JPS6326361B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a color filter. Color filters are widely used, such as color plates for restricting oblique light flux, color face plates for cathode ray tube displays, plates for photoelectric conversion elements for copying, and filters for single-tube color television cameras. Furthermore, particularly in recent years, with advances in semiconductor manufacturing technology, solid-state imaging devices have come to be used in place of conventional image pickup tubes as elements for converting two-dimensional images into electrical signals. for example
CCD (Charge Coupled Device) or
A solid-state image sensor called a BBD (Bucket Tricade Device) has a large number of finely divided light-receiving sections and a drive circuit for extracting information from these light-receiving sections, all housed in one chip, and is capable of capturing color images. In order to achieve this, it is necessary to further provide a color filter corresponding to the fine light-receiving surface.
With such solid-state image sensors as a representative example, color filters used in various fields are becoming more dense and high-resolution as color images have higher resolution and color image conversion devices become more compact. ,
Moreover, it is expected that the material will have excellent durability.

A color filter is a filter in which color elements are arranged in a mosaic or stripe pattern.

The most common color elements are blue (B), red (R) and green (G). Typical conventional methods for producing color filters include vapor deposition and dyeing.

The vapor deposition method uses an interference filter, that is, multiple layers of thin films with different refractive indexes are vapor-deposited to a predetermined thickness on a support, and only the desired wavelength range (color) is allowed to pass through due to the light interference effect. It forms a color filter. However, the color filter obtained by this method has a different number of layers (usually more than ten layers) for each adjacent color element (unit photosensitive area).
This method requires a complicated process in which thin films must be deposited to a precise thickness for each layer, resulting in high costs and poor yields. In addition, in order to form a film with good adhesion to the support and high mechanical strength, it is necessary to heat the support to a temperature of several hundred degrees Celsius or higher, which may limit the support material or deteriorate its performance. There is also a drawback.

Furthermore, in the dyeing method, a resin such as polyvinyl alcohol or gelatin film is coated on a support to form a color element receiving layer, and a color material is applied to this to form a color element layer. To form the red, border, and blue color elements, a mask is usually formed on the color element receiving layer using photoresist, and then the mask is etched after applying a color material of one color to a predetermined area. The removal process had to be repeated three times. This complicates the color filter manufacturing process, and pinholes and scratches are likely to occur during the manufacturing process, so it has been desired to improve the yield of producing defect-free color filters. Furthermore, when forming a color filter directly on a light-receiving element such as a solid-state image sensor, the wet process of forming and removing a photoresist mask is repeated, so the light-receiving element may be damaged by the etching solution. There is a risk of receiving Furthermore, a highly accurate mask alignment operation is required for baking when forming a photoresist mask.

Therefore, the present invention provides a method for manufacturing a color filter that does not require forming a mask on a support for each color element, does not require wet processing for forming the mask, and reduces the manufacturing process. The main object of the present invention is to provide a color filter manufacturing method that is simplified, improves the manufacturing yield of color filters, and does not cause damage to the support.

In the present invention, partition walls corresponding to color elements for color-separating incident light are provided on a support, and a mask having an opening smaller than the spacing between the partition walls is placed over the partition walls so that the opening is located between the partition walls. This method of manufacturing a color filter is characterized in that a color material is attached through the opening.

In the method for manufacturing a color filter according to the present invention, the color elements are formed by adhering color materials injected through the openings of the mask to predetermined areas partitioned by partition walls. For formation, it is not necessary to form a masking pattern using photoresist, which greatly simplifies the manufacturing process, and does not cause deterioration of the support. Furthermore, since the openings of the mask for injecting the color material are set smaller than the spacing between the partition walls, the mask can be easily and reliably aligned.

A typical embodiment of the method for manufacturing a color filter of the present invention is shown in FIGS. 1 to 3.

