Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPS6322640B2 - - Google Patents
[go: Go Back, main page]

JPS6322640B2 - - Google Patents

Info

Publication number
JPS6322640B2
JPS6322640B2 JP57179383A JP17938382A JPS6322640B2 JP S6322640 B2 JPS6322640 B2 JP S6322640B2 JP 57179383 A JP57179383 A JP 57179383A JP 17938382 A JP17938382 A JP 17938382A JP S6322640 B2 JPS6322640 B2 JP S6322640B2
Authority
JP
Japan
Prior art keywords
chip
chips
hole
loading hole
horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57179383A
Other languages
Japanese (ja)
Other versions
JPS5968941A (en
Inventor
Shigeru Kubota
Ikuji Kano
Masahiro Kubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP57179383A priority Critical patent/JPS5968941A/en
Publication of JPS5968941A publication Critical patent/JPS5968941A/en
Publication of JPS6322640B2 publication Critical patent/JPS6322640B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 本発明は、抵抗器、コンデンサー、その他の筒
形(円筒形、円柱形等、所謂メルフタイプ)乃至
板形(角板形、円板形等)の小型電子部品(以下
単にチツプと略記する。)を、各種の自動チツプ
マウント装置のおける治具盤の各チツプ装填孔内
に、正規姿勢で極性整列状態に装填するための、
該治具盤のチツプ装填孔の特殊構成及び、該チツ
プ装填孔に対する落下チユーブ下端の特定設置位
置の関連構成に係るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention is applicable to resistors, capacitors, and other small electronic components (hereinafter referred to as (simply abbreviated as "chip") into each chip loading hole of a jig board in various automatic chip mounting devices in a normal posture and polarity alignment state.
The present invention relates to a special configuration of the chip loading hole of the jig board and a related configuration of a specific installation position of the lower end of the drop tube with respect to the chip loading hole.

近時、各種の自動チツプマウント装置を使用し
て、上記チツプを自動的にプリント基板上に正確
に配置(マウント)し、該状態のままチツプをプ
リント基板上に適宜結着することが行われてい
る。
Recently, various types of automatic chip mounting devices have been used to automatically and accurately position (mount) the chips on printed circuit boards, and to properly bond the chips to the printed circuit boards in this state. ing.

該自動チツプマウント装置の同略は、プリント
基板おけるチツプの配置位置に合わせて多数のチ
ツプ装填孔を設定した治具盤を別設し、該治具盤
の各チツプ装填孔毎にチツプを送給して、該チツ
プを装填した治具盤を設定位置に移行し、該位置
にて治具盤に装填されたチツプを、治具盤の各装
填孔の位置に合わせて構成された多数の吸着口を
備えたサクシヨンヘツドの各吸着口に吸着して、
その配置状態のままプリント基板上に移行し、吸
着を解いて、チツプマウント箇所に予じめ接着剤
を塗着してある該プリント基板上に各チツプを前
記治具盤の設置位置と同一状態に正確にマウント
接着し、次で接着剤を乾燥処理したのち、そのマ
ウント状態のまま、ハンダ槽等へ移送し各チツプ
をプリント基板上に適宜結着するものである。
The automatic chip mount device is a device that has a separate jig board with a large number of chip loading holes set according to the placement positions of the chips on the printed circuit board, and feeds the chips to each chip loading hole on the jig board. The jig board loaded with the chips is moved to a set position, and the chips loaded on the jig board are transferred to a large number of holes configured to match the positions of each loading hole of the jig board at this position. It is adsorbed to each suction port of the suction head equipped with a suction port,
Transfer the chips to the printed circuit board in their arranged state, release the suction, and place each chip on the printed circuit board with adhesive applied to the chip mounting points in advance in the same position as the jig board. After the adhesive is dried, the chips are transferred to a soldering bath or the like in the mounted state, and each chip is appropriately bonded to the printed circuit board.

