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JPS6319066B2 - - Google Patents
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JPS6319066B2 - - Google Patents

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Publication number
JPS6319066B2
JPS6319066B2 JP10303781A JP10303781A JPS6319066B2 JP S6319066 B2 JPS6319066 B2 JP S6319066B2 JP 10303781 A JP10303781 A JP 10303781A JP 10303781 A JP10303781 A JP 10303781A JP S6319066 B2 JPS6319066 B2 JP S6319066B2
Authority
JP
Japan
Prior art keywords
metal foil
temperature
top surface
temperature detection
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10303781A
Other languages
Japanese (ja)
Other versions
JPS585986A (en
Inventor
Hiroshi Sakaguchi
Suminori Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP10303781A priority Critical patent/JPS585986A/en
Publication of JPS585986A publication Critical patent/JPS585986A/en
Publication of JPS6319066B2 publication Critical patent/JPS6319066B2/ja
Granted legal-status Critical Current

Links

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  • Surface Heating Bodies (AREA)

Description

【発明の詳細な説明】 (利用分野) 本発明はナイロン、ポリエチレン等の薄い絶縁
フイルムを上下層とし、この間に発熱線をエツジ
ングによつて形成した面状発熱体に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Application) The present invention relates to a planar heating element having upper and lower layers of thin insulating films made of nylon, polyethylene, etc., with heating wires formed therebetween by etching.

(従来技術の問題点) この種面状発熱体は発熱線とは別にこの発熱線
の温度コントロールを行う温度検出用線を発熱線
と同様の加工法にて埋設する。
(Problems with the Prior Art) In this kind of sheet heating element, a temperature detection wire for controlling the temperature of the heating wire is embedded separately from the heating wire using the same processing method as the heating wire.

従つて、従来例としては絶縁フイルム、発熱用
線、温度検出用線との3者関係に於て、2通りの
ものが存在する。
Therefore, as a conventional example, there are two types in terms of the relationship between the insulating film, the heat generating line, and the temperature detecting line.

即ち、その1つは絶縁フイルムの上下面に例え
ばアルミニウムの金属箔を貼着し、エツジングに
よつて一方面を発熱線用とし、他方面を温度検出
用線とし、その中間の上記フイルムのインピーダ
ンス変化によつて温度制御しようとしている。
That is, one method is to attach metal foils, such as aluminum, to the upper and lower surfaces of an insulating film, and use etching to make one side a heating wire and the other side a temperature detection wire, and change the impedance of the film in between. We are trying to control the temperature through changes.

而して上記のものであると、2枚の金属箔が必
要で、而も2面のエツジングとなり、更には上記
絶縁フイルムとは別に上下フイルムの3枚が必要
となる。勿論ピン等が刺つた際、発熱用線とで短
絡によつて検知する感電防止用金属箔を付加すれ
ば、更に4枚目のフイルムが必要となる。
In the above case, two metal foils are required, which results in two-sided etching, and furthermore, three sheets of upper and lower films are required in addition to the above-mentioned insulating film. Of course, if a metal foil for preventing electric shock is added, which detects a short circuit with the heating wire when a pin or the like pierces the film, a fourth film will be required.

従つて部材点数が多く量産向ではない。 Therefore, the number of parts is large and it is not suitable for mass production.

続いてもう1つの方法は、発熱用線をもつて温
度検出用線を兼ねたものである。
Another method is to have a heat generating line that also serves as a temperature detecting line.

これは確かに1枚の金属箔と、上下のフイルム
だけでよく、部材点数が少いが、反面次の問題点
がある。
Although this requires only one metal foil and upper and lower films, and the number of components is small, it has the following problems.

即ち発熱用には商用電源のため50又は60サイク
ルの周波数をとり、又このサイクルとは別の周波
数(一般に1000サイクル)でもつてその発熱用線
に流して温度上昇時の電流値をもつて監視する。
従つてこの兼用のものでは2異の周波数を用いな
ければならず、特にその差を大きくするのはノイ
ズによる誤動作を防ぐためである。
In other words, for heat generation, a frequency of 50 or 60 cycles is used for the commercial power supply, and a frequency other than this cycle (generally 1000 cycles) is passed through the heat generation line and the current value is monitored as the temperature rises. do.
Therefore, in this dual-purpose device, two different frequencies must be used, and the reason for making the difference particularly large is to prevent malfunctions due to noise.