FIG. 1 shows a state in which partition walls 2 are formed on a support 1. As shown in FIG. The support may be a transparent member such as glass or resin film.Also, when the color filter is formed integrally with an object to which the color filter is applied, for example, in the case of a color face plate for a cathode ray tube display, The support is the display surface of a cathode ray tube; in the case of a single-tube color television camera, the support is the light-receiving surface of the image pickup tube; and in the case of a color display using a liquid crystal, the support is a matrix. It is a glass substrate forming a liquid crystal cell, and is also an electrophotographic photoreceptor for color copying (a photoreceptor in which a color filter is further provided as an insulating layer on the surface of the photoconductive layer of an electrophotographic photoreceptor having a photoconductive layer on the substrate). A color image is formed by applying a predetermined electrophotographic process including color image exposure to form an electrostatic image and developing it.For example, as described in Japanese Patent Publication No. 52-36019, Red (R) due to exposure of color original image
The green (F) light and the blue (B) light pass through only the R, G, and B parts of the color filter, and the resistance of the photoconductive layer is lowered depending on the amount of transmitted light, and those parts are charged. The static charge will disappear. The electrostatic charge is not lost on the photoconductive layer in areas where no light passes through the color filter, and an electrostatic image is formed. By developing this with a toner that has a light-shielding effect, the electrostatic charge remains. A color image is formed by applying toner to the area where the toner is attached, and blocking the R, G, and/or B areas of the color filter in that area to form a color image using the area of the color filter to which toner does not adhere. The support is an electrophotographic photoreceptor,
Further, in the case of a solid-state image sensor, the support is a silicon substrate. Objects to which color filters such as these are applied are so-called light-receiving elements.

The partition wall is made of, for example, Cr, Al, Ni, Cu, Ag, Au,
Metals such as Bi and U, chromium oxide, niobium oxide,
Metal oxides such as vanadium oxide, GeS, PbS,
Metal sulfides such as In ₂ S ₃ , Bi ₂ S ₃ , SnS, TaN,
Metal nitrides such as BN, TiN, ZrN, BaF ₂ ,
It is formed using metal fluorides such as PbF ₂ and metal carbides such as ZrC and TiC. Further, the partition wall may be formed using photoresist. The partition wall is formed by a suitable method such as vapor deposition or etching. In the case of vapor deposition, the barrier rib-forming material is deposited with a mask having striped openings placed on the support, and then the mask is removed to form striped barrier ribs. When forming a mosaic color filter,
Rotate the mask orthogonally and deposit again.
When forming barrier ribs by etching, the method is similar to the method of forming a masking pattern using a normal photoresist, that is, a barrier rib forming layer is formed on a support, and a photoresist layer is further formed on it. Perform pattern exposure and selectively remove unexposed areas of the photoresist layer by etching with a developer (if the exposed areas are soluble in the developer, the exposed areas may be selectively removed). Then, the photoresist layer is removed and the exposed portions of the barrier rib forming layer are dissolved and removed using a predetermined etching solution such as strong acid or strong alkali to form barrier ribs. The photoresist remaining in the exposed area (or unexposed area) may be removed with a predetermined solvent, but it is also effective to use it as part of the partition wall without removing it. As a photoresist,
Any conventionally commonly used materials can be used.
For example, as a commercially available product, product name: KPR
(Kodak photo Resist, manufactured by Kodatsu... developer: methylene chloride, trichlene, etc.), product name: KMER (Kodak Metal Etch Resist, manufactured by Kodatsu... developer: xylene, trichlene, etc.), product name: TPR (manufactured by Tokyo Ohka Co., Ltd.) ...Developer: xylene, trichlene, etc.), Product name: Shitsupre
AZ1300 (manufactured by Shitspray...developer: alkaline aqueous solution), product name: KTFR (Kodak Thin Film
Resist, made by Kodatsu...Developer: xylene, trichlene, etc.), Product name: FNRR (Fuji Pharmaceutical...
…Developer: Chlorocene) Product name: FPER (Fuji
Photo Etching Resist, manufactured by Fuji Photo Film…
…Developer: Triclean), Product name: TESH DOOL
(manufactured by Okamoto Chemical Co., Ltd., developer: water), and product name: Fujiresist No. 7 (manufactured by Fuji Pharmaceutical Co., Ltd., developer: water). After use, the mask can be removed using triclene, methylene chloride, AZ Remover (trade name: Shippray), sulfuric acid, etc. In addition, when forming the barrier ribs using photoresist, it can be formed by coating a photoresist layer on a support, then exposing it to pattern light, and etching away the unexposed areas (or exposed areas) with a developer. , the manufacturing process becomes simpler. Although the partition walls may be light-transmitting, it is effective to make them optically light-blocking in order to improve color resolution. That is, in a color filter that requires high color resolution, the area of each color element becomes extremely small. Therefore, there is a risk that the light information transmitted near the boundaries between each color element may partially overlap, resulting in a decrease in color resolution. This is because, in order to prevent this, it is effective to optically shield partition walls corresponding to certain boundary portions between color elements. The height, thickness, spacing, etc. between the partition walls are set appropriately depending on the type of color filter, but when manufacturing a color filter with high color resolution such as a solid-state image sensor, the height is 1 to 50μ, In particular, it is preferable that the thickness is about 2 to 20μ, the thickness is about 1 to 15μ, especially about 3 to 6μ, and the interval is about 10 to 50μ, especially about 15 to 35μ.

