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JPS63310B2 - - Google Patents
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JPS63310B2 - - Google Patents

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Publication number
JPS63310B2
JPS63310B2 JP58019456A JP1945683A JPS63310B2 JP S63310 B2 JPS63310 B2 JP S63310B2 JP 58019456 A JP58019456 A JP 58019456A JP 1945683 A JP1945683 A JP 1945683A JP S63310 B2 JPS63310 B2 JP S63310B2
Authority
JP
Japan
Prior art keywords
wear
alloy
ceramics
hopper
resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58019456A
Other languages
Japanese (ja)
Other versions
JPS59152190A (en
Inventor
Manabu Iwata
Koji Kamata
Mitsunobu Kora
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KAWASO DENZAI KOGYO KK
Original Assignee
KAWASO DENZAI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KAWASO DENZAI KOGYO KK filed Critical KAWASO DENZAI KOGYO KK
Priority to JP58019456A priority Critical patent/JPS59152190A/en
Publication of JPS59152190A publication Critical patent/JPS59152190A/en
Publication of JPS63310B2 publication Critical patent/JPS63310B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 (A) 〔産業上の利用分野〕 本発明は、鉱石等が投入されるホツパー等の内
壁面の、耐摩耗部材に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (A) [Field of Industrial Application] The present invention relates to a wear-resistant member for the inner wall surface of a hopper or the like into which ore and the like are charged.

(B) 〔従来の技術〕 従来鉱石等が投入されるポツパーは、通常鉄板
等で作られているが、鉱石等の投入時の摩擦によ
る摩耗が激しく、しばしば補修や取り替えを余儀
なくされた。
(B) [Conventional technology] Conventional potspars into which ore, etc. are introduced are usually made of iron plates, etc., but they suffer from severe wear due to friction when ore, etc. is introduced, and often have to be repaired or replaced.

その間設備の休止やメンテナンスに人手を要
し、作業効率の低下や、修繕費を要する等の不都
合があつた。
During this time, equipment shutdowns and maintenance required manpower, resulting in inconveniences such as decreased work efficiency and increased repair costs.

この摩耗の防止法として、摩耗部に特殊鋼を溶
接する等の方法も考えられるが、価格の割には耐
用命数を大きく伸ばすことはできなかつた。
As a method to prevent this wear, methods such as welding special steel to the worn parts have been considered, but considering the cost, it has not been possible to significantly extend the service life.

また、金属基板上にセラミツクスを樹脂接着剤
により接着する等の方法も用いられたが、樹脂接
着の場合は、経年劣化や熱膨張差による剥離が避
けられず、更に使用温度も低く抑制される等の不
都合があつた。
Methods such as bonding ceramics onto metal substrates using resin adhesives have also been used, but with resin bonding, deterioration over time and peeling due to differences in thermal expansion are inevitable, and the operating temperature is also kept low. There were other inconveniences.

更に、セラミツクスにモリブデンマンガン法等
によりメタライズして、これを金属基板に銀ろう
付け接合した板を、ホツパーの摩耗面に溶接や、
ボルト止めする等の方法も考えられるが、この場
合は高温の雰囲気炉を必要とし、設備費が高く製
作手数も多く要し、コスト高となる他、 ホツパー等の場合、形体も大型であるため、耐
摩耗用の金属基板自体もある程度大型とすること
が、使用上枚数も少なくてすみ、取扱い上望まし
いが、セラミツクスと金属基板をメタライズ接合
する場合、従来行なわれている、モリブデンマン
ガン法等高温によるメタライズ接合においては、
両者の熱膨張差による応力の影響が大きく、大形
のセラミツクスの場合応力割れや、残留応力を生
じやすく、接合も困難であつた。
Furthermore, a plate made by metallizing ceramics using a molybdenum manganese method or the like and bonding this to a metal substrate by silver brazing is welded to the worn surface of the hopper.
Methods such as bolting may also be considered, but in this case, a high-temperature atmosphere furnace is required, which requires high equipment costs and many manufacturing steps, resulting in high costs. It is preferable to make the wear-resistant metal substrate itself somewhat large, since the number of sheets used is small, and it is preferable for handling purposes. In metallized bonding by
The influence of stress due to the difference in thermal expansion between the two is large, and large ceramics tend to cause stress cracks and residual stress, making joining difficult.

仮に出来るとしても製作困難度が高いため、コ
スト的に高価となり実用的でなかつた。
Even if it were possible, it would be difficult to manufacture and would be expensive and impractical.

