JPS6329432B2 - - Google Patents
Info
- Publication number
- JPS6329432B2 JPS6329432B2 JP62065712A JP6571287A JPS6329432B2 JP S6329432 B2 JPS6329432 B2 JP S6329432B2 JP 62065712 A JP62065712 A JP 62065712A JP 6571287 A JP6571287 A JP 6571287A JP S6329432 B2 JPS6329432 B2 JP S6329432B2
- Authority
- JP
- Japan
- Prior art keywords
- envelope
- photoelectric
- optical
- optical connector
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は光電装置に係り、特に光伝送システム
に使用する発光装置及び受光装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a photoelectric device, and particularly to a light emitting device and a light receiving device used in an optical transmission system.
（従来の技術）
光伝送システムは低雑音、広帯域などすぐれた
特徴を有することから、通信、CATVはもちろ
ん自動車、オーデイオその他の民生機器の配線に
広く使用されるようになつてきた。(Prior Art) Optical transmission systems have excellent characteristics such as low noise and wide bandwidth, and have come to be widely used for wiring not only communication and CATV but also automobiles, audio, and other consumer equipment.
その一例を第１図により説明すると、送信側の
機器内の回路基板５には電気信号を忠実に光信号
に変換する波形整形器電流増幅器など（以下周辺
回路と云う）と、電気一光変換用のLED素子や
LD素子などの発光素子とがそれぞれ回路基板を
介して配線されるか、または発光素子と周辺回路
用IC素子または発光素子を含む周辺回路用IC素
子を組み込んだ発光装置１がリードフレーム２を
介して半田３により所定配線４に配線されてい
る。また受信側の機器内の回路基板１０には光信
号を忠実に電気信号に変換するPD素子、APD素
子などの受光素子と周辺回路がそれぞれ回路基板
を介して配線されるかまたは受光素子と周辺回路
用IC素子、または受光素子を含む周辺回路用IC
素子を組み込んだ受光装置６がリードフレーム７
を介して半田８により所定配線９に配線されてい
る。そしてこの発光装置１と受光装置６間は光フ
アイバコード１１の両端に取着された光コネクタ
１２に光結合を行ない、発光装置１で電気−光変
換を行なつた信号を受光装置６で光−電気変換を
行なうようになされている。 An example of this is explained with reference to FIG. 1. The circuit board 5 in the transmitting device includes a waveform shaper current amplifier (hereinafter referred to as peripheral circuit) that faithfully converts an electrical signal into an optical signal, and an electrical-to-optical converter. LED elements for
A light emitting element such as an LD element is wired via a circuit board, or a light emitting device 1 incorporating a light emitting element and a peripheral circuit IC element or a peripheral circuit IC element including a light emitting element is wired via a lead frame 2. It is wired to a predetermined wiring 4 with solder 3. In addition, on the circuit board 10 in the receiving device, a light receiving element such as a PD element or an APD element that faithfully converts an optical signal into an electric signal and peripheral circuits are wired via the circuit board, or the light receiving element and peripheral circuits are wired through the circuit board. IC elements for circuits or ICs for peripheral circuits including light receiving elements
The light receiving device 6 incorporating the element is attached to the lead frame 7.
It is wired to a predetermined wiring 9 via solder 8. The light emitting device 1 and the light receiving device 6 are optically coupled to each other through optical connectors 12 attached to both ends of an optical fiber cord 11, and the signal converted from electricity to light by the light emitting device 1 is sent to the light receiving device 6 as an optical signal. - adapted to perform electrical conversion;
このような光コネクタ１２を光電装置１，６に
結合するとき、光コネクタ１２に保持された光フ
アイバコード１１が第１の外囲器２２に接触し、
損傷を生ずることがある。 When such an optical connector 12 is coupled to a photoelectric device 1, 6, the optical fiber cord 11 held by the optical connector 12 contacts the first envelope 22,
May cause damage.
（発明が解決しようとする問題点）
本発明は上記のような欠点を除去するもので、
結合効率よく、傷の発生しない光電装置を提供す
ることを目的とする。(Problems to be solved by the invention) The present invention eliminates the above-mentioned drawbacks.
