JPS632704B2 - - Google Patents
Info
- Publication number
- JPS632704B2 JPS632704B2 JP59076092A JP7609284A JPS632704B2 JP S632704 B2 JPS632704 B2 JP S632704B2 JP 59076092 A JP59076092 A JP 59076092A JP 7609284 A JP7609284 A JP 7609284A JP S632704 B2 JPS632704 B2 JP S632704B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- guide plate
- nozzle
- spout
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷配線板に各種電子部品を自動的に
半田付けする際に使用する噴流式半田付装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a jet soldering device used to automatically solder various electronic components to printed wiring boards.
従来例の構成とその問題点
一般に噴流式の半田付装置は第１図に示すよう
に半田浴槽１内に設けられた導管２の一方に羽根
車３を設け、この羽根車３をモータ４によつて高
速回転させることによつて半田浴槽１内に収納さ
れ、ヒータ５によつて溶融された半田が導管２の
他方に形成されたノズル７より噴出し案内板８を
伝わつて再び半田浴槽１内に流れ込むように構成
されているのが普通である。ところで、この種の
噴流式半田付装置を用いて印刷配線板に各種電子
部品を半田付けする場合には各種電子部品を搭載
した印刷配線板９を矢印の方向に移行させて印刷
配線板９がノズル７より噴出した半田流に接触す
るようにするのであるが、この場合、案内板８の
角度、半田流の流速、印刷配線板９の移行速度、
半田流の波幅形状等が信頼性の基本となる半田フ
イレツトの形状、半田の付着量等に大きく影響を
与えることになる。従来より使用されているこの
種の半田付装置はいずれも案内板８の取付角度が
ある値に固定されたものであり、印刷配線板の種
類によつては半田付不良が多発する場合があつ
た。Conventional Structure and Problems In general, a jet-type soldering device is equipped with an impeller 3 on one side of a conduit 2 provided in a solder bath 1, and this impeller 3 is connected to a motor 4, as shown in FIG. By rotating at a high speed, the solder is stored in the solder bathtub 1 and melted by the heater 5, and the solder is ejected from the nozzle 7 formed on the other side of the conduit 2, transmitted through the guide plate 8, and returned to the solder bath 1. It is usually constructed so that it flows into the interior. By the way, when soldering various electronic components to a printed wiring board using this type of jet soldering device, the printed wiring board 9 on which various electronic components are mounted is moved in the direction of the arrow. In this case, the angle of the guide plate 8, the flow velocity of the solder flow, the transfer speed of the printed wiring board 9,
The shape of the wave width of the solder flow, etc. greatly influences the shape of the solder fillet, the amount of solder adhesion, etc., which are the basis of reliability. All conventionally used soldering devices of this type have the installation angle of the guide plate 8 fixed at a certain value, and depending on the type of printed wiring board, soldering defects may occur frequently. Ta.
発明の目的
本発明は以上のような従来の欠点を除去するも
のであり、簡単な構成で信頼性の高い確実な半田
付けを可能とする優れた噴流式半田付装置を提供
することを目的とするものである。Purpose of the Invention The present invention eliminates the above-mentioned conventional drawbacks, and aims to provide an excellent jet soldering device that has a simple configuration and enables reliable and reliable soldering. It is something to do.
発明の構成
上記の目的を達成するため、本発明の噴流式半
田付装置は、溶融した半田を噴出させるノズルの
噴出口の両側にそれぞれ回動自在に案内板を取付
け、この案内板をある速度で上下に振動させるこ
とにより上記案内板に沿つて上記噴出口より噴出
した半田が半田浴槽内に流れ込むように構成した
ことを特徴とするものである。Composition of the Invention In order to achieve the above object, the jet soldering device of the present invention rotatably attaches guide plates to both sides of the spout of a nozzle that spouts molten solder, and moves the guide plates at a certain speed. The present invention is characterized in that the solder ejected from the spout along the guide plate flows into the solder bath by vertically vibrating the solder.