FIG. 2 shows that a mask 4 having an opening 3 for injecting a coloring material is placed on a support 1 having partition walls 2 formed in this manner, and the coloring material is attached to a predetermined portion of the support. Indicates the state in which the The openings 3 are located above the partitions where the color elements are formed. The openings may have any shape such as circular or square, or may be striped openings if the color filter to be formed is striped. Regardless of the shape of the opening, the diameter or width of the opening is set to be smaller than the distance between the partition walls, which makes alignment between the mask and the partition walls very easy. This is because each opening may be slightly offset from the center between the partition walls. The size of the diameter or width of the opening can be set appropriately, but it is usually 5/6 or less, particularly 2/3 or less of the spacing between the partition walls. Masks with openings at different positions are used depending on the type of dye to be injected, but depending on the arrangement of color elements formed on the color screen, it may be possible to inject a mask with openings at the same position. It can be used separately for each material.

Typical methods for injecting the color material through the opening 3 include coating and vapor deposition. In the case of coating, by coating the color material on the mask 4, the color material is injected and adhered onto the support through the openings. As the coloring material, for example, a dye solution or a mixed solution of a dye and a resin is used. If by vapor deposition, usually
A sublimable dye is used as the coloring material and is deposited onto the support through the opening. In this case, the dye is sublimed under normal pressure or vacuum, and the sublimated dye is deposited on the support through the opening. Alternatively, as an alternative method using vapor deposition, a coloring material layer 6 is formed on a support 5 as shown in FIG.
By heating the coloring material layer under vacuum or normal pressure, the coloring material is evaporated and injected through the opening 3, so that the coloring material is deposited on the support 1. Similarly, sublimable dyes are usually used as coloring materials. The support 5 may be made of any material such as paper, resin film, or glass. The color material layer is heated using a heater, tungsten lamp, high pressure mercury lamp,
Radiation from ultra-high pressure mercury lamps, xenon lamps, arc lamps, various lasers, etc. may also be used. In this way, by repeating the formation of color elements by adhering the color materials to the support according to each color material, for example, the operation of depositing green, red and blue color materials on the support is performed three times. By doing this, a color filter having a predetermined color element layer is formed. FIG. 4 shows an example of the color element layer formed, and shows a color element 7 in which a green element 8, a red element 9, and a blue element 10 are arranged in a mosaic pattern between the partition walls 2. In addition to directly attaching the color material to the support, it is also effective to attach the color element to a color element receiving layer formed on the support to form a color element layer.

The color element receiving layer is a layer for effectively retaining color materials, and a representative example thereof is described in the document "IEEE TRANSACTION ON ELECTRON
DEVICES, Vol. ED-25, No. 2, page 97, it is made of various resins such as polyurethane resin, polycarbonate resin, and cinnamate-based photosensitive resin. The color element receiving layer is usually set thin, and in particular, for devices such as solid-state imaging devices that require high color separation performance, it is formed to a thickness of 5 to 30 μm, particularly 5 to 10 μm. is preferable.

The color element receiving layer may be formed by various methods, but for example, as shown in FIG. A color element receiving layer 13 is formed by injecting a color element receiving layer forming material by coating, vapor deposition, etc. through a mask 11 having a color element receiving layer, and then the mask 11 is removed. Also, the 6th
As shown in the figure, the color element receiving layer 14 may be formed on the support 1 by coating, vapor deposition, etc., and the partition walls 2 may be formed thereon.

Typical dyes as color materials used in the present invention are as follows: (1) Suitable sublimable red dyes include Seriton Scarlet B (manufactured by Vadateshiyu), Diaceriton Fast Pink R (manufactured by Mitsubishi Kasei), and Thyrasil Brilliant Pink 4BN (manufactured by Mitsubishi Kasei). (manufactured by Ciba Geigy), Kayalon Red R (manufactured by Nippon Kayaku), Sumikalon Red E-FBL (manufactured by Sumitomo Chemical), Resolin Red FB (manufactured by Bayer AG), Sumiacryl Rhodamine 6GCP (manufactured by Sumitomo Chemical), Eisen Kachiron Punku FGH (Hodogaya) chemical),
Examples include Makiron Brilliant Red 4G (manufactured by Ciba Geigy) and Diacrylic Splash Brilliant Pink RN (manufactured by Mitsubishi Kasei).