更に、実験によれば金属箔の抵抗値変化のみを
検出して温度制御及び過昇防止をする場合は金属
箔の抵抗値Rと温度tの間には通常比例関係が成
立する。これは第5図に示し、 Rt=Ro{1+α(t−to)} α:温度抵抗係数で通常の金属では4×
10-3/℃である。
Further, according to experiments, when temperature control and excessive rise prevention are performed by detecting only changes in the resistance value of the metal foil, a proportional relationship is usually established between the resistance value R of the metal foil and the temperature t. This is shown in Figure 5, Rt=Ro {1+α(t-to)} α: Temperature resistance coefficient, which is 4× for ordinary metals.
10 -3 /℃.

例えば第6図に示す如く {制御温度 50℃ 室 温 20℃ 断熱部以外の温度 36℃ 局部断熱面積1/10(面発熱体全面積の1/10)} と仮定した場合断熱部の温度上昇値を計算してみ
ると、 金属箔の温度抵抗係数は4×10-3/℃であるか
ら50℃のときの抵抗値R50は R50=R20{1+4×10-3(50−20)} =1.123R20 となる。R50の抵抗値で制御回路が働いて電源を
切る。
For example, as shown in Figure 6, if we assume {control temperature 50℃, room temperature 20℃, temperature outside the insulation part 36℃, local insulation area 1/10 (1/10 of the total area of the surface heating element)}, the temperature in the insulation part will increase. When calculating the value, the temperature resistance coefficient of metal foil is 4 × 10 -3 /℃, so the resistance value R 50 at 50℃ is R 50 = R 20 {1 + 4 × 10 -3 (50−20 )} = 1.123R 20 . The control circuit operates with a resistance value of R 50 and turns off the power.

断熱部の面積を考慮して全体の抵抗値を求めた
ものが制御抵抗値(R50)と等しくなるときの断
熱部の温度を計算すると この面発熱体を床面暖房等に使用した場合を想
定すると通常の使用状態では最高50℃で制御され
るが面発熱体の1/10が局部断熱された場合断熱部
の温度は183.5℃になり火傷、火災の恐れが生ず
る。面発熱体の材料として通常の金属(Cu,Al,
Fe,ニクロムなど)を使用した場合は、温度抵
抗係数は0.4〜0.5×10-3/℃程度であり、局部断
熱された場合の温度上昇は、さけられない。
Calculating the temperature of the insulation part when the overall resistance value calculated considering the area of the insulation part becomes equal to the control resistance value (R 50 ) Assuming that this surface heating element is used for floor heating, etc., it will be controlled at a maximum temperature of 50℃ under normal usage conditions, but if 1/10 of the surface heating element is locally insulated, the temperature of the insulated part will increase to 183.5℃. There is a risk of burns or fire. Usual metals (Cu, Al,
(Fe, nichrome, etc.), the temperature resistance coefficient is about 0.4 to 0.5×10 -3 /°C, and a temperature rise cannot be avoided when local insulation is applied.

(目的) 本発明は上記の点に鑑みなしたものであつて、
即ち絶縁フイルムの同一面に同一金属箔をも発熱
用線と温度検出用線とをエツジングによつて形成
した後、一定以上の温度で電気抵抗値が変化する
半導体塗料を塗布し、その変化を電気的に検出す
ることを目的とするものであつて、特にその金属
箔は10〜50μという極めて薄く、そのエツジング
された側面間での電気的変化の検出では信頼性に
欠けることを解決したものである。
(Purpose) The present invention has been made in view of the above points, and
That is, after forming a heat generating line and a temperature detecting line using the same metal foil on the same side of an insulating film by etching, a semiconductor paint whose electrical resistance value changes at a temperature above a certain level is applied, and the change is detected. The purpose is to detect electrically, and the metal foil is extremely thin, measuring 10 to 50μ, so it solves the problem that detecting electrical changes between the etched sides is unreliable. It is.

(実施例) 以下本発明を一実施例として掲げた図面に基い
て説明すると、第1図は完成品の正面図であつ
て、下層絶縁フイルム1の上面に発熱用線2と温
度検出用線3とを形成し、両線2,3間に亘つて
半導体塗料5を部分的に塗布したものである。
(Example) The present invention will be explained below based on drawings showing an example of the present invention. FIG. 3, and a semiconductor paint 5 is partially applied between both lines 2 and 3.