The purpose of the present invention is to provide a photoelectric device that has good coupling efficiency and does not cause scratches.
（問題点を解決するための手段）
本発明の光電装置においては、第１の外囲器は
光電素子の光コネクタの対向部において、光コネ
クタの先端部の外径よりも径が小さい凹部を設
け、この凹部内にはこの凹部の深さよりも高さの
低い凸部を有するように構成される。
(Means for Solving the Problems) In the photoelectric device of the present invention, the first envelope has a concave portion having a smaller diameter than the outer diameter of the tip of the optical connector at the opposing portion of the optical connector of the photoelectric element. The recess is provided with a convex portion having a height lower than the depth of the recess.
（作用）
本発明の光電装置において、第１の外囲器に設
けられた凹部における凸部のレンズ作用によつて
光電素子と光フアイバとの結合効率が高くなり、
かつ、上記凹部が形成されているので光コネクタ
を光電装置に結合した場合、光フアイバコードの
端面と凹部に設けられた凸部とが接触することが
防止でき、両者に傷が発生することがなく、高い
結合効率を維持することができる。(Function) In the photoelectric device of the present invention, the coupling efficiency between the photoelectric element and the optical fiber is increased by the lens action of the convex portion in the concave portion provided in the first envelope.
In addition, since the recess is formed, when the optical connector is coupled to a photoelectric device, the end face of the optical fiber cord and the protrusion provided in the recess can be prevented from coming into contact with each other, and damage to both can be prevented. high coupling efficiency can be maintained.
（実施例）
光電素子と光フアイバコードとの結合効率が高
く、光コネクタにおける光フアイバ端面に傷の発
生し難い本発明の光電装置について次に説明す
る。すなわち第２図及び第３図により、この発明
に係る光電装置である発光装置１、受光装置６の
構造、及びこれに装着される光フアイバコード１
１の端部に設けられた光コネクタの構造を説明す
る。図中第１図と同一符号は同一部分を示す。(Embodiment) Next, a photoelectric device of the present invention will be described in which the coupling efficiency between the photoelectric element and the optical fiber cord is high and the end face of the optical fiber in the optical connector is less likely to be damaged. That is, FIGS. 2 and 3 show the structures of the light emitting device 1 and the light receiving device 6, which are photoelectric devices according to the present invention, and the optical fiber cord 1 attached thereto.
The structure of the optical connector provided at the end of 1 will be explained. In the figure, the same reference numerals as in FIG. 1 indicate the same parts.
即ち発光または受光用の光電素子２１は通常透
明なエポキシ樹脂などのモールド体からなる第１
の外囲器２２内にリードフレーム２，７の一部と
共に埋設されている。この第１の外囲器２２の外
側には光コネクタ１２を介して光フアイバコード
１１のフアイバ１１1の光学研摩された端面１１
ａと、光電素子２１とが光結合する部分を除いて
光遮蔽部材からなるモールド体からなる第２の外
囲器２３が設けられ、この第２の外囲器には一面
に例えば４本のリードフレーム２，７が突出され
ており、この面とほぼ直角な面には光コネクタ１
２を保持する保持部２４が設けられている。また
光コネクタ１２は、光フアイバコード１１の端部
にほぼ円柱状の本体１３の軸に沿つて光フアイバ
コード１１及びフアイバ１１1が挿入される孔部
を有し所定位置に一体形成されたフランジ１４及
び保持部２４に嵌着する係止部１５を有してな
り、さらに光コネクタ１２の後端部にはこの光コ
ネクタ１２と光フアイバコードとを固定するかし
めリング１６が嵌着されている。 That is, the photoelectric element 21 for emitting or receiving light is usually made of a first molded body made of transparent epoxy resin or the like.
The lead frames 2 and 7 are embedded in an envelope 22 together with a portion of the lead frames 2 and 7. The optically polished end face 11 of the fiber 11 1 of the optical fiber cord 11 is connected to the outside of the first envelope 22 via the optical connector 12 .
