JPS632130B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a feedthrough capacitor using a highly flexible film-like dielectric member.

As shown in the cross-sectional view of Fig. 1, a conventional feedthrough capacitor is formed by forming a dielectric 2 into a substantially disc-shaped metal case 1, which is attached to a chassis by soldering, and having electrodes 3 and 4 on both sides. One electrode 3 is connected to the bottom of the metal case 1 by solder, and the other electrode 4 is brought into contact with the collar 6 of the through terminal 5 that passes through the capacitor, and the metal case 1 surrounding the capacitor is connected to the bottom of the metal case 1 by soldering. The interior was filled with insulating resin 7. In addition, this feedthrough capacitor is slightly improved to prevent the solder connecting the electrode 3 and the bottom of the metal case 1 from melting and causing a short circuit with the feedthrough terminal 5 when it is attached to the chassis by soldering. A relief part (not shown) for molten solder is provided at the bottom of the metal case 1.

These feedthrough capacitors are basically formed using sintered porcelain with a high dielectric constant as the dielectric material 2 that forms the capacitor, so it takes a large number of steps to form a single feedthrough capacitor. It had drawbacks. Furthermore, as the number of steps for attaching the set to the set by soldering increases, the cost increases because of the assembly process.

Therefore, Jitko No. 51-45463, Jitko No. 53-23548
As disclosed in Japanese Utility Model No. 53-25175, a plurality of feedthrough capacitors are integrally formed in a plate or laminated form at the same time to reduce the number of work steps and cost, or to reduce the size. However, as mentioned above, these use porcelain with a high dielectric constant (formed by sintering) as a basic component, which severely limits their applications. In other words, once it is sintered and molded into a specific shape, it can hardly be used for anything other than the set that requires that specific shape, as it is made of porcelain that cannot be transformed. That's true. Therefore, it cannot be used for applications other than those that require large quantities of the same shape, so it has not been widely used.

The present invention has been made in view of the above points, and
It is an object of the present invention to provide a feedthrough capacitor which has a simple structure, is suitable for various uses, and is inexpensive by using a highly flexible single-sided metallized film with a metal film on one side as a basic component. purpose.

Embodiments of the present invention will be described below with reference to FIGS. 2 to 4.

FIG. 2 is a sectional view showing one embodiment of the feedthrough capacitor of the present invention, FIG. 3 is a sectional view showing another embodiment in which the feedthrough capacitor is laminated, and FIG. 4 is a sectional view showing a plurality of feedthrough capacitors integrated into one. It is a sectional view showing another example formed. A detailed explanation will be given below.

Reference numeral 11 denotes a single-sided metallized film, and this film 11 is made by molding a dielectric 12 into a highly flexible thin film, but a metal film (in some cases, a metal film as one electrode) is applied to one side with adhesive or the like. 13 (which may be a conductive film coated with silver paste or the like) is formed. This single-sided metallized film 11
is the dielectric 12 on which the metal film 13 is not provided.
The insulating surface of the metal plate 14 serving as the other electrode is tightly wrapped around the metal plate 14 (attached with adhesive or the like), and the metal film 13 on the outer periphery of the metal plate 14 and the single-sided metallized film 11 is attached. An encircling capacitor is formed with and as both electrodes.
In this state, a hole is provided that communicates the single-sided metallized film 11 and the metal plate 14, and a through terminal 15 that is press-fitted through the hole and held by the metal plate 14 is provided. Therefore, metal plate 1
4 is electrically connected to the through terminal 15 at the side wall of the through hole. On the other hand, the peripheral portions of the metal films 13, 13 forming the outer periphery of the through holes are removed by etching or the like to achieve electrical insulation between the metal films 13, 13 and the through terminals 15.

To attach the feedthrough capacitor of the present invention constructed in this manner to the chassis 16, as shown in FIG. They are fixed by soldering them together at the peripheral edge of the abutted portion.

As described above, the feedthrough capacitor of the present invention has a simple structure (including its installation at a predetermined position) and has the following advantages.

Manufactured at low cost.

It is easy to manufacture (there is no need to attach electrodes by sintering or sputtering as is the case when using porcelain), there is little variation in capacitance value, and there is no need for sorting, so the yield is high.

Since the through terminal 15 is press-fitted into the through hole of the metal plate 14, it is less likely to be damaged by external force.

Penetration terminal 1 because the outer periphery is surrounded by metal film 13
It has the effect of electrically shielding 5.

By selecting the shape of the through terminal 15, it can be made easy to use in a wide range of applications.

Next, another embodiment will be described based on the sectional view shown in FIG.

The feedthrough capacitor shown in FIG. 3 is formed by stacking the surrounding capacitors described in FIG. are doing.
In this case as well, in the surrounding capacitor in each layer, the internal metal plate 14 contacts the through terminal 15 at the side wall of the through hole, while the metal film 1 forming the outer periphery of the surrounding capacitor in each layer
3 and 13 are insulated from the through terminals 15 by removing the peripheral portions of their through holes. By forming the surrounding capacitor into multiple layers in this manner, there is an advantage that a large capacity feedthrough capacitor can be easily manufactured. Attachment to the chassis 16 is done by soldering as described above.