第2図はその第1の製造方法を示し、(イ)に於て
ナイロン、ポリエチレン等の絶縁フイルム1を下
層とし、この上面に例えばAl,Cu等の10〜50μの
薄い金属箔Xを全面に亘つて貼着する。次に(ロ)に
示す如く導電性インキ4をその発熱用、温度検出
用に各々絶縁空間をもつて分離して印刷する。
尚、このインキ4は例えば藤倉化成(株)製ドータイ
トSH―1A(エポキシ液系)を使用するその固有
抵抗値は10-4Ω−cmとなつている。後(ハ)に示す如
くエツジング加工によつてインキ4を除く部分を
除去し、発熱用線2と温度検出用線3とを形成す
る。このエツジング加工は例えば塩化第2鉄によ
る。続いて(ニ)に示す如く一定温度以上でその電気
抵抗値が変化する半導体塗料5をその発熱用線2
と温度検出用線3とのエツジングされた側面2
a,3aと、導電性インキ4の上面とに塗布す
る。最終工程(ホ)は上層絶縁フイルム6を被覆接着
する。
Figure 2 shows the first manufacturing method. In (a), an insulating film 1 made of nylon, polyethylene, etc. is used as the lower layer, and a thin metal foil X of 10 to 50 μm made of Al, Cu, etc. is placed on the entire surface of the film. Paste it over the entire length. Next, as shown in (b), the conductive ink 4 is printed separately with insulating spaces for heat generation and temperature detection.
Incidentally, this ink 4 uses, for example, Dotite SH-1A (epoxy liquid type) manufactured by Fujikura Kasei Co., Ltd., and has a specific resistance value of 10 -4 Ω-cm. As shown in (c), the portions excluding the ink 4 are removed by etching to form the heat generating line 2 and the temperature detecting line 3. This etching process is performed using, for example, ferric chloride. Next, as shown in (d), the semiconductor paint 5 whose electrical resistance value changes above a certain temperature is connected to the heat generating wire 2.
Edged side surface 2 with and temperature detection wire 3
a, 3a and the upper surface of the conductive ink 4. In the final step (e), the upper insulating film 6 is coated and bonded.

この(ホ)に示すA,Bは発熱用線2と温度検出用
線3との電流通路であつて、Aはエツジングされ
た側面2a,3aであり、薄いがその単位面積当
り広い上面でインキ4を介してBのバイパスをも
検出できる。
A and B shown in this (e) are current paths between the heat generation wire 2 and the temperature detection wire 3, and A is the etched side surfaces 2a and 3a, which are thin but wide per unit area and are ink-filled. A bypass of B can also be detected via 4.

次に第3図は別の製造方法を示し、(イ)は下層フ
イルム1に金属箔Xを貼着し、(ロ)に示す如く絶縁
性インキ7で発熱回路と温度検出回路とを印刷す
る。このインキ7は塩ビ系を用いる。続いて(ハ)の
エツジング加工を施す。このエツジングの後この
インキ7を除去する。その方法は例えば苛性ソー
ダ液、又は溶剤にて化学的変化をもつて行う。こ
れは(ニ)に示す。更に(ホ)に示す半導体塗料5を塗布
する。(ヘ)は同様の上層フイルム6の接着である。
Next, FIG. 3 shows another manufacturing method, in which (a) metal foil X is pasted on the lower film 1, and as shown in (b), a heat generating circuit and a temperature detection circuit are printed with insulating ink 7. . This ink 7 is made of vinyl chloride. Next, perform the etching process (c). After this etching, this ink 7 is removed. The process is carried out with chemical changes, for example in caustic soda solution or in a solvent. This is shown in (d). Furthermore, a semiconductor paint 5 shown in (e) is applied. (F) shows the adhesion of a similar upper layer film 6.

(効果) 本発明は上記の如く絶縁フイルム1の同一面に
発熱用線2と温度検出用線3とを同一金属箔から
分離して形成したから、従来の両線を別々の金属
箔から形成していたものに比し金属箔及び絶縁フ
イルムの枚数が少くてすみ、而も同一に発熱用と
温度検出用とを1本の線で兼ねたものの如く温度
検出用として敢えて異なる周波数を設定すること
もない。
(Effects) As described above, the present invention forms the heat generating line 2 and the temperature detecting line 3 on the same surface of the insulating film 1 separately from the same metal foil. It requires fewer metal foils and insulating films than the previous method, and it purposely sets different frequencies for temperature detection, as if the same wire were used for both heat generation and temperature detection. Not at all.

