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JPS6315909B2 - - Google Patents
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JPS6315909B2 - - Google Patents

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Publication number
JPS6315909B2
JPS6315909B2 JP55133815A JP13381580A JPS6315909B2 JP S6315909 B2 JPS6315909 B2 JP S6315909B2 JP 55133815 A JP55133815 A JP 55133815A JP 13381580 A JP13381580 A JP 13381580A JP S6315909 B2 JPS6315909 B2 JP S6315909B2
Authority
JP
Japan
Prior art keywords
curing
heating furnace
cured
temperature
unsaturated polyester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55133815A
Other languages
Japanese (ja)
Other versions
JPS5757621A (en
Inventor
Masaharu Abe
Yasuo Fushiki
Masayuki Ooizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP55133815A priority Critical patent/JPS5757621A/en
Publication of JPS5757621A publication Critical patent/JPS5757621A/en
Publication of JPS6315909B2 publication Critical patent/JPS6315909B2/ja
Granted legal-status Critical Current

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  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Description

【発明の詳細な説明】 本発明は、不飽和ポリエステル樹脂系積層板の
連続的製造法、特に該樹脂の連続的硬化方法に係
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous method for manufacturing unsaturated polyester resin-based laminates, and in particular to a continuous method for curing the resin.

本発明者等は既に特開昭55−4838あるいは特開
昭55−53013において、積層板の連続的製造方を
開示した。これにより硬化の為の加熱温度として
50℃〜100℃及び50℃〜150℃は公知であるが、そ
の後本発明者は製品の品質及び生産性にすぐれし
かも不飽和ポリエステル樹脂系積層板の連続的製
造方法により適した該樹脂の連続的な硬化方法を
鋭意検討した結果、上記公知の条件に比してより
速い硬化速度、即ち生産速度を確保でき、しかも
十分に硬化を進めることができ、従つて優れた品
質の製品を製造できる方法を見い出し本発明に至
つた。
The present inventors have already disclosed a continuous method for manufacturing a laminate in JP-A-55-4838 or JP-A-55-53013. This allows the heating temperature for curing to be
Although 50°C to 100°C and 50°C to 150°C are known, the present inventor has developed a continuous method for producing unsaturated polyester resin laminates that is superior in product quality and productivity and is more suitable for continuous production of unsaturated polyester resin laminates. As a result of intensive research into new curing methods, we were able to secure a faster curing speed, i.e., production speed, compared to the above known conditions, and were able to proceed with curing sufficiently, making it possible to manufacture products of excellent quality. We found a method and arrived at the present invention.

即ち、不飽和ポリエステル樹脂を主成分とする
室温で液状の熱硬化性樹脂液を連続的に搬送され
る複数のシート状基材に含浸し、続いて該樹脂含
浸基材を連続的に積層し、引き続き連続的に加熱
硬化せしめる積層板の連続製造方法において、雰
囲気温度が60℃以上140℃以下の第1の加熱炉で
硬化せしめた後、雰囲気温度が140℃以上で190℃
以下の第2の加熱炉で後硬化する不飽和ポリエス
テル樹脂系積層板の硬化方法である。
That is, a plurality of continuously conveyed sheet-like base materials are impregnated with a thermosetting resin liquid that is liquid at room temperature and whose main component is an unsaturated polyester resin, and then the resin-impregnated base materials are continuously laminated. , in a continuous production method of a laminate in which the laminate is continuously heated and cured, after curing in a first heating furnace at an ambient temperature of 60°C or higher and 140°C or lower, the temperature is 190°C at an ambient temperature of 140°C or higher.
This is a method of curing an unsaturated polyester resin laminate, which is post-cured in the following second heating furnace.

本発明でいう不飽和ポリエステル樹脂系積層板
とは、特に電気用途を目的とした積層絶縁板ある
いは印刷回路板用金属箔張り積層板をさすが、こ
れに制限されるものではない。
The unsaturated polyester resin laminate referred to in the present invention refers to a laminated insulating board or a metal foil-covered laminate for printed circuit boards particularly intended for electrical purposes, but is not limited thereto.

