JPS632222B2 - - Google Patents
Info
- Publication number
- JPS632222B2 JPS632222B2 JP16462882A JP16462882A JPS632222B2 JP S632222 B2 JPS632222 B2 JP S632222B2 JP 16462882 A JP16462882 A JP 16462882A JP 16462882 A JP16462882 A JP 16462882A JP S632222 B2 JPS632222 B2 JP S632222B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle plate
- soft solder
- electric vibrator
- nozzle
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000010408 film Substances 0.000 claims description 17
- 239000010409 thin film Substances 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
Landscapes
- Special Spraying Apparatus (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、灯油などの液体燃料、水、薬液など
の液体の霧化器に関するものであり、さらに詳し
くは、圧電振動子などの電気振動子を利用した霧
化器に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an atomizer for liquid fuels such as kerosene, water, and liquids such as chemical solutions. This is related to the atomizer used.
従来例の構成とその問題点
従来この種の霧化ポンプは、第１図に示すよう
に構成されている。すなわち電気振動子１の相対
向する平滑面には、電極膜２ａ，２ｂが形成さ
れ、電極膜２ｂとノズル板３とは軟鑞４ａを介し
て接合がされていた。さらにノズル板３の他方の
面と、ボデイー５は軟鑞４ｂを介して接合されて
いた。Conventional configuration and problems thereof A conventional atomizing pump of this type has a configuration as shown in FIG. That is, electrode films 2a and 2b were formed on opposing smooth surfaces of the electric vibrator 1, and the electrode film 2b and the nozzle plate 3 were joined via a soft solder 4a. Furthermore, the other surface of the nozzle plate 3 and the body 5 were joined via soft solder 4b.
電気振動子１は主成分がPbO、TiO2、ZrO2、
MbO、MgOからなるセラミツク体で、円形中央
部に開口部を設けたリング形状を有し、電極膜２
ａ，２ｂは、銀系の厚膜用導電性ペーストの焼結
体などが用いられ、ノズル板３は厚さ約50μm程
度のデイスク状に加工された金属板が用いられ、
その中央部にはノズル孔６（孔径約70〜100μm）
が複数個設けられていた。尚、ノズル板３は、各
構成部材を軟鑞で接合するため、軟鑞に不活性な
金属を用いた場合、第２図に示す様にノズル板３
表面を予じめ軟鑞に活性な金属薄膜層３１で形成
してあつた。この金属薄膜層３１とノズル板３表
面との付着強度を高めるために、クロム、チタン
等の金属薄膜による中間薄膜層３２を設ける方法
もおこなわれていた。 The main components of the electric vibrator 1 are PbO, TiO 2 , ZrO 2 ,
It is a ceramic body made of MbO and MgO, and has a ring shape with an opening in the center of the circle, and the electrode film 2
For a and 2b, a sintered body of silver-based thick film conductive paste is used, and the nozzle plate 3 is a metal plate processed into a disk shape with a thickness of about 50 μm.
In the center is a nozzle hole 6 (hole diameter approximately 70 to 100 μm).
There were multiple locations. Note that since the nozzle plate 3 uses soft solder to join each component, if an inert metal is used for the soft solder, the nozzle plate 3
The surface was previously formed with an active metal thin film layer 31 in soft solder. In order to increase the adhesion strength between the metal thin film layer 31 and the surface of the nozzle plate 3, a method of providing an intermediate thin film layer 32 made of a metal thin film of chromium, titanium, or the like has been used.
次に、電極膜２ａは外部リード線接続用電極で
あり、ボデイー５には液体通路７および液体室８
が設けられ、この様にして霧化ポンプユニツトは
構成されていた。 Next, the electrode film 2a is an electrode for connecting an external lead wire, and the body 5 has a liquid passage 7 and a liquid chamber 8.
was provided, and the atomizing pump unit was constructed in this way.