実施例の説明
以下、本発明の噴流式半田付装置について一実
施例の図面とともに説明する。第２図は本発明の
噴流式半田付装置における一実施例の要部断面図
であり、他の部分は第１図に示す従来の噴流式半
田付装置と実質的に同一の構成であるためその部
分を省略して示してある。第２図において、８′
はノズル７の噴出口の両側にそれぞれ支軸１０を
もつて回動自在に取付けられた案内板である。そ
して、１１は案内板８の遊端近傍に対向して設け
られた回転軸であり、この回転軸１１には外周が
案内板８′の下面に当接するカム１２が取付けら
れている。したがつて回転軸１１をある速度で回
転させればカム１２の作用によつて案内板８′を
支軸１０を中心に上下に振動させることができ
る。DESCRIPTION OF EMBODIMENTS The jet soldering apparatus of the present invention will be described below with reference to drawings of one embodiment. FIG. 2 is a sectional view of a main part of one embodiment of the jet soldering device of the present invention, and the other parts have substantially the same configuration as the conventional jet soldering device shown in FIG. That part is omitted from the illustration. In Figure 2, 8'
are guide plates rotatably attached to both sides of the ejection port of the nozzle 7 with support shafts 10, respectively. Reference numeral 11 denotes a rotating shaft provided near the free end of the guide plate 8, and a cam 12 is attached to the rotating shaft 11, the outer periphery of which abuts against the lower surface of the guide plate 8'. Therefore, if the rotary shaft 11 is rotated at a certain speed, the guide plate 8' can be vibrated up and down about the support shaft 10 by the action of the cam 12.
このように案内板８′と支軸１０を中心に回動
可能とし、カム１２を連続して動かすことにより
案内板８′を振動させると、半田流の形状を変化
させることができ、印刷配線板９に接する溶融半
田の角度及び圧力を変化させることができる。そ
して案内板８′の上方への動きは印刷配線板９へ
の接触圧力を上げ、細かい部分あるいは半田は時
に発生するガスを移動して半田の印刷配線板への
ぬれ性を高めることになる。一方、案内板８′の
下方への動きは印刷配線板９に接触した溶融半田
を引き離し、余分に付着した半田を取り、シヨー
ト、ツララ等の現象の発生を防ぐことになる。 By making the guide plate 8' rotatable around the guide shaft 10 and vibrating the guide plate 8' by continuously moving the cam 12, the shape of the solder flow can be changed, and the printed wiring The angle and pressure of the molten solder contacting the plate 9 can be varied. The upward movement of the guide plate 8' increases the contact pressure on the printed wiring board 9, and the fine parts or solder displaces the gas that is sometimes generated, thereby increasing the wettability of the solder to the printed wiring board. On the other hand, the downward movement of the guide plate 8' separates the molten solder that has come into contact with the printed wiring board 9, removes excess solder, and prevents phenomena such as shorts and icicles.
このように上記実施例によれば、回転軸１１を
ある速度で回転させ、案内板８′を上下に振動さ
せることができるため、ノズル７より噴出した半
田流の形状を変化させ、印刷配線基板との接触角
度、切れ角度を連続的に変化させて印刷配線板に
対する半田流の接触作用力を変化させることによ
り半田の盛りも良化され、より信頼性の高い半田
付けが可能であるという利点を有する。 As described above, according to the above embodiment, since the rotating shaft 11 can be rotated at a certain speed and the guide plate 8' can be vibrated up and down, the shape of the solder flow ejected from the nozzle 7 can be changed, and the printed wiring board By continuously changing the contact angle and cutting angle with the printed wiring board to change the contact force of the solder flow on the printed wiring board, the solder buildup is improved and the advantage is that more reliable soldering is possible. has.
