JPS6330795B2 - - Google Patents
Info
- Publication number
- JPS6330795B2 JPS6330795B2 JP12004882A JP12004882A JPS6330795B2 JP S6330795 B2 JPS6330795 B2 JP S6330795B2 JP 12004882 A JP12004882 A JP 12004882A JP 12004882 A JP12004882 A JP 12004882A JP S6330795 B2 JPS6330795 B2 JP S6330795B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- board
- hole
- electrodes
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は材質の異なる二枚の基板の一方に設け
た透孔に他方の電極部分を挿入して半田付により
結合する基板接続装置に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a board connecting device that connects two boards made of different materials by inserting the electrode portion of the other board into a through hole provided in one of the boards and bonding the other board by soldering. .
従来例の構成とその問題点
第１図に示すようにセラミツク基板１の端部に
銀パラジウムによる電極２を設け、これを第２図
に示すように普通の紙・フエノール積層板による
プリント基板３の透孔に挿入し、裏面で半田付を
している。この半田付はデツプ半田方法によつて
行う。この場合、デツプ半田による急激な熱変化
によつて半田付部分にクラツクが発生する欠点が
ある。このクラツクは基板１と３の熱膨張係数が
異るために発生するものである。Structure of the conventional example and its problems As shown in FIG. 1, an electrode 2 made of silver and palladium is provided at the end of a ceramic substrate 1, and as shown in FIG. 2, a printed circuit board 3 made of an ordinary paper/phenol laminate It is inserted into the through hole and soldered on the back side. This soldering is performed by the deep soldering method. In this case, there is a drawback that cracks occur in the soldered portion due to rapid thermal changes caused by the deep solder. This crack occurs because the coefficients of thermal expansion of the substrates 1 and 3 are different.
発明の目的
本発明は熱膨張係数が異る基板を接続する場合
であつても、半田付部分にクラツクが生じること
がない基板接続装置を提供しようとするものであ
る。OBJECTS OF THE INVENTION The present invention aims to provide a board connecting device that does not cause cracks in the soldered portion even when boards having different coefficients of thermal expansion are connected.
発明の構成
本発明は第１の基板の両面の端部にそれぞれ電
極を設け、耐熱性および弾力性を有する絶縁板を
上記電極を設けた部分を覆うようにＵ字状に形成
し、この絶縁板の上記電極と対向する部分にスル
ーホール電極を形成し、このスルーホール電極の
上記電極に対向する部分あるいは上記電極に半田
よりも溶融温度が高い金属を設けて、この金属に
より上記電極と上記スルーホール電極とを固着
し、上記第１の基板と異なる材質によつて作られ
た第２のプリント基板の透孔に上記第１の基板の
上記絶縁板を取付けた部分を挿入し、上記第２の
プリント基板の裏面の銅箔と上記スルーホール電
極とを半田付けしたものであり、絶縁板がクツシ
ヨン材となつて急激な熱変化があつても半田付部
分にクラツクが発生することがないものである。Structure of the Invention The present invention provides electrodes at the ends of both sides of a first substrate, and forms an insulating plate having heat resistance and elasticity into a U-shape so as to cover the portion where the electrodes are provided. A through-hole electrode is formed in a portion of the plate facing the above-mentioned electrode, and a metal having a higher melting temperature than the solder is provided on the portion of the through-hole electrode facing the above-mentioned electrode or on the above-mentioned electrode, and this metal allows the connection between the above-mentioned electrode and the above-mentioned electrode. A through hole electrode is fixed to the second printed circuit board, and the part of the first board to which the insulating plate is attached is inserted into the through hole of a second printed board made of a material different from that of the first board. The copper foil on the back side of the printed circuit board (No. 2) and the through-hole electrode are soldered together, and the insulating plate acts as a cushioning material, so even if there is a sudden change in heat, no cracks will occur in the soldered part. It is something.
実施例の説明
以下本発明の実施例について図面を参照して説
明する。DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第３図〜第５図に示すように、セラミツク基板
４の両面の端部に銀パラジウム等による電極５
ａ，５ｂを設ける。この電極５ａ，５ｂを覆うよ
うにポリイミド等の耐熱性があつて弾力性のある
絶縁板６をＵ字状に形成し、この絶縁板６の電極
５ａ，５ｂと相対向する部分にスルーホール電極
を７ａ，７ｂを設ける。このスルーホール電極７
ａ，７ｂの上記電極５ａ，５ｂと対向する部分に
半田よりも溶融温度が高い金属たとえばスズを設
け、これを用いて電極５ａ，５ｂにスルーホール
電極７ａ，７ｂを熱圧着する。このように構成し
たものを紙・フエノール積層板等のプリント基板
８に設けた透孔９に挿入し、プリント基板８の裏
面で銅箔１０と半田１１により接続する。 As shown in FIGS. 3 to 5, electrodes 5 made of silver-palladium or the like are attached to the ends of both sides of the ceramic substrate 4.
a and 5b are provided. A heat-resistant and elastic insulating plate 6 made of polyimide or the like is formed in a U-shape to cover the electrodes 5a, 5b, and through-hole electrodes are formed in the portions of the insulating plate 6 facing the electrodes 5a, 5b. 7a and 7b are provided. This through-hole electrode 7
A metal having a higher melting temperature than solder, such as tin, is provided at the portions of a and 7b facing the electrodes 5a and 5b, and is used to bond the through-hole electrodes 7a and 7b to the electrodes 5a and 5b by thermocompression. The structure thus constructed is inserted into a through hole 9 provided in a printed circuit board 8 such as a paper/phenol laminate, and connected to a copper foil 10 on the back surface of the printed circuit board 8 by solder 11.
