JPS6316902B2 - - Google Patents
Info
- Publication number
- JPS6316902B2 JPS6316902B2 JP56097739A JP9773981A JPS6316902B2 JP S6316902 B2 JPS6316902 B2 JP S6316902B2 JP 56097739 A JP56097739 A JP 56097739A JP 9773981 A JP9773981 A JP 9773981A JP S6316902 B2 JPS6316902 B2 JP S6316902B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid phase
- growth
- epitaxial growth
- temperature
- phase epitaxial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B19/00—Liquid-phase epitaxial-layer growth
- C30B19/02—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux
- C30B19/04—Liquid-phase epitaxial-layer growth using molten solvents, e.g. flux the solvent being a component of the crystal composition
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/46—Sulfur-, selenium- or tellurium-containing compounds
- C30B29/48—AIIBVI compounds wherein A is Zn, Cd or Hg, and B is S, Se or Te
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
【発明の詳細な説明】
本発明は液相エピタキシヤル成長方法に関し、
特に水銀のような易蒸発性成分を構成成分として
含む多元半導体層のエピタキシヤル成長方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a liquid phase epitaxial growth method,
In particular, the present invention relates to a method for epitaxially growing a multi-component semiconductor layer containing an easily vaporizable component such as mercury.
赤外線検知素子の製造に用いられる水銀・カド
ミウム・テルル(HgCdTe)や、半導体レーザの
製造に用いられるガリウム・砒素(GaAs),ガ
リウム・アルミニウム・砒素(GaAlAs)等の多
元半導体層を形成するのに液相エピタキシヤル成
長法が用いられる。 For forming multi-component semiconductor layers such as mercury-cadmium-tellurium (HgCdTe) used in the production of infrared sensing elements, gallium-arsenic (GaAs), gallium-aluminum-arsenic (GaAlAs) used in the production of semiconductor lasers, etc. A liquid phase epitaxial growth method is used.
この液相エピタキシヤル成長(以下単に液相成
長と略記する)を行う際、成長させる多元半導体
の構成成分にHgのような著しく易蒸発成分を含
む場合には、液相からHgが多量に蒸発して失わ
れ、ついには液相の成分組成が変化する。即ち一
般に液相成長は開管中で行われ、管内に絶えず水
素(H2)ガス等を流しておくため、液相中のHg
は順次蒸発してH2と共に管外へ流出し、液相中
から漸次失われていく。このため液相内のHg量
が次第に減少する。このような状態で液相成長を
行えば、予定された組成よりもHg含有量の少な
い組成の成長層しか得られない。 When performing this liquid phase epitaxial growth (hereinafter simply referred to as liquid phase growth), if the components of the multi-component semiconductor to be grown include extremely easily evaporated components such as Hg, a large amount of Hg evaporates from the liquid phase. and is lost, eventually changing the composition of the liquid phase. In other words, liquid phase growth is generally performed in an open tube, and hydrogen (H 2 ) gas etc. is constantly flowing through the tube, so Hg in the liquid phase
is gradually evaporated and flows out of the tube along with H 2 , and is gradually lost from the liquid phase. Therefore, the amount of Hg in the liquid phase gradually decreases. If liquid phase growth is performed under such conditions, only a grown layer with a composition lower in Hg content than the expected composition can be obtained.
この問題点を解消するため発明者らは先に特願
昭55−80541号(特開昭57−5326号)において、
開管形式の反応管内の液相成長用器具を配設する
成長ゾーンとは異なる位置に易蒸発性成分蒸気の
発生源を設け、更にこの両者を挾んで上記反応管
の内径より僅かに小さいカーボン等よりなるブロ
ツクを配設し、ガス流路を小面積に制限すると共
にこのブロツクを上述の成長系の中で最も高温と
することにより、上記2つのブロツクに挾まれた
領域を液相と気相とが略平衡な状態(以後準平衡
状態と称する)とされた反応空間となし得る液相
エピタキシヤル成長装置を提唱した。 In order to solve this problem, the inventors previously published Japanese Patent Application No. 55-80541 (Japanese Unexamined Patent Publication No. 57-5326).
