JPS6335104B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cooling device for semiconductor devices such as thyristors, diodes, and transistors, and more specifically, to a cooling device for semiconductor devices such as thyristors, diodes, and transistors. The present invention relates to a cooling device that immerses a semiconductor element in a refrigerant and uses boiling and condensation of the refrigerant to cool the semiconductor element.

Conventionally, in this type of semiconductor device cooling device, a tank for sealing a refrigerant and a radiator equipped with a refrigerant flow pipe and heat radiation fins are assembled separately, and these are connected so that the refrigerant flow pipe communicates with the inside of the tank. There are some that are assembled by welding, etc. with piping. However, the conventional semiconductor device cooling device has a problem in that the tank and the heat exchanger are assembled separately, which increases the number of man-hours, which is time-consuming and expensive. Another problem was that this semiconductor device cooling device required a large space.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device cooling device that is easy to assemble, inexpensive, and compact.

In the semiconductor device cooling device according to the present invention, a pair of vertically elongated plates each having a hole in the lower end are arranged facing each other, and at least both side edges and the lower edge of the entire circumferential edges of both plates are arranged opposite to each other. A plurality of vertically elongated flat hollow bodies connected through connecting walls arranged between them or at bent portions provided on the plate are arranged in parallel,
All the flat hollow bodies are connected to each other in a continuous manner by a ring interposed at the lower end between the adjacent flat hollow bodies so as to surround the hole, and the adjacent flat hollow bodies are connected above the ring. A heat dissipation fin is interposed between the two.

In the above, at least both side edges and the lower edge of the entire peripheral edges of the pair of plates arranged opposite to each other are joined via a connecting wall arranged between the plates, and at the bent part provided on the plates. The joining is performed by a brazing method. It is preferable that corrugated fins having a large number of uneven striations extending in the vertical direction are arranged inside the flat hollow body and brazed to the inner surface. The flat hollow body and the ring are joined by brazing, for example. Preferably, both ends of the ring are provided with protrusions that can fit into holes drilled in the lower end of the plate. It is preferable to braze the flat hollow body and the heat radiation fins. Brazing between the peripheral edges of the plates, brazing between the flat hollow body and the ring, and brazing between the flat hollow body and the radiation fins are performed simultaneously by, for example, a vacuum brazing method.

In this semiconductor device cooling device, a liquid refrigerant sealing tank portion is formed by the ring and a portion of each flat hollow body located at a height position corresponding to the ring.
A heat radiating portion is formed by a portion of each flat hollow body above the ring and the heat radiating fin. Then, the semiconductor element is immersed in the liquid refrigerant sealed in the tank section. When the heat emitted from the semiconductor element is transferred to the liquid refrigerant, the refrigerant boils and vaporizes. This gaseous refrigerant rises inside the flat hollow body and reaches the heat dissipation section.
Heat possessed by the gaseous refrigerant is radiated from the plates and the radiation fins to the air between the flat hollow bodies, and the refrigerant is condensed. The condensed liquid refrigerant flows down the flat hollow body and returns to the tank section. This operation is repeated to cool the semiconductor element.

The semiconductor device cooling device of the present invention is configured as described above, and the refrigerant sealed tank portion and the heat dissipation portion are integrated, so it is easier to assemble and is less expensive than conventional semiconductor device cooling devices. It is possible to make it compact and convenient.

This invention will be described in detail below with reference to embodiments shown in the drawings. In the following description, left and right refer to those toward FIG. 1.

A semiconductor device cooling device 1 is formed from a pair of vertically rectangular aluminum brazing sheet plates 2 arranged oppositely, and includes a plurality of flat hollow bodies 3 arranged in parallel, and adjacent flat hollow bodies 3. It consists of an aluminum circular ring 4 disposed between the lower end portions and connecting the flat hollow bodies 3 in a continuous manner, and an aluminum corrugated fin interposed between the adjacent flat hollow bodies 3 above the ring 4. The heat dissipation fins 5 are also provided.