A second envelope 23 made of a molded body made of a light shielding member is provided except for the portion where the photoelectric element 21 and the photoelectric element 21 are optically coupled. Lead frames 2 and 7 are protruded, and an optical connector 1 is mounted on a surface substantially perpendicular to this surface.
A holding section 24 for holding 2 is provided. Further, the optical connector 12 has a hole at the end of the optical fiber cord 11 along the axis of the substantially cylindrical main body 13 into which the optical fiber cord 11 and the fiber 11 1 are inserted, and a flange integrally formed at a predetermined position. 14 and a locking part 15 that fits into the holding part 24, and a caulking ring 16 that fixes the optical connector 12 and the optical fiber cord is fitted to the rear end of the optical connector 12. .
そして第１の外囲器２２には、光電素子２１の
光コネクタ１２との対向部において光コネクタ１
２の先端部の外径よりも径の小さい凹部２２1を
形成するとともに、この凹部２２1内にこの凹部
の深さよりも高さの低い凸部２２2を有している。
このような構成であるので、光コネクタ１２を光
電装置１，６に結合したとき、光フアイバコード
の端面と凹部内に形成された凸部とが接触するこ
とが防止でき、両者に傷が発生することなく、
又、凸部のレンズ作用により光電素子と光フアイ
バとの高い結合効率を維持することができる。 The first envelope 22 includes an optical connector 1 at a portion of the photoelectric element 21 facing the optical connector 12.
A concave portion 22 1 having a diameter smaller than the outer diameter of the tip end of the concave portion 22 1 is formed, and a convex portion 22 2 having a height lower than the depth of the concave portion is provided within the concave portion 22 1 .
With this configuration, when the optical connector 12 is connected to the photoelectric devices 1 and 6, it is possible to prevent the end face of the optical fiber cord from coming into contact with the protrusion formed in the recess, thereby preventing damage to both. without doing,
In addition, the lens effect of the convex portion makes it possible to maintain high coupling efficiency between the photoelectric element and the optical fiber.
更に、光コネクタの端面を第１の外囲器に当接
するようにすることによつて、異なる光コネクタ
を用いた場合でも、光フアイバコードの端面と凸
部との間隔を一定に保つことができ、ばらつきの
ない光結合が実現できる。 Furthermore, by bringing the end face of the optical connector into contact with the first envelope, the distance between the end face of the optical fiber cord and the convex portion can be maintained constant even when different optical connectors are used. It is possible to achieve uniform optical coupling.
次に第４図及び第５図により本発明の光電装置
の他の実施例を説明する。図中光フアイバコー
ド、光コネクタ、リードフレームなどは上記実施
例とほぼ同一なので同一符号を使用し、特に説明
は行なわない。 Next, another embodiment of the photoelectric device of the present invention will be described with reference to FIGS. 4 and 5. In the drawings, the optical fiber cord, optical connector, lead frame, etc. are almost the same as in the above embodiment, so the same reference numerals are used and no particular explanation will be given.
即ち光電装置１，６は発光または受光用の光電
素子または光電素子と周辺回路用IC素子または
光電素子を含む周辺回路用IC素子（以下単に光
電素子と云う）４１を所定のリードフレーム２，
７上に載置配線し、このリードフレーム２，７の
一部と光電素子４１を埋設するように透明なエポ
キシ樹脂などのモールド体からなる第１の外囲器
４２を形成し、この第１の外囲器４２の外側にモ
ールド成形または固着され、その一部に光コネク
タとのスナツプインにより光結合を行なう保持部
４４を有する導電性部材からなる第２の外囲器４
３からなる。この第２の外囲器４３のリードフレ
ーム２，７の出口には光遮断および固着を兼ねた
不透明接着剤層４５を設けると共にこれらリード
フレーム２，７の形成する平面とは離間した位置
にこの第２の外囲器４３に植設されたピン４６を
回路基板５，１０を介して接地回路４ａ，９ａに
半田３ａ，８ａにより固定し得るようになされて
いる。また第２の外囲器はリードフレーム２，７
との電気的接触およびリードフレーム切断部の形
状不ぞろいによる発光・受光素子の位置精度の悪
化を防ぐため凹部５０を有している。 That is, the photoelectric devices 1 and 6 include a photoelectric element for emitting or receiving light, or a photoelectric element, and an IC element for a peripheral circuit, or an IC element for a peripheral circuit (hereinafter simply referred to as a photoelectric element) 41 including a photoelectric element, on a predetermined lead frame 2,
A first envelope 42 made of a molded body of transparent epoxy resin or the like is formed so as to bury parts of the lead frames 2 and 7 and the photoelectric element 41. A second envelope 4 made of a conductive member is molded or fixed on the outside of the envelope 42, and has a holding portion 44 on a part of which performs optical coupling by snap-in with an optical connector.