A source of easily evaporable component vapor is provided in a position different from the growth zone in which the liquid phase growth equipment is installed in the open-tube reaction tube, and a carbon material slightly smaller than the inner diameter of the reaction tube is placed between the two. By arranging a block consisting of the above-mentioned two blocks, restricting the gas flow path to a small area, and making this block the highest temperature in the above-mentioned growth system, the region sandwiched between the above two blocks can be separated from the liquid phase and the gas phase. We have proposed a liquid phase epitaxial growth apparatus that can be used as a reaction space in which the phase is in a substantially equilibrium state (hereinafter referred to as a quasi-equilibrium state).
上記発明を用いて準平衡状態を現出した反応空
間において液相成長を行うことにより、構成成分
中に水銀(Hg)のような易蒸発性成分を含む多
元半導体層を成長せしめる場合であつても、成分
組成を正確に制御することが可能となつた。 In the case where a multi-component semiconductor layer containing an easily evaporable component such as mercury (Hg) is grown among its constituent components by performing liquid phase growth in a reaction space in which a quasi-equilibrium state is created using the above invention. It has also become possible to precisely control the component composition.
ところがこのようにして成長した成長層表面に
は、易蒸発性成分のHgやHgと他の元素との化合
物等が析出し付着する。そのため液相成長後に研
磨法等により上記付着物を除去せねばならなかつ
た。かかる問題は液相成長の反応空間を準平衡系
とした場合に一般的に生じる。 However, on the surface of the growth layer grown in this manner, easily vaporizable components such as Hg and compounds of Hg and other elements precipitate and adhere. Therefore, the deposits had to be removed by polishing or the like after liquid phase growth. Such a problem generally occurs when the reaction space for liquid phase growth is made into a quasi-equilibrium system.
本発明は上記問題点を解消するためになされた
もので、成長層表面に付着物を生じることのない
準平衡系液相エピタキシヤル成長方法を提供する
ことを目的とする。そのため本発明の特徴は、成
長終了までは反応空間を準平衡系となし、成長終
了後の冷却期間においては上記反応空間のうち成
長ゾーンを除く残りの区域の少なくとも一部に過
飽和領域を形成することにある。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a quasi-equilibrium liquid phase epitaxial growth method that does not generate deposits on the surface of the grown layer. Therefore, the feature of the present invention is to make the reaction space a quasi-equilibrium system until the end of growth, and to form a supersaturated region in at least a part of the remaining area of the reaction space excluding the growth zone during the cooling period after the end of growth. There is a particular thing.
以下本発明の液相エピタキシヤル成長方法の一
実施例として、CdTe基板上にHg1-XCdXTe層を
成長せしめる例を掲げて説明する。 An example of growing a Hg 1-X Cd X Te layer on a CdTe substrate will be described below as an embodiment of the liquid phase epitaxial growth method of the present invention.
第1図は上記一実施例に用いた液相エピタキシ
ヤル装置の構成を示す要部断面図で、石英から成
る炉心管(反応管)1の内部に基板保持具2と、
液相収容部4を有するスライダ3が設置されてお
り、液相収容部4内に液相である溶融物5が収容
されていることについては従来周知の成長装置と
本質的には同一である。ただし基板保持具には結
晶成長用基板6の他に、Cd源としてのCdTe薄板
7が保持されており、溶融物5は一旦CdTe薄板
7上に運ばれてCdTeを溶解し、しかる後結晶成
長用CdTe基板6(以下基板と言う)の上に運ば
れて、その表面にHg1-XCdXTeのエピタキシヤル
成長層を成長させる。8は結晶成長開始の直前ま
で基板6およびCdTe薄板7の表面を覆つて表面
からのHgの蒸発を防止するための保護板である。
また溶融物5の表面からのHgの蒸発を防止する
ために、液面遮蔽板9が液相収容部4の上部に設
置されている。ただしこのような成長用器具Aの
構造は本発明者らがすでに提案ずみのものであつ
て、本発明の本質ではない。 FIG. 1 is a cross-sectional view of the main parts showing the structure of the liquid phase epitaxial apparatus used in the above embodiment, in which a substrate holder 2 is placed inside a core tube (reaction tube) 1 made of quartz.