このように構成すれば絶縁材６がクツシヨン材
となるので、デイツプ半田によつて半田付をし
て、急激な熱変化が起つても半田付部分にクラツ
クが生じることはない。また、スルーホール電極
７ａ，７ｂはスズ等で電極５ａ，５ｂに接続され
ているので半田付時に電極５ａ，５ｂと電極７
ａ，７ｂ部分が外れることはないものである。絶
縁板６はポリイミド等の耐熱性のものを用いてい
るので半田付時に絶縁板６が破壊されることはな
いものである。 With this structure, the insulating material 6 serves as a cushioning material, so that cracks will not occur in the soldered portion even when soldering is performed using dip soldering and sudden thermal changes occur. Also, since the through-hole electrodes 7a, 7b are connected to the electrodes 5a, 5b with tin or the like, the electrodes 5a, 5b and the electrode 7 are connected to each other during soldering.
Parts a and 7b will not come off. Since the insulating plate 6 is made of a heat-resistant material such as polyimide, the insulating plate 6 will not be destroyed during soldering.
発明の効果
以上のように本発明によればクツシヨン材とな
る絶縁板を介して第１の基板が第２の基板の透孔
に挿入されて半田付されるので、半田付時の熱に
よつて半田付部分にクラツクが生じることがない
ものである。Effects of the Invention As described above, according to the present invention, the first board is inserted into the through hole of the second board through the insulating plate serving as the cushion material and soldered. Therefore, cracks will not occur in the soldered parts.
第１図は従来例における基板接続装置の基板の
平面図、第２図は同装置の断側面図、第３図は本
発明の一実施例における基板接続装置の基板の断
側面図、第４図は同装置の断側面図、第５図は同
装置に用いる基板の平面図である。
４……第１の基板、５ａ，５ｂ……電極、７
ａ，７ｂ……スルーホール電極、６……絶縁板、
８……第２の基板、９……透孔、１０……銅箔、
１０……半田。
FIG. 1 is a plan view of a board of a board connecting device in a conventional example, FIG. 2 is a cross-sectional side view of the same device, FIG. 3 is a cross-sectional side view of a board of a board connecting device in an embodiment of the present invention, and FIG. The figure is a cross-sectional side view of the same device, and FIG. 5 is a plan view of a substrate used in the same device. 4...First substrate, 5a, 5b...Electrode, 7
a, 7b...Through hole electrode, 6...Insulating plate,
8... Second substrate, 9... Through hole, 10... Copper foil,
10...Solder.
Claims (1)
け、耐熱性および弾力性を有する絶縁板を上記電
極を設けた部分を覆うようにＵ字状に形成し、こ
の絶縁板の上記電極と対向する部分にスルーホー
ル電極を形成し、このスルーホール電極の上記電
極に対向する部分あるいは上記電極に半田よりも
溶融温度が高い金属を設けて、この金属により上
記電極と上記スルーホール電極とを固着し、上記
第１の基板と異なる材質によつて作られた第２の
プリント基板の透孔に上記第１の基板の上記絶縁
板を取付けた部分を挿入し、上記第２のプリント
基板の裏面の銅箔と上記スルーホール電極と半田
付けした基板接続装置。1 Electrodes are provided at the ends of both sides of the first substrate, an insulating plate having heat resistance and elasticity is formed in a U-shape so as to cover the part where the electrodes are provided, and the electrodes of this insulating plate and A through-hole electrode is formed in opposing parts, and a metal having a higher melting temperature than solder is provided on the part of the through-hole electrode facing the above-mentioned electrode or on the above-mentioned electrode, and this metal connects the above-mentioned electrode and the above-mentioned through-hole electrode. The part of the first board to which the insulating plate is attached is inserted into the through hole of a second printed board made of a material different from that of the first board, and the part of the second printed board is fixed. Board connection device soldered to the copper foil on the back side and the above through-hole electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57120048A JPS5910297A (en) | 1982-07-09 | 1982-07-09 | Board connection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57120048A JPS5910297A (en) | 1982-07-09 | 1982-07-09 | Board connection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5910297A JPS5910297A (en) | 1984-01-19 |
| JPS6330795B2 true JPS6330795B2 (en) | 1988-06-21 |
Family
ID=14776599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57120048A Granted JPS5910297A (en) | 1982-07-09 | 1982-07-09 | Board connection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5910297A (en) |
-
1982
- 1982-07-09 JP JP57120048A patent/JPS5910297A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5910297A (en) | 1984-01-19 |
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