JPS6328351B2 - - Google Patents
Info
- Publication number
- JPS6328351B2 JPS6328351B2 JP56006823A JP682381A JPS6328351B2 JP S6328351 B2 JPS6328351 B2 JP S6328351B2 JP 56006823 A JP56006823 A JP 56006823A JP 682381 A JP682381 A JP 682381A JP S6328351 B2 JPS6328351 B2 JP S6328351B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- light receiving
- receiving element
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】
本発明は、混成集積回路の基板の上に直接チツ
プ状の発光素子と受光素子を取付けて形成される
光結合装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical coupling device formed by directly attaching a chip-shaped light emitting element and a light receiving element to a substrate of a hybrid integrated circuit.
絶縁基板上に形成する膜技術を利用して、抵抗
体、絶縁体等の受動素子を形成し、トランジス
タ、IC等の能動素子や発光素子等を塔載して集
積化する厚膜混成ICの生産プロセスは、印刷技
術が主体となるため平面的な拡がりをもつ回路構
成をとつている。 Thick film hybrid ICs utilize film technology to form on insulating substrates, forming passive elements such as resistors and insulators, and mounting active elements such as transistors and ICs, and light emitting elements for integration. Since the production process is mainly based on printing technology, it has a circuit configuration with a two-dimensional expansion.
例えば、第１図に示すように、抵抗体１や導電
体２が基板３上に平面的に形成され、半導体チツ
プ４は基板３上にダイボンデイングされ、極細線
５で電極６と電気的に接続されている。 For example, as shown in FIG. 1, a resistor 1 and a conductor 2 are formed planarly on a substrate 3, a semiconductor chip 4 is die-bonded on the substrate 3, and is electrically connected to an electrode 6 using a very fine wire 5. It is connected.
しかし、このような基板３上に、チツプ状態の
発光素子と受光素子を直接取付け、光結合装置を
構成する場合、発光素子の発光面と受光素子の受
光面とを対向させる必要がある点から実現が困難
であつた。このため、従来は、発光素子７と受光
素子８を対向し１対として１つのパツケージ１０
内に収納し、１つの部品として基板３に実装する
方法が採られていた。 However, when a light-emitting element and a light-receiving element in chip form are directly mounted on such a substrate 3 to form an optical coupling device, the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element must face each other. It was difficult to realize this. For this reason, conventionally, the light emitting element 7 and the light receiving element 8 are arranged as a pair in a single package 10.
A method has been adopted in which the semiconductor device is housed inside the device and mounted on the board 3 as a single component.
このように、発光素子と受光素子とを１つのパ
ツケージに収納して部品を形成してから基板に実
装する生産プロセスは、工程が煩雑でしかも周辺
回路の集積化が困難であることからコスト高を招
き集積回路の小型化が困難であつた。 In this way, the production process in which a light-emitting element and a light-receiving element are housed in one package to form a component and then mounted on a board is complicated and difficult to integrate peripheral circuits, resulting in high costs. This made it difficult to miniaturize integrated circuits.
本発明は上述の点に鑑みなされたもので、同一
基板上に直接発光素子と受光素子を塔載し、この
発光素子の発光面と受光素子の受光面とに臨ませ
て光の屈折反射手段を設けて両者を光学的に結合
した光結合装置を提供するものである。 The present invention has been made in view of the above points, and includes a light emitting element and a light receiving element directly mounted on the same substrate, and a light refraction and reflection means that faces the light emitting surface of the light emitting element and the light receiving surface of the light receiving element. The present invention provides an optical coupling device in which the two are optically coupled.
以下、本発明の実施例を第２図以下の図面に基
づいて説明する。 Hereinafter, embodiments of the present invention will be described based on the drawings from FIG. 2 onwards.