A slider 3 having a liquid phase storage section 4 is installed, and the liquid phase storage section 4 houses a liquid phase melt 5, which is essentially the same as a conventionally well-known growth apparatus. . However, in addition to the substrate 6 for crystal growth, the substrate holder holds a CdTe thin plate 7 as a Cd source, and the melt 5 is once conveyed onto the CdTe thin plate 7 to dissolve the CdTe, and then the crystal grows. The substrate is transferred onto a CdTe substrate 6 (hereinafter referred to as the substrate), and an epitaxial growth layer of Hg 1-X Cd X Te is grown on its surface. A protective plate 8 covers the surfaces of the substrate 6 and the CdTe thin plate 7 until just before the start of crystal growth to prevent Hg from evaporating from the surfaces.
Further, in order to prevent Hg from evaporating from the surface of the melt 5, a liquid level shielding plate 9 is installed above the liquid phase storage section 4. However, this structure of the growth device A has already been proposed by the present inventors, and is not the essence of the present invention.
さらにスライダ3を移動させるための押し棒1
0および基板保持具2の柄11が成長用器具Aに
付設され、これら両者は管外に延長している。 Push rod 1 for further moving slider 3
0 and the handle 11 of the substrate holder 2 are attached to the growth instrument A, and both extend outside the tube.
つぎに炉心管1内には前述の成長用器具Aの他
にHg源Bが設置されている。Hg源Bは上面開放
の容器12内に金属Hg13を少量収容させたも
ので、後述するように炉心管内でHgの液相一気
相平衡を樹立するために設けられたものである。 Next, in addition to the above-mentioned growth device A, an Hg source B is installed inside the furnace tube 1. The Hg source B has a small amount of metal Hg 13 contained in a container 12 with an open top, and is provided to establish a liquid phase-vapor phase equilibrium of Hg in the reactor core tube, as will be described later.
さらに炉心管内の2箇所に2個の高温ブロツク
CおよびDが設けられている。上記両高温ブロツ
クC,Dは本実施例においては貫通孔を有するカ
ーボンブロツクであつて、炉心管1内において最
も高い温度に保たれている。そして高温ブロツク
Cは一部に小径の貫通孔hを有しており、成長工
程中該貫通孔hを通じてガス導入口1aから導入
されたH2を炉心管1内に流す。 Furthermore, two high temperature blocks C and D are provided at two locations within the reactor core tube. In this embodiment, both the high-temperature blocks C and D are carbon blocks having through holes, and are maintained at the highest temperature within the reactor core tube 1. The high-temperature block C has a small-diameter through-hole h in part, and H 2 introduced from the gas inlet 1a flows into the furnace tube 1 through the through-hole h during the growth process.
また、押し棒10,基板ホルダーの柄11,
Hg源の柄14は別の高温ブロツクDを貫通して
炉心管1の外へ出ているが、該高温ブロツクDと
上記押し棒等との間は気密ではなく、むしろ故意
に若干の間隙を設けて、H2がこの間隙を通つて
高温ブロツクDの裏側へ出るようになつている。
炉心管1の一端(図において右端)は蓋15によ
つて密閉されており、押し棒10,基板保持具の
柄11,Hg源の柄14は上記の蓋15を気密に
貫通して管外に引出されており、高温ブロツクD
を通つたH2は炉心管1の端部近くに設けられた
ガス排出口1bから排出される。以後便宜上高温
ブロツクCを第1高温ブロツク、同じくDを第2
高温ブロツクと呼ぶことにする。4系統のヒータ
Ha,Hb,Hc,Hdはそれぞれの直下にある炉心
管の領域を所定温度に保つためのものである。 In addition, the push rod 10, the handle 11 of the substrate holder,
The handle 14 of the Hg source passes through another high-temperature block D and comes out of the reactor core tube 1, but the space between the high-temperature block D and the push rod, etc. is not airtight, but rather there is a slight gap intentionally left. is provided so that H 2 exits to the back side of the hot block D through this gap.