この構成では、ノズル板３と電気振動子１（電
極膜２ｂ）ならびに、ノズル板３とボデイー５を
軟鑞４ａで接合するため、軟鑞溶融時に軟鑞流れ
が生じ易く接合界面以上に軟鑞４ａ，４ｂが拡大
し、軟鑞４ａ，４ｂの位置規正ができなかつた。
従つて、電気振動子１からの振動伝播が異なつ
て、霧化特性の安定化が得られないという欠点を
有していた。また、半田レジスト膜により軟鑞接
合部を規正することもおこなわれていたが、ノズ
ル孔６を汚染したり、目詰りさせる問題や、軟鑞
４ｂ側の接合では、レジスト膜が除去できないと
いう欠点を有していた。 In this configuration, since the nozzle plate 3 and the electric vibrator 1 (electrode film 2b) as well as the nozzle plate 3 and the body 5 are bonded with the soft solder 4a, a flow of soft solder is likely to occur when the soft solder melts, and the soft solder flows beyond the bonding interface. 4a, 4b expanded, and the position of the soft solders 4a, 4b could not be adjusted.
Therefore, the vibration propagation from the electric vibrator 1 is different, and the atomization characteristics cannot be stabilized. In addition, a solder resist film has been used to regulate the soft solder joint, but this method has the problem of contaminating or clogging the nozzle hole 6, and has the disadvantage that the resist film cannot be removed when joining the soft solder 4b side. It had
発明の目的
本発明はかかる従来の欠点を除去するもので、
霧化器の電気振動子とノズル板ならびにノズル板
とボデイーを軟鑞接合するうえで、実用上信頼性
の高いユニツトを提供することを目的とする。OBJECTS OF THE INVENTION The present invention obviates such conventional drawbacks,
The purpose of this invention is to provide a unit with high practical reliability for soft solder joining of an electric vibrator and a nozzle plate of an atomizer, and a nozzle plate and a body.
発明の構成
この目的を達成するために本発明は、リング形
状を有した電気振動子と、１ないし１以上のノズ
ル孔を設けたノズル板とボデイーからなり、前記
のノズル板表面の一部に軟鑞に活性な金属薄膜層
を形成し、その後、軟鑞を介して前記電気振動子
と前記ノズル板ならびに前記ノズル板と前記ボデ
イーとを接合したものである。Structure of the Invention In order to achieve this object, the present invention comprises a ring-shaped electric vibrator, a nozzle plate provided with one or more nozzle holes, and a body, and a part of the surface of the nozzle plate is provided with a nozzle hole. An active metal thin film layer is formed on soft solder, and then the electric vibrator and the nozzle plate as well as the nozzle plate and the body are joined via the soft solder.
この構成によつて、軟鑞層の位置規正が精度よ
くでき、霧化特性の安定した霧化ポンプユニツト
が得られる。 With this configuration, the position of the soft solder layer can be precisely regulated, and an atomizing pump unit with stable atomizing characteristics can be obtained.
実施例の説明
以下、本発明の一実施例を、第３図、第４図を
用いて説明する。尚、これらの図において第１図
と同じものについては、同一番号を付している。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 3 and 4. Components in these figures that are the same as those in FIG. 1 are designated by the same numbers.
第３図において、電気振動子１は外径10mm、開
口径3.5mm、厚さ約1.0mmのリング状で従来例と同
じものであり、電極膜２ａ，２ｂが形成されてい
る。ノズル板３は、軟鑞に不活性なステンレス、
チタン等の金属薄板で、従来と同じ材質を選ん
だ。ノズル板３の両面の一部には、軟鑞に活性な
銅、金、銀、真鍮、コバール等の金属薄膜層９
が、真空蒸着法、スパツタ法、メツキ法、溶射法
などにより形成される。この金属薄膜層９の形成
は、ノズル板３面上で電気振動子１ならびにボデ
イーとの接合を要す部分のみにパターン形成がな
されている。 In FIG. 3, the electric vibrator 1 has a ring shape with an outer diameter of 10 mm, an opening diameter of 3.5 mm, and a thickness of about 1.0 mm, and is the same as the conventional example, and has electrode films 2a and 2b formed thereon. The nozzle plate 3 is made of stainless steel that is inert to soft solder.