A red dye suitable for application is Suminol Fast Red B conc.
(manufactured by Sumitomo Chemical), Eisen Brilliant Scarlet 3RH (manufactured by Hodogaya Chemical), Azorbinol 3GS250% (manufactured by Mitsubishi Chemical), Kayaku Ash
Rhodamine FB (manufactured by Nippon Kayaku), Acid Anthracene Red 3B (manufactured by Chugai Kasei), Benzyl Fast Red B (manufactured by Ciba Geigy), Palatin Fast Red RN (manufactured by Vadeice), Nyromine Red 2BS (manufactured by ICI), Lanaf Fast Red 2GL (manufactured by ICI) Examples include Mitsui Toatsu Chemical Co., Ltd.) and Rose Bengal (Kenji Kasei Co., Ltd.).

(2) Suitable sublimable green dyes include Eisen Diamond Green GH (manufactured by Hodogaya Chemical), Eisen Malachite Green (manufactured by Hodogaya Chemical), Brilliant Green (manufactured by Dupont),
Examples include Fast Green JJO (manufactured by Ciba Geigy), Sinagrill Green G (manufactured by ICI), and Victoria Green (manufactured by Dupont).

Green dyes suitable for coating include Kayakaran Blue Black 3BL (manufactured by Nippon Kayaku), Sumilan Green BL (manufactured by Sumitomo Chemical), and Eisen Florslan Olive Green.
GLH (manufactured by Hodogaya Chemical), Diacid Cyanine Green GWA (manufactured by Mitsubishi Kasei), Cibaran Green GL (manufactured by Ciba-Geigy), Carboran Brilliant Green 5G (manufactured by AICI), Palatin Fast Green BLN (manufactured by Vadeitshu), Acid Green GBH (manufactured by Takaoka Chemical),
Examples include Assisted Brilliant Milling Green B (manufactured by Mitsui Toatsu Chemicals).

Green color can also be produced by combining a blue dye and a yellow dye.

(3) Suitable sublimation blue dyes include Miketon Fast Blue Extra (manufactured by Mitsui Toatsu Chemical Co., Ltd.), Kayalon Fast Blue FN (manufactured by Nippon Kayaku Co., Ltd.), Sumikalon Blue E-BR (manufactured by Sumitomo Chemical Co., Ltd.), and Thyrasil Blue. 2R (manufactured by Ciba Geigy), Paranil Blue R (manufactured by Badice), crampons
Brilliant Basics Cyanine 6GH (Hodogaya Chemical), Crampons Carotene Blue GLH
(manufactured by Hodogaya Chemical), Cibaset Blue F3R (manufactured by Ciba Geigy), Diaceritone Fast Brilliant Blue B (manufactured by Mitsubishi Kasei), Despasol Blue BN (manufactured by ICI), Resolin Blue
FBL (manufactured by Bayer AG), Ratile Blue FRN (manufactured by Dupont), Seblon Blue ER (manufactured by Dupont),
Diacrylic brilliant blue H2R-N
(manufactured by Mitsubishi Kasei), etc.

Blue dyes suitable for coating include Orient Soluble Blue OBC (manufactured by Oriont Chemical), Suminol Revering Blue 4GL (manufactured by Sumitomo Chemical), and Kayanol Blue.
N2G (manufactured by Nippon Kayaku), Mitsui Alizarin Saphyrol B (manufactured by Mitsui Toatsu Chemical), Xylene First Blue BL200% (manufactured by Mitsubishi Kasei), Alizarin First Blue R (manufactured by Ciba Geigy), Carboran Brilliant Blue 2R
(manufactured by ICI), Palatin Fast Blue GGN (manufactured by Vadateshiyu), Eisen Opal Blue New Conc (manufactured by Hodogaya Chemical), Fastogen Blue SBL (manufactured by Dainippon Ink Chemical)
Examples include.

All of the above are product names.

