性が劣り、高温で熱分解しガスを発生し絶縁
油を含浸させた系で結果としてコロナ放電が発生
しやすくなるという欠点を有する。
後者の熱融着による積層法の一例としては、例
えば、芳香族ポリアミドからなるシートを積層し
芳香族ポリアミドの軟化点付近の温度である280
〜300℃、70〜200Kg/cm2というような高温高圧で
熱圧着することが必要で、その結果高密度化し油
浸性が著しく損われる欠点があつた。
他の接着剤を使用しない積層法としては、芳香
族系重合体からなるパルプ状粒子と該重合体から
なる短繊維及び/又は無機質の短繊維と混合した
水性スラリーから湿式抄造によつて湿紙を形成
し、該湿紙の水分含有率を50〜95%に調整した湿
紙を任意の枚数積層して後、加熱加圧下に脱水乾
燥する、所謂抄造工程上の一体成形法はすでに本
発明者の一人が提案した「油浸絶縁用ボードの製
造方法」特公昭57−46163号公報がある。
本発明は前記接着剤による欠点を克服し、更に
上記一体形成法とは異なつたより汎用性のある優
れた絶縁油含浸性を持ち、かつコロナ放電のもと
となる熱分解ガスなどの発生しない積層絶縁ボー
ドを得る積層方法に基くもので、特公昭57−
46163号公報によつて得られる絶縁ボード2枚以
上を芳香族系重合体からなるパルプ状粒子又は芳
香族系重合体からなるパルプ状粒子及び短繊維の
混合水性スラリーより抄紙して得られた湿紙を用
いて、積層する方法を提案するものである。
すなわち、本発明は、芳香族系重合体からなる
パルプ状粒子と該重合体からなる短繊維及び/又
は無機質の短繊維とを混合した水性スラリーから
湿式抄造によつて湿紙を形成し、該湿式の水分含
有率を50〜95%に調整した湿紙を任意の枚数積層
して後、加熱加圧下に脱水乾燥して一体化した絶
縁ボードを2以上積層するに際し、該ボードの層
間に水分30%以上を有する芳香族系重合体湿紙
で、該湿紙が濾水度80〜300ml(カナデイアン・
スタンダード・フリーネス)のパルプ状粒子又は
該パルプ状粒子及び芳香族系重合体の短繊維から
なり、厚さが100〜500μmであるものを1以上介
在せしめたのち、該重合体の軟化点より80〜160
℃低い温度、30Kg/cm2以上の圧力にて熱圧接着す
ることを特徴とする積層絶縁用ボードの製造方法
である。
ここでいう芳香族系重合体湿紙は、上記絶縁用
ボードを接着させるのに際し重要なものである。
即ち、従来絶縁ボードの接着剤として用いられ
ていたエポキシ系、シリコーン系及びホウ素フツ
素系接着剤を使用することなく該湿紙の含水分を
利用して、該ボードを熱圧時水和作用により接着
せしめることに特徴づけられる。
従つて、該湿紙の含水分の臨界値は得られる積
層絶縁ボードの接着強度と密なる関係を有し、含
水分が20%より低い場合熱圧をあげても、充分な
水和作用を呈することができず、結果として接着
強度を満足しない。本発明者らの実験に於ては、
熱圧及び時間との相関性から、画一的な限定要素
は欠くものの好ましい含水分は30%以上が実用的
であると確認された。加熱温度は芳香族重合体の
有する軟化点より低い温度で行うべきである。一
般的に重合体の軟化点より50℃以上低い範囲であ
り、好ましくは80℃〜160℃低い温度にて行なう
とよい。160℃以上低い温度では、接着強度が充
分でなく、逆に軟化点により近いか、それ以上に
なると積層されるべき絶縁ボードにブリスターが
起こり不都合である。好ましい加圧は30Kg/cm2以
上であり、30Kg/cm2以下だと接着力が不充分で作
業性の低下につながり、逆に300Kg/cm2以上では
密度が高くなることで、油含浸性に不都合をきた
す。これらの加熱圧は、上記の範囲にて適宜選択
されるべきものであるが、一般的に160℃の75
Kg/cm2で30分の加熱圧を中心に適応される。
かかる芳香族系重合体湿紙の代表的な製法の一
つは本発明者の一人が先に提案した発明の名称
「電気絶縁用薄紙の製造方法」(特公昭57−46164
号公報)に示されている。
この湿紙は通常抄紙工程で抄紙に適する範囲の
濾水度で80ml〜300ml(カナデイアン・スタンダ
ード・フリーネス)の芳香族系重合体からなるパ
ルプ状粒子又は該パルプ状粒子と芳香族系重合体
からなる短繊維を組合せたものからなるもので、
パルプ状粒子と該短繊維の配合比は10:0〜2:
8で可能であり、好ましくは10:0〜4:6の範
囲であり、該短繊維を8以上混合することは湿紙
強度を低下させ、積層作業能率を悪化させるので
好ましくはない。
その厚みは通常500μm以下のものを1又は2枚
以上重ね合せせて使用すればよく、約200μmのも
のを2〜3枚重ね合せると好適である。
次に上述芳香族系重合体湿紙により積層される
絶縁ボードは芳香族系重合体のパルプ状粒子と該
重合体及び/又は無機質の短繊維からなるもので
あり、その代表的な製法は前述した「油浸絶縁用
ボードの製造方法」(特公昭57−46163号公報)に
示された芳香族系重合体からなるパルプ状粒子と
該重合体からなる短繊維及び/又は無機質の短繊
維と混合した水性スラリーから湿式抄造によつて
湿紙を形成し、該湿紙の水分含有率を50〜95%に
調整した湿紙を任意の枚数重ね合せて後、加熱加
圧下に脱水乾燥して一体化することによつて作ら
れる。
湿紙の水分含有率が50%より少ないと、湿紙を
積層して乾燥した場合、紙層間の接着が弱く、一
体のボードとならない。又水分含有率が95%より
多いと、湿紙が崩れやすく、積層が困難である
し、加圧加熱中に亀裂が生ずる。
絶縁ボード及び湿紙に用いられる芳香族系重合
体のパルプ状粒子と該重合体の短繊維及び無機質
の短繊維とは次のようなものである。即ち、芳香
族系重合体は芳香族ポリアミド及び芳香族ポリイ
ミドであり、パルプ状粒子とは抄紙機を用いて紙
に似た構造物を作ることができる多数の突起を有
する繊維状、薄膜状又はリボン状構造の粒子をい