In the embodiment shown in FIG. 3, the surrounding capacitors are stacked vertically with one through terminal 15 in common, but a plurality of through capacitors are formed integrally in the vertical (or horizontal) direction. An example will be described next.

FIG. 4 shows a cross-sectional view of this embodiment.

A plurality of metal plates 14, 14, .
are folded so that their insulating surfaces are in contact with each metal plate 14 (of course, two single-sided metalized films
1 may be overlapped, but in this case, a means should be provided for electrically connecting the metal films 13, 13 of the two single-sided metallized films 11 at their peripheral edges or the like. ) The parts that come into contact are pasted. In this state, between each metal plate 14 and the metal films 13, 13 of the single-sided metallized film 11 sandwiching it from both sides (metal film 1
Each capacitor (corresponding to the encircling capacitor in the embodiment of FIG. 2) is formed, and each metal plate 14 and the single-sided metallized film 11 covered on both sides thereof are formed. As described in the embodiment shown in FIG. 2, 11 is provided with a communicating hole and a through terminal 15 that is press-fitted and penetrated through the communicating hole to form a through capacitor. In this case, as described above, each metal plate 14 and the through-hole terminal 15 press-fitted into the through-hole are electrically connected to each other at the side wall of the through-hole, while the metal films 13 on the outer periphery are etched etc. around the through-hole. By removing the metal film 13,
13 and the through terminal 15 are electrically insulated. As shown in FIG. 4, a group of integrally formed feedthrough capacitors (the figure shows a cross section of a case where they are regularly arranged in a grid pattern),
Of course, the arrangement does not necessarily have to be regular. ), if one feedthrough capacitor is cut and taken out, it will be approximately equivalent to the feedthrough capacitor shown in FIG. If not, a means for making the metal conductive, for example, a means for ensuring that the solder spreads over both metal films 13, 13 when soldering and fixing to the chassis 16 should be provided.)

Therefore, if a large number of feedthrough capacitors are integrally formed as in the embodiment shown in FIG. 4, they can be used as one body, or they can be cut appropriately and the required number can be used as one body. However, it is also possible to decompose it into a single feedthrough capacitor as described above (in this case, both metal films 1
3 and 13 should be provided with a means to make them conductive when they are not electrically connected at the peripheral edge. ). In FIG. 4, it is also possible to form each feedthrough capacitor into a layered structure. Further, the metal plate 14 may be replaced with one that moves approximately the same in any case.
For example, a printed circuit board with metal foil pasted on both sides may be used. In this case, it is desirable that the metal foils on both sides are electrically conductive, so when attaching the through terminal 15, the peripheral part of the through hole (the through hole may include the side wall of the through hole) is soldered. It is necessary to attach the In addition, the through terminals 15 are made long, and an insulating reinforcing plate is arranged at the boundary of each surrounding capacitor in a laminated structure as shown in FIG. It is also possible to form a capacitor.

As described above, according to the present invention, since a highly flexible film-like dielectric member is used as the basic component forming the feedthrough capacitor,
It has the advantage that it has a simple structure, is suitable for a variety of uses ranging from small to large capacity, and can be made into an inexpensive feedthrough capacitor.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a conventional feedthrough capacitor.
Fig. 2 is a sectional view showing one embodiment of the feedthrough capacitor of the present invention, Fig. 3 is a sectional view showing another embodiment formed in a laminated form, and Fig. 4 is a sectional view showing a plurality of feedthrough capacitors integrated in a planar form. FIG. 4 is a cross-sectional view showing another embodiment formed in the same manner as shown in FIG. 12... Dielectric, 13... Metal film, 14... Metal plate,
15...Through terminal, 16...Chassis.

Claims (1)

[Claims] 1. A metal film serving as one electrode is provided on one side of a thin film-like dielectric material to form a single-sided metallized film,
This film surrounds a metal plate serving as the other electrode, with the insulating surface of the film facing toward the outer peripheral surface of the metal plate, and a hole communicating between the film and the metal plate is provided. The metal plate and the through terminal are brought into contact by press-fitting the through terminal, and the metal film and the through terminal are insulated around the through hole, and a capacitor is formed by the metal film and the through terminal. A feed-through capacitor featuring: 2. A plurality of metal plates are arranged in a layered manner, each of these is surrounded by a metal film, a hole is provided to communicate with these, a through terminal is press-fitted into this hole, and the metal film is removed around the hole. 2. The feedthrough capacitor according to claim 1, wherein the feedthrough capacitor is insulated. 3. Insulating surfaces of single-sided metallized films are pasted on both sides of a plurality of metal plates arranged in parallel at predetermined intervals, and in this state, holes are provided that communicate with each metal plate, and through-hole terminals are inserted into these holes. 2. The feedthrough capacitor according to claim 1, wherein a plurality of feedthrough capacitors are integrally formed by adding a plurality of feedthrough capacitors.