１１はガラスやセラミツクなどで形成された基
板で、この基板１１上には抵抗体１２や導電体１
３等が印刷形成され、チツプ状に形成された
LED等の発光素子１４と、フオトダイオードや
フオトトランジスタ等の受光素子１５とが直接ダ
イボンデイングされている。これらの発光素子１
４と受光素子１５は極細線１６によつて電極１
７，１８に接続され、これらの電極１７，１８は
周辺回路（図示せず）に接続されている。また、
前記発光素子１４の発光面と、受光素子１５の受
光面とに臨ませて光の屈折反射手段が設けられ両
者間を光学的に結合している。この光の屈折反射
手段は、例えば次のように構成されている。すな
わち、ボンデイング後発光素子１４、受光素子１
５の上部の円孔１９，２０部分だけを残して基板
１１上全面に、遮光性のある黒色の樹脂層２１を
一定厚さでモールドする。前記円孔１９，２０の
中にシリコン樹脂やエポキシ樹脂等の透明な樹脂
をその小径部２２，２３の体積に比しやや多めに
注入すると、表面張力によつて第１、第２の凸レ
ンズ２４，２５が形成される。この第１、第２の
凸レンズ２４，２５は前記発光素子１４および受
光素子１５の表面保護を兼ねている。 Reference numeral 11 denotes a substrate made of glass, ceramic, etc., and a resistor 12 and a conductor 1 are mounted on this substrate 11.
3rd grade was printed and formed into a chip shape.
A light emitting element 14 such as an LED and a light receiving element 15 such as a photodiode or phototransistor are directly die bonded. These light emitting elements 1
4 and the light receiving element 15 are connected to the electrode 1 by a very fine wire 16.
7 and 18, and these electrodes 17 and 18 are connected to a peripheral circuit (not shown). Also,
Light refraction/reflection means is provided facing the light emitting surface of the light emitting element 14 and the light receiving surface of the light receiving element 15 to optically couple them. This light refraction/reflection means is configured as follows, for example. That is, after bonding, the light emitting element 14 and the light receiving element 1
A light-shielding black resin layer 21 is molded to a constant thickness on the entire surface of the substrate 11, leaving only the circular holes 19 and 20 at the top of the substrate 11. When a transparent resin such as silicone resin or epoxy resin is injected into the circular holes 19 and 20 in an amount slightly larger than the volume of the small diameter portions 22 and 23, the first and second convex lenses 24 are formed by surface tension. , 25 are formed. The first and second convex lenses 24 and 25 also serve to protect the surfaces of the light emitting element 14 and the light receiving element 15.
前記第１と第２の凸レンズ２４，２５の上部に
は、空間部２６と２７を介して、光の伝送路を略
直角に屈折反射させるためのガラスや透明なアク
リル樹脂等でできた三角形状のプリズム２８が、
その水平面を前記第１と第２の凸レンズ２４，２
５の光軸と垂直となるように設けられている。こ
のプリズム２８の斜面２９，３０には、外部から
の光を遮断するための手段としての反射膜３１が
形成されている。 Above the first and second convex lenses 24 and 25, there are triangular shaped lenses made of glass, transparent acrylic resin, etc., for refracting and reflecting the light transmission path at approximately right angles through the spaces 26 and 27. The prism 28 of
The horizontal plane is connected to the first and second convex lenses 24 and 2.
It is provided perpendicular to the optical axis of 5. A reflective film 31 is formed on the slopes 29 and 30 of this prism 28 as a means for blocking light from the outside.
つぎに作用を説明する。 Next, the effect will be explained.
第２図において、発光素子１４から発射した光
は矢印で示すように放射状に広がり、第１の凸レ
ンズ２４で集光され、その光軸と略平行な光線と
なつてプリズム２８の水平面の図中左側に垂直に
入射する。この入射光はプリズム２８の一方の斜
面２９で反射し略水平な光線となり他方の斜面３
０反射してプリズム２８の水平面の図中右側から
出る。そして、この光は空間部２７を経て第２の
凸レンズ２５で集光され、受光素子１５の受光面
に入射する。このようにして発光素子１４と受光
素子１５とが光学的に結合される。 In FIG. 2, the light emitted from the light emitting element 14 spreads radially as shown by the arrows, is condensed by the first convex lens 24, and becomes a ray approximately parallel to the optical axis of the prism 28 on the horizontal plane of the prism 28. Enter vertically to the left. This incident light is reflected on one slope 29 of the prism 28 and becomes a substantially horizontal light beam on the other slope 3.