い、芳香族系重合体の溶液を沈澱剤中に導入して
微細な粒子として沈澱させることによつて得られ
る。これらの代表的な製法は特公昭37−5732号公
報に示される如くである。
上記パルプ状粒子と混合する短繊維は、芳香族
重合体からなる短繊維及び無機質の短繊維が用い
られる。該無機質の短繊維としては、ガラス、セ
ラミツク、アルミナ、ロツクウールのそれぞれの
繊維及び石綿等が好ましい。
即ち、本発明でいう油浸絶縁用ボードの属性か
ら、当然これらの短繊維は絶縁性を有するもので
あり、従つて同じ短繊維であつても、炭素繊維等
の導電性繊維は排除されるべきである。
又、芳香族系重合体よりなる短繊維の場合、該
重合体はパルプ状粒子と同一構造であつてもよい
し、異なつた構造であつてもよい。
短繊維は芳香族系重合体よりなる繊維のみでも
よいし、これと無機繊維とを混合してもよい。
又、無機繊維単独でもよい。
このようにして本発明は任意の芳香族系重合体
絶縁ボードを、任意の芳香族重合体湿紙を介して
接着することにより具現化することができ、得ら
れた積層絶縁ボードは公知の接着剤を使用するこ
となく、結果として含浸性、コロナ特性を満足す
ることからその利用価値は大であり、好ましい実
施態様は所望の厚さを有する積層絶縁ボードを容
易に提供しうることは勿論のこと、トランスに使
用した際、含浸油の通路として間欠的且つ不連続
に絶縁ボードを熱圧接合したもの所謂ワツシヤー
のスペーサーとして好適である。以下実施例を示
すが、本発明は特許請求の範囲の基き当業者をし
て各種具現化されうるものであり、これに限定さ
れるものではない。
実施例 1
(1) ボードの製造
硫酸中の対数粘度1.5のポリメタフエニレン
イソフタルアミド10部を塩化リチウム5部を含
むN−N−ジメチルアセトアミド90部に溶解
し、この溶液を高速かきまぜしているホモミキ
サー中のグリセリン水溶液に導入してパルプ状
粒子を得た。このパルプ状粒子の濾水度はカナ
デイアン・スタンダード・フリーネス80mlであ
つた。
一方、ポリメタフエニレンイソフタルアミド
を湿式紡紙し、沸騰水中で2.5倍延伸後処理を
して得た2デニールの繊維を6mmにカツトして
短繊維とした。上記パルプ状粒子60部と短繊維
40部を水に分散させてスラリーとし、円網抄紙
機で湿紙を形成させてフエルトに転移させ、吸
引して湿紙の水分含有率を90%にした。なお同
湿紙中の固形分重量は80g/m2であつた。この
ようにして得た湿紙を連続的に円筒に巻きつけ
ることによつて、30枚積層して円筒から取外
し、脱水を容易にするために金網をおいた鉄板
の間にはさんで140℃40Kg/cm2で40分間乾燥し、
2.85mmのボードを得た。
(2) 湿紙の製造
硫酸中の対数粘度が1.6であるポリメタフエ
ニレンイソフタルアミドを塩化リチウム5部を
含むジメチルアセトアミド(以下DMAC)に
溶解して、ポリマー濃度を15〜8%まで変えた
重合体溶液を得た。DMAC40%、塩化カルシ
ウム25%及び水35%からなる沈澱剤溶液を調整
し、重合体溶液1部に対し沈澱剤溶液30部の比
率で、ホモミキサー中で高速撹拌しながら接触
させて、パルプ状粒子を得た、ついで十分水洗
したのを純水中に分散して、0.21%濃度の水性
スラリーを調整し、抄紙して26g/m2の湿紙を
得た。
(3) 積層
(1)で得られた絶縁ボード2枚の間に(2)で得ら
れた湿紙をはさみ、120℃、30分の加熱、湿紙
水分70%の条件下で接着させたものの特性は以
下の通りであつた。
The present invention generally relates to an oil-immersed insulating board used in electromagnetic induction devices such as transformers and reactors, and specifically relates to a method for producing a laminated insulating board with excellent heat resistance and suitable for sail use. be. In recent years, transformers have been required to be smaller, lighter, and flame retardant, and for this reason, heat-resistant insulating materials have been required. Since aromatic polyamide has high heat resistance and excellent electrical properties, it has been recognized as the most suitable material for these uses, and sheets made of the above polymers have begun to be used. All of the above-mentioned sheets are made by mixing short fibers made of aromatic polyamide and pulp-like particles made of aromatic polyamide having a shape similar to wood pulp, and made using a normal paper machine, and have a density of about It is limited to a low value of 0.3 g/cm 3 and a thickness of 0.5 mm or less, and in order to use it as a