One end of the reactor core tube 1 (the right end in the figure) is sealed with a lid 15, and the push rod 10, the handle 11 of the substrate holder, and the handle 14 of the Hg source pass through the lid 15 in an airtight manner and are exposed to the outside of the tube. The high temperature block D
The H 2 that has passed through is discharged from a gas outlet 1b provided near the end of the furnace tube 1. Hereinafter, for convenience, high-temperature block C will be referred to as the first high-temperature block, and D will be referred to as the second high-temperature block.
We will call it the high temperature block. 4 heaters
Ha, Hb, Hc, and Hd are used to maintain the area of the reactor core tube directly below each at a predetermined temperature.
更に炉心管1外には高圧エアー或いは高圧窒素
(N2)等の冷却用ガスを噴出するためのガス供給
管16が設けられている。その位置は高温ブロツ
クCおよびDに挾まれた反応空間のうち成長用器
具Aを設置した成長ゾーン以外の場所であればよ
い。このガス供給管は液相成長終了後の冷却期間
において、反応空間内に過飽和領域を形成するた
め設けたものである。 Furthermore, a gas supply pipe 16 is provided outside the reactor core tube 1 for blowing out a cooling gas such as high pressure air or high pressure nitrogen (N 2 ). The position may be any place other than the growth zone where the growth device A is installed in the reaction space between the high temperature blocks C and D. This gas supply pipe is provided to form a supersaturated region within the reaction space during the cooling period after the liquid phase growth is completed.
次に上記液相エピタキシヤル成長装置を用いて
Hg1-XCdXTe層を成長させる工程について説明す
る。 Next, using the above liquid phase epitaxial growth apparatus,
The process of growing the Hg 1-X Cd X Te layer will be explained.
第2図は液相成長を終了するまでの炉心管1内
の温度分布の一例として、エピタキシヤル層成長
時の温度分布を模式的に示したグラフで、第1,
第2両高温ブロツクC,Dの部位は最も高温であ
り、結晶成長用器具Aの部位がこれに次ぎ、Hg
源Bの部位は最も低温である。実際の温度は一例
として高温ブロツク部位が約700℃,結晶成長用
器具の部位即ち成長ゾーンは約500℃,Hg源の部
位は約100℃である。 FIG. 2 is a graph schematically showing the temperature distribution during epitaxial layer growth as an example of the temperature distribution in the reactor core tube 1 until the end of liquid phase growth.
The parts of the second high-temperature blocks C and D have the highest temperature, followed by the part of the crystal growth device A, and the Hg
Source B sites are the coldest. The actual temperatures are, for example, approximately 700°C in the high temperature block area, approximately 500°C in the crystal growth device area, ie, the growth zone, and approximately 100°C in the Hg source area.
以上の説明から明らかなように、炉心管1内に
おいては第1高温ブロツクCおよび第2高温ブロ
ツクDによつて挾まれた空間内に結晶成長用器具
AおよびHg源Bが設置されている。Hg源Bから
蒸発したHg蒸発は、第1高温ブロツクCおよび
第2高温ブロツクDによつて両高温ブロツク外へ
の輸送が押さえられる。その理由を以下に説明す
る。 As is clear from the above description, in the furnace tube 1, the crystal growth device A and the Hg source B are installed in a space sandwiched between the first high temperature block C and the second high temperature block D. The Hg evaporated from the Hg source B is prevented from being transported outside the first high temperature block C and the second high temperature block D. The reason for this will be explained below.
