JPS6317916B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in an electrodeposition processing apparatus for forming an electrodeposition layer or an electroformed layer on the surface of a workpiece or the surface of a matrix.

Conventionally, when performing electrodeposition processing, if the surface of the base material is uneven, there is a drawback that uniform electrodeposition cannot be formed. The current-carrying energy line is high in the convex part and low in the concave part. Therefore, the current is concentrated in the convex portions and the amount of electrodeposition is large, but it is difficult to flow in the concave portions and the amount of electrodeposition is small, and depending on the shape, almost no electrodeposition may be possible. When a large amount of electrodeposition is performed on the convex portions, the lines of electric force tend to become higher and higher, and the difference in electrodeposition on the uneven portions further increases, making uniform electrodeposition impossible.

The present invention has been proposed to eliminate this drawback. That is, the present invention is characterized by not only electrodeposition but also electrodeposition while performing a polishing action.
A tool electrode is used in which two or more wire rods are attached in the axial direction to the end face of a rotating cylinder. Machining is performed while each wire rotates, presses into contact with the processing surface of the workpiece, slides on it by friction, and moves away from the workpiece.

The present invention will be explained below with reference to an embodiment of the drawings.
As shown in a perspective view of the tool electrode in FIG. 1, the tool electrode is fixed to a rotating cylinder 1 by attaching a conductive wire 3 to one end surface 1A in the axial direction. It is preferable to plant the plant parallel to the axial direction or with the tip tapered. A side view is shown in FIG.
It is preferable to plant two or more wire rods 3 symmetrically around the central axis of the cylinder 1 to ensure smooth rotation.

A rotating shaft 2 is provided at the other end 1B of the cylinder.

FIG. 3 shows an example of electrodeposition processing, in which when the rotating shaft 2 is connected to the motor 4 and high speed rotation is applied, the free end of the wire 3 at the tip of the cylindrical body 1 spreads outward. At this time, when brought close to the processed surface 5A of the workpiece 5, each wire 3 comes into contact with the processed surface 5A. The wire rod 3 is rotated while controlling its spread, rotational force, etc. by controlling the rotational speed, torque, etc. of the motor 4. Reference numeral 6 denotes a power source for electrodeposition, which applies current between the wires 3 using the workpiece 5 as a cathode to flow an electrodeposition current. DC, DC+AC, pulse,
High frequency superposition etc. are optionally used. Reference numeral 7 denotes a nozzle for supplying an electrodeposition liquid, and a metal layer is electrodeposited on the processing surface 5A by passing an electric current through the electrodeposition liquid.

The wire rod 3 at the tip of the tool electrode expands due to high-speed rotation by the motor 4, and when the rotation is stopped, the wire rod 3 returns to its original state and narrows. Now, when the wire rods 3, which are expanded by high-speed rotation, are brought into contact with the surface 5A of the workpiece as shown in the figure, each wire rod bends and bends due to rotational movement, and fits onto the work surface 5A and slides by friction. Each wire rod 3 leaves the machining surface 5A every rotation, rotates, comes into pressure contact with the machining surface 5A, slides by friction, moves and passes, and as the cylinder rotates, each wire rod 3 moves one after the other. This is repeated, and the processed surface 5A is sequentially struck and polished by the sides of each wire rod 3. If this polishing is performed at the beginning of electrodeposition processing, the surface of the workpiece can be cleaned. During this time, electricity is supplied from the power source 6, electrodeposition liquid is supplied from the nozzle 7, and electrodeposition plating is performed. The plating layer is polished by friction with the wire 3, and plating and polishing are repeated. The electrodeposition current is pulsed when the wire 3 is contacted and released, and the electrodeposition is also performed in a pulsed manner. Since the polishing action is mainly performed on the convex portions of the electrodeposited layer, even if the electrodeposition is not uniform, the electrodeposition is smoothed by polishing, so that a uniform plating layer is formed on the processed surface 5A as a whole. Further, since the electrodeposition process is performed while striking the processed surface 5A with the side of each wire, the plating layer can be formed densely.