(C) 〔発明が解決しようとする問題点〕 本発明は、以上のような耐摩耗性、経年劣化、
低使用温度、およびセラミツクスを使用する場合
の応力割れや残留応力、並びに製作の困難性等の
諸問題や、経済性の問題等を解決して、 極めて耐摩耗性よく、耐劣化で使用可能温度も
高く、かつ、セラミツクスの残留応力の影響も少
なく、しかも経済的に、使用ニーズを満足する、
ホツパー用耐摩耗基板を提供しようとするもので
ある。
(C) [Problems to be solved by the invention] The present invention solves the above-mentioned problems such as wear resistance, aging deterioration,
By solving problems such as low operating temperatures, stress cracking, residual stress, and manufacturing difficulties when using ceramics, as well as economical issues, it has extremely high wear resistance, is resistant to deterioration, and has a usable temperature. It has a high resistance to stress, is less affected by the residual stress of ceramics, and is economical, satisfying the needs of use.
The present invention aims to provide a wear-resistant substrate for a hopper.

(D) 〔問題を解決するための手段〕 第1図に示すように、Zn合金等の低温溶融の
溶融合金1中で、超音波振動加振によりメタライ
ズしたセラミツクス板3のメタライズ面6を、裏
面に取付部4を設けた金属基板5の摩耗面に、低
温溶融合金1により一体に接合して、金属基板5
の摩耗面に、セラミツクス3を複合して、耐摩耗
性を大きく向上したポツパー用耐摩耗基板であ
る。
(D) [Means for solving the problem] As shown in Fig. 1, the metallized surface 6 of a ceramic plate 3 metalized by ultrasonic vibration excitation in a low-temperature molten alloy 1 such as a Zn alloy, The metal substrate 5 is integrally joined with the low temperature melting alloy 1 to the worn surface of the metal substrate 5 which has the mounting portion 4 provided on the back side.
This is a wear-resistant substrate for poppers that has significantly improved wear resistance by combining Ceramics 3 on the wear surface.

即ち、Zn合金またはPb合金、例えば95Zn−
5Alなどの低温溶融の溶融合金1中に挿入した超
音波振動子2に、例えばアルミナやジルコニア等
の耐摩耗性のよいセラミツクス板3を載置して、
超音波振動子2に1KW、18KHzの超音波振動を
加振することにより、セラミツクス3と溶融合金
1との接触面がキヤビテーシヨンにより、液相−
固相界面反応が促進されて、セラミツクス3の溶
融合金1との接触面が低温溶融合金によりメタラ
イズされる。
That is, Zn alloy or Pb alloy, e.g. 95Zn−
A ceramic plate 3 having good wear resistance, such as alumina or zirconia, is placed on an ultrasonic vibrator 2 inserted into a low-temperature melting alloy 1 such as 5Al.
By applying ultrasonic vibrations of 1KW and 18KHz to the ultrasonic vibrator 2, the contact surface between the ceramics 3 and the molten alloy 1 undergoes cavitation to form a liquid phase.
The solid-phase interfacial reaction is promoted, and the contact surface of the ceramics 3 with the molten alloy 1 is metalized by the low-temperature molten alloy.

この場合Zn合金またはPb合金の何れを使用す
るかは、ホツパー用耐摩耗金属の使用温度条件等
を勘案して適当な低温溶融合金を使用すればよ
い。
In this case, whether to use a Zn alloy or a Pb alloy may be determined by taking into consideration the operating temperature conditions of the wear-resistant metal for the hopper, and selecting an appropriate low-temperature melting alloy.

次に第2図に示すように、例えば取付ボルト4
を下面に有する金属基板5を、溶融合金1の融点
近くに予熱しておき、これに前記したセラミツク
ス3のメタライズ面6を溶融状態で載せて、一挙
に接合する。この場合要すれば接合面にフラツク
スを併用して接合を容易にする。
Next, as shown in FIG.
A metal substrate 5 having a lower surface thereof is preheated to near the melting point of the molten alloy 1, and the metallized surface 6 of the ceramic 3 described above is placed in a molten state on this and bonded at once. In this case, if necessary, flux is also used on the joining surfaces to facilitate joining.

また金属基板5を予め溶融亜鉛メツキ等を施し
ておき、前記した超音波振動によりメタライズし
たセラミツクス3を接合すれば、非常に良好な接
合ができ、温度的、機械強度的、防錆的に優れた
ホツパー用耐摩耗基板を得ることができる。
Furthermore, if the metal substrate 5 is subjected to hot-dip galvanizing or the like in advance, and the metalized ceramics 3 are bonded using the above-mentioned ultrasonic vibration, a very good bond can be obtained, and it is excellent in terms of temperature, mechanical strength, and rust prevention. A wear-resistant substrate for a hopper can be obtained.