まず第1の理由は、Hg蒸気の洩れる空間が狭
く絞られているためである。第2の理由として
は、両高温ブロツクと炉心管1との間隙に流れ込
んだHg蒸気は加熱されるため希薄になり、した
がつて単位断面積を単位時間に通過するHg原子
数が減少するためである。 The first reason is that the space through which Hg vapor leaks is narrowly constricted. The second reason is that the Hg vapor that has flowed into the gap between both high-temperature blocks and the core tube 1 is heated and becomes diluted, and therefore the number of Hg atoms passing through a unit cross-sectional area in a unit time decreases. It is.
上述したように両高温ブロツクC,D外への
Hg原子の輸送が押さえられる結果、Hg源Bの面
積が充分広ければ、Hg源Bから蒸発するHg原子
数は両高温ブロツクC,D外へ失われるHg原子
数よりも充分大きくすることができる。したがつ
て該両高温ブロツクに挾まれた反応空間のHg蒸
気の分圧はどの箇所でも常にHg源BのHg蒸気圧
にほぼ等しくなる。つまり上記反応空間は準平衡
状態が現出されている。 As mentioned above, the outside of both high temperature blocks C and D is
As a result of suppressing the transport of Hg atoms, if the area of Hg source B is sufficiently large, the number of Hg atoms evaporated from Hg source B can be made sufficiently larger than the number of Hg atoms lost to the outside of both high-temperature blocks C and D. . Therefore, the partial pressure of Hg vapor in the reaction space sandwiched between the two high-temperature blocks is always approximately equal to the Hg vapor pressure of Hg source B at any location. In other words, a quasi-equilibrium state appears in the reaction space.
尚本例は第1高温ブロツクCと第1高温ブロツ
クDを配設した実施例であるが、第1高温ブロツ
クCはガス流入方向に設けたブロツクであり、ガ
スの流れに逆行してHg蒸気が輸送されることは
少なく、従つて、結晶成長用器具Aとガス排出口
1bとの間の第1高温ブロツクDのみでも準平衡
状態を現出させることは十分可能である。 Note that this example is an embodiment in which a first high temperature block C and a first high temperature block D are arranged, but the first high temperature block C is a block provided in the gas inflow direction, and the Hg vapor flows against the gas flow. is rarely transported, and therefore, it is sufficiently possible to bring about a quasi-equilibrium state with only the first high-temperature block D between the crystal growth device A and the gas outlet 1b.
よつて上記蒸気圧が液相5からのHg蒸気圧に
等しくなるようにHg源Bの温度を調整しておけ
ば、液相5から蒸発するHg原子数と、雰囲気中
から液相5内に入るHg原子数とは相等しくなり、
液相5のHg含有量は減少しなくなる。その結果
得られた成長層におけるHg含有量が予定量より
減少することもなく、成長層の成分組成を正確に
制御できる。 Therefore, if the temperature of the Hg source B is adjusted so that the above vapor pressure is equal to the Hg vapor pressure from the liquid phase 5, the number of Hg atoms evaporated from the liquid phase 5 and the number of Hg atoms evaporated from the atmosphere into the liquid phase 5 will be reduced. The number of Hg atoms entering is equal to
The Hg content of liquid phase 5 no longer decreases. As a result, the Hg content in the grown layer does not decrease below the expected amount, and the component composition of the grown layer can be accurately controlled.
このようにして所望のHg1-XCdXTe層の成長を
完了した後、4系統のヒータHa,Hb,HCHdを
制御(或いは切断)して反応系を所定の降温速度
により冷却するのであるが、このとき本実施例に
おいてはガス供給管16より高圧エアーを噴出さ
せて炉心管1を局部的に急冷する。その位置は前
述した如く反応空間の中の成長ゾーン以外の場所
を選ぶ。 After completing the growth of the desired Hg 1-X Cd However, at this time, in this embodiment, high pressure air is blown out from the gas supply pipe 16 to locally rapidly cool the reactor core tube 1. As described above, the location is selected outside the growth zone in the reaction space.