Although the typical configuration of the color filter has been described above, the color elements may be divided into more than three colors of red, blue, and green. The size of one color element is very small, especially for high color resolution color filters such as those for solid-state image sensors.
100~10000μ ² (If it is striped,
A width range of 10 to 100μ is suitable. ) When the support of the color filter is a light receiving element such as a solid-state image sensor, the registration with the color filter can be made more accurate by forming the color filter and such a detection member integrally. It is suitable for this purpose. Further, when the support of the color filter is not a light receiving element, the color filter is used in close contact with such a light receiving element.

As explained above, in the present invention, a mask having openings smaller than the spacing between the partition walls is used inside the partition walls formed on the support, and ink, microcapsules, steam, etc. are used to color the mask through the openings. The mask alignment operation is extremely easy as the material is attached and each color element is formed.
Furthermore, since the accuracy of the color elements is related to the accuracy of the partition walls, the mask alignment accuracy requires that the mask openings are not on the center line of the partition wall spacing, but are just above the partition walls even if they are slightly off. be relaxed to a certain extent.

Also, as mentioned above, the dimensions of the color elements are determined by the partition walls and are therefore very stable.

Furthermore, as shown in FIG. 4, since each color element is separated by a partition wall, the color material does not protrude when it is attached, resulting in excellent color separation.

In addition, in forming an opaque partition wall with light-shielding properties, a metal layer such as Cr or a similar opaque layer such as carbon is formed on the support in advance.
There is a method of etching away the opaque layer in the window area using a window formed by a partition wall, leaving a light-shielding layer only under the partition wall, or using a photoresist dyed opaque in advance, or ion bombarding the photoresist pattern. Commonly known means such as blackening the surface of the material are used. Furthermore, when microcapsules containing a dye are injected through the openings of the mask, the capsules themselves can also serve as a color element receiving layer, so it is not necessarily necessary to form a color element receiving layer in advance. Furthermore, without forming a dye-receiving layer in advance, the dye-containing organic polymer material may be melted or dissolved in a solvent and injected through a mask opening, as in screen printing, and formed directly on the support. good.

Further, the dye deposited by vapor deposition can be diffused into the color element receiving layer by a subsequent heat treatment to form a uniform color element. Further, an organic polymer layer, such as a polystyrene layer, may be formed as a protective layer on the surface of such a color element layer.
Further, after the partition walls are provided, the color element receiving layer can be formed uniformly over the entire surface in the windows separated by the partition walls by a method such as spinner coating without using a mask.

Example 1 First, an evaporation mask was placed on a CCD wafer so that the opening of the evaporation mask was located at the imaging area of the CCD, and metallic chromium was evaporated to a thickness of 7000 Å to 9000 Å.
On top of that, positive photoresist (product name: OFPR-
2. Coat with a spinner (manufactured by Tokyo Ohka). Next, we used a matrix-like mask with a square pattern of 20 μm transparent part, 5 μm opaque part, and 25 μm pitch arranged vertically and horizontally, and the effective area corresponding to one CCD was 13 mm x 13 mm. 2 seconds of exposure using a 300,000 Lux ultra-high pressure mercury lamp, after developing and cleaning with a special developer, a photoresist pattern is formed, and the exposed chrome is etched with a chrome etchant.
Only the light-receiving surface of each photosensitive element of the CCD was exposed.
Further, the unexposed portion of the photoresist layer having a thickness of about 2.5 μm is left as is to be used as a partition wall.

Through the above process, a width of 25 μm is printed on the CCD.
A 5 μm opaque mesh barrier was formed.

On the other hand, a circular opening with a diameter of 15 μm has a pitch of 25 μm.
Prepare phosphor bronze masks with a thickness of approximately 20 μm that are arranged vertically and horizontally. The mask is positioned on the partition wall formed on the CCD so that the opening of the mask is over the window (the part surrounded by the partition wall) formed on the CCD, and is brought into close contact with the mask, and the polyester resin is passed through this opening. A 0.1% methyl ethyl ketone solution of (trade name: Ester Resin #200, manufactured by Toyobo) was injected onto the light-receiving surface of the CCD by a spray method and dried at 60°C for 30 minutes. The thickness of the color element receiving layer thus obtained was 1.5 μm.

Next, a similar mask having circular openings with a diameter of 15 μm and a pitch of 50 μm is prepared. The mask is aligned and brought into close contact with the CCD coated with the color element receiving layer using a transmitted illumination type mask alignment device so that the opening of the mask is exactly on the window provided on the CCD. Next, using a transfer paper containing a sublimable dye, the dye is sublimated and adhered to the color element receiving layer in the area not covered by the mask by heating the transfer paper from the back side using a hot-ray heater using a Yotz lamp, and then heating it at 80°C. The dye receiver is dyed by heating for 30 minutes to form a color element. This operation was repeated three times for each red, green, and blue dye to form a color element layer as shown in FIG.

