JPS6321332B2 - - Google Patents
Info
- Publication number
- JPS6321332B2 JPS6321332B2 JP7561278A JP7561278A JPS6321332B2 JP S6321332 B2 JPS6321332 B2 JP S6321332B2 JP 7561278 A JP7561278 A JP 7561278A JP 7561278 A JP7561278 A JP 7561278A JP S6321332 B2 JPS6321332 B2 JP S6321332B2
- Authority
- JP
- Japan
- Prior art keywords
- coils
- substrate
- thick film
- conductor
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000010304 firing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 239000000696 magnetic material Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】
本発明はテレビジヨン受像機の入力端子部にお
けるインピーダンス変換トランスに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an impedance conversion transformer in an input terminal section of a television receiver.
従来の斯種トランスは第１図のようにメガネ型
コア１に導線２を第２図の回路接続を満足するよ
うに巻回して形成したものである。 A conventional transformer of this kind is formed by winding a conducting wire 2 around a spectacle-shaped core 1 as shown in FIG. 1 so as to satisfy the circuit connection shown in FIG.
しかしながら、このようにコア１に導線２を巻
回したインピーダンス変換トランスでは製造上、
自動化が難しく、またテレビジヨン受像機への取
り付けの際にも時間と手間がかかるという欠点を
有する。またテレビジヨン受像機に取り付けるま
での部品管理においても大変である。 However, in manufacturing the impedance conversion transformer in which the conductor 2 is wound around the core 1,
It has the disadvantage that it is difficult to automate, and it takes time and effort to install it on a television receiver. It is also difficult to manage parts until they are installed in a television receiver.
本発明はこれらの欠点を一掃したインピーダン
ス変換トランスを提案するものである。 The present invention proposes an impedance conversion transformer that eliminates these drawbacks.
本発明では第３図に示すようにインピーダンス
変換トランスを構成する第１〜第４コイルL1，
L2，L3，L4につきそれぞれ２つに分割して第１
部分L1a，L2a，L3a，L4a、第２部分L1b，L2b，
L3b，L4bとし、且つこれらのコイルを第４図に
示すように一枚の基板３の表面（第１図）３ａ及
び裏面（第２図）３ｂに分けて対応配置し、しか
もこれらのコイルをバイフアイラ・スパイラル状
厚膜導電体４で形成し、両面のコイルを前記基板
３を貫通する導電体５で接続したことを特徴とす
るものである。ここに、基板３はプリント板若し
くはセラミツク板でよく厚膜導電体４はプリント
板の銅箔又はセラミツク板に焼成した導電体材料
で形成すればよい、両面のコイルを結合する貫通
導電体５は例えばプリント板に設けたスルーホー
ル導電体で達成できる。第５図は第４図の構成を
結線図で示しており、回路的には第３図と同一の
回路である。第５図において、１１，１２，１
４，１５′は入出力端子を示しており、１６，１
６′、１７，１７′、１８，１８′、１９，１９′、
１３，１３′及び１５，１５′は表面３ａと裏面３
ｂにおける接続点を示し更に、点線は貫通する導
体を示している。尚、２０は接続点１３と１５を
接続する厚膜導電体である。 In the present invention, as shown in FIG. 3, the first to fourth coils L 1 , which constitute an impedance conversion transformer,
Divide each of L 2 , L 3 and L 4 into two and
Part L 1 a, L 2 a, L 3 a, L 4 a, second part L 1 b, L 2 b,
L 3 b, L 4 b, and these coils are arranged correspondingly on the front surface (FIG. 1) 3a and the back surface (FIG. 2) 3b of one board 3 as shown in FIG. These coils are formed of a bifilar spiral thick film conductor 4, and the coils on both sides are connected by a conductor 5 penetrating the substrate 3. Here, the substrate 3 may be a printed board or a ceramic board, and the thick film conductor 4 may be formed of a copper foil of a printed board or a conductive material fired on a ceramic board.The through conductor 5 that connects the coils on both sides is For example, this can be achieved with a through-hole conductor provided on a printed board. FIG. 5 shows the configuration of FIG. 4 in a wiring diagram, and the circuit is the same as that of FIG. 3. In Figure 5, 11, 12, 1
4, 15' indicate input/output terminals, 16, 1
6', 17, 17', 18, 18', 19, 19',
13, 13' and 15, 15' are the front surface 3a and the back surface 3
The connection point at b is shown, and the dotted line shows the conductor passing through. Note that 20 is a thick film conductor that connects the connection points 13 and 15.