0 is reflected and exits from the right side of the horizontal plane of the prism 28 in the figure. Then, this light passes through the space 27, is condensed by the second convex lens 25, and enters the light receiving surface of the light receiving element 15. In this way, the light emitting element 14 and the light receiving element 15 are optically coupled.
前記実施例では、発光素子と受光素子各１個づ
つで形成した光結合装置の場合を説明したが、第
３、第４および第５図に示すように複数個の発光
素子１４1，１４2，１４3…と受光素子１５1，１
５2，１５3…とをそれぞれ１個づつ対として複数
組設ける多チヤンネル方式の光結合装置を構成す
る場合についても同様である。 In the above embodiment, a case has been described in which an optical coupling device is formed with one light emitting element and one light receiving element, but as shown in FIGS. 3, 4, and 5, a plurality of light emitting elements 14 1 , 14 2 , 14 3 ... and light receiving elements 15 1 , 1
The same applies to the case of configuring a multi-channel optical coupling device in which a plurality of pairs of 5 2 , 15 3 . . . are provided.
これらの図において、３２は光の屈折反射手段
としてのプリズムで、このプリズム３２の下部に
は、発光素子群１４1，１４2，１４3…と、受光
素子群１５1，１５2，１５3…とが形成されてい
る。前記プリズム３２の上部には、対とならない
発光素子と受光素子との間で光の相互干渉が起こ
るのを防止するためのスリツト３３，３３，３３
…が設けられ、これらのスリツト３３，３３，３
３…の表面には外部の光を遮断するための手段と
して反射膜３４が形成されている。 In these figures, 32 is a prism as a light refraction and reflection means, and below this prism 32 are light emitting element groups 14 1 , 14 2 , 14 3 . . . and light receiving element groups 15 1 , 15 2 , 15 3 . ...is formed. At the upper part of the prism 32, there are slits 33, 33, 33 for preventing mutual interference of light between a light emitting element and a light receiving element that are not paired.
... are provided, and these slits 33, 33, 3
A reflective film 34 is formed on the surfaces of 3 as a means for blocking external light.
本発明は上記のように混成集積回路の同一基板
上に直接発光素子と受光素子とをチツプ状態で塔
載して光結合装置を形成するようにしたので、発
光素子および受光素子と電極とのワイヤボンデイ
ング等の生産プロセスが簡易になるとともに、発
光素子や受光素子の直ぐ近くの基板上に抵抗体や
導電体または周辺回路を形成できるので混成集積
回路の小型化が可能である。 In the present invention, as described above, the light emitting element and the light receiving element are directly mounted in chip form on the same substrate of the hybrid integrated circuit to form an optical coupling device. In addition to simplifying production processes such as wire bonding, it is possible to form a resistor, a conductor, or a peripheral circuit on a substrate immediately adjacent to a light emitting element or a light receiving element, thereby making it possible to miniaturize the hybrid integrated circuit.
以上の効果は、発光素子と受光素子の対を複数
個設けた多チヤンネル方式の光結合装置を形成す
る場合も同様である。 The above effects are the same when forming a multichannel optical coupling device in which a plurality of pairs of light emitting elements and light receiving elements are provided.
また、発光素子の発光面と受光素子の受光面と
を光学的に結合するための光の屈折反射手段を、
凸レンズとプリズムとで構成したので、発光素子
から発射される光を有効に受光素子に伝送するこ
とができる。多チヤンネル方式の光結合装置にお
いて、プリズムの上部に各１対毎に区切るスリツ
トを設け、このスリツトに反射膜を形成したので
外部の光からの干渉や他の発光素子からの入射を
防止できる。 Further, a light refraction/reflection means for optically coupling the light emitting surface of the light emitting element and the light receiving surface of the light receiving element is provided.
Since it is composed of a convex lens and a prism, the light emitted from the light emitting element can be effectively transmitted to the light receiving element. In a multi-channel optical coupling device, slits are provided at the top of the prism to divide each pair into pairs, and a reflective film is formed on the slits to prevent interference from external light and incidence from other light emitting elements.