上記の如く、治具盤におけるチツプ装填孔は、
目的とするプリント基板のチツプマウント数と同
じ数を各相当する位置に設置する必要があり、ち
なみに、該チツプ数は数10個〜数100個である。
As mentioned above, the chip loading hole on the jig board is
It is necessary to install the same number of chips as the number of chip mounts on the intended printed circuit board at each corresponding position, and the number of chips ranges from several tens to several hundred.

而して、上記適宜のチツプマウント装置におい
て、その一部装置たるチツプ自動分離供給装填装
置、例えば、複数のチツプ投入ホツパーと落下チ
ユーブを備えた分離供給部と、治具盤のチツプ装
填孔毎の位置に合わせて各落下チユーブを配置し
たデイストリビユータ等からなるチツプ自動分離
供給装置によつて、各チツプ装填孔にチツプを落
下装填するものであるが、 上記の落下チユーブ(例、デイストリビユータ
の落下チユーブ)下端から治具盤の各チツプ装填
孔内へチツプを装填したときに、該チツプが正規
姿勢で極性整列状態に装填されなければならな
い。
Accordingly, in the above-mentioned appropriate chip mounting device, the automatic chip separation and supply loading device which is a part of the device, for example, the separation and supply section equipped with a plurality of chip input hoppers and drop tubes, and each chip loading hole of the jig board. Chips are dropped and loaded into each chip loading hole by an automatic chip separation and supply device consisting of a distributor, etc., in which each drop tube is arranged according to the position of the drop tube (e.g. distributor). When loading chips from the lower end of the user's drop tube into each chip loading hole of the jig board, the chips must be loaded in a normal position and with polarity aligned.

即ち、 (イ) チツプは極めて小型軽量(例、径2mm、長さ
6mm等)であることから、チツプ装填孔内に落
下した際に孔底面にきちんと落着かずに、周壁
面によりかかるように斜に立つてしまうことが
しばしばである。そして、この不良姿勢装填に
対しては、従来は治具盤にバイブレーシヨンを
付加するなどによつて、正規姿勢に直すように
しているが、仲々完全にはいかず、而して、こ
の不良姿勢のままであると、次工程のサクシヨ
ンヘツドの吸着口に正しく吸着されず、吸着口
脱落が生じ、よつて、プリント基板へのマウン
ト脱落という重大な結果を引き起こすことにな
る。
(a) Since the chips are extremely small and lightweight (e.g., diameter 2 mm, length 6 mm, etc.), when they fall into the chip loading hole, they do not settle properly on the bottom of the hole, but are tilted so that they rest against the surrounding wall surface. I often end up standing there. Conventionally, when loading in this bad posture, we have added vibration to the jig board to correct it to the normal posture, but this has not always been possible, and If this continues, it will not be properly attracted to the suction port of the suction head in the next step, causing the suction port to fall off, which will have the serious consequence of falling off from the mounting on the printed circuit board.

(ロ) また、チツプには+、−の極性を有するもの
があり(例、ダイオード、タンタルコンデンサ
等)、この有極チツプは当然にそのプリント基
板上における極性方向位置が定まつていること
から、治具盤のチツプ装填孔においても、チツ
プがプリント基板におけると同一方向位置に極
性整列されて装填されなければならないという
重大な目的がある。
(b) Also, some chips have + and - polarities (e.g. diodes, tantalum capacitors, etc.), and these polarized chips naturally have a fixed polarity position on the printed circuit board. In the chip loading hole of the jig board, there is also an important objective that chips must be loaded in the same directional position and polar alignment as on the printed circuit board.

なお、このチツプを極性検測して、即ち、+ま
たは−を整列して落下チユーブへ+極を下向きま
たは上向きとして送給する装置については、本願
出願人は先に、昭和57年特許願第167385号、発明
の名称、チツプの極性等検測装置として特許出願
している。
Regarding a device for detecting the polarity of chips, ie, arranging + or -, and feeding the chips to the falling tube with the + pole facing downward or upward, the applicant of the present application previously disclosed patent application no. No. 167385, a patent application has been filed for the name of the invention and a device for measuring chip polarity.