また、第３図において、第４コイルの第２部分
L4bの一端と第２コイルの第２部分L2bとを接続
する線と第３コイルの第２部分L3bと一方の出力
端子４とを接続する線とが交叉するため、同一平
面上でこれらを構成すると厚膜導電体を重ねなけ
ればならない。しかしながら本発明では第４図
イ，ロ及び第５図に示す如く、端子１３′と１
５′を第２面３ｂ上で接続せずに第１面３ａにお
いて、端子１３′と１５′に夫々対応する接続点１
３，１５を接続する厚膜導体２０を設けることに
より第２面３ｂ上での交叉を回避している。 In addition, in FIG. 3, the second portion of the fourth coil
The wire connecting one end of L 4 b and the second portion L 2 b of the second coil and the wire connecting the second portion L 3 b of the third coil and one output terminal 4 intersect, so they are the same. If these are constructed on a flat surface, thick film conductors must be overlapped. However, in the present invention, as shown in FIGS. 4A and 4B and FIG.
Connecting points 1 corresponding to terminals 13' and 15', respectively, on the first surface 3a without connecting terminals 5' on the second surface 3b.
By providing a thick film conductor 20 that connects 3 and 15, crossing on the second surface 3b is avoided.
次に第４図のように形成されたコイル上に第７
図に示す如く導電性の低い磁性体８を施してイン
ダクタンスを上げる。この場合、ゴム状のフエラ
イトをコイル部上に貼着してもよく、粉末状のフ
エライトをペースト類に含有させコイルパターン
の上に更に印刷するなどして被覆しても良い。ま
た、その際、コイルを形成する導電体の上に絶縁
処理を施してから上述の磁性体を設けるようにし
ても良い。 Next, place the seventh coil on the coil formed as shown in Fig. 4.
As shown in the figure, a magnetic material 8 with low conductivity is applied to increase the inductance. In this case, rubber-like ferrite may be pasted onto the coil portion, or powder-like ferrite may be added to a paste and further printed on the coil pattern to cover it. Further, in this case, the above-mentioned magnetic material may be provided after performing an insulation treatment on the conductive material forming the coil.
以上の通り本発明では従来のようにコアを使用
せず且つ導線を使用しないで、基板３に厚膜導電
体４を形成して作成するものであるから製造上有
利であり、自動化も容易である。また部品として
の管理が容易であると共にテレビジヨン受像機へ
取り付ける際にも作業性がよいという効果があ
る。 As described above, in the present invention, the thick film conductor 4 is formed on the substrate 3 without using a core or conducting wire as in the conventional method, which is advantageous in terms of manufacturing and easy to automate. be. In addition, it is easy to manage as a component, and it also has the advantage of being easy to work with when attaching it to a television receiver.
また、表面に配したコイル部分と裏面に配した
コイル部分との間で相互誘導結合をするのでイン
ダクタンスも大きくなるという大きな効果があ
る。即ち本発明によれば例えば第１コイルの第１
部分L1aと第２部分L1bは直列に接続されて第１
部分L1aと第２部分L1bの合成インダクタンスが
得られるばかりでなく第１部分L1aと第２部分
L1bの相互間で電磁結合するので第１、第２部分
L1a，L1bが個別に有している自己インダクタン
スだけでなく相互インダクタンスが加算されて大
きなインダクタンス値となる効果がある。このよ
うにインダクタンスが増加され且つバイフアイラ
ースパイラル状による隣接コイルとの結合が十分
になると挿入損失（トランスを回路に挿入したこ
とによる信号のロス）も小さくなり、また電圧定
在波比の良好なインピーダンス変換トランスとな
る。 Furthermore, since there is mutual inductive coupling between the coil portion arranged on the front surface and the coil portion arranged on the back surface, there is a great effect that the inductance is also increased. That is, according to the present invention, for example, the first
The part L 1 a and the second part L 1 b are connected in series to
Not only can the composite inductance of the part L 1 a and the second part L 1 b be obtained, but also the composite inductance of the first part L 1 a and the second part L 1 b can be obtained.