Consists of 3. At the exits of the lead frames 2 and 7 of this second envelope 43, an opaque adhesive layer 45 is provided which also serves as light shielding and fixing. The pins 46 implanted in the second envelope 43 can be fixed to the ground circuits 4a, 9a via the circuit boards 5, 10 with solders 3a, 8a. Further, the second envelope includes lead frames 2 and 7.
The recess 50 is provided to prevent deterioration of positional accuracy of the light emitting/light receiving element due to electrical contact with the lead frame and uneven shape of the cut portion of the lead frame.
この第２の外囲器４３の材料としては例えば炭
素を含有させたプラスチツク成形物があり、この
炭素の含有量によりある程度任意に電導率をコン
トロールすることが可能であるし、しかも成形前
の樹脂材料に炭素を混ぜておくだけでよく、作業
的には簡便である。勿論炭素のかわりに金属粉末
その他導電性を上げるものであれば良く、さらに
作業性を考えれば金属のモールドその他作業性の
よい方法で成形してもよい。ピン４６は細い銅線
で充分であり、第２の外囲器４３との電気的接触
は導電性接着剤圧入でもよいし、第２の外囲器４
３の成形時に突起として形成してもよい。 The material of the second envelope 43 is, for example, a plastic molded product containing carbon, and the electrical conductivity can be controlled to a certain degree depending on the carbon content. It is easy to work as it only requires mixing carbon with the materials. Of course, carbon may be replaced with metal powder or other material that increases conductivity, and if workability is considered, metal molding or other methods with good workability may be used. A thin copper wire is sufficient for the pin 46, and electrical contact with the second envelope 43 may be made by press-fitting a conductive adhesive, or
3 may be formed as a protrusion during molding.
前記実施例の変形例としては作業性は多少落ち
るがリードフレーム２，７のうちの接地リードを
折りまげて第２の外囲器４３内を通り他のリード
フレーム２，７の形成する平面から離間した位置
から出すようにしてもよい。またピン４６は金属
性ねじなどでも良いし、リードフレーム２，７と
同程度の太さのピンまたは突起にしてもよく、一
般に回路基板５，１０として使用されているPC
ボードや電気コネクタが使えるようにすることも
可能である。 As a modification of the above embodiment, the ground leads of the lead frames 2 and 7 are bent and passed through the second envelope 43 from the plane formed by the other lead frames 2 and 7, although the workability is somewhat lowered. It may be made to come out from a spaced apart position. Further, the pin 46 may be a metal screw or the like, or may be a pin or protrusion with the same thickness as the lead frames 2 and 7.
It is also possible to use boards and electrical connectors.
また第２の外囲器４３は一体部品で作られてい
る必要はなく、分割形成してもよく、分割されて
いる場合はそのすべてが導電性材料である必要も
ない。即ち例えば光電素子４１を含む第１の外囲
器４２の一部または全域にわたつて導電材料から
なる部品が固持され、この部品と接触して固着さ
れた導電性ピンを回路基板の接地配線に固着すれ
ばよい。さらに発光装置・受光装置と光フアイバ
コードとの光結合は必ずしも光コネクタを使用せ
ずに直接第２の外囲器４３と光フアイバコードを
固着するような構造にしても良いことは勿論であ
る。 Further, the second envelope 43 does not need to be made of an integral part, and may be formed by dividing it, and if it is divided, it is not necessary that all of the parts are made of conductive material. That is, for example, a component made of a conductive material is fixed over a part or the entire area of the first envelope 42 including the photoelectric element 41, and a conductive pin that is fixed in contact with this component is connected to the ground wiring of the circuit board. It should just stick. Furthermore, it goes without saying that the optical coupling between the light emitting device/light receiving device and the optical fiber cord does not necessarily require the use of an optical connector, but may be structured such that the second envelope 43 and the optical fiber cord are directly fixed. .