本発明にいう不飽和ポリエステル樹脂を主成分
とする室温で液状の熱硬化性樹脂液とは、不飽和
多塩基酸、飽和多塩基酸及び多価アルコールを主
原料とした不飽和ポリエステル鎖と架橋用ビニル
モノマーとの混合物に、その他硬化用触媒や必要
に応じて硬化助剤、フイラー及び難燃剤、各種安
定剤、改質剤等を混合したものである。該不飽和
ポリエステル鎖がハロゲンを含む難燃性樹脂であ
ることは差しつかえない。
The thermosetting resin liquid which is liquid at room temperature and whose main component is an unsaturated polyester resin as used in the present invention refers to an unsaturated polyester chain and crosslinking whose main ingredients are an unsaturated polybasic acid, a saturated polybasic acid, and a polyhydric alcohol. In addition to the vinyl monomer, other curing catalysts, curing aids, fillers, flame retardants, various stabilizers, modifiers, etc. are mixed as necessary. There is no problem in that the unsaturated polyester chain is a flame-retardant resin containing halogen.

本発明にいう基材とは、例えばクラフト紙やリ
ンター紙、合成繊維布又はその不織布、ガラスフ
アイバー又はガラスステープルフアイバーからな
るクロス又は不織布の如き長尺なシート状物であ
り良く知られているものはどれでも適用出来る。
The base material referred to in the present invention is a well-known long sheet-like material such as kraft paper, linter paper, synthetic fiber cloth or non-woven fabric thereof, cloth or non-woven fabric made of glass fiber or glass staple fiber. can be applied to any.

架橋用ビニルモノマーは、例えばスチレンモノ
マー、アクリル酸エステル類、メタアクリル酸エ
ステル類、ジビニルベンゼン、あるいはジアリル
フタレート等の一般に知られているモノマー単独
もしくは2種以上の混合物が適用できるが、価格
並びに製品の特性上の特徴から一般にはスチレン
モノマーが償用されている。
As the vinyl monomer for crosslinking, generally known monomers such as styrene monomer, acrylic esters, methacrylic esters, divinylbenzene, or diallyl phthalate can be used alone or in a mixture of two or more, but price and product Generally, styrene monomer is used because of its characteristic characteristics.

不飽和ポリエステル樹脂の硬化を好ましく行な
うことは、製造上重要である。硬化の程度は、例
えば硬化せしめた積層板の加熱収縮率あるいは残
存する架橋用ビニルモノマーの量等で評価でき
る。本発明では、架橋用ビニルモノマーとして一
般に償用されているスチレンを使用した場合につ
いて以下説明するが、これに本発明は制限しな
い。
Preferably curing the unsaturated polyester resin is important in manufacturing. The degree of curing can be evaluated by, for example, the heat shrinkage rate of the cured laminate or the amount of residual crosslinking vinyl monomer. In the present invention, a case will be described below in which styrene, which is commonly used as a crosslinking vinyl monomer, is used, but the present invention is not limited thereto.