Since there is electromagnetic coupling between L 1 b, the first and second parts
Not only the self-inductance that L 1 a and L 1 b have individually but also the mutual inductance are added together, resulting in a large inductance value. In this way, when the inductance is increased and the coupling with the adjacent coil due to the bifilar spiral shape is sufficient, the insertion loss (signal loss due to inserting the transformer into the circuit) is also reduced, and the voltage standing wave ratio is improved. It becomes an impedance conversion transformer.
また、厚膜導電体コイルを導電性の低い磁性体
で被覆したため、更にインダクタンスが増加し特
性も向上する。 Furthermore, since the thick film conductor coil is coated with a magnetic material having low conductivity, the inductance is further increased and the characteristics are also improved.
尚、全コイルを基板３の片面に厚膜導電体で設
けたインピーダンス変換トランスも考えられる
が、この場合には本発明の如きインダクタンスの
増加が期待できないから、電圧定在波比が劣り、
好ましくない。 It is also possible to consider an impedance conversion transformer in which all the coils are provided on one side of the substrate 3 using a thick film conductor, but in this case, the increase in inductance as in the present invention cannot be expected, and the voltage standing wave ratio is inferior.
Undesirable.
第６図はそのようなインピーダンス変換トラン
スの場合Ａと本発明の場合Ｂについて電圧定在波
比（VSWR）特性を比較して示しているが、こ
れからも分るように本発明のインピーダンス変換
トランスは特性的にも優れている。 FIG. 6 compares the voltage standing wave ratio (VSWR) characteristics of case A of such an impedance conversion transformer and case B of the present invention, and as can be seen from this, the impedance conversion transformer of the present invention has excellent characteristics as well.
第１図及び第２図は従来のインピーダンス変換
トランスの斜視図及び回路図である。第３図は本
発明のインピーダンス変換トランスの回路図であ
る。第４図イ，ロは本発明を実施したインピーダ
ンス変換トランスの平面図及び裏面図であり、第
５図はその回路結線図である。第６図は本発明の
効果を説明するための特性図である。第７図は本
発明の一実施例を示す斜視図である。
３……基板、３ａ……基板の表面（第１面）、
３ｂ……基板の裏面（第２面）、４……バイフア
イラスパイラル状厚膜導電体、５……基板を貫通
する導電体、８……導電性の低い磁性体。
1 and 2 are a perspective view and a circuit diagram of a conventional impedance conversion transformer. FIG. 3 is a circuit diagram of an impedance conversion transformer according to the present invention. 4A and 4B are a plan view and a back view of an impedance conversion transformer embodying the present invention, and FIG. 5 is a circuit connection diagram thereof. FIG. 6 is a characteristic diagram for explaining the effects of the present invention. FIG. 7 is a perspective view showing an embodiment of the present invention. 3...Substrate, 3a...Surface (first surface) of substrate,
3b...Back surface (second surface) of the substrate, 4... Bifilar spiral thick film conductor, 5... Electric conductor penetrating the substrate, 8... Magnetic material with low conductivity.