本発明は、治具盤のチツプ装填孔に対して、チ
ツプを正規姿勢に正しい姿勢で、正しい極性方向
に整列して装填するために、治具盤のチツプ装填
孔を特殊構成とすると共に、該チツプ装填孔にチ
ツプを落下供給する落下チユーブ下端開口部の設
置位置を上記チツプ装填孔の特殊構成との関連に
おいて特定したことを特徴とし、もつて、常時均
一安定したチツプの正規姿勢で極性整列装填を可
能として、従来の欠点を解消したものである。
The present invention has a special structure for the chip loading hole of the jig board in order to load the chips into the chip loading hole of the jig board in a normal position, in a correct posture, and aligned in the correct polarity direction. The installation position of the opening at the lower end of the drop tube for dropping and supplying chips to the chip loading hole is specified in relation to the special configuration of the chip loading hole, so that the polarity can be maintained evenly and stably in the normal posture of the chip at all times. It enables aligned loading and eliminates the drawbacks of the conventional method.

以下、本発明の実施例につき説明すると、 適宜構成の自動チツプマウント装置における、
複数の長方形箱穴状等のチツプ装填孔1を設けた
治具盤Aにおいて、該治具盤Aのチツプ装填孔1
内へチツプtを極性を同一とした垂直な状態で落
下供給する落下チユーブ2(例、デイストリビユ
ータBの落下チユーブ2)の下端開口部2′を、
チツプ装填孔1上の一方端部(図示例、右端部)
へ偏位して設置する一方、 該チツプ装填孔1の水平な底面3における上
記落下チユーブ2下端開口部2′の設置位置
(図示例、右端部)の反対側端部(第1図示例、
左端部)に吸気小孔4を穿孔し、該チツプ装填
孔1内に落下してきたチツプtを、該吸気小孔
4からの適宜の真空吸引装置による真空吸引力
によつて、水平な底面3上に強制的に吸着し
て、もつて、チツプtをチツプ装填孔1内に水
平な正規姿勢で極性整列状態に装填するように
したもの、 該チツプ装填孔1の底面3における上記落下
チユーブ2下端開口部2′の設置位置(図示例、
右端部)と相対した側の一部を水平部とし、反
対側(第2図示例、左側)の過半部を傾斜部3
aとして、該孔1内に落下してきたチツプtを
その極性方向(例、+を下向き)のまま傾斜部
3aに導入して、チツプtを傾斜装填するよう
に設け、次工程のサクシヨンヘツド5の吸着口
6に真空吸着されるときに、該吸着口6先端の
下降接近による真空吸着作用によつて、チツプ
が上記水平部上に正しい水平姿勢に姿勢制御さ
れて正規姿勢で極性整列状態に姿勢制御されて
吸着されるようにしたもの、 該チツプ装填孔1の水平な底面3部分に、上
面を傾斜部3bとした柱状体7を適宜手段で上
下動自在に設置し、例えば、台板8に該柱状体
7を樹立固定し、該台板8を上下動して各チツ
プ装填孔1の柱状体7を一斉に上下動するよう
に設置し、 該チツプ装填孔1内に落下してきたチツプt
をその極性方向(例、+を下向き)のまま、上
昇位置にある傾斜部3b上に導入して、一旦傾
斜姿勢で受取つたのち、該柱状体7を下降し
て、チツプtを水平な底面3上に水平な正規姿
勢で極性整列状態に装填するようにしたもの、
(第3図示) 該チツプ装填孔1の底面3を傾斜面3cに形
成すると共に、該傾斜面3cの下端部に小孔9
を穿孔して、該小孔9にピン10を適宜手段で
上下動自在に設置し、例えば、前記柱状体7と
同様に、台板11に該ピン10を樹立固定し、
該台板11を上下動して各チツプ装填孔1のピ
ン10を一斉に上下動するように設置し、 チツプ装填孔1内に落下してきたチツプt
を、その極性方向(例、+を下向き)のまま傾
斜面3c上に導入して、一旦傾斜姿勢に受取つ
たのち、ピン10を傾斜面3cの上端部と水平
位置まで上昇してチツプtを水平な正規姿勢で
極性整列状態に装填するようにしたもの、(第
4図示)である。
Hereinafter, embodiments of the present invention will be described. In an appropriately configured automatic chip mount apparatus,
In a jig board A provided with a plurality of chip loading holes 1 in the shape of rectangular box holes, etc., the chip loading holes 1 of the jig board A are
The lower end opening 2' of the drop tube 2 (for example, the drop tube 2 of distributor B) that supplies the chips t vertically with the same polarity to the inside,
One end above the chip loading hole 1 (illustrated example, right end)
On the other hand, at the opposite end (first illustrated example, right end) of the lower end opening 2' of the drop tube 2 on the horizontal bottom surface 3 of the chip loading hole 1,