上記炉心管1の急冷された部分は、炉心管1の
内側も温度が低下し、当該部分及びその近傍にお
いては反応空間内雰囲気はHg等の過飽和状態と
なる。そのためこの過飽和領域17の雰囲気中に
含まれるHg蒸気等の過剰分が析出し、上述の冷
えた管壁に吸着する。このようにして雰囲気中に
含まれていたHg等は急速に失なわれて行く。 In the rapidly cooled portion of the reactor core tube 1, the temperature inside the reactor core tube 1 also decreases, and the atmosphere in the reaction space becomes supersaturated with Hg and the like in this portion and its vicinity. Therefore, excess Hg vapor and the like contained in the atmosphere of the supersaturated region 17 is precipitated and adsorbed on the above-mentioned cold pipe wall. In this way, Hg and the like contained in the atmosphere are rapidly lost.
一方成長ゾーンは所定の降温速度により降温さ
れているので、上述の過飽和領域17より高温で
あつて、液相一気相間の準平衡状態を維持してい
る。従つてこの部分ではHg等の析出は起こらず、
従来の成長方法に見られた望ましくない付着物の
発生は皆無と言つてよい。 On the other hand, since the temperature of the growth zone is lowered at a predetermined temperature lowering rate, the temperature is higher than the above-mentioned supersaturated region 17, and a quasi-equilibrium state between the liquid phase and the gas phase is maintained. Therefore, precipitation of Hg etc. does not occur in this part,
It can be said that there is no occurrence of undesirable deposits seen in conventional growth methods.
第3図は本実施例の成長ゾーンの経過時間に対
する温度プロフアイルを示す図であつて、期間
は成長を終了するまでの期間、また期間は成長
終了後の冷却期間を示す。上記期間の区間は
昇温期間,区間は成長源を完全に融解して溶融
物5とする期間,区間はこの溶融物5がCdTe
薄板7上に運ばれてCdTeを溶解し、飽和融液と
される期間,区間は基板6上で溶解物5の温度
を上げ、基板6の表面を一部溶解させるメルトバ
ツクの期間,区間は液相成長の期間である。 FIG. 3 is a diagram showing a temperature profile with respect to elapsed time in the growth zone of this example, where the period indicates the period until the growth is completed, and the period indicates the cooling period after the growth is completed. The above period is a temperature rising period, the period is a period when the growth source is completely melted to form the melt 5, and the period is when this melt 5 is CdTe
The period during which the CdTe is transported onto the thin plate 7 and turned into a saturated melt is the period during which the temperature of the melt 5 is raised on the substrate 6 and a portion of the surface of the substrate 6 is melted. It is a period of phase growth.
期間が終了すると前述の如く成長ゾーンは図
の実線18で示すように所定の降温速度により徐
冷される。これに対し前記高圧エアーを吹きつけ
る等の手段により冷却された領域17は、一点鎖
線19で示すように急冷されて過飽和領域17が
形成される。なお同図においては説明の便宜上期
間の頭初の過飽和領域17の温度を成長ゾーン
と同一温度で示したが、過飽和領域17を設ける
場所によりその温度は異なるので、両者は必ずし
も一致しない。 When the period ends, as described above, the growth zone is slowly cooled at a predetermined cooling rate as shown by the solid line 18 in the figure. On the other hand, the region 17 cooled by means such as blowing high-pressure air is rapidly cooled to form a supersaturated region 17 as shown by a dashed line 19. In addition, in the figure, for convenience of explanation, the temperature of the supersaturated region 17 at the beginning of the period is shown as the same temperature as the growth zone, but since the temperature differs depending on the location where the supersaturated region 17 is provided, the two do not necessarily match.
なお過飽和領域17を形成するには上記一実施
例の如く、反応空間の一部を局部的に急冷する
が、その方法は空冷法に限定されるものではな
く、水冷法その他如何なる冷却法を用いてもよ
い。また過飽和領域17を形成する位置は成長ゾ
ーン以外の場所であれば、反応空間内のどこに選
んでもよいことは容易に理解できよう。 In order to form the supersaturated region 17, a part of the reaction space is locally rapidly cooled as in the above embodiment, but the method is not limited to air cooling, and any cooling method such as water cooling may be used. It's okay. Furthermore, it is easy to understand that the supersaturated region 17 can be formed anywhere in the reaction space as long as it is outside the growth zone.