Claims (1)
るインピーダンス変換トランスにおいて、基板３
の第１面３ａに、夫々２分割された第１、第２コ
イルL1，L2の各第１部分L1a，L2a、夫々２分割
された第３、第４コイルL3，L4の各第１部分
L3a，L4a、基板３の第２面３ｂに、前記第１、
第２コイルL1，L2の各第２部分L1b，L2b及び前
記第３、第４コイルL3，L4の各第２部分L3b，
L4bを夫々形成する複数のバイフアイラ・スパイ
ラル状厚膜導電体４と、前記各コイルの第１部分
L1a，L2a，L3a，L4aと第２部分L1b，L2b，L3b，
L4bとを直列に接続すべく前記基板３を貫通する
導電体５と、前記第１面３ａに形成され、第１及
び第４コイルL1，L4の第１部分L1a，L4aの一端
に接続された一対の入力端子１１，１２と、前記
第２面３ｂに形成され、第１及び第４コイルL1，
L4の第２部分L1b，L4bの一端に接続された一対
の出力端子１４，１５′と前記第１面３ａにおい
て前記第２及び第３コイルL2，L3の各第１部分
L2a，L3aの接続点１３と前記出力端子の一方１
５′に接続され前記基板３を貫通する導電体とを
接続する厚膜導電体２０とで構成されるインピー
ダンス変換トランス。 ２ 前記基板３はプリント基板であり、前記厚膜
導電体４はプリント基板の銅箔であることを特徴
とする特許請求の範囲第１項記載のインピーダン
ス変換トランス。 ３ 前記基板３はセラミツク板であり、前記厚膜
導電体４は前記セラミツク板上に導電性材料を焼
成して形成されたものであることを特徴とする特
許請求の範囲第１項記載のインピーダンス変換ト
ランス。[Claims] 1. In an impedance conversion transformer formed by a plurality of inductance coils, a substrate 3
On the first surface 3a of , the first portions L 1 a and L 2 a of the first and second coils L 1 and L 2 each divided into two, the third and fourth coils L 3 each divided into two, Each first part of L 4
L 3 a, L 4 a, on the second surface 3b of the substrate 3, the first,
Second portions L 1 b , L 2 b of the second coils L 1 , L 2 and second portions L 3 b of the third and fourth coils L 3 , L 4 ,
a plurality of bifilar spiral thick film conductors 4 forming L 4 b respectively, and a first portion of each coil;
L 1 a, L 2 a, L 3 a, L 4 a and the second part L 1 b, L 2 b, L 3 b,
A conductor 5 passing through the substrate 3 to connect L 4 b in series, and first portions L 1 a, L of the first and fourth coils L 1 and L 4 formed on the first surface 3 a . A pair of input terminals 11 and 12 connected to one end of 4a , and first and fourth coils L 1 , formed on the second surface 3b.
A pair of output terminals 14, 15' connected to one ends of the second portions L 1 b , L 4 b of L 4 and the respective first terminals of the second and third coils L 2 and L 3 at the first surface 3a. part
Connection point 13 of L 2 a, L 3 a and one of the output terminals 1
5' and a thick film conductor 20 connecting the conductor penetrating the substrate 3. 2. The impedance conversion transformer according to claim 1, wherein the substrate 3 is a printed circuit board, and the thick film conductor 4 is a copper foil of the printed circuit board. 3. The impedance according to claim 1, wherein the substrate 3 is a ceramic plate, and the thick film conductor 4 is formed by firing a conductive material on the ceramic plate. conversion transformer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7561278A JPS553651A (en) | 1978-06-21 | 1978-06-21 | Impedance conversion transformer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7561278A JPS553651A (en) | 1978-06-21 | 1978-06-21 | Impedance conversion transformer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS553651A JPS553651A (en) | 1980-01-11 |
| JPS6321332B2 true JPS6321332B2 (en) | 1988-05-06 |
Family
ID=13581201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7561278A Granted JPS553651A (en) | 1978-06-21 | 1978-06-21 | Impedance conversion transformer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS553651A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057108U (en) * | 1983-09-26 | 1985-04-20 | ティーディーケイ株式会社 | ferrite magnetic core |
-
1978
- 1978-06-21 JP JP7561278A patent/JPS553651A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS553651A (en) | 1980-01-11 |
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