さて、不飽和ポリエステル系樹脂の硬化は、通
常、パーオキサイド類の如き熱分解によつてラジ
カルを発生する触媒を添加した樹脂液を加熱する
ことにより硬化せしめる。該加熱温度が高ければ
高い程ラジカルの発生が激しく不飽和ポリエステ
ル系樹脂の硬化は急速に進行する。例えば80〜90
℃の雰囲気で硬化せしめた硬化体の残存スチレン
モノマー量は120℃〜130℃の雰囲気温度で硬化せ
しめた硬化体の残存スチレンモノマー量よりも多
い。しかしながら高温の雰囲気温度で硬化させる
ことが必らずしも硬化を十分に進める上で有効で
はない。本発明者等の研究によれば、例えば60〜
140℃、より好ましくは90〜140℃の雰囲気温度で
約10分間硬化せしめた硬化体の残存スチレンモノ
マー量は、数パーセント〜数千ppmも残存する。
そこで第2の加熱炉を設置して雰囲気温度140〜
190℃、より好ましくは140〜170℃で後硬化せし
めると残存スチレンモノマー量は数十〜数百ppm
まで大巾に減少する。該後硬化の時間は、3〜20
分間が好ましい。60〜140℃の雰囲気温度を有す
る加熱炉を第1の加熱炉と呼ぶ。第1の加熱炉の
雰囲気温度が高ければ高い程、該第1の加熱炉に
よる硬化体の残存スチレンモノマー量は少なくな
ることは既に述べたが、該硬化体を第2の加熱炉
で同一条件、例えば160℃で10分間後硬化せしめ
たとき、該硬化体の残存スチレンモノマー量は、
逆に相対的に多くなる。即ち、第1の加熱炉の雰
囲気温度が低ければ低い程第1の加熱炉による硬
化体の存在スチレン量は多くなるものの第2の加
熱炉における後硬化によつて残存スチレン量は著
しく減少する。
Now, unsaturated polyester resins are usually cured by heating a resin liquid to which a catalyst such as a peroxide that generates radicals by thermal decomposition is added. The higher the heating temperature is, the more radicals are generated and the curing of the unsaturated polyester resin progresses more rapidly. For example 80-90
The amount of styrene monomer remaining in the cured product cured in an atmosphere of 120°C to 130°C is greater than the amount of styrene monomer remaining in the cured product cured at an ambient temperature of 120°C to 130°C. However, curing at a high ambient temperature is not necessarily effective in sufficiently advancing curing. According to the research of the present inventors, for example, 60~
The amount of residual styrene monomer in the cured product cured for about 10 minutes at an ambient temperature of 140° C., preferably 90 to 140° C., remains in the amount of several percent to several thousand ppm.
Therefore, a second heating furnace was installed and the ambient temperature was 140~140℃.
When post-curing is carried out at 190°C, more preferably at 140-170°C, the amount of residual styrene monomer can be reduced to several tens to hundreds of ppm.
It decreases by a wide margin. The post-curing time is 3 to 20
Minutes are preferred. A heating furnace having an ambient temperature of 60 to 140°C is called a first heating furnace. As already mentioned, the higher the ambient temperature in the first heating furnace, the lower the amount of residual styrene monomer in the product cured by the first heating furnace. For example, when post-curing at 160°C for 10 minutes, the amount of residual styrene monomer in the cured product is:
On the contrary, it increases relatively. That is, the lower the atmospheric temperature of the first heating furnace is, the more the amount of styrene present in the product cured by the first heating furnace increases, but the amount of remaining styrene is significantly reduced by post-curing in the second heating furnace.

第1の加熱炉の雰囲気温度が140℃を越える条
件で硬化せしめると、該硬化体の残存スチレンモ
ノマー量は、後硬化によつてもあまり減少しな
い。第1の加熱炉の雰囲気温度が60℃以下であれ
ば、一般に硬化のための時間が長くなつて生産性
が悪くなる。この時、生産性を良くする目的で低
温分解型の触媒を用いることもできるが、その場
合、樹脂のポツトライフが短かくて生産に支障を
きたし不適当である。
If the cured product is cured under conditions where the ambient temperature in the first heating furnace exceeds 140°C, the amount of residual styrene monomer in the cured product will not decrease much even after post-curing. If the atmospheric temperature of the first heating furnace is 60° C. or lower, the curing time generally becomes longer and productivity deteriorates. At this time, a low-temperature decomposition type catalyst can be used for the purpose of improving productivity, but in that case, the pot life of the resin is short, which hinders production and is therefore unsuitable.

第2の加熱炉の雰囲気温度は、140〜190℃が適
している。140℃以下では後硬化の効果が少ない。
即ち、残存スチレン量の減少が少ない。一方、該
温度が190℃を越えても残存スチレン量の減少率
は190℃の場合とかわらない。
A suitable ambient temperature of the second heating furnace is 140 to 190°C. At temperatures below 140°C, the effect of post-curing is small.
That is, the amount of residual styrene decreases little. On the other hand, even if the temperature exceeds 190°C, the rate of decrease in the amount of residual styrene remains the same as at 190°C.

一方、本発明において、樹脂含浸基材を積層す
ると同時に又は積層した後、金属箔又は接着剤を
塗布した金属箔を重ね合わせて不飽和ポリエステ
ル樹脂を硬化せしめると金属箔張り積層板を製造
することができるが、例えば該金属箔が銅箔であ
る場合、上記第2の加熱炉の雰囲気温度が190℃
を越えると該銅箔の酸化変色が著るしくなる。
On the other hand, in the present invention, a metal foil-clad laminate can be produced by laminating metal foil or adhesive-coated metal foil and curing the unsaturated polyester resin at the same time as or after laminating the resin-impregnated base materials. However, for example, when the metal foil is copper foil, the ambient temperature of the second heating furnace is 190°C.
If it exceeds this amount, the oxidation discoloration of the copper foil becomes significant.