なお、金属基板5の取付部は取付ボルト4によ
るボルト止め構造の他、取付ボルト4に代わる取
付棒による溶接構造、あるいは取付棒の尖端部を
圧縮止めする構造等とすることができる。
The mounting portion of the metal substrate 5 may have a bolted structure using the mounting bolts 4, a welded structure using a mounting rod instead of the mounting bolt 4, or a structure in which the tip of the mounting rod is compressed.

(E) 〔発明の効果〕 本発明の効果について述べると、まず本発明に
おいては、Zn合金等の低溶融点の溶融合金中で、
超音波振動加振によりセラミツクス3の接合面に
メタライズを施し、このメタライズ面を、裏面に
取付部を設けた金属基板に、低溶融点の溶融合金
により一体に接合して、摩耗面にセラミツクス3
を複合したことにより、耐摩耗性が非常に高く、
しかも接合が各部均一強固で、樹脂で接合した場
合に比し、接合部が長期間の使用にも経年劣化等
により剥離に至ることがない。
(E) [Effects of the Invention] To describe the effects of the present invention, first, in the present invention, in a molten alloy with a low melting point such as a Zn alloy,
The bonding surface of the ceramics 3 is metallized by ultrasonic vibration excitation, and this metallized surface is integrally bonded to a metal substrate with a mounting part on the back side using a molten alloy with a low melting point, and the ceramics 3 is attached to the worn surface.
By combining these, it has extremely high wear resistance,
In addition, the bonding is uniform and strong at all parts, and the bonded parts will not peel off due to aging deterioration even after long-term use, compared to when bonded with resin.

また、使用温度も樹脂に比して高く、例えばセ
ラミツクス3にZn合金の95Zn−5Alを使用する場
合は融解温度も382℃で、相当高温条件下での使
用を可能とするものである。。
Further, the operating temperature is also higher than that of resin. For example, when Zn alloy 95Zn-5Al is used for the ceramic 3, the melting temperature is 382°C, making it possible to use it under considerably high temperature conditions. .

しかも、摩耗面が全面的に均一にセラミツクス
と複合化されているので、鉱石等の衝撃に対して
もセラミツクス3の破損欠落を生ずることなく、
長期間の使用に良く耐えるものである。
Moreover, since the wear surface is uniformly composited with ceramics over the entire surface, the ceramics 3 will not break or break even when subjected to impact from ores, etc.
It can withstand long-term use.

次に本発明の場合は、メタライズ温度もモリブ
デンマンガン法の千数百℃に比し、500℃程度以
下と低いため、セラミツクスと金属の熱膨張差に
よるセラミツクスへの熱応力の影響が少ない。
Next, in the case of the present invention, the metallization temperature is also low at about 500° C. or less, compared to the thousands and hundreds of degrees Celsius of the molybdenum manganese method, so that the influence of thermal stress on the ceramic due to the difference in thermal expansion between the ceramic and the metal is small.

しかもZn合金にしてもPb合金にしても軟らか
いため、熱応力の影響をある程度吸収できるの
で、比較的大形のセラミツクス板と金属基板の接
合が可能であるため、比較的大形の耐摩耗基板の
製作が容易である。
Moreover, both Zn and Pb alloys are soft and can absorb the effects of thermal stress to some extent, making it possible to join relatively large ceramic plates and metal substrates, making it possible to create relatively large wear-resistant substrates. is easy to manufacture.

従つて、ホツパーに耐摩耗基板を取り付ける場
合も、取付枚数が少なくて済み、取付作業量を軽
減できる。
Therefore, even when attaching wear-resistant substrates to the hopper, the number of attached substrates can be reduced, and the amount of attachment work can be reduced.

次に、本発明のホツパー用耐摩耗基板を使用す
るには、ホツパー内部の摩耗の激しい部分に本ホ
ツパー用耐摩耗基板を並べて、取付ボルト4によ
りボルト止めするか、取付ボルトに代わる取付棒
を溶接、あるいは取付棒の頭部を油圧等により圧
縮して取り付けて使用する。
Next, in order to use the wear-resistant substrate for hopper of the present invention, the wear-resistant substrate for hopper is lined up in the area of severe wear inside the hopper and fixed with the mounting bolt 4, or a mounting rod is used in place of the mounting bolt. It is attached by welding or by compressing the head of the mounting rod using hydraulic pressure, etc.