A small suction hole 4 is bored in the left end (left end), and the chips t that have fallen into the chip loading hole 1 are pulled onto the horizontal bottom surface 3 by the vacuum suction force of an appropriate vacuum suction device from the small suction hole 4. The drop tube 2 on the bottom surface 3 of the chip loading hole 1 is forcibly attracted to the top so that the chips t are loaded into the chip loading hole 1 in a horizontal normal position and in a state of polar alignment. Installation position of the lower end opening 2' (illustrated example,
A part of the side opposite to the right end) is the horizontal part, and a majority part of the opposite side (second illustrated example, left side) is the inclined part 3.
As a, the chip t that has fallen into the hole 1 is introduced into the inclined part 3a with its polarity direction (for example, + facing downward), and the chip t is installed so as to be loaded at an angle, and then the chip t is loaded into the suction head 5 in the next process. When the chip is vacuum-suctioned to the suction port 6, the vacuum suction effect caused by the downward approach of the tip of the suction port 6 causes the chip to be posture-controlled to a correct horizontal posture on the horizontal portion, and to be in a normal posture with polarity alignment. A columnar body 7 having an inclined upper surface 3b is installed on the horizontal bottom surface 3 of the chip loading hole 1 so as to be vertically movable, for example, by a base plate 8. The columnar body 7 is fixed in an upright position, and the base plate 8 is moved up and down to move the columnar bodies 7 of each chip loading hole 1 up and down at the same time. t
is introduced onto the inclined part 3b in the raised position with its polar direction (for example, + pointing downwards), and once received in the inclined position, the columnar body 7 is lowered and the chip t is placed on the horizontal bottom surface. 3, which is loaded in a horizontal normal position and in polar alignment,
(Third figure shown) The bottom surface 3 of the chip loading hole 1 is formed into an inclined surface 3c, and a small hole 9 is formed at the lower end of the inclined surface 3c.
A pin 10 is installed in the small hole 9 so as to be movable up and down by an appropriate means, and for example, similarly to the columnar body 7, the pin 10 is fixed to the base plate 11,
The base plate 11 is moved up and down to move the pins 10 of each chip loading hole 1 up and down simultaneously, and the chips t that have fallen into the chip loading hole 1 are removed.
is introduced onto the inclined surface 3c with its polar direction (for example, + pointing downward) and once received in an inclined position, the pin 10 is raised to a position horizontal to the upper end of the inclined surface 3c, and the chip t is It is designed to be loaded in a normal horizontal position with polarities aligned (as shown in the fourth figure).