structural insulation material for transformers, it is necessary to laminate them into a board shape. Lamination methods include a method using an adhesive and a method of heat-sealing sheets at high temperature and high pressure. The former is a method in which sheets are coated with a heat-resistant adhesive, laminated, and heated and pressed, and it has been proposed that the adhesive be coated or impregnated with a solvent that dissolves aromatic polyamide. It requires environmental measures due to the toxicity of the solvent used, and has disadvantages in that a board with a uniform internal structure cannot be obtained and its strength and toxicity are unsatisfactory. In addition, the thermal properties of laminated boards are controlled by the adhesive used, and no matter how heat-resistant the adhesive is, it is inferior to aromatic polymers, and it thermally decomposes at high temperatures, producing gas and causing insulating oil. It has the disadvantage that corona discharge tends to occur as a result in the impregnated system. As an example of the latter lamination method using heat fusion, for example, sheets made of aromatic polyamide are laminated at a temperature of 280°C, which is around the softening point of aromatic polyamide.
It is necessary to carry out thermocompression bonding at high temperatures and pressures such as ~300°C and 70~200 kg/cm 2 , which has the disadvantage of increasing density and significantly impairing oil immersion. As a lamination method that does not use other adhesives, wet paper making is performed by wet paper making from an aqueous slurry in which pulp-like particles made of an aromatic polymer are mixed with short fibers made of the polymer and/or short inorganic fibers. The present invention has already developed a so-called integrated molding method in the papermaking process, in which an arbitrary number of sheets of wet paper with a moisture content of 50 to 95% are laminated and then dehydrated and dried under heat and pressure. There is a ``Method for manufacturing an oil-immersed insulating board'' proposed by one of the researchers in Japanese Patent Publication No. 1983-46163. The present invention overcomes the drawbacks caused by the adhesive, and furthermore has superior insulating oil impregnation properties that are more versatile than the above-mentioned integral forming method, and does not generate pyrolysis gas, etc., which can cause corona discharge. It is based on the lamination method to obtain a laminated insulating board, and was published in 1983.