更に本発明は半導体塗料5を両線2,3のエツ
ジングされた側面2a,3aと上面とに塗布して
両通路A,Bから電気的変化を検出するようにし
たから、この面状発熱体の金属箔Xが特に10〜
50μという極薄に於てもそのバイパスの上面から
も検出でき、もつて電気的変化が正確に検出し得
る効果がある。
Furthermore, in the present invention, the semiconductor paint 5 is applied to the etched side surfaces 2a, 3a and the upper surfaces of both the wires 2, 3 so that electrical changes can be detected from both the passages A, B. The metal foil X is especially 10~
Even if it is as thin as 50μ, it can be detected from the top surface of the bypass, which has the effect of accurately detecting electrical changes.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明面状発熱体の製造方法の一実施例
を示し、第1図は正面図、第2図は製造工程図、
第3図は異る実施例を示し、第4図及び第5図は
金属箔の抵抗特性図、第6図は温度分布図であ
る。 1…一方フイルム、2…発熱用線、3…温度検
出用線、4…インキ、5…半導体塗料、6…他方
フイルム、X…金属箔。
The drawings show an embodiment of the method for manufacturing the sheet heating element of the present invention, with FIG. 1 being a front view, and FIG. 2 being a manufacturing process diagram.
FIG. 3 shows a different embodiment, FIGS. 4 and 5 are resistance characteristic diagrams of the metal foil, and FIG. 6 is a temperature distribution diagram. DESCRIPTION OF SYMBOLS 1...One side film, 2...Heating line, 3...Temperature detection line, 4...Ink, 5...Semiconductor paint, 6...Other film, X...Metal foil.

Claims (1)

【特許請求の範囲】 1 下層絶縁フイルムの上面に金属箔を貼着し、
この金属箔の上面に導電性インキにて発熱用線の
回路と温度検出用線の回路とを互に絶縁空間をも
つて分離印刷し、この金属箔をエツジング加工に
よつて前記発熱用線と温度検出用線とを形成し、
更に一定温度以上でその電気抵抗値が変化する半
導体塗料を該発熱用線と温度検出用線とのエツジ
ングされた側面及び前記導電性インキの上面に塗
布し、後この半導体塗料の上面に上層絶縁フイル
ムを被覆接着したことを特徴とした面状発熱体の
製造方法。 2 下層絶縁フイルムの上面に金属箔を貼着し、
この金属箔の上面に絶縁性インキにて発熱用線の
回路と温度検出用の回路とを互に絶縁空間をもつ
て分離印刷し、この金属箔をエツジング加工によ
つて前記発熱用線と温度検出用線とを形成し、後
前記絶縁性インキを化学的方法にて除去し、更に
一定温度以上でその電気抵抗値が変化する半導体
塗料を該発熱用線と温度検出用線とのエツジング
された側面及び前記絶縁性インキが除去された上
面に塗布し、後この半導体塗料の上面に上層絶縁
フイルムを被覆接着したことを特徴とした面状発
熱体の製造方法。
[Claims] 1. A metal foil is attached to the upper surface of the lower layer insulating film,
On the top surface of this metal foil, conductive ink is printed to separate the heating wire circuit and the temperature detection wire circuit with an insulating space between them, and the metal foil is etched to separate the heating wire circuit and the temperature detection wire circuit. form a temperature detection wire,
Further, a semiconductor paint whose electrical resistance value changes above a certain temperature is applied to the etched side surfaces of the heating wire and temperature detection wire and the top surface of the conductive ink, and then an upper insulating layer is applied to the top surface of the semiconductor paint. A method for manufacturing a planar heating element characterized by coating and adhering a film. 2 Paste metal foil on the top surface of the lower layer insulating film,
On the top surface of this metal foil, a heat generating line circuit and a temperature detection circuit are printed separately with an insulating space using insulating ink, and this metal foil is etched to connect the heat generating line and the temperature detecting circuit. After forming a detection wire, the insulating ink is removed by a chemical method, and a semiconductor paint whose electrical resistance value changes above a certain temperature is applied to the heating wire and the temperature detection wire. A method for manufacturing a planar heating element, characterized in that the insulating ink is coated on the side surface and the top surface from which the insulating ink has been removed, and then an upper insulating film is coated and adhered to the top surface of the semiconductor coating.
JP10303781A 1981-06-30 1981-06-30 Method of producing panel heater Granted JPS585986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10303781A JPS585986A (en) 1981-06-30 1981-06-30 Method of producing panel heater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10303781A JPS585986A (en) 1981-06-30 1981-06-30 Method of producing panel heater

Publications (2)

Publication Number Publication Date
JPS585986A JPS585986A (en) 1983-01-13
JPS6319066B2 true JPS6319066B2 (en) 1988-04-21

Family

ID=14343457

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10303781A Granted JPS585986A (en) 1981-06-30 1981-06-30 Method of producing panel heater

Country Status (1)

Country Link
JP (1) JPS585986A (en)

Also Published As

Publication number Publication date
JPS585986A (en) 1983-01-13

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