更に本発明はHg1-XCdXTe層のみならず他の如
何なる成分組成の多元半導体層を成長させる場合
にも用い得るものであること、及び反応空間を準
平衡状態とするための手段は前記一実施例に限定
されるものではなく、他の如何なる手段を用いて
もよいことも特に説明するまでもない。 Furthermore, the present invention can be used not only to grow a Hg 1-X Cd It goes without saying that the present invention is not limited to the one embodiment described above, and that any other means may be used.
以上説明した如く本発明により、液相成長が終
了するまでは反応空間を準平衡系となし、液相成
長終了後の冷却期間においては反応空間内の成長
ゾーンを除く他の部分に過飽和領域を形成するこ
とにより、Hgのような易蒸発性成分を構成成分
として含む多元半導体層であつても、成分組成を
正確に制御し且つ成長層表面に付着物を生じない
液相エピタキシヤル成長法が提供された。 As explained above, according to the present invention, the reaction space is made into a quasi-equilibrium system until the liquid phase growth is completed, and during the cooling period after the liquid phase growth is completed, a supersaturated region is created in the reaction space other than the growth zone. By forming a multi-component semiconductor layer that contains easily evaporable components such as Hg, a liquid phase epitaxial growth method that accurately controls the component composition and does not produce deposits on the surface of the grown layer can be achieved. offered.
第1図〜第3図は本発明の液相エピタキシヤル
成長方法の一実施例を示す図で、第1図は上記一
実施例に用いた液相エピタキシヤル成長装置を示
す要部断面図、第2図は第1図の炉心管内におけ
る温度分布を示す図、第3図は成長ゾーンと過冷
却領域の時間経過に対する温度変化を示す図であ
る。
図において、1は炉心管(反応管)、5は液相、
6は基板、13は水銀、16はガス供給管、17
は過冷却領域、18は成長ゾーンの温度、19は
過冷却領域の温度、は液相エピタキシヤル成長
を終了するまでの期間、は冷却期間、Aは成長
用器具、Bは水銀の蒸発源、Cは第1高温ブロツ
ク、Dは第2高温ブロツクを示す。
1 to 3 are diagrams showing an embodiment of the liquid phase epitaxial growth method of the present invention, and FIG. 1 is a cross-sectional view of essential parts showing the liquid phase epitaxial growth apparatus used in the above embodiment; FIG. 2 is a diagram showing the temperature distribution in the core tube of FIG. 1, and FIG. 3 is a diagram showing temperature changes over time in the growth zone and supercooled region. In the figure, 1 is the reactor core tube (reaction tube), 5 is the liquid phase,
6 is a substrate, 13 is mercury, 16 is a gas supply pipe, 17
is the supercooled region, 18 is the temperature of the growth zone, 19 is the temperature of the supercooled region, is the period until the liquid phase epitaxial growth is completed, is the cooling period, A is the growth apparatus, B is the mercury evaporation source, C indicates the first high temperature block, and D indicates the second high temperature block.
