JPS6317325B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a method for manufacturing a terminal piece for an electronic component such as a radial lead terminal used in a multilayer ceramic chip capacitor or the like.

(b) Prior Art and Problems A radial lead terminal provided on a chip component on which an electric circuit is formed is formed as shown in FIG. 1A, 1B, and 1C are explanatory diagrams showing the manufacturing process of a radial type lead terminal.

As shown in a, first, a wire terminal piece 3 bent in a U-shape and solder-plated is attached to the electrode 2 formed of a thick film such as Ag-Pd of the chip component 1.
The tip 3A is superimposed on the electrode 2 by sandwiching the electrodes. Next, as shown in b, the chip component 1 is immersed in the solder bath 4 in which the solder 5 is melted. Thereby, the electrode 2 and the tip 3A are fixed by the solder 5 as shown in c. Thereafter, the bent portion 3B of the terminal piece 3 is cut to form a radial lead terminal 3C.

In manufacturing such a terminal piece, when the chip 1 is immersed in the solder bath 4, it is necessary to prevent the overlapping part of the electrode 2 and the tip 3A from coming off in order to ensure that they are fixed without any displacement. Conventionally, consideration has been given to compressing the chip component 1 by giving the terminal piece 3 bent in a U-shape a tension in the direction of arrow A.

However, such a clamping force tends to cause the terminal 3C to come off easily, and the terminal 3C is bent and fixed due to the positional shift, and furthermore, there is a problem that the terminal 3C is not completely fixed.

(c) Object of the Invention The object of the invention is to provide a device which eliminates the above-mentioned problems by temporarily fixing the electrode and the terminal piece when the chip component is immersed in a solder bath.

(d) Structure of the Invention The object of the present invention is to provide a method for manufacturing a terminal piece for electronic components. The solder film is formed using high-temperature solder whose melting point is higher than that of the solder in the solder bath, and a flux is applied to the overlapping portion of the electrode and the tip, and heat rays are irradiated for a predetermined period of time to melt the solder film. This is achieved by a method for manufacturing a terminal piece for an electronic component, which is characterized by performing post-dipping solder.

(e) Embodiments of the Invention The present invention will be described in detail below with reference to FIGS. 2 and 3.

As the terminal piece 3, attach it to the outer periphery of a wire of 0.5±0.05φ.
It was made by bending it into a U-shape as shown in Figure 1 using MLH-122 solder-plated annealed copper wire (manufactured by Kyowa Electric Wire) with a 12 μm thick coating formed with 90% Pb and 10% Sn solder. The chip component 1 is then held between the terminal pieces 3. Next, electrode 2 and tip 3
Apply I, P, A diluted flux of WW rosin to the overlapping area with A, and apply H ₁ , as shown in the graph of Figure 2.
Preheating with H ₂ and H ₃ is performed, and further heating is performed using an infrared light source to reach approximately 300°C as shown in F to melt the coating on the terminal piece 3 and connect the electrode 2 and tip 3A of the overlapping part. Temporarily fix. In this case, the temporary fixing strength due to infrared heating is as shown in the graph of the relationship between infrared heating time and tensile strength in FIG.

As the infrared heating time increases as shown in P ₁ , P ₂ , and P ₃ , the tensile strength increases. In _P3 , where the infrared heating time is 3 seconds, the tensile strength is high, but the flux is oxidized and the "solder wetting" property is deteriorated during dipping. But P ₂ for 2 seconds
The flux is not oxidized and has good "solder wetting" properties. In this case, unless flux is applied, the electrode 2 and tip 3A will not be fixed even if the coating is melted.

After being temporarily fixed, Ag3% is added to the Pb40/Sn60 ratio.
250±5 using a solder with a melting point of 180 to 183℃.
Immerse it in a solder bath at ℃. After this immersion, the chip component 1 was taken out from the solder bath and was checked for poor adhesion or misalignment between the electrode 2 and the tip 3A, but it was found that neither of these problems occurred and they were securely bonded.

In this way, the temperature of the fusion by the coating is set higher than the melting point of the solder in the solder bath, so the temporary bonding caused by infrared heating does not come off during dipping.
In addition, the effect of "solder wetting" caused by the flux is added, and a good solder tank can be formed.

(f) Effects of the Invention As explained above, the present invention provides a coating on the terminal piece 3 that is formed by high-temperature solder plating so that the electrode 2 and the tip 3
The overlapping portion with A is coated with flux and temporarily fixed by infrared heating to perform dipping.

This eliminates chipping and misalignment during transfer of the chip component 1 during the manufacturing process, and also prevents chipping during dipping and bending of terminals due to misalignment during incomplete fixation, which has a great practical effect.

Although the present invention has been described using a radial type terminal piece 3, it is also applicable to an axial type where the terminal piece 3 is located coaxially with the chip component 1, and the same effect can be obtained.

[Brief explanation of the drawing]

Figures a, b, and c in Figure 1 are explanatory diagrams showing the manufacturing process of a radial lead terminal, and Figure 2 is a graph of the relationship between heating temperature and time in an example of the method for manufacturing a terminal piece for electronic components according to the present invention. , FIG. 3 shows a graph of the relationship between infrared heating time and tensile strength. In the figure, 1 is a chip component, 2 is an electrode, and 3 is a chip component.
indicates a terminal piece, 4 indicates a solder tank, and 5 indicates solder.

Claims (1)

[Claims] 1. By soldering a stacked part in which the end of a U-shaped terminal piece with a solder coating is overlaid on a smooth terminal electrode in a solder bath, the terminal piece protrudes from the terminal electrode. In the method for manufacturing a terminal piece for an electronic component in which a radial type lead terminal is formed by fixing the solder film with a high-temperature solder having a higher melting point than the solder in the solder bath, 1. A method of manufacturing a terminal piece for an electronic component, comprising applying flux and irradiating the solder coating with heat rays for a predetermined period of time to melt the solder coating, and then performing the solder dipping.