We chose the same material as before, which is a thin metal plate such as titanium. A thin film layer 9 of a metal such as copper, gold, silver, brass, Kovar, etc., which is active in soft soldering, is formed on a part of both sides of the nozzle plate 3.
is formed by a vacuum evaporation method, a sputtering method, a plating method, a thermal spraying method, etc. This metal thin film layer 9 is formed by patterning only the portions on the surface of the nozzle plate 3 that require bonding with the electric vibrator 1 and the body.
ついで、電気振動子１（電極膜２ｂ）とノズル
板３ならびにノズル板３とボデイー５は、軟鑞層
４ａおよび軟鑞層４ｂを介して接合される。ま
た、液体通路７、液体室８は従来と同じ形態であ
る。 Next, the electric vibrator 1 (electrode film 2b) and the nozzle plate 3 as well as the nozzle plate 3 and the body 5 are joined via the soft solder layer 4a and the soft solder layer 4b. Further, the liquid passage 7 and the liquid chamber 8 have the same form as the conventional one.
上記構成において、電気振動子１（電極膜２
ｂ）とノズル板３ならびにノズル板３とボデイー
５間の軟鑞接合の場合、ノズル板３面上には軟鑞
に活性な金属薄膜層９をパターン形成しているた
め、各軟鑞層４ａ，４ｂは接合界面が規正され、
従つて形状的に安定した接合部が得られる。 In the above configuration, the electric vibrator 1 (electrode film 2
b) In the case of soft solder joints between the nozzle plate 3 and the nozzle plate 3 and the body 5, a metal thin film layer 9 active in soft solder is patterned on the surface of the nozzle plate 3, so that each soft solder layer 4a , 4b, the bonding interface is regulated,
Therefore, a geometrically stable joint can be obtained.
また、上記構成によれば、レジスト膜を用いた
ときのような、ノズル孔６を汚染したり、目詰り
させるなどの問題は全くない。 Further, according to the above configuration, there is no problem such as contamination or clogging of the nozzle hole 6, which occurs when a resist film is used.
尚、上記実施例ではノズル板３表面上に、金属
薄膜層９を直接的に形成する方法で述べてきた
が、ノズル板３と金属薄膜層９の付着力を高める
ために、第４図に示す如く、ノズル板３両面の全
表面上あるいは、第５図に示す如くノズル板３両
面の一部分に金属薄膜層９と同一パターンで、付
着力の高いクロム、チタンなどの中間薄膜層３２
を形成する方法でも、上記実施例と同様の効果が
得られる。 In the above embodiment, a method was described in which the metal thin film layer 9 was directly formed on the surface of the nozzle plate 3, but in order to increase the adhesion between the nozzle plate 3 and the metal thin film layer 9, the method shown in FIG. As shown, on the entire surface of both sides of the nozzle plate 3, or as shown in FIG.
The same effect as in the above embodiment can also be obtained by the method of forming.
尚、本実施例で用いられる軟鑞は、Pb―Sn共
晶合金を始めとした450℃より低い融点をもつ、
鑞付用金属溶加材である。 The soft solder used in this example is a Pb-Sn eutectic alloy with a melting point lower than 450°C.
It is a metal filler metal for brazing.
発明の効果
以上のように、本発明の霧化器によれば、次の
効果が得られる。Effects of the Invention As described above, the atomizer of the present invention provides the following effects.
(1) 金属薄膜層をパターン形成するため、接合部
の接合界面が形状的に安定化できる。従つて、
電気振動子からの振動伝播が安定し、霧化特性
の安定化が得られる。(1) Since the metal thin film layer is patterned, the joint interface of the joint can be stabilized in shape. Therefore,
The vibration propagation from the electric vibrator is stabilized, and the atomization characteristics are stabilized.