本発明の特徴は、第1の加熱炉で硬化せしめた
後より高温の第2の加熱炉で後硬化せしめること
によつて硬化を更に進めることである。このこと
により生産速度を上げてもなお硬化を十分に進め
ることができる。
A feature of the present invention is that after curing in the first heating furnace, curing is further advanced by post-curing in a second heating furnace at a higher temperature. This allows curing to proceed sufficiently even when the production speed is increased.

本発明は、例えば硬化用触媒を注意深く撰択す
ることによつて更に有効となる。本発明における
硬化用触媒は、一般に市販されている有機過酸化
物はどれでも使用できるが、例えば、ジ−t−ブ
チルパーオキサイド、t−ブチルパーオキシ−2
−エチルヘキサノエート、1,1−ビス(t−ブ
チルパーオキシ)3、3、5−トリメチルシクロ
ヘキサン、t−ブチルパーオキシベンゾエート等
分解温度が中温から高温の有機過酸化物が好まし
い。これらの触媒の中で熱分解温度の比較的低い
触媒例えばパーブチルO(日本油脂製、t−ブチ
ルパーオキシ−2−エチルヘキサノエート)と熱
分解温度の比較的高い触媒、例えばパーブチルZ
(日本油脂製、t−ブチルパーオキシベンゾエー
ト)とを組み合わせることによつて、本発明を更
に有効ならしめることができる。又、第1の加熱
炉の加熱によつて主として熱分解温度の低い触媒
が分解し、第2の加熱炉における後硬化時に主と
して熱分解温度の高い触媒が分解し、硬化を更に
進めることもできる。さて本発明においては、更
に硬化のための第1の加熱炉を少なくとも2つ以
上のゾーンに分割し、しかも該分割したゾーンを
それぞれ独立に60〜140℃の間の雰囲気温度で
個々に制御できることがより適切な条件を設定で
きて好ましいことといえる。
The invention is further enhanced, for example, by careful selection of the curing catalyst. As the curing catalyst in the present invention, any generally commercially available organic peroxide can be used, but examples include di-t-butyl peroxide, t-butylperoxy-2
-Ethylhexanoate, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane, t-butylperoxybenzoate, and other organic peroxides having a decomposition temperature of medium to high temperature are preferred. Among these catalysts, catalysts with a relatively low thermal decomposition temperature such as Perbutyl O (manufactured by NOF Corporation, t-butyl peroxy-2-ethylhexanoate) and catalysts with a relatively high thermal decomposition temperature such as Perbutyl Z
(t-butyl peroxybenzoate manufactured by NOF Corporation), the present invention can be made even more effective. Further, the catalyst with a low thermal decomposition temperature is mainly decomposed by heating in the first heating furnace, and the catalyst with a high thermal decomposition temperature is mainly decomposed during post-curing in the second heating furnace, so that curing can be further promoted. . Now, in the present invention, the first heating furnace for curing is further divided into at least two or more zones, and each of the divided zones can be independently controlled at an ambient temperature between 60 and 140°C. This can be said to be preferable because it allows more appropriate conditions to be set.

以上述べた如く、本発明は、残存スチレンモノ
マー量の少ないいい換えればより硬化の進んだ積
層板を小さい設備あるいはより高い生産性での製
造を可能とする。
As described above, the present invention makes it possible to manufacture a laminate with a small amount of residual styrene monomer and, in other words, a more advanced hardening process, using smaller equipment or with higher productivity.

本発明において、第1の加熱炉と第2の加熱炉
が連続して設置されており、加熱が連続的に行な
われても何ら本発明から逸脱するものではない。
また、第1の加熱炉から送り出された積層体は必
要に応じて定尺に切断され、その後第2の加熱炉
で後硬化させることもできる。
In the present invention, the first heating furnace and the second heating furnace are installed in succession, and even if heating is performed continuously, there is no deviation from the present invention.
Further, the laminate sent out from the first heating furnace can be cut into regular lengths as necessary, and then post-cured in the second heating furnace.

本発明において、第2の加熱炉で後硬化せしめ
た後、更にまた加熱によつて硬化せしめたり、あ
るいは高温多湿の雰囲気下に暴露することは、し
ばしば好ましい結果を得ることができる。
In the present invention, favorable results can often be obtained by post-curing in the second heating furnace and then further curing by heating, or by exposing to a high-temperature and humid atmosphere.