The transfer paper used was prepared by preparing ink of each color by blending the dyes, resins, solvents, etc. shown below, and coating and drying the paper using a gravure coating method.

1 Red ink Mikaron Red B (product name, Sumitomo Chemical dye)
5 parts (parts by weight) Methyl isobutyl ketone 55 parts Toluene 40 parts 2 Green ink Kayalon Fast Yellow GL (trade name, Nippon Kayaku dye) 3 parts Kayalon Fast Blue FN (trade name, Nippon Kayaku dye) 2 Parts Methyl isobutyl ketone 55 parts Toluene 40 parts 3 Blue ink Diaceritone Fast Brilliant Blue B
(Product name, Mitsubishi Kasei dye) 5 parts Methyl isobutyl ketone 55 parts Toluene 40 parts The dye deposition process was carried out by shifting the position of the same mask for blue and red, and as shown in Figure 4 for green. Change the mask to CCD
A color filter was formed on top.

Example 2 Pitch 25μ on CCD formed in Example 1
width 5μm, height 3.5μm, window area 20μm x 20μm
A CC support is used in which the partition wall is provided so that the light-receiving part of the window CCD is exactly aligned with the partition wall.

Next, prepare the red, green, and blue inks shown below.

Ink composition Parts by weight (1) Red ink Valif Astretz #1306 (trade name, dye manufactured by Orient Chemical Industries) 1.0 Aron S-1002 (trade name, acrylic resin manufactured by Toagosei Chemical Industry Co., Ltd.) 0.5 KBM403 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) Silane coupling agent) 0.5 Ethyl cellosolve 98.0 (2) Blue ink Varifast Blue #1601 (trade name, Orient Kagaku Kogyo dye) 1.0 Aron S-1002 0.5 KBM403 0.5 Ethyl cellosolve 98.0 (3) Green ink Varifast Yellow #1101 (Product name, dye manufactured by Orient Chemical Industry) 0.6 Varifast Blue #1601 (Product name, dye manufactured by Orient Chemical Industry) 0.4 Aron S-1002 0.5 KBM403 0.5 Ethyl Cellosolve 98.0 First, the red ink obtained in (1) was applied. Using the mask used in Example 1 having circular openings with a diameter of 15 μm and a pitch of 50 μm, the mask was applied to a thickness of 3 μm on the light-receiving surface of the CCD, and then dried by heating at about 60° C. for 30 minutes. In this way, the first color element is formed.

Next, after washing the mask, shift it by one pitch to the support, align it, and bring it into close contact.
Next, blue ink was applied on the CCD support in the same way,
forming the second color element.

In the third step, a similar step is performed using green ink and a mask with a pitch of 35.4 μm to form a third color element.

In the above manner, a color mosaic filter was obtained that was in close contact with the CCD and had sufficiently high positional accuracy.

[Brief explanation of the drawing]

1 and 2 show one embodiment of the method for manufacturing a color filter according to the present invention, with FIG. 1 showing a partition wall forming step and FIG. 2 showing a color element forming step. FIG. 3 shows another embodiment of the color element forming process according to the present invention. FIG. 4 shows one embodiment of a color element layer formed according to the present invention. FIGS. 5 and 6 respectively show other variations for forming color elements according to the invention. DESCRIPTION OF SYMBOLS 1... Support body, 2... Partition wall, 3... Opening, 4... Mask, 5... Support body, 6... Color material layer, 7... Color element layer,
13...Color element receiving layer.

Claims (1)

[Claims] 1. Partition walls corresponding to color elements for color-separating incident light are provided on a support, and a mask having an opening smaller than the interval between the partition walls is placed between the partition walls so that the opening is located between the partition walls. A method for manufacturing a color filter, characterized by placing the color filter on top of the filter and attaching a color material through the opening. 2. The method for producing a color filter according to claim 1, wherein a color material is attached to a color element receiving layer formed on a support. 3. The method for manufacturing a color filter according to claim 1, wherein the color material is attached by vapor deposition. 4. The method for manufacturing a color filter according to claim 1, wherein the color material is attached by coating. 5. The method for manufacturing a color filter according to claim 1, wherein the support is a solid-state image sensor.