本発明は、上記のような構成及び作用におい
て、チツプはチツプ装填孔の一方端部の特定位置
に、全て極性方向を同一とした垂直な状態に落下
してきて、それらチツプが全て、上記〜に記
載したチツプ装填孔の各種の特殊構成毎の特定し
た姿勢状態に導入されたのち、それら特殊構成毎
のチツプ装填孔の上記のような特殊作用によつ
て、水平な正規姿勢で極性整列状態に矯正装填し
得るものであるので、本発明によつて正しく装填
された各チツプは、次工程のサクシヨンヘツドに
正しく吸着され、よつて、プリント基板上にも正
しい姿勢、正しい極性方向にマウントし得ること
となる優れた効用を発揮するものである。
In the present invention, in the above-described configuration and operation, the chips fall vertically to a specific position at one end of the chip loading hole with all the chips having the same polarity direction, and all of the chips fall into the above-mentioned ~. After being introduced into the specified posture state for each of the various special configurations of the chip loading holes described above, due to the above-mentioned special effects of the chip loading holes for each of these special configurations, the chips are brought into a polar alignment state in a horizontal normal posture. Since corrective loading is possible, each chip loaded correctly according to the present invention can be properly attracted to the suction head in the next process, and therefore can be mounted on a printed circuit board in the correct orientation and in the correct polarity direction. It exhibits excellent efficacy.

なお、本発明は以上の如く、主として、チツプ
装填孔の一方端部の特定位置に、全て極性方向を
同一とした垂直な状態で落下してくるチツプを、
その極性方向のままにチツプ装填孔内へ導入した
のち、水平な正規姿勢に矯正装填することにつき
説明しているが、 極性方向を特定した状態のチツプを正しく矯正
装填し得る位であるから、 当然の事に、極性整列を必要としない或は極性
のないチツプの矯正装填などは、極めて容易に行
い得るものである。
As described above, the present invention mainly uses chips that fall vertically, all with the same polarity direction, at a specific position at one end of the chip loading hole.
The explanation is about inserting the chip into the chip loading hole with its polarity as it is, and then correctively loading the chip in a horizontal normal position. Of course, corrective loading of chips that do not require polarity alignment or have no polarity can be accomplished quite easily.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第4図は何れも本発明の実施例構成
を示し、第1図のイ,ロはチツプ装填孔の底面に
吸気小孔を設けた実施例の一部断面、作用説明
図、第2図のイ,ロはチツプ装填孔の底面過半部
に傾斜部を設けた実施例の一部断面、作用説明
図、第3図のイ,ロはチツプ装填孔の底面に傾斜
部を有する柱状体を上下動自在に設置した実施例
の一部断面、作用説明図、第4図のイ,ロはチツ
プ装填孔の底面を傾斜面とし小孔にピンを上下動
自在に設置した実施例の一部断面、作用説明図で
ある。 符号、A……治具盤、B……デイストリビユー
タ、1……チツプ装填孔、2……落下チユーブ、
2′……その下端開口部、3……底面、3a……
傾斜部、3b……柱状体7の傾斜部、3c……傾
斜部、4……吸気小孔、5……サクシヨンヘツ
ド、6……その吸気口、7……柱状体、8……台
板、9……小孔、10……ピン、11……台板。
1 to 4 each show the configuration of an embodiment of the present invention, and A and B in FIG. A and B in Fig. 2 are partial cross-sections and action explanatory diagrams of an embodiment in which a sloped portion is provided on the bottom half of the chip loading hole, and A and B in Fig. 3 have a sloped portion on the bottom surface of the chip loading hole. Partial cross-section and action explanatory diagram of an embodiment in which the columnar body is installed vertically movably, A and B in Fig. 4 are examples in which the bottom surface of the chip loading hole is an inclined surface and a pin is installed in the small hole in a vertically movable manner. It is a partial cross section and an action explanatory diagram. Code, A... Jig board, B... Distributor, 1... Chip loading hole, 2... Falling tube,
2'... lower end opening, 3... bottom surface, 3a...
Inclined part, 3b... Inclined part of columnar body 7, 3c... Inclined part, 4... Small intake hole, 5... Suction head, 6... Inlet port thereof, 7... Columnar body, 8... Base plate, 9...Small hole, 10...pin, 11...base plate.