A wet paper obtained by paper-making two or more insulating boards obtained according to Publication No. 46163 from pulp-like particles made of an aromatic polymer or a mixed aqueous slurry of pulp-like particles made of an aromatic polymer and short fibers. This paper proposes a method of laminating paper. That is, the present invention forms a wet paper by wet papermaking from an aqueous slurry in which pulp-like particles made of an aromatic polymer and short fibers made of the polymer and/or short inorganic fibers are mixed. When laminating two or more insulating boards that have been laminated with an arbitrary number of sheets of wet paper with a wet moisture content adjusted to 50 to 95% and then dehydrated and dried under heat and pressure, moisture is removed between the layers of the boards. An aromatic polymer wet paper having a freeness of 30% or more, the wet paper has a freeness of 80 to 300ml (Canadian
After interposing one or more pulp-like particles of standard freeness or short fibers of the pulp-like particles and an aromatic polymer with a thickness of 100 to 500 μm, the softening point of the polymer is 80 ~160
This is a method for manufacturing a laminated insulating board, which is characterized by heat-pressure bonding at a temperature as low as 30°C and a pressure of 30 kg/cm 2 or more. The aromatic polymer wet paper referred to here is important in bonding the above-mentioned insulating board. That is, without using epoxy, silicone, or boron fluorine adhesives that have been conventionally used as adhesives for insulating boards, the water content of the wet paper is used to hydrate the board during hot pressing. It is characterized by adhesion. Therefore, the critical value of the moisture content of the wet paper has a close relationship with the adhesive strength of the resulting laminated insulating board, and if the moisture content is lower than 20%, even if the heat pressure is increased, sufficient hydration will not occur. As a result, the adhesive strength is not satisfied. In our experiments,
From the correlation with heat pressure and time, it was confirmed that a preferred water content of 30% or more is practical, although there are no uniform limiting factors. The heating temperature should be lower than the softening point of the aromatic polymer. Generally, the temperature is 50°C or more lower than the softening point of the polymer, preferably 80°C to 160°C lower. If the temperature is lower than 160°C, the adhesive strength will not be sufficient, and if the temperature is closer to or above the softening point, blistering will occur on the insulating boards to be laminated, which is disadvantageous. The preferred pressure is 30Kg/cm 2 or more; if it is less than 30Kg/cm 2 , the adhesive force will be insufficient and workability will be reduced, while if it is 300Kg/cm 2 or more, the density will increase and oil impregnation will occur. cause inconvenience. These heating pressures should be selected appropriately within the above range, but generally 75°C at 160°C.
Applicable to heating pressure for 30 minutes at Kg/ cm2 . One of the typical manufacturing methods for such aromatic polymer wet paper was proposed earlier by one of the present inventors under the title of ``Method for manufacturing thin paper for electrical insulation'' (Japanese Patent Publication No. 57-46164).