A circular hole 2a is bored in the lower end of the aluminum plate 2. The flat hollow body 3 is formed by brazing both side edges and lower edges of the entire peripheral edges of a pair of opposing plates 2 to each other via an aluminum connecting wall 6. Inside the flat hollow body 3, an aluminum corrugated fin 7 having a large number of uneven lines extending in the vertical direction is arranged and brazed to the inner surface of the plate 2.
In addition, aluminum corrugated fins 8 are arranged at four locations at predetermined intervals in the circumferential direction at a position below the corrugated fins 7 in the flat hollow body 3 and around the hole 2a.
It is brazed to the inner surface of plate 2. This fin 8 also plays a role of heat radiation. On both left and right sides of the flat hollow body 3 located at both left and right ends, side plates 9 made of aluminum brazing sheets are arranged at predetermined intervals and are vertically rectangular and have a circular hole 9a in the lower end. It is brazed to the flat hollow body 3 via a circular ring 10. Also disposed above the ring 10 between the side plate 9 and the flat hollow bodies 3 at both left and right ends are heat dissipation fins 11 made of aluminum corrugated fins having a large number of uneven streaks extending in the width direction. The flat hollow body 3 and the side plate 9 are brazed to each other. The upper ends of all the flat hollow bodies 3 are connected to an aluminum air reservoir 12 with an open bottom surface.
Connected to communicate with the inside. Air reservoir 1
The width of 2 is equal to the width of the flat hollow body 3.
The upper end of the side plate 9 is also joined to both left and right ends of the air reservoir 12. The remaining portion of the lower opening of the air reservoir 12 is formed by an aluminum square member 13 interposed between the upper ends of adjacent flat hollow bodies 3 and between the upper ends of the flat hollow bodies 3 at both left and right ends and the upper ends of the side plates 9. It is obstructed. A pipe 14 is attached to the left end of the air reservoir 12 for evacuating the inside of the semiconductor device cooling device 1 and for introducing a refrigerant into the inside of the device 1. This tube 14 is
After charging the refrigerant, it is closed as shown in FIG.

A protrusion 4a that can fit into the hole 2a of the plate 2 is provided at both ends of the ring 4.
It is brazed to the plate 2 with the hole 2a fitted into the hole 2a. Further, protrusions 10a are provided at both ends of the ring 10, one protrusion 10a is fitted into the hole 2a of the plate 2, and the other protrusion 10a is fitted into the hole 2a of the plate 2.
The ring 10 is brazed to the plate 2 and the side plate 9, with the ring 10 being fitted into the hole 9a of the side plate 9. Aluminum pipes 15 and 16 are welded to the holes 9a of the left and right side plates 9 so as to communicate with each other, respectively. A protrusion that can fit into the hole 9a is provided at the joint end of both pipes 15, 16 to the side plate 9, and the protrusion is fitted into the hole 9a and welded. A flange 15a is provided at the left end of the left pipe 15, and a lid 17 is attached to this flange 15a. There is a flange 16 at the right end of the right pipe 16.
a, and a lid 18 is attached to this flange 16a. The lid 18 includes, as described later,
A hole 18a is formed through which a power supply line 22 for supplying power to the semiconductor element 20 immersed in the liquid refrigerant C in the tank part B is inserted.

The heat dissipation fin 5 has a large number of uneven streaks extending in the width direction of the flat hollow body 3.
It is soldered to.

This semiconductor device cooling device 1 includes each flat hollow body 3.
A heat dissipation part A is formed by the portion above the ring 4 and the heat dissipation fin 5.
0, a portion of the flat hollow body 3 existing at a height position corresponding to the rings 4, 10 and the pipe 15,
16 forms a tank portion B, and both portions A and B are integrated. A liquid refrigerant C made of fluorocarbon is sealed in the semiconductor device cooling device 1, and this liquid refrigerant C is accumulated in the tank portion B. Air and the like that are mixed in when liquid refrigerant B is sealed are pushed up into the air reservoir 12 because it is lighter than Freon.