If a passivation material is formed on the surface of the plating layer on the processed surface 5A, the electrodeposition rate will decrease, but it will be activated by the abrasive action of the wire 3, and the intervening electrodeposition liquid will be moved and stirred, so the surface portion will always be activated. Highly efficient electrodeposition can be performed with increased ion density.
The grindability of the wire rod 3 due to frictional sliding does not remove the entire plating layer, but rather polishes and smoothes the surface, so layers can be stacked one after another, making it possible to form thick, arbitrary layers. Can be formed.

When the abrasiveness is high, it is recommended to weaken the contact pressure of the wire, and when the amount of electrodeposition is large, it is recommended to interrupt the energization during processing. When final polishing is required, turn off the power and polish to create a mirror finish.

The electrode tool is moved according to the shape of the surface to be machined of the workpiece, and the wire 3 is fitted onto the surface of the workpiece and electrodeposited in a pulsed manner through friction, so that grooves, grooves, etc. An electrodeposited plating layer with a smooth and uniform surface can be easily formed on the inner surface of the pores. Electrodeposition into pores, narrow grooves, etc. can be easily achieved by making the cylinder thinner and attaching the metal wire to a smaller diameter.

The material of the wire 3 is preferably a metal alloy material with low solubility and wear resistance, but piano wire, stainless steel wire, tungsten carbide wire, titanium nitride wire, etc. are generally used to improve wear resistance, abrasiveness, etc. Hard material particles such as tungsten carbide, boron carbide, diamond, boron nitride, alumina, etc. are attached, bonded, painted, coated, etc. on a bus bar made of copper, brass, nickel, etc. for use. It can also be used by wrapping an abrasive material such as sandpaper around it.

In addition, we glue insulating hard materials to make them porous so as not to impede electrical conductivity.
Alternatively, if they are partially glued together, it becomes an insulating spacer and can be processed without passing a short-circuit current.

The diameter of the wire used is about 0.1 to 3 mmφ,
Round, square, and band-shaped wire rods are used. The number of tubes attached to the cylinder was 2 or more, at most about 20, and good results were obtained when the tubes were attached at equal intervals in symmetrical positions. The rotation speed can be used from about 100 rpm to about 20,000 rpm.

In the above embodiment, the electrodeposition liquid was supplied from the nozzle, but a jet hole may be provided in the cylindrical body 1 and the electrodeposition liquid may be supplied through the mounting wire 3. You can go in a state.

Even if a steady DC power source is used as the energizing power source 6, each wire 3
As the electrode rotates and comes into contact with and separates from the workpiece 5, it becomes pulsed and increases the current density, making it possible to perform high-quality and highly efficient electrodeposition. Further, the electrodepositivity can be further improved by using a pulse as a power source and using a high frequency pulse.

As explained above, since the present invention performs electrodeposition while polishing, it is possible to scrape off excessively deposited parts and make the electrodeposition smooth, and it can be applied to any machined surface or curved interior, which was previously impossible. It is possible to easily form a smooth electrodeposited metal layer.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a tool electrode of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a configuration diagram of an embodiment of the device of the present invention. 1 is a cylindrical body, 2 is a rotating shaft, 3 is a wire rod, 4 is a motor, 5 is a workpiece, 6 is an electrodeposition power source, and 7 is an electrodeposition liquid supply nozzle.

Claims (1)

[Scope of Claims] 1. A tool electrode formed by fixing a plurality of electrically conductive wires to the end face of a cylinder including a solid body in a substantially axial direction of the cylinder; A rotary motor that rotates around an axis, a processing power supply that passes an electrodeposition current between the tool electrode and the workpiece, and a device that interposes an electrodeposition liquid between the tool electrode and the surface of the workpiece. An electrodeposition processing device comprising: 2. The plurality of conductive wires fixedly attached to the end face of the cylinder in the substantially axial direction of the cylinder are disposed in a uniform shape with respect to the central axis of the cylinder. An electrodeposition processing apparatus according to claim 11. 3. The plurality of conductive wires provided in the same dissipating shape are provided in such a shape that the distance between each wire at the free end thereof is smaller than the distance between each wire at the fixed end. An electrodeposition processing apparatus according to claim 2, characterized in that: 4. The electrodeposition processing apparatus according to claim 1, wherein the wire has hard material particles on its surface.