Claims (1)

【特許請求の範囲】 1 自動チツプマウント装置の治具盤において、
チツプが極性方向を同一とした垂直な状態で落下
してくる落下チユーブの下端開口部をチツプ装填
孔上の一方端部に偏位して設置する一方、 該チツプ装填孔の水平な底面における上記落下
チユーブ下端開口部の設置位置の反対側端部に吸
気小孔を穿孔し、該チツプ装填孔内に落下してき
たチツプを、該吸気小孔からの真空吸引力によつ
て、水平な底面上に吸着して、チツプ装填孔内に
水平な正規姿勢で極性整列状態に装填するように
した、自動チツプマウント装置の治具盤。 2 自動チツプマウント装置の治具盤において、
チツプが極性方向を同一とした垂直な状態で落下
してくる落下チユーブの下端開口部をチツプ装填
孔上の一方端部に偏位して設置する一方、 該チツプ装填孔の底部における上記落下チユー
ブ下端開口部の設置位置と相対した側の一部を水
平部とし、反対側の過半部を傾斜部として、該孔
内に落下してきたチツプをその極性方向のまま傾
斜部に導入して、チツプを傾斜状態に装填するよ
うに設け、次工程のサクシヨンヘツドの吸着口に
真空吸着されるときに、該吸着口先端の下降接近
による真空吸着作用によつて、チツプが上記水平
部上に水平に姿勢制御されて正規姿勢で極性整列
状態に吸着されるようにした、自動チツプマウン
ト装置の治具盤。 3 自動チツプマウント装置の治具盤において、
チツプが極性方向を同一とした垂直な状態で落下
してくる落下チユーブの下端開口部をチツプ装填
孔上の一方端部に偏位して設置する一方、 該チツプ装填孔の水平な底面部分に、上面を傾
斜部とした柱状体を上下動自在に設置し、該孔内
に落下してきたチツプをその極性方向のまま、上
昇位置にある傾斜部上に導入して、一旦傾斜姿勢
で受取つたのち、該柱状体を下降して、チツプを
水平な底面上に水平な正規姿勢で極性整列状態に
装填するようにした、自動チツプマウント装置の
治具盤。 4 自動チツプマウント装置の治具盤において、
チツプが極性方向を同一とした垂直な状態で落下
してくる落下チユーブの下端開口部をチツプ装填
孔上の一方端部に偏位して設置する一方、 該チツプ装填孔の底面を傾斜面に形成すると共
に、該傾斜面下端部に小孔を穿設して、該小孔に
ピンを上下動自在に設置し、チツプ装填孔内に落
下してきたチツプを、その極性方向のまま傾斜面
上に導入して、一旦傾斜姿勢に受取つたのち、ピ
ンを傾斜面の上端部と水平位置まで上昇してチツ
プを水平な正規姿勢で極性整列状態に装填するよ
うにした、自動チツプマウント装置の治具盤。
[Claims] 1. In a jig panel for an automatic chip mount device,
The lower end opening of the drop tube, from which the chips fall vertically with the same polarity direction, is installed offset to one end above the chip loading hole. A small intake hole is drilled at the end opposite to the installation position of the lower end opening of the drop tube, and the chips that have fallen into the chip loading hole are pulled onto the horizontal bottom surface by the vacuum suction from the small intake hole. A jig board for an automatic chip mount device that loads chips into the chip loading hole in a horizontal, normal position and with polarity aligned. 2. On the jig panel of automatic chip mount equipment,
The lower end opening of the drop tube from which the chips fall in a vertical state with the same polarity direction is installed offset to one end above the chip loading hole, while the drop tube at the bottom of the chip loading hole is installed. A part of the side opposite to the installation position of the lower end opening is set as a horizontal part, and a majority part on the opposite side is set as an inclined part, and the chips that have fallen into the hole are introduced into the inclined part with their polarity direction unchanged, and the chips are removed. When the chip is loaded in an inclined state, when the chip is vacuum-suctioned to the suction port of the suction head in the next process, the vacuum suction effect caused by the downward approach of the tip of the suction port causes the chip to be held horizontally on the horizontal part. A jig panel for an automatic chip mount device that is controlled so that chips are attracted in a normal position and polar alignment state. 3. On the jig panel of automatic chip mount equipment,
The lower end opening of the drop tube, from which chips fall vertically with the same polarity direction, is installed offset to one end above the chip loading hole. A columnar body with an inclined upper surface is installed so as to be able to move up and down, and chips that have fallen into the hole are introduced onto the inclined part in the raised position with their polarity unchanged, and once received in an inclined position. A jig board for an automatic chip mount device, which lowers the columnar body and loads chips on a horizontal bottom surface in a normal horizontal position and in polar alignment. 4. On the jig panel of automatic chip mount equipment,
The lower end opening of the drop tube, from which the chips fall vertically with the same polarity direction, is installed offset to one end above the chip loading hole, while the bottom surface of the chip loading hole is placed on an inclined surface. At the same time, a small hole is drilled at the lower end of the slope, and a pin is installed in the small hole so that it can move up and down, and the chips that have fallen into the chip loading hole are placed on the slope with their polarity direction unchanged. This is an automatic chip mount device that loads chips in a normal horizontal position with polarity alignment by raising the pin to a horizontal position with the upper end of the slope after receiving the chip in an inclined position. Topping board.
JP57179383A 1982-10-13 1982-10-13 Jig panel of automatic chip mounting apparatus Granted JPS5968941A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57179383A JPS5968941A (en) 1982-10-13 1982-10-13 Jig panel of automatic chip mounting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57179383A JPS5968941A (en) 1982-10-13 1982-10-13 Jig panel of automatic chip mounting apparatus