以上述べたように、本発明の光電装置によれ
ば、光電素子と光フアイバコードとの結合効率が
高く、また光フアイバコード端面に傷の発生し難
い光電装置を提供することができる。
As described above, according to the photoelectric device of the present invention, it is possible to provide a photoelectric device in which the coupling efficiency between the photoelectric element and the optical fiber cord is high, and the end face of the optical fiber cord is less likely to be damaged.
第１図は光伝送回路を示す説明図、第２図は光
電装置、光フアイバケーブル及び光コネクタの関
係の一例を示す断面図、第３図は第２図の光電装
置の底面図、第４図及び第５図は本発明の光電装
置の一実施例を示す図であり、第４図は光電装
置、光フアイバケーブル及び光コネクタの関係の
一例を示す断面図、第５図は第４図の光電装置の
底面図である。
１……発光装置、６……受光装置、２，７……
リードフレーム、１２……光コネクタ、２１，４
１……光電素子、２２，４２……第１の外囲器、
２３，４３……第２の外囲器、４６……ピン。
Fig. 1 is an explanatory diagram showing an optical transmission circuit, Fig. 2 is a cross-sectional view showing an example of the relationship between a photoelectric device, an optical fiber cable, and an optical connector, Fig. 3 is a bottom view of the photoelectric device in Fig. 2, and Fig. 4 is an explanatory diagram showing an optical transmission circuit. 5 and 5 are diagrams showing one embodiment of the photoelectric device of the present invention, FIG. 4 is a cross-sectional view showing an example of the relationship between the photoelectric device, the optical fiber cable, and the optical connector, and FIG. FIG. 3 is a bottom view of the photoelectric device. 1... Light emitting device, 6... Light receiving device, 2, 7...
Lead frame, 12... Optical connector, 21, 4
1... Photoelectric element, 22, 42... First envelope,
23, 43...second envelope, 46...pin.
Claims (1)
に接続されたリードフレームの一部を保持する第
１の外囲器と、この第１の外囲器を収容する外囲
器であつて、前記光電素子との光結合を行なう光
フアイバを内部に保持した光コネクタの保持部を
有する第２の外囲器とを備えた光電装置におい
て、 前記第１の外囲器は、前記光電素子の前記光コ
ネクタとの対向部において前記光コネクタの先端
部の外径よりも径が小さい凹部を有するととも
に、この凹部内にこの凹部の深さよりも高さが低
い凸部を有することを特徴とする光電装置。[Claims] 1. A first envelope that holds a photoelectric element for emitting or receiving light and a part of a lead frame that is electrically connected to the photoelectric element, and an outer housing that houses the first envelope. a second envelope having a holding part for an optical connector that holds an optical fiber therein for optical coupling with the photoelectric element; has a concave portion having a diameter smaller than the outer diameter of the tip of the optical connector at a portion of the photoelectric element facing the optical connector, and a convex portion having a height lower than the depth of the concave portion within the concave portion. A photoelectric device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62065712A JPS62229885A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62065712A JPS62229885A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6236081A Division JPS57177580A (en) | 1981-04-27 | 1981-04-27 | Device for light emission and detection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62229885A JPS62229885A (en) | 1987-10-08 |
| JPS6329432B2 true JPS6329432B2 (en) | 1988-06-14 |
Family
ID=13294905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62065712A Granted JPS62229885A (en) | 1987-03-23 | 1987-03-23 | Photoelectric apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62229885A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54134992A (en) * | 1978-04-12 | 1979-10-19 | Toshiba Corp | Semiconductor device |
-
1987
- 1987-03-23 JP JP62065712A patent/JPS62229885A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62229885A (en) | 1987-10-08 |
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