(2) 半田レジスト膜を用いた場合のような、目詰
りやノズル孔の汚染などの問題がない。(2) There are no problems such as clogging or contamination of the nozzle holes, unlike when using a solder resist film.
第１図は従来の霧化器の構成を示す断面図、第
２図は従来の要部の拡大断面図、第３図は本発明
の霧化器の一実施例を示す断面図、第４図ならび
に第５図は本発明の他の実施例を示す断面図であ
る。
１……電気振動子、２ａ……電極膜、２ｂ……
電極膜、３……ノズル板、３２……中間薄膜層、
４ａ……軟鑞、４ｂ……軟鑞、５……支持容器、
６……ノズル孔、７……液体通路路、８……液体
室、９……金属薄膜層。
FIG. 1 is a sectional view showing the configuration of a conventional atomizer, FIG. 2 is an enlarged sectional view of the main parts of the conventional atomizer, FIG. 3 is a sectional view showing an embodiment of the atomizer of the present invention, This figure and FIG. 5 are cross-sectional views showing other embodiments of the present invention. 1... Electric vibrator, 2a... Electrode film, 2b...
Electrode film, 3... Nozzle plate, 32... Intermediate thin film layer,
4a... Soft solder, 4b... Soft solder, 5... Support container,
6... Nozzle hole, 7... Liquid passageway, 8... Liquid chamber, 9... Metal thin film layer.
Claims (1)
を設けた電気振動子と、この電気振動子で加振さ
れる１ないし１以上のノズル孔を設けたノズル板
と、このノズル板を装着したボデイーとからな
り、前記のノズル板表面の一部には軟鑞に活性な
金属薄膜層を形成し、軟鑞を介して前記電気振動
子と前記ノズル板ならびに前記ノズル板と前記ボ
デイーとを接合した霧化器。 ２ ノズル板は軟鑞に不活性なステンレス、チタ
ンなどの金属薄板とした特許請求の範囲第１項記
載の霧化器。 ３ 軟鑞に活性な金属薄膜層は、銅、金、銀、真
鍮、コバールなどの金属とした特許請求の範囲第
１項記載の霧化器。 ４ 軟鑞に活性な金属薄膜層は、ノズル板表面で
電気振動子ならびにボデイーを接合するに必要な
範囲に形成した特許請求の範囲第１項記載の霧化
器。[Scope of Claims] 1. An electric vibrator having a ring shape and having electrode films provided on opposing smooth surfaces, and a nozzle plate provided with one or more nozzle holes that is excited by the electric vibrator. , and a body to which this nozzle plate is mounted, and a thin metal film layer active in soft solder is formed on a part of the surface of the nozzle plate, and the electric vibrator, the nozzle plate, and the nozzle are connected to each other through the soft solder. An atomizer in which a plate and the body are joined. 2. The atomizer according to claim 1, wherein the nozzle plate is a thin metal plate made of stainless steel, titanium, or the like that is inert to soft solder. 3. The atomizer according to claim 1, wherein the metal thin film layer active in soft solder is a metal such as copper, gold, silver, brass, or Kovar. 4. The atomizer according to claim 1, wherein the soft solder-active metal thin film layer is formed on the surface of the nozzle plate in an area necessary for joining the electric vibrator and the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164628A JPS5952561A (en) | 1982-09-20 | 1982-09-20 | Atomizer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57164628A JPS5952561A (en) | 1982-09-20 | 1982-09-20 | Atomizer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5952561A JPS5952561A (en) | 1984-03-27 |
| JPS632222B2 true JPS632222B2 (en) | 1988-01-18 |
Family
ID=15796810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57164628A Granted JPS5952561A (en) | 1982-09-20 | 1982-09-20 | Atomizer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5952561A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2588860B (en) * | 2020-11-23 | 2022-01-12 | Specialist Health Solutions Ltd | Injection head for excitation of fluid |
-
1982
- 1982-09-20 JP JP57164628A patent/JPS5952561A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5952561A (en) | 1984-03-27 |
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