Publications (2)

Publication Number Publication Date
JPS5968941A JPS5968941A (en) 1984-04-19
JPS6322640B2 true JPS6322640B2 (en) 1988-05-12

Family

ID=16064894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57179383A Granted JPS5968941A (en) 1982-10-13 1982-10-13 Jig panel of automatic chip mounting apparatus

Country Status (1)

Country Link
JP (1) JPS5968941A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235350U (en) * 1988-08-30 1990-03-07
JPH0276348U (en) * 1988-11-30 1990-06-12

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429899U (en) * 1986-11-17 1989-02-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235350U (en) * 1988-08-30 1990-03-07
JPH0276348U (en) * 1988-11-30 1990-06-12

Also Published As

Publication number Publication date
JPS5968941A (en) 1984-04-19

Similar Documents

Publication Publication Date Title
CN115810967A (en) Automatic test equipment for serial plugging and unplugging and working method thereof
JPS6322640B2 (en)
KR200372566Y1 (en) The jig for surface mounting of printer circuit board
JPS61194900A (en) Electronic component inserter
US6550133B1 (en) Surface mounting apparatus installed with tray feeder
DE10121578C2 (en) Method and assembly system for assembling a substrate with electronic components
JP7498458B2 (en) Conductive ball mounting method using electrostatic chuck
JPS59130561A (en) Adhesive agent coater for tip type electronic parts
KR100998595B1 (en) Component mounting device and component mounting method
JP3823719B2 (en) Electronic component mounting apparatus and electronic component mounting method
KR20120070094A (en) Tray feeder
CN223786257U (en) Device for attaching interconnects to electronic packages
KR200314873Y1 (en) The jig for surface mounting of printer curcuit board
CN212398400U (en) Spot welding device for integrated circuit
CN216470819U (en) Electronic component feeding mechanism
JPH08162495A (en) Solder ball mounting device
JP4483690B2 (en) Substrate receiving device for electronic component mounting equipment
JPH0346995B2 (en)
JP3127742B2 (en) Solder ball mounting device
JPS649758B2 (en)
JPS5825295A (en) Device for mounting electronic part
JP3289724B2 (en) Chip mounting equipment
JPS626500Y2 (en)
JP3397093B2 (en) Apparatus and method for transferring conductive balls
JP2001111297A (en) Chip mounting equipment