Claims (1)
式の反応管内にて易蒸発性成分を含む多元半導体
層を成長する液相エピタキシヤル成長方法におい
て、前記反応管内に液相エピタキシヤル成長用器
具と、前記易蒸発性成分蒸気の発生源と、該易蒸
発性成分蒸気の発生源および液相エピタキシヤル
成長用器具を配設した所定の区域と前記ガス排出
口との間に貫通孔を有する高温ブロツクとを配設
し、エピタキシヤル成長時には前記液相エピタキ
シヤル成長用器具を配設した成長ゾーンを含む所
定の区域を液相と気相の準平衡状態に保ち、エピ
タキシヤル成長終了時には前記所定の区域のうち
成長ゾーンを除く残りの区域の少なくとも一部を
反応管外より反応管壁にガスを噴射して冷却し、
該冷却区域における前記易蒸発性成分を過飽和状
態にするようにしたことを特徴とする液相エピタ
キシヤル成長方法。1. In a liquid phase epitaxial growth method in which a multi-component semiconductor layer containing an easily evaporable component is grown in an open reaction tube having a gas inlet and a gas outlet, a liquid phase epitaxial growth device and a device for liquid phase epitaxial growth are provided in the reaction tube. , a high-temperature system having a through hole between the source of the easily evaporable component vapor, a predetermined area in which the source of the easily evaporable component vapor and the liquid phase epitaxial growth device are arranged, and the gas outlet; During epitaxial growth, a predetermined area including the growth zone in which the liquid phase epitaxial growth equipment is provided is kept in a quasi-equilibrium state between the liquid phase and the gas phase, and when the epitaxial growth is completed, the predetermined area is cooling at least a portion of the remaining area excluding the growth zone by injecting gas onto the reaction tube wall from outside the reaction tube;
A liquid phase epitaxial growth method, characterized in that the easily evaporable component in the cooling zone is brought into a supersaturated state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56097739A JPS57211725A (en) | 1981-06-23 | 1981-06-23 | Liquid epitaxial growth method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56097739A JPS57211725A (en) | 1981-06-23 | 1981-06-23 | Liquid epitaxial growth method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57211725A JPS57211725A (en) | 1982-12-25 |
| JPS6316902B2 true JPS6316902B2 (en) | 1988-04-11 |
Family
ID=14200259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56097739A Granted JPS57211725A (en) | 1981-06-23 | 1981-06-23 | Liquid epitaxial growth method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57211725A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1210812B (en) * | 1987-06-16 | 1989-09-29 | Selenia Ind Elettroniche | PROCEDURE FOR THE MANUFACTURE OF MONOCRYSTALLINE LAYERS OF CADMIUM AND MERCURY TELLURIDE |
-
1981
- 1981-06-23 JP JP56097739A patent/JPS57211725A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57211725A (en) | 1982-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6187089B1 (en) | Tungsten doped crucible and method for preparing same | |
| US3507625A (en) | Apparatus for producing binary crystalline compounds | |
| Rudolph et al. | The horizontal Bridgman method | |
| US3493431A (en) | Vapor-liquid-solid crystal growth technique | |
| Deitch | Liquid-phase epitaxial growth of gallium arsenide under transient thermal conditions | |
| JP2001514149A (en) | Apparatus and method for crystal growth | |
| US4923561A (en) | Crystal growth method | |
| Yablonovitch et al. | Wetting angles and surface tension in the crystallization of thin liquid films | |
| JPS6316902B2 (en) | ||
| EP0765406A1 (en) | Improvements in crystal growth | |
| US3290181A (en) | Method of producing pure semiconductor material by chemical transport reaction using h2s/h2 system | |
| US3501406A (en) | Method for producing rod-shaped silicon monocrystals with homogeneous antimony doping over the entire rod length | |
| US6800137B2 (en) | Binary and ternary crystal purification and growth method and apparatus | |
| JPH0286121A (en) | Device for vapor growth of compound semiconductor | |
| JP2599767B2 (en) | Solution growth equipment | |
| JP2005089257A (en) | Group III nitride crystal growth method and crystal growth apparatus | |
| JPH11513352A (en) | Method for epitaxially growing an object and apparatus for such growth | |
| JPS5946096B2 (en) | Liquid phase epitaxial growth equipment | |
| JPH11513353A (en) | Method for epitaxially growing objects and apparatus for performing such growth | |
| JP2000026190A (en) | Equipment for growing compound single crystal and method for growing compound single crystal, using the same | |
| US20230099939A1 (en) | Controlling the thickness and width of a crystalline sheet formed on the surface of a melt using combined surface cooling and melt heating | |
| JP2697327B2 (en) | Compound semiconductor single crystal manufacturing equipment | |
| JP2004277228A (en) | Crystal growth method | |
| JPH0139997B2 (en) | ||
| Tsaur | Czochralski growth of gallium indium antimonide alloy crystals |