なお、本発明においては、残存スチレンモノマ
ー量の定量は、室温で約24時間抽出せしめたアセ
トン溶液のガスクロマトグラムから求めた。
In the present invention, the amount of residual styrene monomer was determined from a gas chromatogram of an acetone solution extracted at room temperature for about 24 hours.

図面は、以上の本発明に係る不飽和ポリエステ
ル樹脂系積層板の連続的硬化方法を実施した一例
を示す装置の説明図であり、今この装置説明図を
もとに本発明を説明すると、図中1として示され
る単一又は複数のシート状基材を乾燥装置2を通
つて乾燥させ、次いで熱硬化性樹脂液を樹脂供給
装置3で供給して含浸し、これにカバーフイルム
4を外被した後、樹脂含浸基材を積層し、これを
7で示される60〜140℃に制御された第1の加熱
炉中で区画された第1ゾーン5、第2ゾーン6を
経て硬化させ、更にカバーフイルム4を剥離した
後切断し、この切断積層板を140〜190℃に制御さ
れた第2の加熱炉8へ送つて後硬化させ本発明の
連続的硬化を完了する。
The drawing is an explanatory diagram of an apparatus showing an example of the continuous curing method for unsaturated polyester resin laminates according to the present invention.The present invention will now be explained based on this explanatory diagram of the apparatus. A single or plural sheet-like base material shown as medium 1 is dried by passing through a drying device 2, and then a thermosetting resin liquid is supplied and impregnated by a resin supplying device 3, and a cover film 4 is coated on the substrate. After that, a resin-impregnated base material is laminated, and this is cured through a first zone 5 and a second zone 6 divided in a first heating furnace controlled at 60 to 140 ° C., and further After peeling off the cover film 4, it is cut, and the cut laminate is sent to a second heating furnace 8 controlled at 140 to 190°C for post-curing, completing the continuous curing of the present invention.

実施例 1 武田薬品製ポリマール6304、100重量部に対し
て触媒としてパーブチルO(日本油脂製)0.8部、
パーブチルH(日本油脂製)0.2部を添加した不飽
和ポリエステル樹脂液を、連続的に搬送されるク
ラフト紙(巴川製紙MKD−150)5枚にそれぞ
れ含浸せしめ続いて積層し、同時に上下を厚さ
100μmのマイラーフイルムで被覆し引き続き加
熱炉の中へ導いた。加熱炉の温度を90℃で15分間
加熱硬化せしめた一次硬化体のスチレンモノマー
濃度は、約3.5%あつたが、該一次硬化体を更に
160℃で10分間後硬化させると残存スチレンモノ
マー量は約74ppmに減少した。
Example 1 0.8 parts of Perbutyl O (manufactured by NOF Corporation) as a catalyst per 100 parts by weight of Polymer 6304 manufactured by Takeda Pharmaceutical Co., Ltd.
Five sheets of continuously conveyed kraft paper (Tomoekawa Paper MKD-150) are each impregnated with an unsaturated polyester resin liquid containing 0.2 parts of Perbutyl H (Nippon Oil & Fats Co., Ltd.), and then laminated, and at the same time the top and bottom are thickened.
It was covered with a 100 μm Mylar film and then introduced into a heating furnace. The styrene monomer concentration of the primary cured product, which was cured by heating at 90°C for 15 minutes in a heating furnace, was approximately 3.5%.
Post-curing at 160°C for 10 minutes reduced the amount of residual styrene monomer to about 74 ppm.

実施例 2 一次硬化条件を120℃で10分間に変更したこと
以外は実施例1と全く同様に実施したところ、一
次硬化体及び後硬化体のスチレンモノマー濃度
は、それぞれ約3840ppm及び約420ppmであつた。
Example 2 The same procedure as in Example 1 was carried out except that the primary curing conditions were changed to 120°C for 10 minutes, and the styrene monomer concentrations in the primary cured product and post-cured product were approximately 3840 ppm and approximately 420 ppm, respectively. Ta.

比較例 1 一次硬化条件を150℃で5分間に変更したこと
以外は実施例と全く同様に実施したところ、後硬
化後のスチレンモノマー濃度は約1300ppmであつ
た。
Comparative Example 1 The same procedure as in Example was carried out except that the primary curing conditions were changed to 150° C. for 5 minutes, and the styrene monomer concentration after post-curing was about 1300 ppm.