Publication No.). This wet paper is usually produced in the papermaking process by using pulp-like particles of 80 ml to 300 ml (Canadian Standard Freeness) of aromatic polymers or pulp-like particles and aromatic polymers with freeness within a range suitable for paper-making. It is made of a combination of short fibers,
The blending ratio of pulp particles and short fibers is 10:0 to 2:
8, preferably in the range of 10:0 to 4:6. Mixing 8 or more of the short fibers is not preferred because it lowers the strength of the wet paper and impairs lamination efficiency. Usually, one or two or more layers of 500 μm or less may be used, and it is preferable to use 2 to 3 layers of about 200 μm. Next, the insulating board laminated with the above-mentioned aromatic polymer wet paper is made of aromatic polymer pulp particles and the polymer and/or inorganic short fibers, and a typical manufacturing method thereof is as described above. Pulp-like particles made of an aromatic polymer and short fibers made of the polymer and/or inorganic short fibers shown in "Method for manufacturing oil-immersed insulation board" (Japanese Patent Publication No. 57-46163) Wet paper is formed from the mixed aqueous slurry by wet papermaking, the moisture content of the wet paper is adjusted to 50 to 95%, and any number of sheets of wet paper are stacked on top of each other, and then dehydrated and dried under heat and pressure. It is created by integrating. If the moisture content of the wet paper is less than 50%, when the wet paper is laminated and dried, the adhesion between the paper layers will be weak and the board will not form as a single piece. Moreover, if the moisture content is more than 95%, the wet paper paper will easily crumble, making lamination difficult and causing cracks during pressurization and heating. Pulp-like particles of aromatic polymers, short fibers of the polymer, and short inorganic fibers used in insulating boards and wet paper are as follows. That is, aromatic polymers are aromatic polyamides and aromatic polyimides, and pulp-like particles are fiber-like, thin-film-like, or It refers to particles with a ribbon-like structure, and is obtained by introducing a solution of an aromatic polymer into a precipitant to precipitate fine particles. Typical manufacturing methods for these are as shown in Japanese Patent Publication No. 37-5732. The short fibers to be mixed with the above-mentioned pulp-like particles include short fibers made of an aromatic polymer and short fibers made of an inorganic substance. As the inorganic short fibers, glass, ceramic, alumina, rock wool fibers, asbestos, etc. are preferable. That is, from the attributes of the oil-immersed insulating board referred to in the present invention, these short fibers naturally have insulating properties, and therefore, even if they are the same short fibers, conductive fibers such as carbon fibers are excluded. Should. Further, in the case of short fibers made of an aromatic polymer, the polymer may have the same structure as the pulp-like particles, or may have a different structure. The short fibers may be only fibers made of an aromatic polymer, or they may be mixed with inorganic fibers. Alternatively, the inorganic fiber may be used alone. In this way, the present invention can be realized by bonding any aromatic polymer insulating board through any aromatic polymer wet paper, and the resulting laminated insulating board can be bonded using any known adhesive. It has great utility value because it satisfies the impregnating properties and corona properties without using any agents, and the preferred embodiment can of course easily provide a laminated insulating board having a desired thickness. In particular, when used in a transformer, an insulating board is intermittently and discontinuously bonded under heat and pressure as a path for impregnated oil, and is suitable as a so-called washer spacer. Examples will be shown below, but the present invention can be embodied in various ways by those skilled in the art based on the scope of the claims, and is not limited thereto. Example 1 (1) Manufacture of board 10 parts of polymetaphenylene isophthalamide with a logarithmic viscosity of 1.5 in sulfuric acid was dissolved in 90 parts of N-N-dimethylacetamide containing 5 parts of lithium chloride, and this solution was stirred at high speed. Pulp-like particles were obtained by introducing the mixture into a glycerin aqueous solution in a homomixer. The freeness of the pulp-like particles was 80 ml Canadian Standard Freeness. On the other hand, 2-denier fibers obtained by wet-spinning polymetaphenylene isophthalamide and post-stretching them by 2.5 times in boiling water were cut into 6 mm lengths to obtain short fibers. 60 parts of the above pulp-like particles and short fibers
40 parts were dispersed in water to form a slurry, formed into a wet paper using a cylinder paper machine, transferred to felt, and vacuumed to bring the moisture content of the wet paper to 90%. The weight of solid content in the same wet paper was 80 g/m 2 . By continuously wrapping the wet paper obtained in this way around a cylinder, 30 sheets were laminated and removed from the cylinder, and heated to 140°C by sandwiching them between iron plates with a wire mesh to facilitate dehydration. Dry at 40Kg/ cm2 for 40 minutes,
I got a 2.85mm board. (2) Production of wet paper Polymetaphenylene isophthalamide, which has a logarithmic viscosity of 1.6 in sulfuric acid, was dissolved in dimethylacetamide (DMAC) containing 5 parts of lithium chloride, and the polymer concentration was varied from 15 to 8%. A polymer solution was obtained. A precipitant solution consisting of 40% DMAC, 25% calcium chloride, and 35% water was prepared and brought into contact with each other in a homomixer at a ratio of 30 parts of the precipitant solution to 1 part of the polymer solution while stirring at high speed to form a pulp. The particles were obtained, washed thoroughly with water, dispersed in pure water to prepare an aqueous slurry with a concentration of 0.21%, and paper-made to obtain a wet paper of 26 g/m 2 . (3) Lamination The wet paper obtained in step (2) was sandwiched between the two insulating boards obtained in step (1), and the two sheets were heated at 120°C for 30 minutes and bonded together under the conditions that the moisture content of the wet paper was 70%. The characteristics of the product were as follows.