第１図は従来例を示す側面図、第２図は本発明
による光結合装置の一実施例を示す拡大断面図、
第３図は本発明による光結合装置を多チヤンネル
方式に形成した場合の正面図、第４図は同上平面
図、第５図は同上側面図である。
３，１１……基板、４……半導体チツプ、５，
１６……極細線、６，１７，１８……電極、７，
１４，１４1，１４2，１４3……発光素子、８，
１５，１５1，１５2，１５3……受光素子、９…
…光結合装置、１９，２０……円孔、２１……樹
脂層、２２，２３……円孔１９，２０の小径部、
２４，２５……凸レンズ、２６，２７……空間
部、２８，３２……プリズム、２９，３０……斜
面、３１，３４……反射膜、３３……スリツト。
FIG. 1 is a side view showing a conventional example, and FIG. 2 is an enlarged sectional view showing an embodiment of the optical coupling device according to the present invention.
FIG. 3 is a front view of the optical coupling device according to the present invention formed in a multi-channel system, FIG. 4 is a plan view of the same, and FIG. 5 is a side view of the same. 3, 11...Substrate, 4...Semiconductor chip, 5,
16... extra fine wire, 6, 17, 18... electrode, 7,
14, 14 1 , 14 2 , 14 3 ... light emitting element, 8,
15, 15 1 , 15 2 , 15 3 ... light receiving element, 9...
...Optical coupling device, 19, 20... Circular hole, 21... Resin layer, 22, 23... Small diameter portion of circular hole 19, 20,
24, 25... Convex lens, 26, 27... Space, 28, 32... Prism, 29, 30... Slope, 31, 34... Reflective film, 33... Slit.
Claims (1)
受光素子を１個ずつ対として複数組を略一直線上
に搭載し、各対毎にそれぞれの発光素子と受光素
子間に光学的に結合するための屈折反射手段を設
け、この屈折反射手段は、該発光素子と受光素子
の各表面にそれぞれ保護を兼ねてモールドした透
明な合成樹指からなる凸レンズと、これら凸レン
ズ全体に臨設され、発光素子からの光を受光素子
へ反射する１個のプリズムとからなり、このプリ
ズムに、各１対の発光素子と受光素子毎に相隣る
他の１対と区切るための光の進行方向と略平行な
スリツトを形成し、これらのスリツトにそれぞれ
反射膜を形成してなる光結合装置。1. To directly mount a plurality of pairs of a light emitting element and a light receiving element on the same substrate of a hybrid integrated circuit in substantially a straight line, and optically coupling between each light emitting element and light receiving element for each pair. The refractive/reflective means includes a convex lens made of transparent synthetic resin molded on each surface of the light emitting element and the light receiving element for protection, and a convex lens provided over the entire convex lens. The prism consists of a prism that reflects the light of An optical coupling device in which slits are formed and reflective films are formed on each of these slits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP682381A JPS57121285A (en) | 1981-01-20 | 1981-01-20 | Light coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP682381A JPS57121285A (en) | 1981-01-20 | 1981-01-20 | Light coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121285A JPS57121285A (en) | 1982-07-28 |
| JPS6328351B2 true JPS6328351B2 (en) | 1988-06-08 |
Family
ID=11648931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP682381A Granted JPS57121285A (en) | 1981-01-20 | 1981-01-20 | Light coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121285A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0648884Y2 (en) * | 1987-05-14 | 1994-12-12 | ソニー株式会社 | Semiconductor device sealing structure |
| DE19610881B4 (en) * | 1995-12-07 | 2008-01-10 | Limo Patentverwaltung Gmbh & Co. Kg | Microsystem module |
| DE102006042806A1 (en) | 2006-09-08 | 2008-03-27 | Endress + Hauser Flowtec Ag | Opto-electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4893777U (en) * | 1972-02-15 | 1973-11-09 | ||
| JPS5320874U (en) * | 1976-08-02 | 1978-02-22 | ||
| JPS5357773U (en) * | 1976-10-18 | 1978-05-17 |
-
1981
- 1981-01-20 JP JP682381A patent/JPS57121285A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121285A (en) | 1982-07-28 |
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