このようにして本ホツパー用耐摩耗基板をホツ
パー内壁に敷きつめることにより、ホツパー内壁
面は摩耗に強いセラミツクス3で保護されるの
で、摩耗や欠落を生ずることなく、ホツパーの耐
用命数を大きく引き伸ばすことができる。
By laying this wear-resistant substrate for hopper on the inner wall of the hopper in this way, the inner wall surface of the hopper is protected by the abrasion-resistant ceramic 3, thereby greatly extending the service life of the hopper without causing wear or chipping. Can be done.

(F) 〔他の実施例〕 本発明のホツパー用耐摩耗基板は、ホツパー以
外の摩耗の激しい器材の摩耗部にも、耐摩耗部材
として適宜使用できるものである。
(F) [Other Examples] The wear-resistant substrate for a hopper of the present invention can be appropriately used as a wear-resistant member in the worn parts of equipment other than hoppers that are subject to severe wear.

以上、本発明は、Zn合金等の低溶融合金の超
音波振動によるセラミツクスと金属基板のメタラ
イズ接合基板のため、製作に特に高温炉、ガス雰
囲気炉、あるいは真空炉等を使用する要なく、製
造設備が簡易で低廉であり、小形のものから比較
的大形の耐摩耗基板まで製作が可能である。
As described above, the present invention is a metallized bonded substrate of ceramics and a metal substrate using ultrasonic vibration of a low-melting alloy such as a Zn alloy, so there is no need to use a high-temperature furnace, gas atmosphere furnace, vacuum furnace, etc. for manufacturing. The equipment is simple and inexpensive, and it is possible to manufacture from small to relatively large wear-resistant substrates.

しかも、セラミツクスのメタライズと金属基板
への接合が、1回の低温加熱でできるため、製造
コストが安価で経済的である。
Furthermore, since the metallization of the ceramic and the bonding to the metal substrate can be performed by one low-temperature heating, the manufacturing cost is low and economical.

更に、セラミツクスのメタライズ接合が比較的
低温で行なわれるため、セラミツクスの残留応力
も少なく、使用中にセラミツクスの剥離、割れ、
欠落等なく、長期間の使用に良く耐える等、多く
の優れた特徴を有するものである。
Furthermore, since the metallization bonding of ceramics is performed at a relatively low temperature, residual stress in the ceramics is small, and there is no risk of peeling, cracking, or cracking of the ceramics during use.
It has many excellent features, such as no cracks and good durability over long periods of use.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は本発明のホツパー用耐摩耗基
板のメタライズ接合の説明図。 1はメタライズ用の溶融合金、2は超音波振動
子、3はセラミツクス、4は取付ボルト、5は金
属基板、6はメタライズ面。
FIGS. 1 and 2 are explanatory diagrams of metallized bonding of the wear-resistant substrate for a hopper of the present invention. 1 is a molten alloy for metallization, 2 is an ultrasonic vibrator, 3 is ceramics, 4 is a mounting bolt, 5 is a metal substrate, and 6 is a metallized surface.

Claims (1)

【特許請求の範囲】 1 Zn合金等の低溶融点の溶融合金中で、超音
波振動加振によりメタライズしたセラミツクス板
のメタライズ面を、 裏面に取付部を設けた金属基板の摩耗面に、低
溶融点合金により一体に接合して、摩耗面にセラ
ミツクスを複合したことを特徴とするポツパー用
耐摩耗基板。
[Claims] 1. The metallized surface of a ceramic plate metallized by ultrasonic vibration excitation in a molten alloy with a low melting point such as a Zn alloy is placed on the worn surface of a metal substrate with a mounting portion on the back surface. A wear-resistant substrate for poppers characterized by being integrally bonded using a melting point alloy and having a ceramic composite on the wear surface.
JP58019456A 1983-02-07 1983-02-07 Abrasion-resisting substrate for hopper Granted JPS59152190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58019456A JPS59152190A (en) 1983-02-07 1983-02-07 Abrasion-resisting substrate for hopper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58019456A JPS59152190A (en) 1983-02-07 1983-02-07 Abrasion-resisting substrate for hopper

Publications (2)

Publication Number Publication Date
JPS59152190A JPS59152190A (en) 1984-08-30
JPS63310B2 true JPS63310B2 (en) 1988-01-06

Family

ID=11999815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58019456A Granted JPS59152190A (en) 1983-02-07 1983-02-07 Abrasion-resisting substrate for hopper

Country Status (1)

Country Link
JP (1) JPS59152190A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0221432Y2 (en) * 1985-11-27 1990-06-08

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436455Y2 (en) * 1973-12-28 1979-11-02

Also Published As

Publication number Publication date
JPS59152190A (en) 1984-08-30

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