【表】
実施例 2
実施例1に従い積層条件160℃、60分で75Kg/
cm2にて次の湿紙水分につき接着させたものの特性
次の通りであつた。[Table] Example 2 According to Example 1, lamination condition: 160℃, 60 minutes, 75Kg/
The properties of the wet paper bonded with the following moisture content at cm 2 were as follows.
【表】
実施例 3
実施例1に従い、積層条件220℃、60分で40
Kg/cm2及び湿紙水分を90%で行つた結果、3.3Kg
の接着強度を得た。これは充分に実用的である。
比較例 1
実施例1に従い、積層条件250℃、10Kg/cm2、
湿紙水分90%で、3分及び5分にて接着したもの
は、接着強度は満足するものの絶縁ボードにブリ
スターを起し又該ボードにめり込んで実用的では
なかつた。[Table] Example 3 According to Example 1, lamination conditions 220℃, 40 minutes in 60 minutes
Kg/cm 2 and wet paper moisture at 90%, 3.3Kg
The adhesive strength was obtained. This is quite practical. Comparative Example 1 According to Example 1, lamination conditions were 250°C, 10Kg/cm 2 ,
Wet paper paper with a moisture content of 90% and bonded for 3 minutes and 5 minutes had satisfactory bonding strength, but blistered on the insulating board and sank into the board, making it impractical.
Claims (1)
合体からなる短繊維及び/又は無機質の短繊維と
を混合した水性スラリーから湿式抄造によつて湿
紙を形成し、該湿紙の水分含有率を50〜95%に調
整した湿紙を任意の枚数積層して後、加熱加圧下
に脱水乾燥して一体化した絶縁ボードを2以上積
層するに際し、該ボードの層間に水分30%以上を
有する芳香族系重合体湿紙で、該湿紙が濾水度80
〜300ml(カナデイアン・スタンダード・フリー
ネス)のパルプ状粒子又は該パルプ状粒子及び芳
香族系重合体の短繊維からなり、厚さが100〜
500μmであるものを1以上介在せしめたのち、該
重合体の軟化点より80〜160℃低い温度、30Kg/
cm2以上の圧力にて熱圧接着することを特徴とする
積層絶縁用ボードの製造方法。1. A wet paper is formed by wet papermaking from an aqueous slurry in which pulp-like particles made of an aromatic polymer and short fibers made of the polymer and/or short inorganic fibers are mixed, and the water content of the wet paper is reduced. When laminating two or more insulating boards that have been laminated with an arbitrary number of sheets of wet paper with a moisture content adjusted to 50 to 95% and then dehydrated and dried under heat and pressure, the moisture content between the layers of the boards must be 30% or more. An aromatic polymer wet paper with a freeness of 80
~300ml (Canadian Standard Freeness) of pulp-like particles or pulp-like particles and short fibers of aromatic polymer, with a thickness of ~100ml
After intervening one or more particles having a diameter of 500 μm, the polymer is heated at a temperature 80 to 160°C lower than the softening point of the polymer, at a temperature of 30 kg/
A method for producing a laminated insulating board, characterized by bonding under heat and pressure at a pressure of cm 2 or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12172378A JPS5549811A (en) | 1978-10-03 | 1978-10-03 | Laminated insulating board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12172378A JPS5549811A (en) | 1978-10-03 | 1978-10-03 | Laminated insulating board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5549811A JPS5549811A (en) | 1980-04-10 |
| JPS6313288B2 true JPS6313288B2 (en) | 1988-03-24 |
Family
ID=14818279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12172378A Granted JPS5549811A (en) | 1978-10-03 | 1978-10-03 | Laminated insulating board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5549811A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6081399A (en) * | 1983-10-04 | 1985-05-09 | 三菱電機株式会社 | Inorganic paper |
| BR8501096A (en) * | 1984-03-14 | 1985-11-05 | Du Pont | PERFECT PRESSED CARD AND PROCESS FOR ITS PREPARATION |
| JPH07101569B2 (en) * | 1987-12-24 | 1995-11-01 | 帝人株式会社 | Method for manufacturing spacer for gas insulated transformer |
| JPH02261337A (en) * | 1989-03-31 | 1990-10-24 | Futaba Denki Kogyo Kk | Edible meat injector with defoamer |
-
1978
- 1978-10-03 JP JP12172378A patent/JPS5549811A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5549811A (en) | 1980-04-10 |
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