発明の効果
以上のように本発明の噴流式半田付装置は、溶
融した半田を噴出させるノズル口の両側に、ノズ
ル口に接近して配置した支軸を回転中心とし、上
記ノズルより遠い側に配置した回転軸と同軸のカ
ムに常時当接して上下に振動可能な案内板をそれ
ぞれ設け、この案内板に沿つて噴出した半田が流
れ込むように構成したので、案内板の上方への動
きは印刷配線板への半田接触圧力を上げて半田の
印刷配線板に対するぬれ性を高め、案内板の下方
への動きは印刷配線板に接触した溶融半田を引き
離してシヨート、ツララ現象の発生を防ぐように
作用し、結果的に半田流の形状を連続して変化さ
せ、印刷配線板に接する溶融半田の角度及び圧力
を変化させることによつて、信頼性の高い優れた
半田付けを行なうことができ、実用上きわめて有
利なものである。Effects of the Invention As described above, the jet soldering device of the present invention rotates around the spindles disposed close to the nozzle opening on both sides of the nozzle opening for spouting molten solder, and on the side farther from the nozzle. Each guide plate is provided with a cam that is coaxial with the rotating shaft and can vibrate up and down at all times, and the ejected solder flows along the guide plate, so the upward movement of the guide plate is controlled by printing. The contact pressure of the solder to the printed wiring board is increased to improve the wettability of the solder to the printed wiring board, and the downward movement of the guide plate separates the molten solder that has come into contact with the printed wiring board to prevent shortening and icicle phenomena. As a result, by continuously changing the shape of the solder flow and changing the angle and pressure of the molten solder in contact with the printed wiring board, it is possible to perform excellent and highly reliable soldering. This is extremely advantageous in practice.
第１図は従来の噴流式半田付装置の断側面図、
第２図は本発明の噴流式半田付装置における一実
施例の要部断側面図である。
１……半田浴槽、２……導管、３……羽根車、
４……モータ、５……ヒータ、６…半田、７……
ノズル、８，８′……案内板、９……印刷配線板、
１０……支軸、１１……回転軸、１２……カム。
Figure 1 is a cross-sectional side view of a conventional jet-type soldering device.
FIG. 2 is a sectional side view of essential parts of an embodiment of the jet soldering apparatus of the present invention. 1... Solder bathtub, 2... Conduit, 3... Impeller,
4...Motor, 5...Heater, 6...Solder, 7...
Nozzle, 8, 8'...Guide plate, 9...Printed wiring board,
10... Support shaft, 11... Rotating shaft, 12... Cam.
Claims (1)
両側にそれぞれ回動自在に案内板を取付け、この
案内板に沿つて上記噴出口より噴出した半田が半
田浴槽内に流れ込むように構成した噴流式半田付
装置であつて、上記案内板は上記ノズルの噴出口
近傍に配置した支軸を中心に回動可能でかつ上記
ノズルの噴出口より遠い側に設けた回転軸に同軸
のカムに常時当接して、上記回転軸がある速度で
回転されることにより上記支軸を中心として上下
に振動させるように構成したことを特徴とする噴
流式半田付装置。1. A jet type solder in which guide plates are rotatably attached to both sides of the spout of a nozzle that spouts molten solder, and the solder spouted from the spout flows into the solder bath along the guide plates. The guide plate is rotatable around a support shaft disposed near the spout of the nozzle, and is always in contact with a cam coaxial with a rotating shaft provided on a side farther from the spout of the nozzle. The jet soldering device is characterized in that the rotary shaft is rotated at a certain speed to vibrate up and down about the support shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59076092A JPS59209475A (en) | 1984-04-16 | 1984-04-16 | Jet type soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59076092A JPS59209475A (en) | 1984-04-16 | 1984-04-16 | Jet type soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59209475A JPS59209475A (en) | 1984-11-28 |
| JPS632704B2 true JPS632704B2 (en) | 1988-01-20 |
Family
ID=13595196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59076092A Granted JPS59209475A (en) | 1984-04-16 | 1984-04-16 | Jet type soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59209475A (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52127263U (en) * | 1976-03-24 | 1977-09-28 | ||
| JPS54139028U (en) * | 1978-03-16 | 1979-09-27 |
-
1984
- 1984-04-16 JP JP59076092A patent/JPS59209475A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59209475A (en) | 1984-11-28 |
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