実施例 3 実施例2において、加熱炉を2つのゾーンに区
分し、第1ゾーンの温度を135℃、第2ゾーンを
120℃にしたところ、予熱時間を約2分間短縮す
ることができて第1の加熱炉における硬化時間を
合計約8分間ですませ又第2の加熱炉による後硬
化を160℃で10分したところ残存スチレンモノマ
ー濃度は約460ppmであつた。
Example 3 In Example 2, the heating furnace was divided into two zones, and the temperature of the first zone was set to 135°C, and the temperature of the second zone was set to 135°C.
When the temperature was set to 120°C, the preheating time was shortened by about 2 minutes, and the curing time in the first heating furnace was reduced to about 8 minutes in total, and the post-curing in the second heating oven was performed at 160°C for 10 minutes. The residual styrene monomer concentration was approximately 460 ppm.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明に係る不飽和ポリエステル樹脂系
積層板の連続製造装置の一例である。 1……基材、2……乾燥装置、3……樹脂供給
装置、4……カバーフイルム、5……第1ゾー
ン、6……第2ゾーン、7……第1の加熱炉、8
……第2の加熱炉。
The drawing shows an example of an apparatus for continuously producing an unsaturated polyester resin laminate according to the present invention. DESCRIPTION OF SYMBOLS 1... Base material, 2... Drying device, 3... Resin supply device, 4... Cover film, 5... First zone, 6... Second zone, 7... First heating furnace, 8
...Second heating furnace.

Claims (1)

【特許請求の範囲】[Claims] 1 不飽和ポリエステル樹脂を主成分とする室温
で液状の熱硬化性樹脂液を連続的に搬送される複
数のシート状基材に含浸し続いて該樹脂含浸基材
を連続的に積層、引き続き連続的に加熱硬化せし
める積層板の連続製造法において、雰囲気温度が
60℃以上140℃以下の第1の加熱炉で硬化せしめ
た後雰囲気温度が140℃以上190℃以下の第2の加
熱炉で後硬化することを特徴とする不飽和ポリエ
ステル樹脂系積層板の連続的硬化方法。
1 Impregnating a plurality of continuously conveyed sheet-like base materials with a thermosetting resin liquid that is liquid at room temperature and containing an unsaturated polyester resin as a main component, then continuously laminating the resin-impregnated base materials, and then continuously laminating the resin-impregnated base materials. In the continuous production method of laminates, which are heated and cured, the ambient temperature is
A series of unsaturated polyester resin laminates, characterized in that they are cured in a first heating furnace at a temperature of 60°C or higher and 140°C or lower, and then post-cured in a second heating furnace at an ambient temperature of 140°C or higher and 190°C or lower. Hardening method.
JP55133815A 1980-09-25 1980-09-25 Continuous hardening method of unsaturated polyester resin system laminated plate Granted JPS5757621A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55133815A JPS5757621A (en) 1980-09-25 1980-09-25 Continuous hardening method of unsaturated polyester resin system laminated plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55133815A JPS5757621A (en) 1980-09-25 1980-09-25 Continuous hardening method of unsaturated polyester resin system laminated plate

Publications (2)

Publication Number Publication Date
JPS5757621A JPS5757621A (en) 1982-04-06
JPS6315909B2 true JPS6315909B2 (en) 1988-04-06

Family

ID=15113679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55133815A Granted JPS5757621A (en) 1980-09-25 1980-09-25 Continuous hardening method of unsaturated polyester resin system laminated plate

Country Status (1)

Country Link
JP (1) JPS5757621A (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596162A (en) * 1945-03-01 1952-05-13 Marco Chemicals Inc Method of polymerizing fiber-reinforced resinous materials and product
FR1222759A (en) * 1959-01-22 1960-06-13 Cordoual Continuous production of plastic laminate panels
JPS5519438B2 (en) * 1973-06-20 1980-05-26
US4012267A (en) * 1975-07-10 1977-03-15 Bell Telephone Laboratories, Incorporated Process for producing pultruded clad composites
JPS6042566B2 (en) * 1978-06-26 1985-09-24 鐘淵化学工業株式会社 Method for continuously manufacturing electrical laminated insulation boards or metal foil clad laminates
JPS5553013A (en) * 1978-10-11 1980-04-18 Kanegafuchi Chemical Ind Method of manufacturing electric laminated plate

Also Published As

Publication number Publication date
JPS5757621A (en) 1982-04-06

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