Inside the tank part B, semiconductor elements 20 and cooling fins 21 are arranged in layers alternately in the left-right direction and supported by suitable means (not shown). Power is supplied to the semiconductor element 20 through a power supply line 22 . The power supply line 22 is led out through the hole 18a, and is connected to the hole 1.
An insulating material 23 is filled around the power supply line 22 in the inside 8a. The cooling fin 21 is made of copper or aluminum alloy, and has a porous surface with aluminum powder 24 brazed to cover the entire surface except for the semiconductor element mounting portions on both left and right sides. The aluminum powder 24 is made by dissolving the aluminum powder 24 and aluminum brazing filler metal powder in an organic binder such as acrylic to form a slurry, which is then applied to the cooling fins 21.
Brazed after drying. If the cooling fins 21 are made of copper, the surfaces of the fins 21 are plated with nickel in advance, since a porous surface cannot be used because they cause a eutectic reaction with the aluminum powder and diffuse into each other.

In such a configuration, heat generated from the semiconductor element 20 is transmitted to the liquid coolant C via the cooling fins 21 and the aluminum powder 24. At this time,
Aluminum powder 2 on the surface of the cooling fin 21
The porous voids formed in step 4 become boiling nuclei of vapor bubbles, and the liquid refrigerant C is easily boiled by the heat. The gaseous refrigerant thus generated rises within the flat hollow body 3 and reaches the heat radiation section A. The heat possessed by the gaseous refrigerant is radiated to the air flowing between the flat hollow bodies 3 via the plate 2 and the radiation fins 5, and the gaseous refrigerant is condensed. The condensed liquid refrigerant flows through the space and falls back to the tank section B. The semiconductor element 20 is cooled by repeating such operations.

The semiconductor device cooling device 1 is assembled, for example, as follows.

First, plate 2, corrugated fin 7,
8. Set the connecting wall 6, heat dissipation fin 5, rings 4, 10 and side plate 9 in predetermined positions and braze them simultaneously by vacuum brazing. After that, the air reservoir 12 and the pipes 15 and 16 are welded.

In the above embodiment, the hole 2a drilled in the plate 2 and the ring 4 are circular, but the shape is not limited to this. Furthermore, in the above embodiment,
A vertically rectangular aluminum brazing sheet heat dissipation plate may be arranged between adjacent flat hollow bodies 3, and heat dissipation fins may be disposed and brazed between the heat dissipation plate and the heat dissipation plate. This increases the heat transfer area and improves cooling efficiency. A circular hole having a diameter equal to the outer diameter of the ring 4 is provided at the lower end of the heat dissipation plate, and the heat dissipation plate is attached by inserting the ring 4 into the circular hole. Further, in the above embodiment, only the both side edges and the lower edges of the pair of plates 2 which are arranged opposite to each other are connected to each other via the connecting wall 6, but the upper edges are also connected to each other via the connecting wall. In this case, a part of the connecting wall interposed between the upper edges of the plates is cut out to communicate the inside of the flat hollow body 3 and the working reservoir 12. Furthermore, although the air reservoir 12 is provided in the above embodiment, this is not necessarily required. In this case, the entire peripheries of a pair of plates 2 arranged opposite to each other are joined together via a connecting wall, and the space between the plates 2 is sealed.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention; FIG. 1 is a partially cutaway front view, FIG. 2 is a cross-sectional view taken along the line --- of FIG. 1, and FIG. 3 is a cross-sectional view taken along the -- line of FIG. 1. , FIG. 4 is a vertical cross-sectional view of the cooling fin. 1... Semiconductor element cooling device, 2... Plate,
2a...hole, 3...flat hollow body, 4...ring,
5... Heat dissipation fin, 6... Connecting wall.

Claims (1)

[Claims] 1 A pair of plates 2 which are vertically elongated and have holes 2a in their lower ends are arranged to face each other, and at least both side edges and lower edges of the entire circumferential edges of both plates 2 are arranged between both plates 2. A vertically elongated flat hollow body 3 joined via a connecting wall 6 or at a bent portion provided on the plate 2.
A plurality of flat hollow bodies 3 are arranged in parallel, and all the flat hollow bodies 3 are in communication with each other by a ring 4 interposed at the lower end between adjacent flat hollow bodies 3 so as to surround the hole 2a. A semiconductor device cooling device in which a heat dissipation fin 5 is interposed between adjacent flat hollow bodies 3 connected to each other above a ring 4.